EP1702386B1 - Coupleur directionnel a espace de couplage important - Google Patents
Coupleur directionnel a espace de couplage important Download PDFInfo
- Publication number
- EP1702386B1 EP1702386B1 EP04804750A EP04804750A EP1702386B1 EP 1702386 B1 EP1702386 B1 EP 1702386B1 EP 04804750 A EP04804750 A EP 04804750A EP 04804750 A EP04804750 A EP 04804750A EP 1702386 B1 EP1702386 B1 EP 1702386B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- coupling
- coupling conductors
- conductor
- parallel line
- line coupler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Not-in-force
Links
- 230000008878 coupling Effects 0.000 title claims description 56
- 238000010168 coupling process Methods 0.000 title claims description 56
- 238000005859 coupling reaction Methods 0.000 title claims description 56
- 239000004020 conductor Substances 0.000 claims description 57
- 239000002184 metal Substances 0.000 claims description 38
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 238000005516 engineering process Methods 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 238000002955 isolation Methods 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000005530 etching Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000001939 inductive effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 240000001439 Opuntia Species 0.000 description 1
- 235000004727 Opuntia ficus indica Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
- H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
- H01P5/185—Edge coupled lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
- H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
- H01P5/187—Broadside coupled lines
Definitions
- the invention relates to a directional coupler in stripline technology.
- Directional couplers are circuit elements of high-frequency (RF) or antenna technology and are used for unbalanced power distribution, for example. In the size of -12 dB, in a desired frequency range. Directional couplers have, in principle, a short line section whose characteristic impedance corresponds to that of the line used. As a result, only a certain voltage is coupled out of the incoming or outgoing wave.
- RF radio frequency
- a directional coupler affected here is apparent, for example, from an article published on 5 December 2003 entitled "HF Passive Components" by Prof. DU Gysel, ZHW, Department of Technology, Computer Science and Natural Sciences, Electrical Engineering and Signal Processing, High Frequency Technology, Zurich in the following described in detail Fig. 1 shown schematically.
- directional couplers are formed eagerorig and have two receiving gates (entrance gates) and two transmission ports (exit gates) on.
- the two receiving ports must be as far as possible decoupled from each other.
- the affected in here Directional couplers produced by stripline technology are produced by means of conventional printed circuit board technology.
- substrates with a relatively low dielectric constant and coupling gaps between the two conductors with a very small gap width in the range of about 100 ⁇ m are used in order to achieve the desired high coupling values of more than 15 dB, such as 12 dB.
- the coupling conductor consisting of two galvanically separated strip conductors, forms a first metal layer there.
- a metallic shielding layer is provided in the region of the coupling conductor, which can influence the coupling.
- a shielding layer can also be provided on the opposite side of the coupling conductor.
- a multilayer dielectric filter in which a further layer with a coupling electrode is provided between a ground layer and a layer with two coupling conductors.
- the US 6,294,967 describes a directional coupler, in which a laterally second metal layer has the shape of a transverse in the direction of the two coupling conductor "H" and the "H" -shaped metal layer has two longitudinal sides and a transverse leg which connects the longitudinal legs, the longitudinal legs parallel to the Paired conductors run and have the "H" -shaped metal layer and the coupling conductor both in the direction of a longitudinal extent of the coupling conductor and in the direction perpendicular to the longitudinal extent of the coupling conductor equal axes of symmetry.
- the directional coupler according to the invention is characterized in particular by a multilayer structure in which at least three metal layers and between these at least two dielectric insulating layers are arranged on a substrate, preferably on a printed circuit board.
- the directional coupler layout per se can correspond to the layouts known in the prior art.
- the ground layer does not correspond to a metal layer arranged directly below the conductor structure of the directional coupler, but only to a subsequent metal layer.
- an insulated and specially shaped conductor structure is created on a metal layer arranged therebetween, preferably etched. Due to this structure very small capacitances connected in series are produced, which allow the required coupling and at the same time a very high electrical insulation between said metal layers.
- This structure makes it possible to produce a coupling gap which is larger by a factor of 5 than in the structures known in the prior art.
- said isolated and specially shaped conductor structure has the shape of a transverse "H".
- any other shapes are conceivable, as the simplest form, for example, also a transverse rectangle
- additional structures or structure extensions are provided on the outer sides of the coupling conductor, preferably short trapezoidal structures.
- the reflection properties of the coupling conductors are improved by means of small capacitive structures arranged in the corners of the terminals ("capacitance spots").
- capacitive spots the sum of slightly inductive impedance of the coupling conductor is compensated so that a particularly good impedance matching is made possible at the terminals.
- the directional coupler proposed according to the invention can be produced by means of conventional printed circuit board technology without any production limitation, even under customary etching tolerances.
- the directional coupler has, in particular, a very large coupling value, which would only be feasible in the prior art with considerably high manufacturing and cost outlay.
- the production spread of the directional coupler parameters, in particular the RF-related parameters, thanks to the invention significantly lower.
- the use of inexpensive substrates and cost-effective etching process in the production of the directional coupler underlying structures is possible.
- the Indian Fig. 1 Directional coupler 10 shown schematically in oblique top view represents a parallel line coupler in stripline design, ie, the electrical conductors are formed as thin metallization strips on a substrate 15.
- the substrate 15 is in this case made of a conventional printed circuit board.
- the actual coupler consists of two coupling conductors 20, which run parallel over a length ⁇ / 4. Since the coupling between the two coupling conductors 20 naturally increases with decreasing (lateral) distance between the two conductors, the distance d 'has to be as low as possible in order to achieve a sufficient coupling.
- Such a directional coupler 10 is a passive four-port, which has the property that an input signal at one of the four gates 1 - 4 is passed on only two of the three remaining goals.
- the currents caused by capacitive and inductive coupling are present simultaneously, they can, depending on their phase position, depending on the direction of the current in the one conductor, either adding or canceling each other, which ultimately causes said directional coupling.
- multi-layer directional coupler consists of a printed circuit board 100, which has a plurality of metal layers. These metal layers comprise an uppermost metal layer in the form of copper strips ('TOP-Cu') 105, 110, through which the two coupling conductors 105, 110 required for the directional coupler are formed. The lateral distance between the coupling conductors 105, 110 is again indicated by 'd'. Below the uppermost metal layer 105, 110 and from this by an insulation layer not shown here (see Fig. 3 ) is also a copper strip formed middle metal layer ('Mid-1-Cu') 115 is arranged, which in the present embodiment has the shape of a transverse "H".
- 'Mid-1-Cu' middle metal layer
- the two copper layers 105-115 are drawn in different stripes. Below this middle metal layer 115 is a not shown here (see Fig. 3 ), in turn, from the middle metal layer 115 by a not shown insulation layer galvanically isolated, at ground potential copper ground layer ('Mid-2-Cu') 220th
- the said three metal layers are in each case galvanically separated from one another by dielectric insulation layers, not shown here, which are produced from glass fiber / epoxy substrate material used in printed circuit board technology.
- the metal and insulating layers shown are in the preferred embodiment in the form of a conventional printed circuit board made in per se known etching technique.
- capacitive structures (“capacitance spots") 125 are arranged, by means of which the reflection properties of the coupling conductors 105, 110 are improved.
- capacitive structures the 90 ° internal corners are filled obliquely with the triangular shapes 125 shown.
- other shapes are possible which produce a correspondingly small increase in area, for example a square shape with which, however, a small additional corner is then produced.
- a further embodiment of the directional coupler according to the invention results from exchanging the above-described uppermost 105, 110 and middle metal layers 115. The described operation itself is unaffected.
- the in the Fig. 3 shown lateral sectional view corresponds to a section in the Fig. 2 shown structure along the line marked there, A-A '. From the Fig. 3 the spatial arrangement of the three metal layers 200, 210, 220 is even clearer. The corresponding layer thicknesses of the metal layers 200, 210, 220 can also be seen therefrom.
- the dashed areas 105, 110 correspond to those in the Fig. 2 marked with matching reference numerals two coupling conductors and the two dashed areas 115 of in Fig. 2 also shown, H'-shaped liner. Also, the insulation layers 205, 215, 225 disposed between the metal layers 200, 210, 220 are in the Fig. 3 located.
- the uppermost metal layer 200 serves essentially as a component side, ie for connecting the directional coupler structure shown with further RF components in the field of antenna technology, whereas an additional fourth lowest metal layer 230 serves to the shown directional coupler structure with an externally arranged antenna (not shown here) connect.
- a directional coupler of 11 dB actually manufactured according to the above-described structure had a coupling gap nominal value of 380 ⁇ m. In this case, etching tolerances up to +/- 40 ⁇ m were completely harmless for the proper functioning of the respective directional coupler. Conventional couplers would only have a coupling value of about 20 dB with this specification or would require a small coupling gap of 80 ⁇ m, which can not be manufactured in printed circuit board technology.
- the above-described directional coupler structure according to the invention is preferably provided in the frequency range up to a few GHz and for use on printed circuit boards.
- the above-described structures can be used in principle with all the advantages mentioned, even with special HF substrates at higher frequencies, for example in the 77 GHz, which is frequently used in automotive technology. Equally feasible is an integrated use of the structures in EF ICs at even higher frequencies (122 GHz, 150 GHz).
Landscapes
- Waveguides (AREA)
- Structure Of Printed Boards (AREA)
Claims (7)
- Coupleur pour conduits parallèles en technologie des conducteurs en ruban, qui présente :deux conducteurs de couplage (105, 110) séparés galvaniquement d'une couche de masse (220) placée à un potentiel de masse et dont chacune des extrémités présente une borne de porte (1, 2, 3, 4),une structure multicouches de conducteurs qui présente au moins trois couches métalliques séparées par au moins deux couches diélectriques d'isolation (205, 215), une première couche métallique formant le conducteur de couplage (105, 110) et une deuxième des trois ou plusieurs couches métalliques présentant une structure de conducteurs (115) séparée galvaniquement des deux ou plusieurs autres couches métalliques, disposée spatialement entre les deux ou plusieurs autres couches métalliques (105, 110, 220) et au moyen de laquelle de petites capacités raccordées en série sont formées entre les trois ou plusieurs couches métalliques,
caractérisé en ce quela structure de conducteurs (115) présente la forme d'un "H" disposé transversalement dans la direction des deux conducteurs de couplage, la couche métallique en forme de "H" présentant deux branches longitudinales et une branche transversale qui relie les branches longitudinales,en ce que les branches longitudinales s'étendent parallèlement aux conducteurs de couplage (105, 110),en ce que la couche métallique en forme de "H" et les conducteurs de couplage présentent les mêmes axes de symétrie dans la direction de l'extension longitudinale des conducteurs de couplage et dans une direction perpendiculaire à l'extension longitudinale des conducteurs de couplage,les conducteurs de couplage présentant des surfaces (120) agrandies en forme de trapèze, disposées sensiblement au milieu de la longueur des conducteurs de couplage et s'étendant vers l'extérieur,les structures capacitives (125) d'adaptation d'impédance étant disposées aux sommets des bornes de porte des deux conducteurs de couplage. - Coupleur pour conduits parallèles selon la revendication 1, caractérisé en ce que la structure conductrice multicouches présente la forme d'un substrat diélectrique multicouches.
- Coupleur pour conduits parallèles selon l'une des revendications précédentes, caractérisé en ce que la couche de masse (220) est séparée de la couche métallique du conducteur de couplage (105, 110) par au moins une autre couche métallique (115).
- Coupleur pour conduits parallèles selon l'une des revendications précédentes, caractérisé en ce que des structures conductrices supplémentaires, en particulier des petites structures en trapèze, sont disposées sur les conducteurs de couplage (105, 110).
- Coupleur pour conduits parallèles selon l'une des revendications précédentes, caractérisé en ce que les sommets intérieurs à 90° des bornes de porte (1, 2, 3, 4) des deux conducteurs de couplage (105, 110) sont configurés de manière à obtenir une petite augmentation de surface.
- Coupleur pour conduits parallèles selon la revendication 6, caractérisé en ce que l'augmentation de surface des bornes de porte (1, 2, 3, 4) des deux conducteurs de couplage (105, 110) a la forme d'un étroit triangle ou d'un carré.
- Coupleur pour conduits parallèles selon l'une des revendications précédentes, caractérisé en ce que les trois ou plusieurs couches métalliques sont réalisées en cuivre et en ce que les deux ou plusieurs couches d'isolation (205, 215) sont réalisées en un composite de fibres de verre et d'époxy.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10361834 | 2003-12-30 | ||
DE102004021535A DE102004021535A1 (de) | 2003-12-30 | 2004-05-03 | Richtkoppler in Streifenleitertechnik mit breitem Koppelspalt |
PCT/EP2004/053377 WO2005064740A1 (fr) | 2003-12-30 | 2004-12-09 | Coupleur directionnel a espace de couplage important |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1702386A1 EP1702386A1 (fr) | 2006-09-20 |
EP1702386B1 true EP1702386B1 (fr) | 2009-08-05 |
Family
ID=34740523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04804750A Not-in-force EP1702386B1 (fr) | 2003-12-30 | 2004-12-09 | Coupleur directionnel a espace de couplage important |
Country Status (4)
Country | Link |
---|---|
US (1) | US7525397B2 (fr) |
EP (1) | EP1702386B1 (fr) |
JP (1) | JP4197352B2 (fr) |
WO (1) | WO2005064740A1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101599571A (zh) * | 2008-06-02 | 2009-12-09 | 鸿富锦精密工业(深圳)有限公司 | 定向耦合器 |
DE102009048148A1 (de) * | 2009-06-04 | 2010-12-09 | Rohde & Schwarz Gmbh & Co. Kg | Vorwärtskoppler mit Bandleitern |
US8299871B2 (en) * | 2010-02-17 | 2012-10-30 | Analog Devices, Inc. | Directional coupler |
DE102011080429A1 (de) * | 2011-08-04 | 2013-02-07 | Endress + Hauser Gmbh + Co. Kg | Galvanisch getrennter Richtkoppler |
JP6125274B2 (ja) * | 2013-02-27 | 2017-05-10 | 株式会社東芝 | 電子回路および電子機器 |
US20150061698A1 (en) * | 2013-09-05 | 2015-03-05 | Delphi Technologies, Inc. | Electromagnetic interference (emi) test apparatus |
KR102581252B1 (ko) | 2016-04-22 | 2023-09-22 | 삼성전자주식회사 | 이어폰 인터페이스 및 이를 포함하는 전자 장치 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2151478C2 (de) | 1971-10-15 | 1981-05-07 | Kathrein-Werke Kg, 8200 Rosenheim | Richtungskoppler |
GB2218853A (en) | 1988-05-18 | 1989-11-22 | Philips Electronic Associated | Microwave directional coupler |
JPH02238716A (ja) | 1989-03-13 | 1990-09-21 | Fujitsu Ltd | 位相同期発振回路 |
JPH03295302A (ja) | 1990-04-12 | 1991-12-26 | Tokimec Inc | マイクロストリップ回路の製造方法 |
JPH0567904A (ja) | 1991-09-05 | 1993-03-19 | Matsushita Electric Ind Co Ltd | 分布結合形方向性結合器 |
JP2651336B2 (ja) | 1993-06-07 | 1997-09-10 | 株式会社エイ・ティ・アール光電波通信研究所 | 方向性結合器 |
JPH09116312A (ja) | 1995-10-19 | 1997-05-02 | Murata Mfg Co Ltd | 積層型方向性結合器 |
JP3498597B2 (ja) | 1998-10-22 | 2004-02-16 | 株式会社村田製作所 | 誘電体線路変換構造、誘電体線路装置、方向性結合器、高周波回路モジュールおよび送受信装置 |
JP2003087008A (ja) | 2001-07-02 | 2003-03-20 | Ngk Insulators Ltd | 積層型誘電体フィルタ |
US6642819B1 (en) * | 2001-11-30 | 2003-11-04 | Anokiwave, Inc. | Method and bend structure for reducing transmission line bend loss |
US6759923B1 (en) * | 2002-02-19 | 2004-07-06 | Raytheon Company | Device for directing energy, and a method of making same |
-
2004
- 2004-12-09 US US10/584,971 patent/US7525397B2/en not_active Expired - Fee Related
- 2004-12-09 EP EP04804750A patent/EP1702386B1/fr not_active Not-in-force
- 2004-12-09 WO PCT/EP2004/053377 patent/WO2005064740A1/fr active Application Filing
- 2004-12-09 JP JP2006546153A patent/JP4197352B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2007517442A (ja) | 2007-06-28 |
EP1702386A1 (fr) | 2006-09-20 |
JP4197352B2 (ja) | 2008-12-17 |
US20070296517A1 (en) | 2007-12-27 |
WO2005064740A1 (fr) | 2005-07-14 |
US7525397B2 (en) | 2009-04-28 |
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