EP1570951A3 - Verfahren zur Herstellung von Wafern mit defektarmen Oberflächen, die Verwendung solcher Wafer and damit erhaltene elektronische Bauteile - Google Patents

Verfahren zur Herstellung von Wafern mit defektarmen Oberflächen, die Verwendung solcher Wafer and damit erhaltene elektronische Bauteile Download PDF

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Publication number
EP1570951A3
EP1570951A3 EP05004484A EP05004484A EP1570951A3 EP 1570951 A3 EP1570951 A3 EP 1570951A3 EP 05004484 A EP05004484 A EP 05004484A EP 05004484 A EP05004484 A EP 05004484A EP 1570951 A3 EP1570951 A3 EP 1570951A3
Authority
EP
European Patent Office
Prior art keywords
wafers
production
defective
polishing
electronic units
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05004484A
Other languages
English (en)
French (fr)
Other versions
EP1570951A2 (de
Inventor
Peter Blaum
Burkhardt Speit
Ingo Köhler
Bernd Ruedinger
Wolfram Beier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott AG filed Critical Schott AG
Publication of EP1570951A2 publication Critical patent/EP1570951A2/de
Publication of EP1570951A3 publication Critical patent/EP1570951A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Semiconductor Lasers (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

Es wird ein Verfahren zur Herstellung von insbesonders spannungsarmen Waferscheiben mit mindestens einer auf an sich bekannte Weise zu beschichtenden aktiven Oberfläche beschrieben, wobei die aktive Oberfläche arm an Beschichtungsfehler erzeugenden Defekten ist. Das Verfahren umfasst ein Glätten der Oberfläche mittels eines Polierschritts, bei dem die aktive Oberfläche mittels eines Polierelements poliert wird. Dabei wird die Waferoberfläche mit einer sich ändernden Polierrichtung vom Polierwerkzeug derart überstrichen, dass jede Stelle der Oberfläche in jeder Richtung eines 360°Vollwinkels statistisch gleichmäßig überstrichen wird.
EP05004484A 2004-03-03 2005-03-01 Verfahren zur Herstellung von Wafern mit defektarmen Oberflächen, die Verwendung solcher Wafer and damit erhaltene elektronische Bauteile Withdrawn EP1570951A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004010379A DE102004010379A1 (de) 2004-03-03 2004-03-03 Verfahren zur Herstellung von Wafern mit defektarmen Oberflächen, die Verwendung solcher Wafer und damit erhaltene elektronische Bauteile
DE102004010379 2004-03-03

Publications (2)

Publication Number Publication Date
EP1570951A2 EP1570951A2 (de) 2005-09-07
EP1570951A3 true EP1570951A3 (de) 2006-04-05

Family

ID=34745363

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05004484A Withdrawn EP1570951A3 (de) 2004-03-03 2005-03-01 Verfahren zur Herstellung von Wafern mit defektarmen Oberflächen, die Verwendung solcher Wafer and damit erhaltene elektronische Bauteile

Country Status (5)

Country Link
US (1) US7367865B2 (de)
EP (1) EP1570951A3 (de)
JP (1) JP5105711B2 (de)
CN (1) CN1684234B (de)
DE (1) DE102004010379A1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8207539B2 (en) * 2009-06-09 2012-06-26 Epistar Corporation Light-emitting device having a thinned structure and the manufacturing method thereof
DE102009052744B4 (de) * 2009-11-11 2013-08-29 Siltronic Ag Verfahren zur Politur einer Halbleiterscheibe
JP7148427B2 (ja) 2019-02-06 2022-10-05 昭和電工株式会社 ＳｉＣエピタキシャルウェハ及びその製造方法
CN112720247B (zh) * 2020-12-30 2022-04-19 合肥晶合集成电路股份有限公司 一种化学机械平坦化设备及其应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0008360A1 (de) * 1978-08-15 1980-03-05 International Business Machines Corporation Vorrichtung zum freien Polieren von Werkstücken und Polierverfahren

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JPH07161667A (ja) * 1993-12-13 1995-06-23 Sony Corp 半導体ウェハの研磨方法及びそれに用いるウェハホルダ
JP3534207B2 (ja) * 1995-05-16 2004-06-07 コマツ電子金属株式会社 半導体ウェーハの製造方法
US6395613B1 (en) * 2000-08-30 2002-05-28 Micron Technology, Inc. Semiconductor processing methods of forming a plurality of capacitors on a substrate, bit line contacts and method of forming bit line contacts
US5895583A (en) * 1996-11-20 1999-04-20 Northrop Grumman Corporation Method of preparing silicon carbide wafers for epitaxial growth
JPH11277413A (ja) * 1998-03-27 1999-10-12 Kyocera Corp ウェハ研磨盤
US6464571B2 (en) * 1998-12-01 2002-10-15 Nutool, Inc. Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
JP2001093867A (ja) * 1999-09-21 2001-04-06 Rodel Nitta Kk ウエハ外周部の保護部材及びウエハの研磨方法
JP4028163B2 (ja) * 1999-11-16 2007-12-26 株式会社デンソー メカノケミカル研磨方法及びメカノケミカル研磨装置
DE60105218T2 (de) * 2000-04-07 2005-08-04 Hoya Corp. Siliciumkarbid und Verfahren zu seiner Herstellung
KR20030024834A (ko) * 2000-08-07 2003-03-26 엠이엠씨 일렉트로닉 머티리얼즈 인코포레이티드 양측 폴리싱을 이용한 반도체 웨이퍼 처리 방법
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
US6753954B2 (en) * 2000-12-06 2004-06-22 Asml Masktools B.V. Method and apparatus for detecting aberrations in a projection lens utilized for projection optics
US6418921B1 (en) * 2001-01-24 2002-07-16 Crystal Systems, Inc. Method and apparatus for cutting workpieces
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0008360A1 (de) * 1978-08-15 1980-03-05 International Business Machines Corporation Vorrichtung zum freien Polieren von Werkstücken und Polierverfahren

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ANONYMOUS: "Method Of Polishing Semiconductor Wafers. September 1979.", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 22, no. 4, 1 September 1979 (1979-09-01), New York, US, pages 1453, XP002366198 *

Also Published As

Publication number Publication date
CN1684234A (zh) 2005-10-19
EP1570951A2 (de) 2005-09-07
JP5105711B2 (ja) 2012-12-26
US20050233679A1 (en) 2005-10-20
CN1684234B (zh) 2012-08-01
DE102004010379A1 (de) 2005-09-22
JP2005260225A (ja) 2005-09-22
US7367865B2 (en) 2008-05-06

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