EP1656235A1 - Verfahren zur herstellung von bauteilen - Google Patents
Verfahren zur herstellung von bauteilenInfo
- Publication number
- EP1656235A1 EP1656235A1 EP04764169A EP04764169A EP1656235A1 EP 1656235 A1 EP1656235 A1 EP 1656235A1 EP 04764169 A EP04764169 A EP 04764169A EP 04764169 A EP04764169 A EP 04764169A EP 1656235 A1 EP1656235 A1 EP 1656235A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- components
- carrier
- protective layer
- subsequently
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by ultrasonic cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10337920A DE10337920B4 (de) | 2003-08-18 | 2003-08-18 | Verfahren zur Herstellung einer Mehrzahl von Bauteilen und Zwischenprodukt in Form eines Schichtverbundes |
PCT/EP2004/009177 WO2005018874A1 (de) | 2003-08-18 | 2004-08-16 | Verfahren zur herstellung von bauteilen |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1656235A1 true EP1656235A1 (de) | 2006-05-17 |
EP1656235B1 EP1656235B1 (de) | 2010-05-05 |
Family
ID=34201645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04764169A Not-in-force EP1656235B1 (de) | 2003-08-18 | 2004-08-16 | Verfahren zur herstellung von bauteilen |
Country Status (7)
Country | Link |
---|---|
US (1) | US7736995B2 (de) |
EP (1) | EP1656235B1 (de) |
CN (1) | CN1835823B (de) |
AT (1) | ATE466688T1 (de) |
DE (2) | DE10337920B4 (de) |
TW (1) | TWI351389B (de) |
WO (1) | WO2005018874A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005046031B3 (de) | 2005-09-26 | 2007-07-12 | Schott Ag | Verfahren zur Separierung von Teilen aus einem Substrat |
DE102007049935A1 (de) * | 2007-10-18 | 2009-05-07 | Siemens Ag | Verfahren und Vorrichtung zum Vereinzeln von keramischen Grünkörpern |
KR101839453B1 (ko) * | 2011-08-02 | 2018-03-16 | 엘지디스플레이 주식회사 | 플렉시블 디스플레이 장치의 제조 장비 및 제조 방법 |
CN109402683A (zh) * | 2018-12-12 | 2019-03-01 | 常州大学 | 一种预置层和超声相结合的提高涂层结合力方法 |
CN113118962B (zh) * | 2021-03-19 | 2023-11-21 | 廊坊市北方天宇机电技术有限公司 | 机匣外表面抛磨处理方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE668918A (de) | 1965-08-27 | 1900-01-01 | ||
CH557091A (de) | 1968-10-28 | 1974-12-13 | Lucas Industries Ltd | Verfahren zur herstellung von halbleitervorrichtungen. |
CH504783A (de) | 1969-06-20 | 1971-03-15 | Siemens Ag | Verfahren zum Abtrennen eines Körpers von einem scheibenförmigen Kristall und Vorrichtung zur Durchführung dieses Verfahrens |
US4138304A (en) * | 1977-11-03 | 1979-02-06 | General Electric Company | Wafer sawing technique |
EP0279949A1 (de) | 1987-02-11 | 1988-08-31 | BBC Brown Boveri AG | Verfahren zur Herstellung von Halbleiterbauelementen |
US4828052A (en) * | 1988-06-20 | 1989-05-09 | The United States Of America As Represented By The United States Department Of Energy | Ultrasonic drilling apparatus |
JP3263128B2 (ja) * | 1992-06-26 | 2002-03-04 | ローム株式会社 | 薄板ガラスの加工法 |
JP2678966B2 (ja) | 1993-04-22 | 1997-11-19 | カシオ計算機株式会社 | 液晶セルの製造方法 |
DE10016628A1 (de) * | 2000-04-04 | 2001-10-18 | Schott Glas | Verfahren zum Herstellen von kleinen Dünnglasscheiben und größere Dünnglasscheibe als Halbfabrikat für dieses Herstellen |
WO2001098015A2 (de) * | 2000-06-21 | 2001-12-27 | Schott Glas | Verfahren zur herstellung von glassubstraten für elektronische speichermedien |
US6319754B1 (en) * | 2000-07-10 | 2001-11-20 | Advanced Semiconductor Engineering, Inc. | Wafer-dicing process |
US7022546B2 (en) * | 2000-12-05 | 2006-04-04 | Analog Devices, Inc. | Method and device for protecting micro electromechanical systems structures during dicing of a wafer |
-
2003
- 2003-08-18 DE DE10337920A patent/DE10337920B4/de not_active Expired - Fee Related
-
2004
- 2004-08-16 EP EP04764169A patent/EP1656235B1/de not_active Not-in-force
- 2004-08-16 AT AT04764169T patent/ATE466688T1/de not_active IP Right Cessation
- 2004-08-16 WO PCT/EP2004/009177 patent/WO2005018874A1/de active Application Filing
- 2004-08-16 DE DE502004011135T patent/DE502004011135D1/de active Active
- 2004-08-16 CN CN2004800235872A patent/CN1835823B/zh not_active Expired - Fee Related
- 2004-08-16 US US10/567,511 patent/US7736995B2/en active Active
- 2004-08-17 TW TW093124657A patent/TWI351389B/zh not_active IP Right Cessation
Non-Patent Citations (1)
Title |
---|
See references of WO2005018874A1 * |
Also Published As
Publication number | Publication date |
---|---|
ATE466688T1 (de) | 2010-05-15 |
TWI351389B (en) | 2011-11-01 |
CN1835823B (zh) | 2011-02-09 |
CN1835823A (zh) | 2006-09-20 |
DE10337920B4 (de) | 2008-08-28 |
WO2005018874A1 (de) | 2005-03-03 |
DE10337920A1 (de) | 2005-03-17 |
US7736995B2 (en) | 2010-06-15 |
TW200523220A (en) | 2005-07-16 |
EP1656235B1 (de) | 2010-05-05 |
DE502004011135D1 (de) | 2010-06-17 |
US20070170597A1 (en) | 2007-07-26 |
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