Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28D—WORKING STONE OR STONE-LIKE MATERIALS
  • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
  • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
  • B28D5/047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by ultrasonic cutting
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
  • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency

Definitions

• the invention relates to a process for the production of a plurality of separate components in general and a process for the production of glass plates, e.g. Windows for optical components in particular.
• Glass is suitable as a contact or cover material in many areas of application.
• glass is difficult to machine, which is particularly disadvantageous when very small components such as Windows for optocaps are to be produced.
• Anti-reflective coating with a variety of extremely thin and different layers called. Under certain circumstances, these coatings are particularly sensitive to scratches due to their mechanical properties.
• the object of the invention is therefore to provide a method for producing components which is inexpensive and at the same time high Component quality achieved.
• Another object of the invention is to provide such a method, which is particularly suitable for very small components, e.g. Glass plate, suitable.
• Another object of the invention is to provide such a method which enables the simultaneous and efficient production of a large number of components.
• a laterally uniform or one-piece flat substrate is provided.
• laterally in one piece means that the substrate, which extends in a lateral plane, forms a structural unit in the substrate plane in this process stage.
• the substrate is preferably single-layered across the plane, but it can also be multi-layered.
• the substrate also has a first and a second surface, which in particular extend along the lateral plane and lie parallel opposite one another.
• a flat carrier which has a first and a second, preferably parallel and has opposite surfaces.
• the first surface of the carrier is connected to the first surface of the substrate in a planar and detachable manner, so that the substrate and the carrier form a layer composite in which the carrier and the substrate are arranged in particular parallel to one another.
• a multiplicity of components are produced from the substrate by working the components out of the substrate, in particular separating or cutting them out.
• the substrate is divided into a plurality of laterally adjacent sections, laterally separate components being produced.
• the components are held together at least immediately after they have been worked out, although in particular they are laterally completely separated from one another, in that the components are or remain attached to the carrier and the carrier is not or at least not completely divided.
• the orientation and the position of the components is consequently obtained by the attachment to the carrier.
• an intermediate product is thus produced in the form of a layer composite, which comprises a plurality of laterally separated components and a common flat carrier, the components being releasably fastened laterally adjacent to the common carrier.
• the components are only detached from the carrier in a further work step, if appropriate with the interposition of further work steps, to finally separate or separate the components while eliminating cohesion.
• This step can advantageously be carried out even under clean room conditions.
• the method according to the invention is particularly suitable for the production of very small and thin glass plates, e.g. made of display glass and / or with a diameter ⁇ 5 mm.
• Such glass plates are e.g. used for so-called optocaps to encapsulate optical components.
• the processing time is advantageously short.
• a carrier film in particular made of plastic, is preferably laminated onto the glass substrate as the carrier or vice versa. It should be noted here that the carrier provides sufficient stability, since it later has to temporarily hold the glass plates together. Furthermore, the connection is releasable in order to subsequently separate the plates.
• a carrier film has proven particularly useful, the adhesive force of which can be released by UV light.
• Such films advantageously leave no soiling on the component surface and prevent the optical functional surface from being scratched during processing and handling of the intermediate product.
• the detachment of the components from the carrier is therefore preferably carried out in two stages, the adhesive force being released first and the components then being picked.
• the working out of the components is preferably carried out as section-by-section removal of the substrate material. In this case, work is carried out transversely to the substrate plane from the second surface of the substrate at least to the first surface of the substrate, optionally into the carrier film. Abrasive or abrasive removal methods are particularly suitable, in which annular structures are worked out in order to produce and separate the sections within the annular structure. It should be noted here that the carrier film should not be completely ground through, so that its function as a carrier which holds together is advantageously retained.
• a plurality of laterally adjacent components are preferably simultaneously machined out of the substrate or laterally separated from one another in one work step.
• the components are particularly preferred by means of
• Vibrating lapping especially ultrasonic vibrating lapping, worked out in a structured manner.
• the components are punched out of the substrate with a plurality of hollow lapping dies, with exactly one lapping die being assigned to each component to be produced.
• a lapping tool is used which has a plurality of laterally adjacent lapping dies which process the composite element in the same work step.
• An array or a matrix is preferably composed of many, for example several hundred to thousand, lapping dies on a sonotrode attached.
• the ultrasonic vibratory lapping is carried out in particular without stacking or connecting the glass substrates, so that the risk of damage to the components can advantageously be reduced.
• lapping stamp is adapted to the shape of the components to be manufactured.
• the lapping process can thus be advantageously adapted to the respective requirement.
• lapping dies are each provided with a closed ring, e.g. circular cross-section, i.e. in particular tubular lapping dies in the form of a hollow body or cylinder open at the bottom, in order to e.g. to get circular glass plates.
• the working out of the components can also be carried out by blasting with a blasting material, for example by means of sand blasting, the material of the substrate being removed between the components to be produced by the blasting.
• a blasting material for example by means of sand blasting
• the substrate is covered in regions, for example with structured photoresist or a solid mask, in particular a metal mask, before the irradiation.
• the second surface of the substrate for example while the substrate and the carrier are still connected, can be structured before, after or simultaneously with the working out of the components. For example, depressions, cavities, etc. are produced in the substrate.
• the advantage of sandblasting lies in the fact that there is no need to produce a mold. Furthermore, the position accuracy, e.g. high using a photolithographic mask. The dimensions of the components or structures are not limited by the tool geometry.
• the components are detached from the carrier, in particular after they have been worked out.
• the components are picked from the carrier by means of vacuum.
• the method according to the invention proves to be particularly advantageous if a solder, e.g. a solder paste is to be applied, e.g. subsequently solder the windows onto a corresponding optical component.
• a solder e.g. a solder paste
• solder is used in particular as a structured solder layer, e.g. printed on the second substrate surface using screen printing technology.
• a structured solder layer e.g. printed on the second substrate surface using screen printing technology.
• other structured functional layers can also be applied or printed on.
• a protective layer for example a protective lacquer, which advantageously protects the surface from damage, is preferably applied, in particular before the components are worked out and / or after the solder has been applied, to the second surface of the substrate or to the solder layer.
• the substrate or glass substrate is provided with a coating, for example an anti-reflective coating, for example on its first or second surface. Either the protective lacquer is applied to the coating in order to protect it or the coating is protected by the carrier film.
• the protective layer is divided into a multiplicity of sections which are separate from one another, each section being assigned to a specific component.
• the solder layer is divided immediately before, but in the same step as working out the components into laterally adjacent and separate sections. As a result, after the components have been worked out and before the components have been detached from the carrier, the solder layer is divided into a plurality of laterally adjacent and separate sections, each section being assigned to exactly one specific component.
• the protective layer is furthermore preferably removed, in particular after the working out and / or before the components are separated from the carrier or before the separation, for example by means of a continuous or ultrasonic washing machine.
• the protective layer is therefore removed in particular from the flat substrate or substrate-carrier composite. In this way, damage to the substrate surface can advantageously be largely avoided and the removal is considerably less complex compared to removal on the individual component.
• the latter is particularly advantageous in the case of components with small dimensions, for example with a diameter of ⁇ 5 mm and the associated low weight.
• FIG. 1 shows a schematic cross section according to an embodiment of the invention
• FIG. 2 shows a schematic cross section of the embodiment from FIG. 1 in a later process stage
• FIG. 3 shows a schematic view of the embodiment from FIG. 2 in a later process stage
• FIG. 4 shows a schematic cross section according to a further embodiment of the invention
• FIG. 5 shows a schematic cross section of the embodiment from FIG. 4 in a later process stage
• FIG. 6 shows a top view of the embodiment from FIG. 5
• FIG. 7 shows a flow diagram of an embodiment of the method according to the invention
• FIG. 8 shows a flow diagram of a further embodiment of the method according to the invention.
• FIG. 1 shows a composite element 8 comprising a glass substrate 10 with a laminated-on plastic film 12, the lower surface 10a of the glass substrate 10 and the upper surface 12a of the plastic film 12 being connected to one another in a detachable manner.
• a protective lacquer 14 is applied to an upper surface 10b of the substrate 10. With a lower surface 12b of the carrier film 12, the composite element 8 can e.g. be placed on a worktop.
• the lapping dies 20 are excited by a sonotrode via a common holder 22 for ultrasonic oscillation and are acted upon in the direction of arrow 24. Due to their shape, the lapping dies 20 remove the material of the protective lacquer 14, the substrate 10 and the carrier film 12 in sections, more precisely in an annular manner, in order to pierce a large number of components 16 from the substrate 10. The substrate 10 is thus processed over the entire surface in one work step.
• the lapping dies 20 are shown in Fig. 1 in a position in which they along the force application direction 24 or transverse to the
• FIG. 2 shows the composite element 8, consisting of the substrate 10, the carrier film 12 and the protective layer 14, after which the components 16 have been worked out by means of the lapping dies 20 and the lapping dies 20 have been removed.
• the composite element 8 consisting of the substrate 10, the carrier film 12 and the protective layer 14, after which the components 16 have been worked out by means of the lapping dies 20 and the lapping dies 20 have been removed.
• Fig. 2 shows the composite element 8, consisting of the substrate 10, the carrier film 12 and the protective layer 14, after which the components 16 have been worked out by means of the lapping dies 20 and the lapping dies 20 have been removed.
• the recess 28 completely penetrates the protective layer
• FIG. 3 shows a top view of the composite element 8 from FIG. 2 after the protective layer 14 has been removed or washed off.
• the upper surface 10b of the substrate 10 is thus exposed both on the components 16 and on the spaces 18 between the components 16.
• the carrier film 12 is exposed in the annular recesses 28 which have been worked out by the lapping dies.
• the composite element 8' differs from the composite element 8 only in that under the protective layer 14 a solder layer 32 is printed in the form of a plurality of annular solder rings is.
• the solder layer 32 has been structured printed and dried as a solder paste before the protective layer 14 is applied by means of screen printing. In order to increase the adhesion of the solder layer to the substrate, the solder layer can additionally be pre-vitrified.
• FIG. 5 shows a cross section through the composite element 8 'after the protective layer 14 has been removed, the composite element 8' also comprising the substrate 10, the carrier film 12 and the solder layer 32. 6, a top view of the composite element 8 'is shown. The components 16 cleaned from the protective layer 14 can be seen, each with a solder ring 32 on the upper surface 10b.
• the working out of the components 16 is carried out without a so-called stacking.
• the solder pastes can be applied inexpensively with a structured screen printing in order to form the solder rings 32. The cut is made after the solder paste has been applied.
• solder rings are used for example on windows of optocaps for semiconductor lasers or LEDs for soldering.
• the solder is therefore applied in the edge region of the optical component or the window 16.
• FIG. 7 a flow diagram for the method according to the invention using ultrasonic vibrating lapping is shown.
• the carrier film is laminated onto the glass substrate.
• the solder paste for producing the solder structures or solder rings 32 is optionally printed on and then dried.
• the protective lacquer 14 is then optionally applied. Subsequently, as shown in FIG. 4, the components or optocaps 16 are worked out into the carrier film 12 by means of ultrasonic vibratory lapping with a shaping tool which comprises the lapping dies 20.
• the protective lacquer if present, is then removed again, for example in an ultrasonic washing machine.
• the carrier film 12 is then irradiated with UV light, as a result of which the adhesive force on the substrate 10 is released, ie weakened, without the carrier film being separated from the substrate 10.
• the optocaps 16 are then picked off the carrier film 12.
• the elaborate handling of the small opto-windows 16 up to the point of picking off the carrier film is thus eliminated.
• FIG. 8 a flow diagram for the method according to the invention, similar to FIG. 7, is shown.
• Fig. 8 differs in that instead of
• Ultrasonic vibratory lapping is used to work out the optocaps using sandblasting.
• a photoresist is applied to the upper surface 10b of the substrate 10 and structured photolithographically. After structuring, the annular recesses 28 are exposed around the optocaps 16. Now the substrate material is removed from the upper surface 10b by means of sandblasting, at least until the upper surface 12a of the carrier film 12 is reached. The photoresist is then removed and the process continues as shown in FIG. 7.

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Joining Of Glass To Other Materials (AREA)
• Surface Treatment Of Glass (AREA)
• Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
• Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
• Glass Compositions (AREA)
• Compositions Of Oxide Ceramics (AREA)
• Laminated Bodies (AREA)

Applications Claiming Priority (2)

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• 2003
  • 2003-08-18 DE DE10337920A patent/DE10337920B4/de not_active Expired - Fee Related
• 2004
  • 2004-08-16 AT AT04764169T patent/ATE466688T1/de not_active IP Right Cessation
  • 2004-08-16 EP EP04764169A patent/EP1656235B1/fr not_active Not-in-force
  • 2004-08-16 WO PCT/EP2004/009177 patent/WO2005018874A1/fr active Application Filing
  • 2004-08-16 US US10/567,511 patent/US7736995B2/en active Active
  • 2004-08-16 DE DE502004011135T patent/DE502004011135D1/de active Active
  • 2004-08-16 CN CN2004800235872A patent/CN1835823B/zh not_active Expired - Fee Related
  • 2004-08-17 TW TW093124657A patent/TWI351389B/zh not_active IP Right Cessation

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