EP1614150A2 - Vorrichtung und verfahren zum reinigen von bei der herstellung von halbleitern verwendeten gegenständen, insbesondere von transport- und reinigungsbehältern für wafer - Google Patents
Vorrichtung und verfahren zum reinigen von bei der herstellung von halbleitern verwendeten gegenständen, insbesondere von transport- und reinigungsbehältern für waferInfo
- Publication number
- EP1614150A2 EP1614150A2 EP04762977A EP04762977A EP1614150A2 EP 1614150 A2 EP1614150 A2 EP 1614150A2 EP 04762977 A EP04762977 A EP 04762977A EP 04762977 A EP04762977 A EP 04762977A EP 1614150 A2 EP1614150 A2 EP 1614150A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- treatment chamber
- objects
- rotor
- condensation dryer
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 45
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 235000012431 wafers Nutrition 0.000 title claims abstract description 16
- 238000009833 condensation Methods 0.000 claims abstract description 67
- 230000005494 condensation Effects 0.000 claims abstract description 67
- 239000007788 liquid Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 239000007921 spray Substances 0.000 claims description 44
- 238000001035 drying Methods 0.000 claims description 31
- 239000003990 capacitor Substances 0.000 claims description 23
- 238000001816 cooling Methods 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000002826 coolant Substances 0.000 claims description 8
- 239000000110 cooling liquid Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 22
- 239000003570 air Substances 0.000 description 21
- 238000010438 heat treatment Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 230000000875 corresponding effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 2
- 241000478345 Afer Species 0.000 description 1
- 241000446313 Lamella Species 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/093—Cleaning containers, e.g. tanks by the force of jets or sprays
- B08B9/0933—Removing sludge or the like from tank bottoms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/0861—Cleaning crates, boxes or the like
Definitions
- Device and method for cleaning objects used in the production of semiconductors in particular transport and cleaning containers for afer
- the invention relates to a device for cleaning objects used in the production of semiconductors, in particular transport and cleaning containers for wafers, wafers, LCD substrates and photomasks, in which the objects are cleaned in a treatment chamber by means of a liquid and then dried, and first means for moving a gas within the treatment chamber are provided in the treatment chamber.
- the invention further relates to a method of purifying during the production, articles used in semiconductor, especially transport and cleaning containers for wafers, wafers, LCD substrates and photomasks, wherein the articles cleaned in a treatment chamber by means of a liquid and then dried, moving a gas within the treatment chamber.
- the objects are dried by means of a hot air stream.
- ambient air is drawn in, heated, filtered and introduced into the treatment chamber.
- the heated drying air is circulated in the treatment chamber by the rotation of the objects on the rotor rotating in the treatment chamber. It is then discharged from the treatment chamber.
- This procedure has the disadvantage that, as a result of the external heating of the drying air, only a limited efficiency in drying can be achieved. Furthermore, the supply of outside air always has the disadvantage that foreign particles can be introduced into the treatment room even though the air is filtered. When filtering, you always have to make a compromise between the effectiveness of the filter on the one hand and the amount of air that can be carried through on the other.
- a method for drying electronic components is known from EP 0 454 873 A1, in which the components are cleaned in a chamber by means of water vapor.
- the water vapor condenses on a condenser and flows out as condensate via a line. Only then are the components dried, using a drying gas that is supplied from the outside. This process therefore has the same disadvantages as mentioned above, because here too, foreign particles are inevitably introduced by the drying gas.
- DE 42 08 665 AI discloses a method for drying machine parts which are contaminated with processing residues containing oil or fat.
- the machine parts are cleaned in a cleaning chamber by spraying with a cleaning liquid.
- air is blown into the cleaning chamber and returned to a blower via a pipe system in the circuit.
- condensers are used at various points in pipelines in order to condense solvent residues which are in vapor form in the corresponding pipeline sections.
- the invention is based on the object of developing a device and a method of the type mentioned at the outset in such a way that the disadvantages mentioned above are avoided.
- an optimal drying of the Objects are made possible without contamination resulting from the supply of outside air.
- this object is achieved according to the invention in that the treatment chamber can be locked, that the first means circulate the gas in the closed treatment chamber, and that a condensation dryer for the gas is also provided in the treatment chamber.
- the object is achieved in that the treatment chamber is closed and that the gas is circulated within the closed treatment chamber and dried by means of condensation.
- Treatment chamber can be condensed.
- Treatment chamber circulated gas "removed the moisture so that the objects are effectively dried.
- a heat exchanger is arranged next to the treatment chamber and the condensation dryer is connected to the heat exchanger via a closed circuit.
- This measure has the advantage that, with a certain additional outlay in terms of apparatus, the device as a whole operates autonomously and is not dependent on the supply and removal of external coolants.
- the condensation dryer can also be connected to an external coolant source via a feed line connection.
- the condensation dryer has at least one capacitor plate.
- This measure has the advantage that the circulating air laden with moisture within the treatment chamber can sweep along a relatively large area of the capacitor plate, so that effective condensation and thus drying is possible.
- capacitor plates are used which are connected in parallel to a supply line or a discharge line for a coolant.
- This measure has the advantage that, on the one hand, a larger condensation area is available, and on the other hand, as a result of the parallel connection, all the capacitor plates are cooled equally.
- a good effect is also achieved in that the objects are arranged in the treatment chamber on a rotor which can be rotated about an axis, and the at least one capacitor plate is arranged inclined by a predetermined angle to a radial plane of the axis.
- This measure has the advantage that the gas circulated in the treatment chamber is impressed with a helical movement, so that a defined circulation is created. Depending on the spatial arrangement of the capacitor plates, this can lead to a laminar flow over the objects to be dried, for example when the obliquely arranged capacitor plates are located in the band area of the treatment chamber.
- guide elements inclined to the radial plane can additionally be arranged on an inner wall of the treatment chamber.
- This measure has the advantage that the entire inner wall of the treatment chamber can be thread-like due to the inclined capacitor plates and the inclined guide elements. This causes a helical gas flow in the area of the chamber, which closes via a counterflow axially directed in the center of the chamber.
- spray nozzles for a cleaning or rinsing liquid are arranged on an inner wall of the treatment chamber.
- the spray nozzles are preferably arranged in the region of corners of the treatment chamber.
- the objects in the treatment chamber are arranged on a rotor which can be rotated about an axis and the axis runs essentially in the center of the treatment chamber, the spray nozzles are preferably directed towards the axis.
- At least one further spray nozzle is provided, which when the rotor is rotating it is held in a retracted position outside the rotor and when the rotor is stationary it can be moved radially into an advanced position in the area of the objects held in the rotor.
- infrared radiators for drying the objects are provided in the treatment chamber in a manner known per se.
- one or more infrared emitters can be arranged in the center of the treatment chamber or on an inner wall of the treatment chamber.
- the infrared radiators are not directed towards the condensation dryer.
- the treatment room is essentially rectangular in horizontal section and accessible via two doors arranged in opposite side walls.
- This measure has the known advantage that the objects can be loaded from one side of the device and unloaded from the other side of the device.
- the treatment room it is also possible for the treatment room to be essentially rectangular in horizontal section and only accessible via a door arranged in a side wall.
- This measure has the advantage that less equipment is required for the device.
- the objects in the treatment chamber are arranged on a rotor which can be rotated about an axis, the first means circulate the gas in the closed treatment chamber, and in the treatment chamber there are also a condensation dryer for the gas and second means for cooling the Condensation dryer provided.
- the treatment chamber is closed and the gas is circulated within the closed treatment chamber and dried by condensation, the condensation dryer being cooled at least before the start of drying.
- condensation dryer can remain switched off as long as the objects are cleaned with hot liquids. These hot liquids reach the condensation dryer at the latest when the objects rotated on the rotor are spun off by centrifugal force and heat up the heat exchange medium located therein. If the condensation dryer continued to run during this phase of the cleaning process, energy would be used unnecessarily to cool the heat exchange medium. This would also mean that the condensation dryer must be connected to a cooling unit with a very high cooling capacity.
- the heating power of the treatment chamber is typically of the order of 18 kW, whereas for the cooling unit assigned to the condensation dryer, one would like to assign a power of only about a tenth of this.
- the temperature of the condensation dryer can be influenced in an active or passive manner. In any case, it is achieved according to the invention that at the beginning of the drying process the condensation dryer is at a temperature which is far below the temperature of the hot cleaning liquid. This is the only way to ensure that condensation drying can begin immediately or at least in full for a very short time. As already mentioned, the cooling of the condensation dryer can be effected in a passive as well as in an active manner.
- this passive cooling is achieved in that the second means are designed as a spray protection wall arranged between the rotor and the condensation dryer.
- This measure has the advantage that the heating up of the condensation dryer is prevented at all by the hot cleaning liquid that is thrown off, because the drops of the hot cleaning liquid that are thrown off do not come into contact with the condensation dryer at all because of the spray protection wall arranged in between.
- the condensation dryer does not heat up or only noticeably, and is therefore available at the beginning of the drying process immediately or at least in a very short time at its low operating temperature, in which the circulated moisture is precipitated on the elements of the condensation dryer.
- the splash guard wall has slats which are arranged in the manner of blinds.
- This measure has the advantage that the air movement within the treatment chamber is not or only minimally disturbed by the splash guard wall, but on the other hand the drops of the hot cleaning agents thrown off by the rotating objects liquid can be intercepted by the slats of the Venetian blind-like splash guard.
- the condensation dryer has a plurality of capacitor plates which are inclined by a predetermined angle to the radial plane of an axis of rotation of the rotor and the fins are arranged parallel to the capacitor plates.
- This measure initially has the advantage that the gas or air circulated in the treatment chamber is subjected to a helical movement, so that a defined circulation is created. Depending on the spatial arrangement of the capacitor plates, this can lead to a laminar flow over the objects to be dried, for example when the obliquely arranged capacitor plates are located in the edge region of the treatment chamber.
- the parallel alignment of the lamellae to the oblique arrangement of the capacitor plates has the advantage that they are also optimally protected in the aforementioned oblique position.
- the condensation dryer is actively cooled. This is preferably done in that the second means are designed as cooling spray nozzles directed towards the condensation dryer.
- This measure has the advantage that the cooling capacity of the cooling unit, which should be kept relatively low for the reasons mentioned, does not have to be used to cool the condensation dryer. Rather, the cold water already installed in the treatment chamber is used to directly to effect te cooling of the condensation dryer via the cooling spray nozzles mentioned.
- spray nozzles directed towards the objects are arranged on an inner wall of the treatment chamber, and that the second means comprise a control which first applies a cooling liquid to the spray nozzles and then the rotor in rotation added.
- This measure has the advantage that the spray nozzles which are expedient anyway for the cleaning process and are directed at the objects are also used for direct cooling of the condensation dryer.
- a separate phase of the cleaning process is to be provided, in which the objects are rinsed off again with cold water after cleaning has been completed.
- the cooling is therefore effected in exactly the same way as the heating by spinning off the hot cleaning liquid before.
- the device according to the invention and the method according to the invention can be used for cleaning different objects. Baskets for semiconductor products or semiconductor products themselves are preferred. Semiconductor products are preferably wafers, LCD substrates or photomasks without the application the invention is limited to these special semiconductor products.
- Fig. 1 shows a first embodiment of a device according to the invention, in a side view, namely a sectional view along the line I-I of Fig. 3;
- FIG. 2 shows the device according to FIG. 1 in a side view rotated 90 ", likewise in section, along the line II-II of FIG. 3;
- FIG. 3 shows a plan view of the device according to FIGS. 1 and 2, likewise in section, along the line III-III of FIG. 2; 4 shows a representation similar to FIG. 3, but for a second exemplary embodiment of a device according to the invention;
- FIG. 5 shows, on a somewhat enlarged scale, a section from FIG. 1, but for a variant of a device according to the invention of a spray protection wall;
- FIG. 6 shows an extremely schematic side sectional view of a first exemplary embodiment of a Venetian blind-like splash guard wall
- FIG. 7 shows a representation similar to FIG. 6, for a further variant of a louver-like splash guard wall
- FIG. 8 is a side view of the splash guard from FIG. 7, the illustration according to FIG. 7 being a sectional illustration along the line VII-VII of FIG. 8.
- FIGS. 1 to 3 designates a cleaning device for objects, as are used in the semiconductor industry in the production of semiconductors.
- the cleaning device 10 has a cuboid housing 12 which is arranged on a floor 16 via feet 14.
- the housing 12 extends in the vertical direction along an axis 17. It has a front side wall 18, a rear side wall 20, a right side wall 22 and a left side wall 24. Inside, the housing 12 is divided by an upper intermediate wall 26 and a lower intermediate wall 28. This creates an upper housing part 30, a middle one Housing part 32 and a lower housing part 34.
- the illustration in the figures is of course to be understood only schematically. The details of the housing 12, connecting means and the like are not shown for the sake of clarity.
- the housing 12 is provided with two doors, namely with a right door 36 in the right side wall 22 and an opposite left door 38 in the left side wall 24.
- Arrows 37 and 39 indicate that at opened doors, as indicated by 36 'and 38' for the state of partial opening, the cleaning device 10 can be loaded in a throughput process.
- the objects to be cleaned are fed in the direction of arrow 37 through the opened door 36 and the cleaned objects are discharged in the direction of arrow 39 through the opened door 38.
- the middle housing part 32 surrounds a treatment chamber 40.
- a rotor 42 which can be driven by means of a shaft 44.
- the shaft 44 extends along the vertical axis 17.
- the rotor 42 has an upper holder 46 and a lower holder 48, between which the objects to be cleaned are held by means of suitable holding means.
- three levels of baskets 50 are held between the holders 46 and 48.
- a total of four baskets 50 are provided in each plane, each of which is arranged offset by 90 ° around the shaft 44.
- the baskets 50 are baskets such as those for handling and Transporting wafers or other semiconductor products can be used.
- the rotor 42 can be set in rotation.
- it is connected via a drive shaft 54 to a motor 56 which is located in a drive chamber 58 in the upper housing part 30.
- the direction of rotation of the motor 56 is preferably switchable.
- the housing 12 is essentially rectangular or square, at least in the region of the treatment chamber 40.
- the corners 61a, 61b, 61c, 61d of the treatment chamber 40 in the illustrated embodiment in the three corners 61a, 61b and 61c, there are spray nozzles 60a, 60b and 60c.
- the spray nozzles 60a to 60c are directed towards the center of the treatment chamber 40, that is to say towards the axis 17 or the shaft 44.
- the feed lines and supply devices of the spray nozzles 60a to 60c are known per se and are not shown for the sake of clarity.
- infrared emitters 62a, 62b, 62c are located within the treatment chamber 40.
- the infrared emitter 62a is arranged in the region of the shaft 44, while the infrared emitters 62b and 62c are located on the front side wall 18.
- the infrared emitters 62a to 62c are also known per se and are therefore not shown in further detail.
- a condensation dryer 64 is now provided in the treatment chamber 40, specifically in the area of the rear side wall 20.
- the condensation dryer 64 preferably contains several capacitor plates, in the embodiment shown Example of a total of nine capacitor plates 66a, 66b, 66c, 66d, 66e, 66f, 66g, 66h and 66i.
- the capacitor plates 66a to 66i are arranged inclined at a predetermined angle ⁇ with respect to a radial plane with respect to the axis 17, as can be clearly seen from FIG. 2.
- the angle ⁇ is, for example, between 10 ° and 30 °, preferably 20 °.
- the capacitor plates 66a to 66i are connected on one side, in the exemplary embodiment shown on their respective lower side, to a common supply line 68 and on their opposite side to a common discharge line 70, so that they are connected in parallel in terms of flow technology.
- the feed line 68 and the discharge line 70 are connected to a heat exchanger 72 in a closed circuit.
- the supply line 68 and the discharge line 70 are each connected to an external supply connection 74 and a discharge connection 76, so that the coolant can be supplied or removed externally.
- the operation of the cleaning device 10 is as follows:
- the empty rotor 42 is loaded via the right door 36.
- the rotor 42 is expediently rotated in four steps, each at 90 °, so that three baskets 50 can be loaded one above the other. This can be done manually or using an appropriate handling device until finally all three levels are each equipped with four baskets.
- objects other than baskets 50 can of course also be loaded, or that a mixed load can be provided in which, for example, the two lower levels are loaded with baskets and the upper level with flat objects.
- the right door 36 is closed.
- the rotor 42 is now set in rotation by switching on the motor 56.
- a cleaning liquid is directed onto the objects to be cleaned, for example the baskets 50, via the spray nozzles 60a to 60c.
- This cleaning process can be followed by a rinsing process in which a rinsing liquid is sprayed in via the spray nozzles 60a to 60c. It goes without saying that different spray nozzles can also be used for supplying the cleaning liquid and a rinsing liquid.
- the cleaning device 10 has a cuboid treatment chamber 40 with an edge length of 125 cm.
- the cleaning / rinsing takes place in two steps of, for example, 20 and 40 seconds, wherein purified water at a temperature of 50 ° is used and the rotor 42 is rotated at 20 min "1 .
- the rotor 42 is first set into a rapid rotation of, for example, 200 min ⁇ 1 , and specifically for two intervals of 30 seconds each. This rapid rotation of the rotor 42 causes the the baskets 50 cleaning or rinsing liquid is partially thrown off by centrifugal force.
- the temperature in the treatment chamber 40 is preferably kept at a constant temperature, for example at 55 ° C., during the entire cleaning and drying process.
- the total duration of the process is preferably ten to twelve minutes.
- the rotation of the rotor 42 causes the gas, for example the air, to be circulated within the closed treatment chamber 40.
- the oblique position of the capacitor plates 66a to 66i imparts a helical movement component to the gas flow in the region of the rear side wall 20. This is indicated in FIG. 2 by arrows 80.
- This helical movement of the gas in the wall area leads to a radially directed flow in the floor and ceiling area, as indicated by an arrow 82 in Fig. 1.
- the flow then closes by means of an axial flow in the region of the shaft 44, as illustrated by an arrow 84 in FIG. 1.
- a reversal of the direction of rotation of the rotor 42 also results in a reversal of the direction of flow (arrows 80, 82 and 84).
- the reversal of the direction of rotation of the rotor 42 also has the effect, in particular, that during the current standstill of the rotor 42 at the zero crossing of the movement, those liquid components which are in corners, blind bores and the like of the baskets 50 can leak out due to the influence of gravity, and then dry off in the subsequent drying interval to become.
- an inner wall 85 of the front side wall 18 can be provided with guide elements 86 in order to support the helical conduction of the gas within the treatment chamber 40.
- guide elements 86 can of course also be provided on the other inner walls of the treatment chamber 40.
- FIG. 4 shows a further exemplary embodiment of the invention with a cleaning device 90 and a treatment chamber 91 which is rectangular in plan view.
- a rotor 92 for baskets 94 is also provided here, as is a condensation dryer 95 in the treatment chamber 91.
- the special feature of the exemplary embodiment according to FIG. 4 consists of the following:
- the cleaning device 90 is provided with a further spray nozzle 96.
- This spray nozzle 96 is in the position shown in solid line in FIG. 4 in a retracted position outside the movement path of the rotor 92, so that the latter can rotate undisturbed by the spray nozzle 96.
- the rotor 92 can be stopped during or at the end of the cleaning process, in a rotational position in which a basket 94 or a plurality of baskets 94 arranged one above the other are located directly in front of the spray nozzle 96 or several spray nozzles 96 arranged one above the other.
- the spray nozzle 96 now moves into the advanced position shown in broken lines in FIG. 4 in order to spray out the inside 98 of the basket 94 when the rotor 92 is at a standstill.
- the spray nozzle 96 then moves back again, the rotor 92 rotates through 90 ° and the spray nozzle 96 moves forward again to spray the next basket 94 of the same level on the inside thereof, etc.
- FIG. 4 shows an enlarged detail from the illustration according to FIG. 1, but in a modified illustration to explain exemplary embodiments of the invention.
- a splash guard 104 is provided between the rotor 42 and the condensation dryer 64.
- This splash guard 104 can be designed, for example, as a continuous sheet metal plate.
- the drops 106 fly freely onto the condensation dryer 64 and heat up its fins.
- the condensation dryer 64 would therefore either have to be constantly cooled or at least be cooled down at the end of the cleaning process before it has again reached the low operating temperature required for the condensation drying.
- This direct heating of the condensation dryer 64 is achieved according to the invention by the provision of the splash guard 104 passively prevented because the hot drops 106 do not reach the condensation dryer 64.
- the condensation dryer 64 can also be cooled directly. This is done, for example, by means of cooling spray nozzles, of which only one is drawn at 110 in FIG. 5. Of course, several such cooling spray nozzles 110, in particular one or two in each case, can also be provided for each lamella of the condensation dryer 64.
- the cooling spray nozzles 110 can be provided regardless of whether a splash guard 104 is provided or not.
- the cooling spray nozzles 110 are switched on at the end of the cleaning process and bring about direct cooling of the fins of the condensation dryer 64 by dissipating heat.
- a corresponding effect can be achieved in a further variant of the invention by working without a splash guard 104.
- the baskets 50 are sprayed with a cold liquid which is spun off by the rotation of the rotor 42, as was shown above in the case of a hot cleaning liquid.
- the condensation dryer 64 is acted upon by centrifuged cold drops of the cooling liquid and is thus also actively cooled.
- splash protection wall 104 is provided, this should of course not, or as little as possible, hinder the desired flow of gas and air in the treatment chamber, which is indicated in an arrow 82. For this reason, it is particularly preferred in the context of the present invention if the splash protection wall 104 is designed in the manner of a blind, as is shown in two variants in FIGS. 6 and 7.
- FIG. 6 shows a first variant of a splash protection wall 104 ′ with slanted individual slats 112.
- FIG. 7 shows another variant of a splash protection wall 104 ′′, in which lamellar elements 116 are punched and bent from a continuous sheet 114, which is also clearly shown in FIG. 8, which is easier to manufacture and assemble compared to the exemplary embodiment 6, allows.
- the lamella-like elements 116 are arranged inclined to a radial plane of the rotor 42, namely by the same angle ⁇ as the lamellae of the condensation dryer 64 (cf. FIG. 2 with the associated description).
- the condensation dryer is not accommodated in a side wall, but e.g. on the floor or ceiling of the treatment chamber. Furthermore, it is not essential that the rotor can be rotated about a vertical axis, because horizontal axes of rotation are also conceivable.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Drying Of Solid Materials (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003117275 DE10317275A1 (de) | 2003-04-11 | 2003-04-11 | Vorrichtung und Verfahren zum Reinigen von bei der Herstellung von Halbleitern verwendeten Gegenständen |
DE10347464A DE10347464B4 (de) | 2003-10-02 | 2003-10-02 | Vorrichtung und Verfahren zum Reinigen und Trocknen von Halbleitererzeugnissen oder von bei der Herstellung von Halbleitererzeugnissen verwendeten Handhabungskörben |
PCT/EP2004/003764 WO2005001888A2 (de) | 2003-04-11 | 2004-04-08 | Vorrichtung und verfahren zum reinigen von bei der herstellung von halbleitern verwendeten gegenständen, insbesondere von transport- und reinigungsbehältern für wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1614150A2 true EP1614150A2 (de) | 2006-01-11 |
EP1614150B1 EP1614150B1 (de) | 2007-08-29 |
Family
ID=33553449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04762977A Expired - Lifetime EP1614150B1 (de) | 2003-04-11 | 2004-04-08 | Vorrichtung und verfahren zum reinigen und trocknen von bei der herstellung von halbleitern verwendeten gegenständen, insbesondere von transport- und reinigungsbehältern für wafer |
Country Status (4)
Country | Link |
---|---|
US (1) | US8161985B2 (de) |
EP (1) | EP1614150B1 (de) |
DE (1) | DE502004004812D1 (de) |
WO (1) | WO2005001888A2 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005030275A1 (de) | 2005-06-21 | 2006-12-28 | Dynamic Microsystems Semiconductor Equipment Gmbh | Verfahren und Vorrichtung zum Reinigen oder Trocknen von topfartigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer |
FR2912923B1 (fr) | 2007-02-28 | 2012-08-24 | C E M | Appareil a plaque vibrante pour la tonification musculaire |
FR2959422A1 (fr) | 2010-04-30 | 2011-11-04 | Fithealth | Appareil de reeducation a plaque vibrante et/ou oscillante muni de verins electromagnetiques. |
KR100987323B1 (ko) | 2010-05-18 | 2010-10-12 | (주) 디바이스이엔지 | 웨이퍼 보관용기 세정장치 |
KR101022014B1 (ko) * | 2010-05-18 | 2011-03-16 | (주) 디바이스이엔지 | 웨이퍼 보관용기 세정장치 |
KR102017867B1 (ko) * | 2011-06-23 | 2019-09-03 | 다이나믹 마이크로시스템즈 세미컨덕터 이큅먼트 게엠베하 | 반도체 클리너 시스템들 및 방법들 |
JP6042427B2 (ja) | 2011-06-28 | 2016-12-14 | ディーエムエス ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハーDMS Dynamic Micro Systems Semiconductor Equipment GmbH | 半導体ストッカシステム及び半導体ストック方法 |
WO2014082212A1 (en) * | 2012-11-28 | 2014-06-05 | Acm Research (Shanghai) Inc. | Method and apparatus for cleaning semiconductor wafer |
US11813649B2 (en) | 2020-05-29 | 2023-11-14 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor arrangement and method for making |
CN112191588B (zh) * | 2020-09-18 | 2021-12-21 | 程瑶 | 太阳能发电板生产过程配用清洁机及清洗方法 |
DE102020129470A1 (de) | 2020-11-09 | 2022-05-12 | PACE-Tec GmbH | Vorrichtung und Verfahren zum Behandeln von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für EUV-Lithografie-Masken |
DE102020129469B4 (de) | 2020-11-09 | 2024-05-29 | Gsec German Semiconductor Equipment Company Gmbh | Vorrichtung zum Reinigen von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für EUV-Lithografie-Masken |
DE202020006006U1 (de) | 2020-11-09 | 2024-03-11 | Gsec German Semiconductor Equipment Company Gmbh | Vorrichtung zum Reinigen von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für EUV-Lithografie-Masken |
DE202020006005U1 (de) | 2020-11-09 | 2024-02-29 | Gsec German Semiconductor Equipment Company Gmbh | Vorrichtung zum Behandeln von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für EUV-Lithografie-Masken |
WO2023213456A1 (de) | 2022-05-06 | 2023-11-09 | Gsec German Semiconductor Equipment Company Gmbh | Vorrichtung und verfahren zum trocknen und/oder reinigen von topfförmigen hohlkörpern, insbesondere von transportbehältern für halbleiterwafer oder für euv-lithografie-masken |
DE102022122723A1 (de) | 2022-05-06 | 2023-11-09 | Gsec German Semiconductor Equipment Company Gmbh | Vorrichtung und Verfahren zum Trocknen und/oder Reinigen von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für EUV-Lithografie-Masken |
WO2023213457A1 (de) | 2022-05-06 | 2023-11-09 | Gsec German Semiconductor Equipment Company Gmbh | Vorrichtung zum reinigen von topfförmigen hohlkörpern, insbesondere von transportbehältern für halbleiterwafer oder für euv-lithografie-masken |
DE102022116177A1 (de) | 2022-06-29 | 2024-01-04 | Gsec German Semiconductor Equipment Company Gmbh | Vorrichtung zum Reinigen von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für Lithografie-Masken |
DE102022124334A1 (de) | 2022-09-22 | 2024-03-28 | Gsec German Semiconductor Equipment Company Gmbh | Vorrichtung und Verfahren zum Reinigen von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für EUV-Lithografie-Masken |
DE102022130420A1 (de) | 2022-11-17 | 2024-05-23 | Gsec German Semiconductor Equipment Company Gmbh | Reinigungsvorrichtung, Behandlungsvorrichtung sowie Verfahren zum Reinigen bzw. Behandeln von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für Lithografie-Masken |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2972352A (en) * | 1957-05-22 | 1961-02-21 | Harold N Ipsen | Washer |
DE3339565C2 (de) | 1983-11-02 | 1989-12-14 | Pero KG - P. Erbel, 8901 Königsbrunn | Verfahren zur Rückgewinnung von Lösungsmittel bei der Trocknung von mittels eines flüssigen Lösungsmittels gereinigtem Gut |
US4977839A (en) * | 1988-01-14 | 1990-12-18 | Chemical Waste Management, Inc. | Process and apparatus for separating organic contaminants from contaminated inert materials |
US4984318A (en) | 1989-06-28 | 1991-01-15 | Coindreau Palau Damaso | Method and system for the recovering of solvents in dry cleaning machines |
US5173258A (en) * | 1989-10-11 | 1992-12-22 | American Sterilizer Company | Recirculation, vapor and humidity control in a sealable enclosure |
US5222307A (en) * | 1989-11-21 | 1993-06-29 | Interface Technical Laboratories Co., Ltd. | Drying method and apparatus therefor |
US5156173A (en) * | 1991-05-14 | 1992-10-20 | Envirosolv | High-efficiency, low-emissions cleaning method and apparatus |
JP2804210B2 (ja) | 1992-01-22 | 1998-09-24 | ジャパン・フィールド株式会社 | 洗浄装置 |
DE4208665C2 (de) | 1992-03-18 | 1994-04-14 | Maerkische Oberflaechenanlagen | Verfahren zum Trocknen von Gegenständen sowie Anlage zur Durchführung des Verfahrens |
US5224503A (en) | 1992-06-15 | 1993-07-06 | Semitool, Inc. | Centrifugal wafer carrier cleaning apparatus |
US5539995A (en) * | 1994-03-16 | 1996-07-30 | Verteq, Inc. | Continuous flow vapor dryer system |
GB9408094D0 (en) | 1994-04-23 | 1994-06-15 | Yule Catto & Co Plc | Article cleaning |
TW338713B (en) * | 1995-09-06 | 1998-08-21 | Sharp Kk | A dishwasher |
US20010001392A1 (en) * | 1998-11-12 | 2001-05-24 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating method and apparatus |
JP2004507102A (ja) * | 2000-07-07 | 2004-03-04 | セミトゥール・インコーポレイテッド | 半導体ウェハコンテナ洗浄装置 |
DE10317275A1 (de) | 2003-04-11 | 2004-11-11 | Dynamic Microsystems Semiconductor Equipment Gmbh | Vorrichtung und Verfahren zum Reinigen von bei der Herstellung von Halbleitern verwendeten Gegenständen |
-
2004
- 2004-04-08 EP EP04762977A patent/EP1614150B1/de not_active Expired - Lifetime
- 2004-04-08 DE DE502004004812T patent/DE502004004812D1/de not_active Expired - Lifetime
- 2004-04-08 WO PCT/EP2004/003764 patent/WO2005001888A2/de active IP Right Grant
-
2005
- 2005-10-10 US US11/247,622 patent/US8161985B2/en active Active
Non-Patent Citations (1)
Title |
---|
See references of WO2005001888A2 * |
Also Published As
Publication number | Publication date |
---|---|
US20060185692A1 (en) | 2006-08-24 |
WO2005001888A3 (de) | 2005-03-17 |
DE502004004812D1 (de) | 2007-10-11 |
EP1614150B1 (de) | 2007-08-29 |
US8161985B2 (en) | 2012-04-24 |
WO2005001888A2 (de) | 2005-01-06 |
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