EP1743053B1 - Method for production of a coating - Google Patents
Method for production of a coating Download PDFInfo
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- EP1743053B1 EP1743053B1 EP05747427A EP05747427A EP1743053B1 EP 1743053 B1 EP1743053 B1 EP 1743053B1 EP 05747427 A EP05747427 A EP 05747427A EP 05747427 A EP05747427 A EP 05747427A EP 1743053 B1 EP1743053 B1 EP 1743053B1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/02—Pretreatment of the material to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
Definitions
- the invention relates to a method for producing a corrosion-resistant and / or oxidation-resistant coating according to the preamble of patent claim 1,
- components In particular components of gas turbines, at high temperatures, their free surfaces are exposed to highly corrosive and oxidizing conditions.
- such components may consist of a nickel base or cobalt base superalloy.
- the components are provided with coatings. Preference is given to PtA1 coatings, with which a particularly good corrosion protection and / or oxidation protection can be realized.
- the EP 0 784 104 Bl discloses a PtA1 coating for gas turbine components and a method of making such a coating. According to the method described there, a PtA1 coating is produced on a substrate by depositing a platinum layer on a substrate surface, wherein after the deposition of the platinum layer, diffusion of platinum from the platinum layer into the substrate surface is carried out. After deposition of the platinum layer and the diffusion of the platinum, the thus coated substrate is a-lit, ie coated with aluminum, wherein the aluminum is preferably diffused into the substrate surface.
- the deposition of platinum on the substrate surface before Alitieren the substrate is preferably carried out by electroplating.
- the present invention relates to details of a method of making a corrosion resistant and / or oxidation resistant coating on a substrate, which involves electrodepositing a platinum group metal, particularly platinum and / or palladium, or an alloy based on at least one platinum group metal. So it is essential for the quality of the corrosion-resistant and / or oxidation-resistant coating that a uniformly defined Deposition of particular platinum is realized by galvanic way, so as to realize a uniform thickness of the platinum coating. For example, a minimum value of the coating thickness of approximately 1 ⁇ m may not be undershot, since this would result in insufficient hot gas resistance and locally rapid failure of the coating.
- the present invention is based on the problem to provide a novel method for producing a corrosion-resistant and / or oxidation-resistant coating, which is a platinum group metal-A1 coating.
- the galvanic deposition of the or each platinum group metal or alloy is carried out in a two-stage deposition process, wherein in a first stage of the deposition process in a coating time T1, a current applied for electroplating is increased continuously or stepwise from a start value to a maximum value , and in a second stage of the deposition process in a coating time T2, the current applied for plating is kept constant at the maximum value.
- the present invention relates in particular to those details which relate to the electrodeposition of at least one platinum group metal, in particular platinum and / or palladium, or an alloy based on at least one platinum group metal on a substrate to be examined.
- platinum group metal in particular platinum and / or palladium
- an alloy based on at least one platinum group metal on a substrate to be examined At this point it should be noted that after the galvanic deposition of platinum and / or palladium or a related alloy on the substrate and before Alitieren the so galvanically coated substrate diffusing the platinum and / or palladium or the corresponding alloy into the substrate can.
- a surface pretreatment of the substrate takes place.
- the surface pretreatment of the substrate comprises at least the following three steps: In a first step of the surface pretreatment, the surface of the substrate to be coated is blasted. The blasting takes place with Al 2 O 3 particles which have a particle diameter of 100 to 200 ⁇ m and are directed at a pressure of 1.5 to 3.5 bar onto the substrate surface to be irradiated. When blasting, a coverage of 200 to 1500% is used, which means that each surface section is blasted between two and fifteen times or detected by a corresponding number of particle beams. After blasting, there is a metallically bright and oxide-free substrate surface. Following blasting, the blasted surface is electrochemically cleaned or degreased, in a NaOH-containing solution. Following degreasing or cleaning of the substrate surface, the same is activated in a 40 to 60% strength by volume HCl solution.
- the galvanic deposition of the or each metal of the platinum group or of the corresponding alloy takes place by means of a deposition process.
- the electrodeposition takes place in a two-stage deposition process, wherein in a first stage of the deposition process, a current applied for electroplating is increased continuously or stepwise from a initial value to a maximum value, and wherein in a second stage of the deposition process the current applied for electroplating is kept constant at the maximum value.
- the electrodeposition is carried out over a total coating time T, wherein the first stage of the cutting process, in which the current applied for plating is continuously or stepwise increased to the maximum value from the initial value, takes place in a coating time T 1 , and wherein the second stage the deposition process, in which the current applied to the plating is kept constant at the maximum value, in a coating time T 2 is performed.
- the coating time T 1 of the first stage of the deposition process amounts to approximately 50% of the total coating time
- the current intensity I is continuously increased to the maximum value starting from an initial value which corresponds approximately to 10% of the maximum value I MAX of the current applied for electroplating within the coating time T 1 .
- the current intensity I in the coating time T 1 can be increased stepwise from the initial value to the maximum value I MAX .
- the current applied to the plating current I is maintained at this maximum value I MAX .
- the current applied to the electrodeposition electrode I preferably has one of the following conditions, wherein the condition (1) corresponds to the continuous increase of the current I in the first phase of the deposition process, and the condition (2) of the stepwise increase of the current I corresponds during the first phase of the deposition process.
- I ⁇ 0 . 1 * I MAX + 0 . 9 * I MAX 0 . 5 * T * t For 0 ⁇ t ⁇ 0 . 5 * T I MAX For 0 .
- the maximum current I MAX applied for the galvanic deposition corresponds, depending on the type of galvanic bath used, to a magnitude of 0.2 to 3.5 A / dm 2 , preferably with maximum currents of 1.5 A. / dm 2 or 2 A / dm 2 worked.
- an initial value of the current I is used, which is about 10% of the maximum current I MAX , it is also possible to work with an initial value of the current I which is approximately 15% or even 20% of the maximum current I MAX is.
- the substrate to be coated during the entire Abscheideprczesses ie during the entire first stage and the entire second stage of the deposition process, connected cathodically and thus negatively.
- the substrate to be coated can be anodically or positively treated prior to the actual deposition process and thus introduced into the galvanic bath. Alternatively, it is also possible to switch the substrate to be coated directly cathodically.
- preferably several substrates are coated simultaneously in a galvanic bath with the or each metal of the platinum group or a corresponding alloy.
- egg is a rational production of relatively large quantities in batch mode possible.
- a uniform deposition of platinum and / or palladium or a corresponding alloy on substrates having a complex, three-dimensional geometry is possible.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Prevention Of Electric Corrosion (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
Die Erfindung betrifft ein Verfahren zum Herstellen einer korrosionsbeständigen und/oder oxidationsbeständigen Beschichtung nach dem Oberbegriff des Patentanspruchs 1,The invention relates to a method for producing a corrosion-resistant and / or oxidation-resistant coating according to the preamble of patent claim 1,
Beim Betrieb von Bauteilen, insbesondere Bauteilen von Gasturbinen, bei hohen Temperaturen sind deren freie Oberflächen stark korrodierenden und oxidierenden Bedingungen ausgesetzt. Beim Einsatz in Gasturbinen können derartige Bauteile zum Beispiel aus einer Superlegierung auf Nickelbasis oder Kobaltbasis bestehen. Zum Schutz vor Korrosion, Oxydation oder auch Erosion werden die Bauteile mit Beschichtungen versehen. Bevorzugt sind PtA1-Beschichtungen, mit denen ein besonders guter Korrosionsschutz und/oder Oxidationsschutz realisiert werden kann.When operating components, in particular components of gas turbines, at high temperatures, their free surfaces are exposed to highly corrosive and oxidizing conditions. For example, when used in gas turbines, such components may consist of a nickel base or cobalt base superalloy. To protect against corrosion, oxidation or erosion, the components are provided with coatings. Preference is given to PtA1 coatings, with which a particularly good corrosion protection and / or oxidation protection can be realized.
Die
Aus den Dokumenten
Das Abscheiden von Platin auf die Substratoberfläche vor dem Alitieren des Substrats erfolgt vorzugsweise auf galvanischem Weg. Die hier vorliegende Erfindung betrifft Details eines Verfahrens zum Herstellen einer korrosionsbeständigen und/oder oxidationsbeständigen Beschichtung auf einem Substrat, die das galvanische Abscheiden eines Metalls der Platingruppe, insbesondere von Platin und/oder Palladium, oder einer Legierung auf Basis mindestens eines Metalls der Platingruppe betreffen. So ist es für die Qualität der korrosionsbeständigen und/oder oxidationsbeständigen Beschichtung von wesentlicher Bedeutung, dass eine gleichmäßig definierte Abscheidung von insbesondere Platin auf galvanischem Weg realisiert wird, um so eine gleichmäßige Dicke der Platinbeschichtung zu realisieren. So darf zum Beispiel ein Minimalwert der Beschichtungsdicke von ca. 1 µm nicht unterschritten werden, da dies eine ungenügende Heißgasbeständigkeit und ein lokal rasches Versagen der Beschichtung nach sich ziehen würde. Auf der anderen Seite dürfen Schichtdicken von 8 bis 15 µm nicht überschritten werden, da hierdurch einerseits wertvolles Edelmetall verschwendet würde und andererseits die ligenschaften der Beschichtung verschlechtert würden. Ein weiteres Problem beim galvanischen Abscheiden von insbesondere Platin auf ein Substrat besteht dann, wenn das Platin zum Beispiel auf Bauteile mit einer komplexen dreidimensionalen Gestalt abgeschieden werden soll. Bei solchen Substraten mit einer komplexen dreidimensionalen Kontur handelt es sich zum Beispiel um Gasturbinenschaufeln, weil dieselben einerseits stark unsymmetrisch sind, und anderseits kanten-, ecken- und spitzenbehaftete Oberflächen sowie Hohlräume und Hinterschneidungen aufweisen. Mit den aus dem Stand der Technik bekannten Verfahren zum galvanischen Abscheiden von Platin lässt sich eine gleichmäßig definierte Abscheidung von Platin auf Substraten mit einer komplexen dreidimensionalen Kontur nur unzureichend realisieren.The deposition of platinum on the substrate surface before Alitieren the substrate is preferably carried out by electroplating. The present invention relates to details of a method of making a corrosion resistant and / or oxidation resistant coating on a substrate, which involves electrodepositing a platinum group metal, particularly platinum and / or palladium, or an alloy based on at least one platinum group metal. So it is essential for the quality of the corrosion-resistant and / or oxidation-resistant coating that a uniformly defined Deposition of particular platinum is realized by galvanic way, so as to realize a uniform thickness of the platinum coating. For example, a minimum value of the coating thickness of approximately 1 μm may not be undershot, since this would result in insufficient hot gas resistance and locally rapid failure of the coating. On the other hand, layer thicknesses of 8 to 15 .mu.m may not be exceeded, since this would waste precious valuable metal on the one hand and on the other hand would impair the properties of the coating. Another problem with the galvanic deposition of particular platinum on a substrate is when the platinum is to be deposited, for example, on components with a complex three-dimensional shape. Such substrates with a complex three-dimensional contour are, for example, gas turbine blades, because they are on the one hand highly asymmetrical, and on the other hand have edge-, corner- and tip-like surfaces as well as cavities and undercuts. With the methods known from the prior art for the galvanic deposition of platinum, a uniformly defined deposition of platinum on substrates with a complex three-dimensional contour can be realized only insufficiently.
Hiervon ausgehend liegt der vorliegenden Erfindung das Problem zu Grunde, ein neuartiges Verfahren zur Herstellung einer korrosionsbeständigen und/oder oxidationsbeständigen Beschichtung zu schaffen, die eine Platingruppenmetall-A1 Beschichtung ist.On this basis, the present invention is based on the problem to provide a novel method for producing a corrosion-resistant and / or oxidation-resistant coating, which is a platinum group metal-A1 coating.
Dieses Problem wird durch ein Verfahren zur Herstellung einer korrosionsbeständigen und/oder oxidationsbeständigen Beschichtung im Sinne von Patentanspruch 1 gelöst. Erfindungsgemäß wird das galvanische Abscheiden des oder jeden Metalls der Platingruppe bzw. der entsprechenden Legierung in einem zweistufigen Abscheideprozess durchgeführt, wobei in einer ersten Stufe des Abscheideprozesses in einer Beschichtungszeit T1 eine zum Galvanisieren angelegte Stromstarke ausgehend von einem Anfangswert kontinuierlich oder stufenweise auf einen Maximalwert gesteigert wird, und wobei in einer zweiten Stufe des Abscheideprozesses in einer Beschichtungszeit T2 die zum Galvanisieren angelegte Stromstärke konstant auf dem Maximalwert gehalten wird.This problem is solved by a method for producing a corrosion-resistant and / or oxidation-resistant coating in the sense of claim 1. According to the invention, the galvanic deposition of the or each platinum group metal or alloy is carried out in a two-stage deposition process, wherein in a first stage of the deposition process in a coating time T1, a current applied for electroplating is increased continuously or stepwise from a start value to a maximum value , and in a second stage of the deposition process in a coating time T2, the current applied for plating is kept constant at the maximum value.
Bevorzugte Weiterbildungen der Erfindung ergeben sich aus den Unteransprüchen und der nachfolgenden Beschreibung.Preferred embodiments of the invention will become apparent from the dependent claims and the description below.
Nachfolgend wird das erfindungsgemäße Verfahren zum Herstellen einer korrosionsbeständigen and/oder oxidationsbeständigen Beschichtung, vorzugsweise einer PtAl-Beschichtung, in größerem Detail beschrieben.The process according to the invention for producing a corrosion-resistant and / or oxidation-resistant coating, preferably a PtAl coating, will be described in greater detail below.
Die hier vorliegende Erfindung betriffz dabei insbesondere solche Details, die das galvanischen Abscheiden mindestens eines Metalls der Platingruppe, insbesondere von Platin und/oder Palladium, oder einer Legierung auf Basis mindestens eines Metalls der Platingruppe auf ein zu besthichtendes Substrat betreffen. An dieser Stelle sei darauf hingewiesen, dass nach dem galvanischen Abscheiden von Platin und/oder Palladium oder einer diesbezüglichen Legierung auf das Substrat und vor dem Alitieren des so galvanisch beschichteten Substrats ein Eindiffundieren des Platins und/oder Palladiums oder der entsprechenden Legierung in das Substrat erfolgen kann.The present invention relates in particular to those details which relate to the electrodeposition of at least one platinum group metal, in particular platinum and / or palladium, or an alloy based on at least one platinum group metal on a substrate to be examined. At this point it should be noted that after the galvanic deposition of platinum and / or palladium or a related alloy on the substrate and before Alitieren the so galvanically coated substrate diffusing the platinum and / or palladium or the corresponding alloy into the substrate can.
Vor dem eigentlichen galvanischen Abscheiden des oder jeden Metalls der Platingruppe bzw. der entsprechenden Legierung erfolgt eine Oberflächenvorbehandlung des Substrats. Die Oberflächenvorbehandlung des Substrats umfasst zumindest die folgenden drei Schritte: In einem ersten Schritz der Oberflächenvorbehandlung wird die Oberfläche des zu beschichtenden Substrats gestrahlt. Das Strahlen erfolgt mit Al2O3-Partikeln, die einen Partikeldurchmesser von 100 bis 200 µm aufweisen und mit einem Druck von 1,5 bis 3,5 bar auf die zu strahlende Substratoberfläche gerichtet werden. Beim Strahlen wird mit einem Überdeckungsgrad von 200 bis 1500 % gearbeitet, was bedeutet, dass jeder Oberflächenabschnitt zwischen zwei und fünfzehn Mal gestrahlt bzw. von einer entsprechenden Partikelstrahlanzahl erfasst wird. Nach dem Strahlen liegt eine metallisch blanke sowie oxidfreie Substratoberfläche vor. Im Anschluss an das Strahlen wird die gestrahlte Oberfläche elektrochemisch gereinigt bzw. entfettet, und zwar in einer NaOH-haltigen Lösung. Im Anschluss an das Entfetten bzw. Reinigen der Substratoberfläche erfolgt eine Aktivierung derselben in einer 40 bis 60 Vol-%igen HCl-Lösung.Before the actual galvanic deposition of the or each metal of the platinum group or the corresponding alloy, a surface pretreatment of the substrate takes place. The surface pretreatment of the substrate comprises at least the following three steps: In a first step of the surface pretreatment, the surface of the substrate to be coated is blasted. The blasting takes place with Al 2 O 3 particles which have a particle diameter of 100 to 200 μm and are directed at a pressure of 1.5 to 3.5 bar onto the substrate surface to be irradiated. When blasting, a coverage of 200 to 1500% is used, which means that each surface section is blasted between two and fifteen times or detected by a corresponding number of particle beams. After blasting, there is a metallically bright and oxide-free substrate surface. Following blasting, the blasted surface is electrochemically cleaned or degreased, in a NaOH-containing solution. Following degreasing or cleaning of the substrate surface, the same is activated in a 40 to 60% strength by volume HCl solution.
Im Arschluss an die Oberflächenvorbehandlung des Substrats erfolgt das galvanische Abscheiden des oder jeden Metalls der Platingruppe bzw. der entsprechenden Legierung mithilfe eines Abscheideprozesses. Nach einem ersten Aspekt der hier vorliegenden Erfindung erfolgt das galvanische Abscheiden in einem zweistufigen Abscheideprozess, wobei in einer ersten Stufe des Abscheideprozesses eine zum Galvanisierung angelegte Stromstärke ausgehend von einem Anfangswert kontinuierlich oder stufenweise auf einen Maximalwert gesteigert wird, und wobei in einer zweiten Stufe des Abscheideprozesses die zum Galvanisieren angelegte Stromstärke konstant auf dem Maximalwert gehalten wird.In connection with the surface pretreatment of the substrate, the galvanic deposition of the or each metal of the platinum group or of the corresponding alloy takes place by means of a deposition process. According to a first aspect of the present invention, the electrodeposition takes place in a two-stage deposition process, wherein in a first stage of the deposition process, a current applied for electroplating is increased continuously or stepwise from a initial value to a maximum value, and wherein in a second stage of the deposition process the current applied for electroplating is kept constant at the maximum value.
Das galvanische Abscheiden wird dabei über eine Gsamtbeschichtungszeit T durchgeführt, wobei die erste Stufe des Abschneideprozesses, in welcher die zum Galvanisieren angelegte Stromstärke ausgehend von dem Anfangswert kontinuierlich oder stufenweise auf den Maximalwert gesteigert wird, in einer Beschichtungszeit T1 erfolgt, und wobei die zweite Stufe des Abscheideprozesses, in welcher die zum Galvanisieren angelegte Stromstärke auf dem Maximalwert konstant gehalten wird, in einer Beschichtungszeit T2 durchgeführt wird. Die Beschichtungszeit T1 der ersten Stufe des Abscheideprozesses beträgt dabei in etwa 50 % der Gesamtbeschichtungszeit, die Beschichtungszeit T2 der zweiten Stufe des Abscheideprozesses beträgt ebenfalls in etwa 50 % der Gesamtbeschichtungszeit T. Demnach gilt dann für die Gesamtbeschichtungszeit T: T = T1 + T2.In this case, the electrodeposition is carried out over a total coating time T, wherein the first stage of the cutting process, in which the current applied for plating is continuously or stepwise increased to the maximum value from the initial value, takes place in a coating time T 1 , and wherein the second stage the deposition process, in which the current applied to the plating is kept constant at the maximum value, in a coating time T 2 is performed. The coating time T 1 of the first stage of the deposition process amounts to approximately 50% of the total coating time, the coating time T 2 of the second stage of the deposition process is also approximately 50% of the total coating time T. Accordingly, the total coating time T then applies: T = T 1 + T 2 .
Nach einer ersten bevorzugten Weiterbildung dieses ersten Aspekts der hier vorliegenden Erfindung wird die Stromstärke I aufgehend von einem Anfangswert, der in etwa 10 % des Maximalwerts IMAX der zum Galvanisieren angelegten Stromstärke entspricht, innerhalb der Beschichtungszeit T1 kontinuierlich auf den Maximalwert gesteigert. Alternativ hierzu kann die Stromstärke I in der Beschichtungszeit T1 ausgehend von diesem Anfangswert stufenweise auf den Maximalwert IMAX gesteigert werden. Nach dem Erreichen dieses Maximalwerts IMAX wird in jedem Fall während der zweiten Stufe des Abscheideprozesses die zum galvanischen Abscheiden angelegte Stromstärke I auf diesem Maximalwert IMAX gehalten.According to a first preferred development of this first aspect of the present invention, the current intensity I is continuously increased to the maximum value starting from an initial value which corresponds approximately to 10% of the maximum value I MAX of the current applied for electroplating within the coating time T 1 . Alternatively, the current intensity I in the coating time T 1 can be increased stepwise from the initial value to the maximum value I MAX . In any case, after reaching this maximum value I MAX , during the second stage of the deposition process, the current applied to the plating current I is maintained at this maximum value I MAX .
In besonders bevorzugten Ausführungsbeispielen, in welchen die Beschichtungszeit T1 der ersten Stufe sowie die Beschichtungszeit T2 der zweiten Stufe jeweils 50 % der Gesamtbeschichtungszeit T betragen, und in welcher der Anfangswert der Stromstärke I in der ersten Stufe des Abscheideprozesses 10 % der maximalen Stromstärke IMAX beträgt, gilt für den zum galvanischen Abscheiden angelegten Strom I vorzugsweise eine der folgenden Bedingungen, wobei die Bedingung (1) dem kontinuierlichen Ansteigen des Stroms I in der ersten Phase des Abscheideprozesses entspricht, und wobei die Bedingung (2) der stufenweisen Vergrößerung des Stroms I während der ersten Phase des Abscheideprozesses entspricht.
An dieser Stelle sei darauf hingewiesen, dass der zum galvanischen Abscheiden angelegte Maximalstrom IMAX je nach verwendeten Typ eines galvanischen Bads in einer Größenordnung von 0,2 bis 3,5 A/dm2 entspricht, vorzugsweise wird mit maximalen Strömen von 1,5 A/dm2 bzw. 2 A/dm2 gearbeitet. Obwohl in dem obigen Ausführungsbeispiel mit einem Anfangswert der Stromstärke I gearbeitet wird, der in etwa 10% der maximalen Stromstärke IMAX beträgt, kann auch mit einem Anfangswert der Stromstärke I gearbeitet wird, der in etwa 15% oder auch 20% der maximalen Stromstärke IMAX beträgt.It should be noted at this point that the maximum current I MAX applied for the galvanic deposition corresponds, depending on the type of galvanic bath used, to a magnitude of 0.2 to 3.5 A / dm 2 , preferably with maximum currents of 1.5 A. / dm 2 or 2 A / dm 2 worked. Although in the above embodiment, an initial value of the current I is used, which is about 10% of the maximum current I MAX , it is also possible to work with an initial value of the current I which is approximately 15% or even 20% of the maximum current I MAX is.
Im Sinne der hier vorliegenden Erfindung ist das zu beschichtende Substrat während des gesamten Abscheideprczesses, also während der gesamten ersten Stufe und der gesamten zweiten Stufe des Abscheideprozesses, kathodisch und damit negativ geschaltet. Im Sinne der hier vorliegenden Erfindung kann vor dem eigentlichen Abscheideprozess das zu beschichtende Substrat anodisch bzw. positiv geachaltet und so in das galvanische Bad eingebracht werden. Alternativ ist es auch möglich, das zu beschichtenden Substrat unmittelbar kathodisch zu schalten.For the purposes of the present invention, the substrate to be coated during the entire Abscheideprczesses, ie during the entire first stage and the entire second stage of the deposition process, connected cathodically and thus negatively. For the purposes of the present invention, the substrate to be coated can be anodically or positively treated prior to the actual deposition process and thus introduced into the galvanic bath. Alternatively, it is also possible to switch the substrate to be coated directly cathodically.
Im Sinne der hier vorliegenden Erfindung werden vorzugsweise mehrere Substrate gleichzeitig in einem galvanischen Bad mit dem oder jedem Metall der Platingruppe bzw. einer entsprechenden Legierung beschichtet. Eierdurch ist eine rationale Fertigung von relativ großen Stückzahlen im Batchbetrieb möglich. Mit dem erfindungsgemäßen Verfahren ist darüber hinaus eine gleichmäßige Abscheidung von Platin und/oder Palladium bzw. einer entsprechenden Legierung auf Substraten mit einer komplexen, dreidimensionalen Geometrie möglich.For the purposes of the present invention, preferably several substrates are coated simultaneously in a galvanic bath with the or each metal of the platinum group or a corresponding alloy. By egg is a rational production of relatively large quantities in batch mode possible. With the method according to the invention, moreover, a uniform deposition of platinum and / or palladium or a corresponding alloy on substrates having a complex, three-dimensional geometry is possible.
Claims (8)
- Method for producing a corrosion-resistant and/or oxidation-resistant coating, wherein at least one metal of the platinum group, in particular platinum and/or palladium or an alloy based on at least one metal of the platinum group, is deposited by means of galvanization onto a surface of a substrate, and wherein subsequently aluminization of the thus galvanically coated substrate is carried out, characterised in that
the galvanic deposition of the or each metal of the platinum group or of the corresponding alloy is carried out in a two-stage deposition process, wherein in a first stage of the deposition process in a coating time T1 a current intensity that is applied for galvanization is increased continuously or stepwise starting from an initial value to a maximum value of the order of magnitude of 0.2 to 3.5 A/dm2, and wherein in a second stage of the deposition process in a coating time T2 the current intensity applied for galvanization is kept constantly at the maximum value, and
the deposition process is carried out over a total coating time T, wherein the coating time T1 of the first stage amounts to approximately 50% of the total coating time T, and the coating time T2 of the second stage amounts to approximately 50% of the total coating time T, and wherein T = T1 + T2. - Method according to claim 1,
characterised in that
the initial value of the current intensity applied in the first stage corresponds to approximately 10 to 20% of the maximum value. - Method according to claim 1 or 2,
characterised in that
starting from the initial value of the current intensity the current intensity is increased continuously to the maximum value in the coating time T1 of the first stage. - Method according to claim 1 or 2,
characterised in that
starting from the initial value of the current intensity the current intensity is increased stepwise to the maximum value in the coating time T1 of the first stage. - Method according to one of claims 1 to 4,
characterised in that
the substrate that is to be coated is connected cathodically or negatively throughout the deposition process. - Method according to one of claims 1 to 5, characterised in that
before the deposition process the substrate that is to be coated is connected anodically or positively and is thus introduced into a galvanic bath. - Method according to one of claims 1 to 6,
characterised in that
before the deposition process and, if applicable, before the anodic or positive connection of the same the substrate that is to be coated is subjected to surface pretreatment, whereina) the surface of the substrate that is to be coated is jet-blasted;b) subsequently the jet-blasted surface is electrochemically cleaned or degreased;c) subsequently the cleaned or degreased surface is activated. - Method according to claim 7,
characterised in that
during the surface pretreatmenta) the surface of the substrate that is to be coated is jet-blasted with Al2O3 particles, which have a particle diameter of 100 to 200 µm, at a pressure of 1.5 to 3.5 bar;b) subsequently the jet-blasted surface is electrochemically cleaned or degreased in a NaOH solution;c) subsequently the cleaned or degreased surface is activated preferably in a 40 to 60 viol % HCl solution.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004021926A DE102004021926A1 (en) | 2004-05-04 | 2004-05-04 | A method of making a coating and anode for use in such a method |
PCT/DE2005/000811 WO2005108651A2 (en) | 2004-05-04 | 2005-05-02 | Method for production of a coating and anode used in such a method |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1743053A2 EP1743053A2 (en) | 2007-01-17 |
EP1743053B1 true EP1743053B1 (en) | 2012-08-29 |
Family
ID=34968980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05747427A Active EP1743053B1 (en) | 2004-05-04 | 2005-05-02 | Method for production of a coating |
Country Status (4)
Country | Link |
---|---|
US (1) | US7771578B2 (en) |
EP (1) | EP1743053B1 (en) |
DE (1) | DE102004021926A1 (en) |
WO (1) | WO2005108651A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10361888B3 (en) * | 2003-12-23 | 2005-09-22 | Airbus Deutschland Gmbh | Anodizing process for aluminum materials |
FR2954780B1 (en) * | 2009-12-29 | 2012-02-03 | Snecma | METHOD FOR THE ELECTROLYTIC DEPOSITION OF A METALLIC MATRIX COMPOSITE COATING CONTAINING PARTICLES FOR THE REPAIR OF A METAL BLADE |
US8828214B2 (en) * | 2010-12-30 | 2014-09-09 | Rolls-Royce Corporation | System, method, and apparatus for leaching cast components |
JP6226231B2 (en) | 2013-09-18 | 2017-11-08 | 株式会社Ihi | Heat-shielding coated Ni alloy part and manufacturing method thereof |
US10392948B2 (en) | 2016-04-26 | 2019-08-27 | Honeywell International Inc. | Methods and articles relating to ionic liquid bath plating of aluminum-containing layers utilizing shaped consumable aluminum anodes |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3666638A (en) | 1970-04-21 | 1972-05-30 | Sidney Levine | Process for anodizing aluminum materials |
US4085012A (en) | 1974-02-07 | 1978-04-18 | The Boeing Company | Method for providing environmentally stable aluminum surfaces for adhesive bonding and product produced |
GB1555940A (en) | 1977-01-21 | 1979-11-14 | Boeing Co | Aluminium or aluminium alloy adherends and to a method oxide coating on an aluminium or aluminium alloy article |
IT1094825B (en) * | 1978-05-11 | 1985-08-10 | Panclor Chemicals Ltd | PROCEDURE AND EQUIPMENT FOR THE HALOGENATION OF WATER |
US4894127A (en) | 1989-05-24 | 1990-01-16 | The Boeing Company | Method for anodizing aluminum |
DE4211881C2 (en) | 1992-04-09 | 1994-07-28 | Wmv Ag | Process for the electrochemical application of a structured surface coating |
EP0567755B1 (en) | 1992-04-29 | 1996-09-04 | WALBAR INC. (a Delaware Corporation) | Improved diffusion coating process and products |
US5486283A (en) | 1993-08-02 | 1996-01-23 | Rohr, Inc. | Method for anodizing aluminum and product produced |
DE69509202T2 (en) | 1994-12-24 | 1999-09-09 | Chromalloy United Kingdom Ltd. | Thermal insulation layer and method for applying it to a superalloy body |
US6066405A (en) * | 1995-12-22 | 2000-05-23 | General Electric Company | Nickel-base superalloy having an optimized platinum-aluminide coating |
DE19902527B4 (en) * | 1999-01-22 | 2009-06-04 | Hydro Aluminium Deutschland Gmbh | Printing plate support and method for producing a printing plate support or an offset printing plate |
US6254756B1 (en) | 1999-08-11 | 2001-07-03 | General Electric Company | Preparation of components having a partial platinum coating thereon |
EP1094131B1 (en) | 1999-10-23 | 2004-05-06 | ROLLS-ROYCE plc | A corrosion protective coating for a metallic article and a method of applying a corrosion protective coating to a metallic article |
US6432821B1 (en) * | 2000-12-18 | 2002-08-13 | Intel Corporation | Method of copper electroplating |
ITTO20010149A1 (en) | 2001-02-20 | 2002-08-20 | Finmeccanica S P A Alenia Aero | LOW ECOLOGICAL ANODIZATION PROCEDURE OF A PIECE OF ALUMINUM OR ALUMINUM ALLOYS. |
WO2003088316A2 (en) | 2002-04-12 | 2003-10-23 | Acm Research, Inc. | Electropolishing and electroplating methods |
US6974531B2 (en) * | 2002-10-15 | 2005-12-13 | International Business Machines Corporation | Method for electroplating on resistive substrates |
DE10350882A1 (en) | 2003-10-31 | 2005-06-02 | Mtu Aero Engines Gmbh | Component, oxidation protection coating for such a component and manufacturing process |
DE10361888B3 (en) | 2003-12-23 | 2005-09-22 | Airbus Deutschland Gmbh | Anodizing process for aluminum materials |
-
2004
- 2004-05-04 DE DE102004021926A patent/DE102004021926A1/en not_active Withdrawn
-
2005
- 2005-05-02 EP EP05747427A patent/EP1743053B1/en active Active
- 2005-05-02 US US11/579,721 patent/US7771578B2/en active Active
- 2005-05-02 WO PCT/DE2005/000811 patent/WO2005108651A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP1743053A2 (en) | 2007-01-17 |
WO2005108651A3 (en) | 2007-03-22 |
WO2005108651A2 (en) | 2005-11-17 |
DE102004021926A1 (en) | 2005-12-01 |
US7771578B2 (en) | 2010-08-10 |
US20080035486A1 (en) | 2008-02-14 |
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