EP1530223A1 - Element isolant a conductivite thermique elevee et son procede de fabrication, bobine electromagnetique et dispositif electromagnetique - Google Patents

Element isolant a conductivite thermique elevee et son procede de fabrication, bobine electromagnetique et dispositif electromagnetique Download PDF

Info

Publication number
EP1530223A1
EP1530223A1 EP03741216A EP03741216A EP1530223A1 EP 1530223 A1 EP1530223 A1 EP 1530223A1 EP 03741216 A EP03741216 A EP 03741216A EP 03741216 A EP03741216 A EP 03741216A EP 1530223 A1 EP1530223 A1 EP 1530223A1
Authority
EP
European Patent Office
Prior art keywords
particles
mica
heat conductivity
insulating member
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03741216A
Other languages
German (de)
English (en)
Other versions
EP1530223B1 (fr
EP1530223A4 (fr
Inventor
Tetsushi Toshiba Corporation OKAMOTO
Hiroyoshi Toshiba Corporation TSUCHIYA
Fumio Toshiba Corporation SAWA
Noriyuki Toshiba Corporation IWATA
Mitsuhiko Toshiba Corporation KOYAMA
Yukio Toshiba Corporation SUZUKI
Akihiko Toshiba Corporation SUZUKI
Tooru Toshiba Corporation OOTAKA
Shigehito Toshiba Corporation ISHII
Susumu Toshiba Corporation NAGANO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002196363A external-priority patent/JP2004035782A/ja
Priority claimed from JP2003144919A external-priority patent/JP4625615B2/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of EP1530223A1 publication Critical patent/EP1530223A1/fr
Publication of EP1530223A4 publication Critical patent/EP1530223A4/fr
Application granted granted Critical
Publication of EP1530223B1 publication Critical patent/EP1530223B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12—Insulating of windings
    • H01F41/127—Encapsulating or impregnating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/323—Insulation between winding turns, between winding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/327—Encapsulating or impregnating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/06—Insulation of windings

Definitions

  • the present invention relates to a tape-like or sheet-like highly heat conductive insulating member used in an electromagnetic coil of an electromagnetic device such as a power generator, electric motor or transformer, and a method of manufacturing the insulating member.
  • the present invention further relates an electromagnetic coil manufactured employing a high-heat conductive insulating member, and an electromagnetic device.
  • one of the measures to improve the cooling performance of the electromagnetic coil is that the electro-insulating tape and sheet material used for a peripheral member of the electromagnetic coil should be made into a high heat conductivity type.
  • the heat conductivity of a conventional electro-insulating member is about 3 to 37 W/mK.
  • Jpn. Pat. Appln. KOKAI Publication No. 11-71498 discloses that the components of the matrix resin are changed to increase the amount of the filling material, as its object, that is, increasing the heat conductivity of the electro-insulating member.
  • the heat conductivity of the electro-insulating member of this prior art document is not sufficient, and further the resins that can be employed for this reference technique are limited to special components only.
  • Jpn. Pat. Appln. KOKAI Publication No. 2002-93257 discloses a highly heat conductive mica matrix sheet having a backing member containing inorganic powder, as the electro-insulating member used for an electromagnetic coil.
  • the heat conductive material that is used for the backing member does not exhibit a sufficiently high heat conductivity.
  • the heat conductivity is not sufficient.
  • Jpn. Pat. Appln. KOKAI Publication No. 11-323162 is directed to an improvement of the heat conductivity of an insulating layer, and discloses that the heat conductivity of the resin can be improved by using a crystalline epoxy resin as the resin for the insulating layer.
  • the crystalline epoxy resin of this prior art document is in a solid state at room temperature, and therefore it is difficult to handle it.
  • Jpn. Pat. Appln. KOKAI Publication No. 10-174333 discloses an electromagnetic coil in which heat conductive sheets are alternately wound around a wire-wound conductor, for the object of improving the heat conductivity of an insulating layer.
  • the heat transmission is insulated by the mica layer, and therefore it is difficult to achieve a high heat conductivity.
  • the conventional insulating members entail such drawbacks that a sufficient heat conductivity cannot be obtained and the production takes much labor, time and high cost.
  • the object of the present invention is to provide a widely usable highly heat conductive insulating member that can exhibit a highly heat conductive without having to use very limited components of resin and that can be easily manufactured, as well as a method of manufacturing the insulating member. Further, the object includes the provision of an electromagnetic coil that employs such a highly heat conductive insulating member, as well as an electromagnetic device.
  • the highly heat conductive insulating member according to the present invention is characterized by comprising: a resin matrix; first particles having a heat conductivity of 1 W/mK or higher and 300 W/mK or lower, that are diffused in the resin matrix; and second particles having a heat conductivity of 0.5 W/mK or higher and 300 W/mK or lower, that are diffused in the resin matrix.
  • the highly heat conductive insulating member of the present invention When the highly heat conductive insulating member of the present invention is used in combination with a conventional mica tape to prepare a wire-wound conductor (Cu coil), an electromagnetic coil having both of an excellent heat radiating property (cooling performance) and an excellent insulating property at the same time can be provided. It is only natural that the highly heat conductive insulating member of the present invention can be solely used.
  • the highly heat conductive insulating member according to the present invention is a tape-like or sheet-like highly heat conductive insulating member including a mica layer and a backing material layer, the insulating member characterized in that the backing material layer comprises: a resin matrix; first particles having a heat conductivity of 1 W/mK or higher and 300 W/mK or lower, that are diffused in the resin matrix; and second particles having a heat conductivity of 0.5 W/mK or higher and 300 W/mK or lower, that are diffused in the resin matrix.
  • the highly heat conductive insulating member according to the present invention is a tape-like or sheet-like highly heat conductive insulating member including a mica layer and,a backing material layer, the insulating member characterized in that the mica layer comprises: mica paper made of mica scales; and second particles having a heat conductivity of 0.5 W/mK or higher and 300 W/mK or lower, that are diffused in the mica paper.
  • the condition that the volume content of the second particles is set to 33.3% by volume or less is satisfied (see FIG. 30)
  • the diameter of the second particles should be set smaller than that of the first particles, and more preferably, the diameter of the second particles should be set to 0.15 times or smaller as that of the first particles. This is because if the ratio in particle diameter of the second particles with respect to the first particles becomes closer to 0.15, the heat conductivity ⁇ decreases as shown in FIG. 7.
  • the diameter of the first particles should be set in a range of 0.05 ⁇ m or more and 100 ⁇ m or less (50 nm to 10 5 nm). If the diameter of the first particles is less than 0.05 ⁇ m, it becomes difficult to disperse the particles uniformly in the layer, and as a result, the electric breakdown strength may be deteriorated in some cases. On the other hand, if the diameter of the first particles exceeds 100 ⁇ m, the flatness of the tape member or sheet member is impaired, and further the thickness becomes uneven easily.
  • the diameter of the second particles should be set to 0.15 times or smaller as that of the mica scales. This is because if the ratio in particle diameter of the mica scales with respect to the second particles becomes closer to 0.15, the heat conductivity ⁇ decreases as in the above-described case.
  • the first particles are made of one or more types selected from the group consisting of boron nitride, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, diamond-like carbon, carbon-like diamond, silicon carbide, laminar silicate clay mineral and mica. This is because the particles of these materials exhibits, at a normal state, a heat conductivity ⁇ of 1 W/mK or more and 300 W/mK or less.
  • the second particles are made of one or more types selected from the group consisting of boron nitride, carbon, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, diamond-like carbon, carbon-like diamond, silicon carbide, gold, cupper, iron, laminar silicate clay mineral and mica. It is particularly preferable that the second particles are made of either one of carbon and aluminum oxide. Carbon particle such as of carbon black is appropriate for improving the heat conductivity ⁇ of the material of the present invention. Further, aluminum oxide particle is suitable since it not only improves the heat conductivity ⁇ of the material of the present invention but also it does not impair the insulating property of the material.
  • the content of the second particles in the backing material layer should preferably be set to 0.5% by volume or more, and most preferably, it should be set to 1% by volume or more. This is because if the content of the second particles is increased, the heat conductivity ⁇ increases accordingly. In particular, if the content of the second particles is 1% by volume or more, the heat conductivity ⁇ of the material dramatically improves as can be seen in FIG. 3 and FIG. 29.
  • the content of the second particles should be set to 33.3% by volume or less with respect to the total amount of the second particles and the resin, and most preferably, it should be set to 23% by volume or less. This is because if the content of the second particles becomes excessive, the electric conductivity ⁇ increases excessively. In particular, if the content of the second particles exceeds 33.3% by volume, the electric conductivity ⁇ becomes excessive as can be seen in FIG. 30, thereby deteriorating the insulating property of the material.
  • the backing material layer may be provided on both surfaces of the mica layer or the mica layer may be provided on both surfaces of the backing material layer. (See FIG. 15.)
  • the backing material layer may be made wider than the mica layer, or the mica layer may be made wider than the backing material layer. (See FIG. 18.)
  • the total thickness of the highly heat conductive insulating member is set to 0.2 to 0.6 mm in the case of tape, whereas it is set to 0.2 to 0.8 mm in the case of sheet.
  • the ratio in thickness between the mica layer and backing material layer should preferably set in a range of 6 : 4 to 4 : 6, and more preferably, in a range of 11 : 9 to 9 : 11.
  • the method of manufacturing a highly heat conductive insulating member is a method of manufacturing a tape-like or sheet-like highly heat conductive insulating member having a mica layer and a backing material layer, and the method is characterized by comprising: (a) kneading first particles having a heat conductivity of 1 W/mK or higher and 300 W/mK or lower, second particles having a heat conductivity of 0.5 W/mK or higher and 300 W/mK or lower, and a resin solution at a predetermined ratio; (b) impregnating the kneaded material to a impregnation member; (c) heating the kneaded material impregnated in the impregnation body to cure the kneaded material, thereby obtaining the backing material layer; (d) adhering the backing material layer and mica paper together; and (e) pressing the backing material layer and mica paper adhered together from upper and lower surfaces by a roller press to form it into a tape- or
  • the above-mentioned impregnation member may be made of either one of glass cloth and resin film.
  • the process B1 steps S1 to S3 shown in FIG. 1 is employed.
  • the process B2 steps S11 and S12 shown in FIG. 13 is employed.
  • the roll press a hot roll press method should preferably be used. In general, the roll press has a single pressing operation just one time, but it may have a multi-step press in which the press is repeated two to three times.
  • the method of manufacturing a highly heat conductive insulating member is a method of manufacturing a tape-like or sheet-like highly heat conductive insulating member having a mica layer and a backing material layer, and the method is characterized by comprising: (i) mixing second particles having a heat conductivity of 0.5 W/mK or higher and 300 W/mK or lower, mica scales and a solvent at a predetermined ratio and stirring the mixture; (ii) filtrating the stirred mixture with a predetermined filter and drying the filtered resultant, thereby obtaining mica paper; (iii) adhering the mica paper and backing material layer together; and (iv) pressing the mica paper and backing material layer adhered together from upper and lower surfaces by a roller press to form it into a tape- or sheet-like shape.
  • the solvent water or various types of alcohols can be used, and it is preferable here that water should be used.
  • the steps S21 to S23 shown in FIG. 9 are employed. Mica scales have a high aspect ratio and therefore they easily aggregate to consolidate. Thus, even after the solvent volatilizes, the shape of the consolidated body is maintained and the highly heat conductive particles are well retained. It should be noted that when a slight amount of binder resin is added, the shape maintaining property and particle retaining property are improved.
  • the electromagnetic coil according to the present invention is characterized in that a wire-wound conductor is covered for insulation with the above-described tape-like highly heat conductive insulating member.
  • the electromagnetic device according to the present invention is characterized by comprising the above-described electromagnetic coil.
  • tape used in this specification is meant to be a slender band-like member to be wound repeatedly around a section that requires to be covered for insulation.
  • sheet used in this specification is meant to be not only a member to be wound around a section that requires to be covered for insulation, but also a member having such a width that it can cover the section.
  • the insulating sheet is used to cover, for example, a soldered connection portion between electromagnetic coils for insulation.
  • mica used in this specification is meant to cover not only natural mica produced from the world of nature, but also artificial mica that is industrially manufactured. There are two types of mica, that is, calcined mica and non-calcined mica. It is preferable in the present invention that calcined mica should be used.
  • the calcined mica as it is calcined at a predetermined temperature, transforms further into scale-like shapes, thereby increasing the electric insulating property.
  • mica paper used in this specification is meant to be a thin film or foil obtained by mixing mica scales into a solvent (such as water or an alcohol), stirring the mixture, filtrating the mixture in a manner of papermaking, and drying the filtrated mixture.
  • a solvent such as water or an alcohol
  • the thus obtained mica paper is cut into a predetermined size, and in this manner, the mica tape and mica sheet are obtained.
  • carbon used in this specification is meant to cover carbon-based materials that has such a structure in which layers formed by ⁇ -bond are joined together by intermolecular force, and it is a general term that includes carbon black, contact black, channel black, roll black, disk black, thermal black, gas black, furnace black, oil furnace black, naphthalene black, anthracene black, acetylene black, animal black, vegetable black, Ketjen black and graphite.
  • artificial diamond used in this specification is meant to not include natural diamonds produced from the world of nature cover, but include diamonds that are industrially manufactured, that is, more specifically, those having such a texture in which carbon atoms are bonded together by sp3 bond to crystallize.
  • diamond-like carbon used in this specification is meant to be a carbon-based material relatively close to the carbon defined above, and more specifically, such a material in which the main portion thereof is made of carbon, and the diamond texture defined above is contained in a part thereof.
  • carbon-like diamond used in this specification is meant to be a carbon-based material relatively close to the diamond defined above, and more specifically, such a material in which the carbon and the diamond texture defined above are mixedly present.
  • binder resin used in this specification is meant to be a filling material used to hold the highly heat conductive particles fixed in the backing material layer or mica layer.
  • the components of the resin are not particularly specified, but in general, any one of an epoxy resin, polypropylene resin and silicone resin (silicone rubber) should be employed.
  • Step K1 300 cc of water was blended to 2.826g of mica scales and the mixture was stirred.
  • the thus obtained stirred mixture was allowed to pass a grid having a lattice size of, for example, 0.05 mm ⁇ 0.05 mm in a manner of papermaking, thereby preparing a raw sheet (Step K2).
  • the raw sheet was heated to a predetermined temperature and thus dried, thereby obtaining mica paper 1 (Step K3).
  • a binder resin, boron nitride particles and carbon black particles were blended at a ratio of 24.7 : 74.2 : 1.1 and the mixture was kneaded (Step S1).
  • Asahi Thermal Tradename of Asahi Carbon Co., Ltd. was used as the carbon black.
  • the average diameter of the carbon black particles was 90 nm.
  • the shape of the carbon black particles was spherical.
  • HP-1CAW (product model number) of Mizushima Ferroalloy Co., LTd. was used as boron nitride.
  • the distribution of the particle diameters was 14 to 18 ⁇ m, and the average diameter of the boron nitride particles was 16 ⁇ m.
  • the crystalline structure of the boron nitride particles was hexagonal and it had a scale shape or a plane shape. It is alternatively possible to use HP-6 (product model number) of Mizushima Ferroalloy Co., LTd. as boron nitride.
  • Step S2 The above-described kneaded material was applied on a glass cloth having a thickness of 0.33 mm (Step S2).
  • the amount of the kneaded material applied per unit area was 400 g/m2.
  • the applied material was heated to a temperature of 120°C to cure, and thus a backing material layer 2 was obtained (Step S3).
  • Step S4 The thus obtained mica paper 1 and the backing material 2 were adhered together with an adhesive (Step S4).
  • the adhesive was applied onto either one of the mica paper 1 and the backing material 2, and they were attached together and then subjected to hot roll press.
  • the adhesive employed here was an epoxy resin type.
  • the hot roll press the resultant was heat to a temperature of 150°C and thus the adhesive, mica paper 1 and backing material 2 were cured and thus a mica sheet was obtained (Step S5).
  • the processes of Steps S4 and S5 are carried out continuously and consequently a wide and long mica sheet is obtained.
  • the obtained mica sheet was cut into a width of 30 mm to prepare a mica tape 10 shown in FIG. 2 (Step S6).
  • the obtained mica tape 10 had boron nitride particles (first particles) having a heat conductivity of 1 W/mK or higher and carbon black particles (second particles) having a heat conductivity of 0.5 W/mK or higher obtain, diffused in a resin 4 of a backing material layer 2.
  • a laser flash method was employed to evaluate and measure the heat conductivity ⁇ of the tape member (or sheet member).
  • TC-3000-NC of ULVAC RIKO, Inc. was used as a heat conductivity measuring device. More specifically, a pulse laser beam was irradiated onto one side of a sample having a thickness of 1 mm, and the rise in temperature on the opposite side (rear side) was measured to evaluate the heat conductivity ⁇ .
  • a laser analysis type graininess distribution measuring device was employed for the measurement of the diameter of the particles.
  • LMS-24 of Seishin Enterprise Co., Ltd. was used as the particle diameter measuring device.
  • the particle diameter measured was the average of the diameters.
  • FIG. 3 is a diagram showing a characteristic curve indicating the dependency of the heat conductivity on the carbon black filling amount, with the horizontal axis indicating the volume ratio (vol%) of carbon black and the vertical axis indicating the heat conductivity ⁇ obtained when carbon black is diffused in the epoxy resin.
  • the carbon black particles used here had a heat conductivity of 1 W/mK and an average particle diameter of 90 nm.
  • the boron nitride particles used here had a heat conductivity of 60 W/mK and an average particle diameter of 16 ⁇ m.
  • characteristic curve A was obtained by connecting points plotted as results of changing the carbon black filling amount to 0%, 0.5%, 1%, 2% and 5% in ratio by volume.
  • heat conductive sheet having a high heat conductivity As can be understood from the characteristic curve A, with a slight amount of carbon black added to the epoxy resin, a heat conductive sheet having a high heat conductivity can be obtained.
  • heat conductive sheet 2 which served as the backing material, and the mica paper 1 prepared by filtrating the mica scales, were attached together, and put through a slit, thereby preparing a mica sheet.
  • the mica layer 1 and heat conductive sheet 2 (backing member) were adhered together with a bisphenol A type epoxy resin adhesive.
  • the backing material member of the mica sheet (tape) prepared as above had a high heat conductivity, and therefore as compared to a mica tape containing boron nitride solely (, which is a conventional product), a high heat conductivity can be achieved.
  • Table 1 indicates the heat conductivity index and composition of the mica tape manufactured by setting the thickness ratio between the mica layer 1 and heat conductive sheet 2 to 1 : 1.
  • the term "heat conductivity index” used here is a relative value having no unit calculated with respect to a reference value of Comparative Example 1 being set to 1.
  • Comparative Example 1 Comparative Example 2
  • Example 1 Boron Nitride 0 60 60 Carbon black 0 0 5 Resin 100 40 35 Heat conductivity index 1 1.8 1.93
  • the tape (Comparative Example 1) filled with boron nitride exhibited a heat conductivity ⁇ of 1.8 times higher as compared to the case of the tape (Comparative Example 2). Further, the tape to which carbon black added (That is, Embodiment 1) exhibited a heat conductivity ⁇ of 1.93 times higher as compared to the reference example.
  • FIG. 4 is a diagram showing a characteristic curve indicating the dependency of the heat conductivity of the mica tape on the carbon black filling amount, using the carbon black filling amount of FIG. 3 as a parameter, with the horizontal axis indicating the volume ratio (vol%) of carbon black and the vertical axis indicating the heat conductivity index of the mica table.
  • the term "heat conductivity index" used here is a relative value having no unit calculated with respect to a reference value of Comparative Example 2 being set to 1.
  • the heat conductivity of the mica tape was increased by adding carbon black.
  • the carbon black filling amount was 1% by volume or more, an increase of about 2.5% in heat conductivity index was achieved. Therefore, the heat conductivity ⁇ of the mica tape is increased in proportional to the heat conductivity ⁇ of the backing member.
  • the mica tape 10 was wound, to have a predetermined thickness, around an outer circumference of wire-wound conductors 5 (bar coil) having a rectangular cross section. Then, a release tape (not shown) was further wound around the resultant. Barrel-shaped rubber-made holder jigs (not shown) were pressed respectively against four surfaces of the wound body. Iron plates (not shown) having a thickness of 2 mm were each inserted between a respective holder jig and the wound body. Further, a heat-shrinkable tube (not shown) was wound around the outer circumference of the holder jigs for 3 times while overlapping by 2/3. The diameter of the heat-shrinkable tube was about 50 mm.
  • the wound body was immersed in an epoxy resin solution and thus the epoxy resin was impregnated to the body under a vacuum atmosphere. After the impregnation of the resin, the wound body was loaded into a heat furnace, where the epoxy resin was cured under heating conditions of a temperature of 150°C for 24 hours. The heat-shrinkable tube, holder jigs, iron plates and release tape were removed, thereby obtaining an electromagnetic coil.
  • the mica tape 10 of the electromagnetic coil thus manufactured had a high heat conductivity.
  • an insulating layer 6 having a high heat conductivity was obtained.
  • the electromagnetic coil thus obtained exhibited an excellent cooling performance, and therefore a current supplied to the wire-wound conductor 5 could be increased, thereby achieving a high efficiency.
  • the cross sectional area of the wire-wound conductor 5 could be decreased, thereby making it possible to reduce the size of the electromagnetic coil. Consequently, the production cost for the electromagnetic coil was decreased.
  • a power generator of a class of 300 MW could increase the heat conductivity of its main insulation from' 0.22 W/mK, which is a conventional performance, to about 1 W/mK. Further, the increase in temperature of the electromagnetic coil could be decreased from 70K to 40K. In this manner, it becomes possible to increase the current density supplied to the electromagnetic coil, and therefore the amount of copper used can be reduced. In fact, it became possible to increase the current density supplied to the electromagnetic coil, and therefore the amount of copper used was cut down by about 30%.
  • a tape member having a high heat conductivity can be obtained easily in a simple way, and further when the tape member is wound around a coil conductor for insulation cover, an electromagnetic coil having a high heat conductivity can be obtained. Further, an electromagnetic device of a reduced size can be manufactured at a low production cost.
  • boron nitride particles and carbon black particles were used as the material for forming the highly heat conductive backing material. It is considered that the high heat conductivity was achieved by replacing the resin layer with carbon black. More specifically, such a high heat conductivity can be obtained due to the main filling material that has a high heat conductivity and the carbon particles that fill the interstices of the filling material.
  • the main filling material (first particles) having a high heat conductivity should be filled at a high density, and therefore it is very important for the second particles, that is, for example, carbon black particles, to enter the interstices of the main filling material (first particles) densely filled.
  • the grain diameter d2 of the second filling material 8 should be limited. In this manner, a heat conducting property of a high heat conductivity can be achieved.
  • FIG. 7 is a diagram showing a characteristic curve indicating the change in the heat conductivity ⁇ with respect to the particle diameter ratio between the second particles and first particles, with the horizontal axis indicating the log of the particle diameter ratio (d2/d1) between the second particles and first particles, and the vertical axis indicating the heat conductivity ⁇ .
  • the heat conductivity ⁇ is increased in a region where the particle diameter ratio between the second particles and first particles is smaller than about 0.1 times.
  • FIG. 8 is a characteristic diagram showing the plotted results of the examination regarding the relationship between the amount of aluminum oxide filled in the epoxy resin and the heat conductivity ⁇ , with the horizontal axis indicating the volume content (% by volume) of aluminum oxide filled in the epoxy resin, and the vertical axis indicating the heat conductivity ⁇ .
  • aluminum oxide particles having an average particle diameter of 70 nm was filled in the epoxy resin in place of the carbon black particles of an average particle diameter of 90 nm.
  • the heat conductivity ⁇ went up.
  • a heat conductivity ⁇ higher than 7W/mK was obtained. It was found that when this material was used as the backing material, a high heat conductivity was obtained.
  • the aluminum oxide particles have a higher electric resistance, a tape with an excellent insulating property can be obtained.
  • the aluminum oxide particles had spherical shapes with an average diameter of 70 nm.
  • NanoTekAl2O3-HT product model number of CI Kasei Company Ltd. was used as the aluminum oxide particles.
  • boron nitride was used as the first particles; however it is alternatively possible to use, in place of this material, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, artificial diamond, diamond-like carbon or silicon carbide. With these substituting materials, a similar effect to that of the present embodiment can be obtained.
  • carbon black and aluminum oxide were used as the second particles; however it is alternatively possible to use, in place of this material, boron nitride, carbon, aluminum nitride, magnesium oxide, silicon nitride, artificial diamond, diamond-like carbon, silicon carbide, gold, copper, iron, laminar silicate clay mineral or mica. With these substituting materials, a similar effect to that of the present embodiment can be obtained.
  • the member of this embodiment highly heat conductive particles were filled in the mica layer side.
  • glass cloth 25 was used as the backing material.
  • 2.83g of mica scales and 0.125g of alumina particles were blended to 3000 cc of water, and the mixture was stirred (Step S21).
  • NanoTekAl2O3-HT product model number of CI Kasei Company Ltd. was used as the alumina particles.
  • the average diameter of the alumina particles was 70 nm.
  • the shape of the alumina particles was spherical.
  • sintered mica was used as the mica scales was 15 ⁇ m.
  • the thus obtained stirred mixture was allowed to pass a grid having a lattice size of, for example, 0.05 mm ⁇ 0.05 mm in a manner of papermaking, thereby preparing a raw sheet (Step S22).
  • the raw sheet was heated to 120°C and thus dried, thereby obtaining mica paper (Step S23).
  • the above-described mica paper was adhered onto a glass cloth 25 using an adhesive (Step S24).
  • the adhesive employed here was an epoxy resin type.
  • the resultant was heat to a temperature of 150°C and thus the adhesive, mica paper 1 and backing material 2 were cured, thereby obtaining a mica sheet (Step S25).
  • the processes of Steps S24 and S25 are carried out continuously and consequently a wide and long mica sheet is obtained.
  • the obtained mica sheet was cut into a width of 35 mm to prepare a mica tape 11A shown in FIG. 10 (Step S26).
  • FIG. 10 shows a cross section of the mica tape 11A in which one of the highly heat conductive particles obtained in the above-described embodiment was dispersed in the glass cloth.
  • particles 26 having a high heat conductivity were supplied thereto while a film or a tape member is formed by impregnating resin into the glass cloth 25, a highly heat conductive tape (film) can be manufactured. Further, with use of thus obtained tape as a material for the mica tape, the mica tape will have a high heat conductivity.
  • FIG. 11 is a schematic diagram showing a cross section of a tape 11B in which a plurality of tapes obtained in the above embodiment were layered.
  • a highly heat conductive material was used for the resin part of the layered member, and thus a laminated member having a high heat conductivity can be manufactured.
  • a mica tape 10A of this embodiment first particles having a heat conductivity of 0.5W/mK or higher were filled and diffused in a mica layer 9.
  • a mica layer 11 was manufactured by an ordinary method and a heat conductive sheet 9 having a high heat conductivity was used as the backing material.
  • the heat conductivity of the mica layer 11 is smaller as compared to that of the backing material layer 9, and therefore the mica layer 11 served as a heat barrier.
  • alumina particles having an average particle diameter of 70 nm was blended into the mica paper. More specifically, the mica paper and the alumina particles were blended into distilled water and stirred, and the mixture was applied onto a cloth having a mesh of 0.05 ⁇ m. Then, the resultant was subjected to a dry process and thus a mica sheet was obtained.
  • the mica sheet itself had a heat conductivity of about 0.6 W/mK; however, when resin was impregnated into the mica layer 11 formed of mica paper solely, the heat conductivity ⁇ became 0.22 W/mK.
  • the heat conductivity of the mica layer filled with the alumina particles was 0.35 W/mK. It is assumed that this is because impregnated resin is present between mica layers, and therefore phonon that is required for heat conduction was dispersed, thereby shortening the average free step of the phonon.
  • an electromagnetic coil was formed using a tape of the present embodiment, and thus a min insulating layer having a high heat conductivity was formed.
  • the fourth embodiment in which a film (a substituting material for glass cloth) was used as the backing material layer will now be described with reference to FIG. 13.
  • the present embodiment is substantially the same as the first embodiment described above except for the backing material manufacturing process B2. Therefore, in the description of this embodiment, the explanations of the mica paper processing steps K1 to K3 and mica tape processing steps S4 to S6 will be omitted.
  • Step S11 0.13g of a binder resin, 2.83g of boron nitride particles and 0.125g of alumina particles were kneaded together.
  • Step S12 kneaded material pressed an cured by a hot roll press machine at a temperature of 150°C, and thus a backing material was obtained.
  • a member 10B of this embodiment is a combination of the backing material layer 2 of the first embodiment and the mica layer 9 of the third embodiment. With this combination, the heat conductivity ⁇ of the mica tape 10B was further enhanced, thereby achieving an excellent heat radiating property.
  • the heat conductivity of the mica tape 10B of this embodiment was estimated to be about 0.66 W/mK.
  • a mica tape 10C of this embodiment was obtained by adhering a highly heat conductive backing material layer 2 filled with the first particles and second particles was adhered onto both surfaces of the mica layer 1.
  • a highly heat conductive material was used on both sides of the backing material layer 2, and with this structure, the heat conductivity of the mica tape 10C itself was increased.
  • the mica tape 10C was wound around the wire-wound conductor 5 for insulation cover, an electromagnetic coil having an excellent heat conductivity can be obtained.
  • FIG. 16 shows a cross section of a main insulating layer of a resultant obtained by winding a mica tape 10 made of a low heat conductive layer (mica layer) 13 and a highly heat conductive layer (highly heat conductive backing material layer) 12 applied on one side of the layer 13 around the surface of the wire-wounded conductor 5 in such a manner that the overlapping portion between adjacent tape winding sections was displaced by one half of the tape width W (W/2).
  • This main insulating layer 13 had such an arrangement that a low heat conductive layer 13 was always interposed between a highly heat conductive layer 12 and another highly heat conductive layer 12 adjacent thereto.
  • the heat conductivity of the low heat conductive layer 13 was low, and therefore it was difficult to obtain a high heat conductivity.
  • a mica tape 10C made of a low heat conductive layer (mica layer) 13 and highly heat conductive layers 12 applied on both sides of the layer 13 was wound around the surface of the wire-wounded conductor 5 in such a manner that the overlapping portion between adjacent tape winding sections was displaced by one half of the tape width W (W/2).
  • W tape width
  • a cross section of the main insulating layer of thus obtained resultant is illustrated in the figure.
  • a heat conductive path is formed in the main insulating layer as the backing materials having a heat conductivity are consecutively connected together. Therefore, with the highly heat conductive layers 12 formed on respective sides of the low heat conductive layer 13, it becomes possible to obtain a high heat conductivity.
  • both sides of the low heat conductive layer have the first particles that have a heat conductivity of 1 W/mK or higher, and with this structure, it becomes possible to obtain an electromagnetic coil with a high heat conductivity, easily. Further, an electromagnetic device with a high heat conductivity, can be easily manufactured.
  • the above-described case has such a structure in which a mica layer is used as a low heat conductive layer and the layer with a relatively low conductivity is sandwiched between highly heat conductive layers.
  • the mica layer is used as a highly heat conductive layer, it is possible to obtain a high heat conductivity by sandwiching the backing material layer with highly heat conductive mica layers. More specifically, when a mica layer containing the second particles having a heat conductivity of 0.5 W/mK or higher is formed on both side of the backing material layer, it is possible to obtain an electromagnetic coil and electromagnetic device that have a high heat conductivity and that can be easily manufactured.
  • a mica tape 10F of this embodiment was made to have such a structure that a highly heat conductive backing material layer 2 was wider than a mica layer 1. In other words, a width W2 of the backing;material layer 2 was set larger than a width W1 of the mica layer 1.
  • the main insulating layer a layer having a high heat conductivity and a relatively low heat conductive layer are combined together to form the main insulating layer.
  • the reason why there is a low conductivity is as follows. That is, the main insulating layer is formed originally to obtain electric insulation.
  • the highly heat conductive material used in the present invention that uses a filling material may cause a decrease in electrical breakdown characteristics. Therefore, in some devices, a layer having a heat conductivity and a high electric breakdown characteristics need be formed in combination.
  • FIG. 19 An equivalent circuit of the mentioned structure is shown in FIG. 19, which illustrates that a heat conductivity 14 of a low heat conductive layer and a heat conductivity 15 of a high heat conductive layer are located series. Since the mica layer serves as a heat barrier, when it is formed into a coil shape, the mica layer does not easily propagate heat.
  • the backing material layer 2 having a high heat conductivity is made wider than the mica layer 1 as shown in FIG. 18, and in this manner, a high heat conductivity can be obtained.
  • FIG. 20 is a cross sectional view of the main insulating layer in which the high heat conductive layer 12 is made wider than the low heat conductor layer 13. With this structure, it is considered that high heat conductive layers 12 are connected together via a coil main insulating layer, and therefore a high heat conductivity can be obtained.
  • An equivalent circuit of the mentioned structure is shown in FIG. 21, which illustrates that a heat conductivity 16 of a wide section bypasses a heat conductivity 14 of a low heat conductive mica layer, thereby achieving a high heat conductivity.
  • Table 2 indicates the difference in heat conductivity index in the case where the heat conductivity of the mica layer was set to 0.22 W/mK, the heat conductivity of the backing material layer was set to 4 W/mK, and the width of the backing material layer was set 10% wider than that of the mica layer.
  • a tape in which the highly heat conductive backing material layer 2 was formed wider was prepared as a sample of Example 2, whereas a tape in which the mica layer 1 and the backing material layer 2 were to have the same width was prepared as a sample of Comparative Example 3.
  • the "heat conductivity index" used here is a relative value having no unit calculated with respect to a reference value of Comparative Example 3 being set to 1. Comparative Example 3
  • Example 2 High heat conductive width/low heat conductive width 1 1.1 Heat conductivity index 1 1.25
  • an electromagnetic coil 2 was prepared.
  • the upper and lower surfaces of the tape were inverted, and the tapes were alternately wound in such a manner that the overlapping portion between tape wound sections is displaced by one half of the tape width W (that is, W/2).
  • a tape member prepared by adhering the low heat conductive layer 13 and high heat conductive layer 12 together was wound around a conductor to form the main insulating layer.
  • a layer having a low heat conductivity is always interposed between adjacent high heat conductive layers, and therefore the heat propagation is cut off by the layer having a low heat conductivity.
  • a highly heat conductive material having a heat conductivity of 4 W/mK described in the first embodiment was used as the backing material.
  • Mica was used as the low heat conductive layer and 0.22 W/mK was obtained. They were adhered together and two of thus obtained tapes were wound around a conductor in the same direction to form a main insulating layer, whose cross section was as shown in FIG. 23.
  • two tapes were used, the upper and lower surfaces of each tape were inverted, and the tapes were alternately wound in such a manner that the overlapping portion between tape wound sections is displaced by one half of the tape width W (that is, W/2), to obtain what is shown in FIG. 22.
  • the heat conductivity of this was 1.2 times higher than that of the above-mentioned case.
  • the important point is how the heat conducting paths are continuously formed in the main insulating layer.
  • a desired main insulating layer for example, by the following manner. That is, a tape is prepared by filling an epoxy resin with boron nitride and apply the resultant on glass cloth, and the tape is adhered on both sides of a mica layer. Thus obtained tape is wounded to form the main insulating layer.
  • the highly heat conductive layer 12 is formed separately from the mica tape. More specifically, as shown in FIG. 25, the tape 13 of the above-described embodiment was used as a mica tape, and this tape 13 and the highly heat conductive tape 16 having a heat conductivity of 1 W/mK or higher are alternately wound to formed the main insulating layer.
  • FIG. 25 illustrates a cross section of the main insulating layer thus obtained.
  • the heat conductive tape having a heat conductivity of 1 W/mK or higher a tape prepared by adding 4% by volume of aluminum oxide to an isopropylene-based elastomer having 60% by volume of boron nitride added thereto, was employed.
  • the mica tapes were alternately wound in such a manner that the overlapping portion between tape wound sections is displaced by less than one half of the tape width W, to obtain the electromagnetic coil described in the above-described embodiment.
  • FIG. 16 illustrates a cross section of the main insulating layer in which the tapes were wound by a displacement of W/2, and the highly heat conductive layer formed a heat conductive path continuously up to the second layer.
  • FIG. 26 illustrates a cross section of the main insulating layer in which the tapes were wound by a displacement of a quarter of the tape width W (W/4) (that is, 3W/4 overlapping winding), and the highly heat conductive layer formed a heat conductive path continuously up to the fourth layer.
  • W tape width
  • FIG. 26 illustrates a cross section of the main insulating layer in which the tapes were wound by a displacement of a quarter of the tape width W (W/4) (that is, 3W/4 overlapping winding), and the highly heat conductive layer formed a heat conductive path continuously up to the fourth layer.
  • Table 3 indicates a comparison in heat conductivity between a coil sample (Example 3) in which the mica tapes were wound in such a manner that the overlapping portion between tape wound sections was displaced by W/2 (Example 3) and another sample in which they were wound in such a manner that the overlapping portion was displaced by W/4 (Example 4).
  • the heat conductivity index used in this table is a relative value having no unit calculated with respect to a reference value of Comparative Example 3 being set to 1.
  • Example 3 Example 4 Tape displacement width W/2 W/4 Heat conductivity index 1 1.1
  • Example 4 the heat conductivity of Example 4 (displacement width of W/4) was 1.1 times higher than that of Example 3 (W/2).
  • the cooling power of the electromagnetic coil can be further improved, and the electromagnetic device can be further reduced in size.
  • examples of the electromagnetic device are a rotating machine, a power generator and a transformer.
  • An electric motor as the rotating machine is illustrated in U.S. Patent No. 4,760,296. This document also illustrates a transformer.
  • An electric power generator as the rotating machine is illustrated in U.S. Patent No. 6,452,29481.
  • a composite material containing the first particles 22 and resin 21 was further combined with the second particles 23.
  • the first particles 22 were a material that has a heat conductivity ⁇ of at least 1 W/mK.
  • the second particles 23 were a material of a different type from that of the first particles 22 or having a particle diameter different therefrom.
  • boron nitride was used as the first particles 22
  • carbon black was used as the second particles 23
  • an epoxy resin 21 was used as the resin 21.
  • the first sample was made of boron nitride 22 and epoxy resin 1 only without carbon black 23.
  • This sample was obtained by diffusing 70% by volume of the boron nitride particles 22 into the epoxy resin 21, and then pressing and curing the resultant to have a thickness of 1.5 mm with, for example, a hot press machine.
  • the hot press had a single pressing operation just one time to have the sample pressed and cured, but it may have a multi-step hot press in which the press is repeated a plurality of times, for example, two to three times.
  • the second sample was made of carbon black 23, boron nitride 22 and an epoxy resin 21.
  • boron nitride particles having an average particle diameter of 16 ⁇ m 5% by volume of carbon black (Asahi Thermal (Tradename) of Asahi Carbon Co., Ltd.) was added and the resultant was stirred for 2 minutes in a stirrer, and the stirred resultant was diffused as a filling material in the epoxy resin 21.
  • the heat conductivity was improved by about two times as high by adding a slight amount of the carbon black particles.
  • the epoxy resin 22 was used as a surface treating agent such as a binder resin (coupling agent); however the present invention is not limited to this, but it can be used in any resin, for example, a silicone-based resin. Therefore, the invention is not dependent on the composition of the resin and the versatility is high. Consequently, a highly heat conductive material having a high heat conductivity can be provided.
  • a binder resin coupling agent
  • the present invention is not limited to this, but it can be used in any resin, for example, a silicone-based resin. Therefore, the invention is not dependent on the composition of the resin and the versatility is high. Consequently, a highly heat conductive material having a high heat conductivity can be provided.
  • the boron nitride particles were used as the first particles 22 in this embodiment.
  • a ceramic material having a heat conductivity of 1 W/mK or higher and containing any one of aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, diamond-like carbon, carbon-like diamond, silicon carbide, laminar silicate clay mineral and mica.
  • the carbon black particles were used as the second particles 23 in this embodiment.
  • the present invention is not limited to this, but it is alternatively possible to use boron nitride particles having difference particles diameters with an average particle diameter of, for example, 3 ⁇ m.
  • boron nitride particles having difference particles diameters with an average particle diameter of, for example, 3 ⁇ m.
  • the second particles had a heat conductivity of at least 0.5 W/mK or higher.
  • the reason whey the heat conductivity ⁇ was greatly improved with the material 21 of this embodiment is assumed to be that the interstices that were created while being filled with the first particles 22 could be filled with the second particles 23. According to this reasoning, it is preferable that the second particles 23 should be of a type having a heat conductivity ⁇ higher than that of the resin 21.
  • the heat conductivity ⁇ of aluminum nitride (AlN) is 100 W/mK. Therefore, when aluminum nitride particles are added as the second particles 23 to the composite material made of boron nitride and resin, the heat conductivity ⁇ of the material 21 is further improved.
  • boron nitride was used as the first particles and an epoxy resin was used as the binder resin 21. Further, carbon black (Asahi Thermal (Tradename) of Asahi Carbon Co., Ltd.) was used as the second particles 23 and the content of the carbon black particles was set to be 0.5% by volume or higher.
  • FIG. 29 is a diagram showing a characteristic curve indicating the results of examination of the heat conductivity ⁇ of the member of this embodiment, with the horizontal axis indicating the volume ratio (vol%) of carbon black with respect to the volume excluding boron nitride and the vertical axis indicating the heat conductivity ⁇ (W/mK).
  • the characteristic curve E indicates the change in the heat conductivity ⁇ .
  • the content of the carbon black particles 24 was set to be 33.3% by volume or lower with respect to the total amount of the resin 21 and carbon black particles 24.
  • the carbon black particles 24 have a high electrical conductivity. Consequently, the use of the material as an electrical insulating member is not preferable because an increase in the electric conductivity ⁇ cause an adverse effect on the performance of the product.
  • FIG. 30 is a diagram showing a characteristic curve indicating the results of examination of the comparison between the volume content of carbon particles and heat conductivity ⁇ or electric conductivity ⁇ , with the horizontal axis indicating the volume content (vol%) of the carbon black particles with respect to the total amount of the resin and carbon particles in volume, the left-hand side vertical axis indicating the heat conductivity ⁇ (W/mK) and the right-hand side vertical axis indicating the electric conductivity ⁇ (S/m).
  • the characteristic curve F indicates the change in the heat conductivity ⁇
  • the characteristic curve G indicates the change in the electric conductivity ⁇ .
  • infinite clusters means that carbon black particles are connected together in the sample and they serve to connect the interior of the sample without interposing the resin layer as shown in 31, which creates an extremely undesirable state for insulation. This phenomenon is determined by the physical diffusion state regardless of the type of binder resin.
  • the sample was prepared such that the content of the carbon black particles 24 was adjusted to be 33.3% by volume or lower with respect to the total amount of the resin 21 and carbon black particles 24.
  • a highly heat conductive material having a high versatility, being not dependent on the composition of the epoxy resin 21, a high heat conductivity and an insulating property was obtained.
  • aluminum nitride particles (having a particle diameter of less than 1 ⁇ m to nanometer) that served as the second particles 24 were made smaller in size than boron nitride particles (having a particle diameter of 1 ⁇ m to 100 ⁇ m) that served as the first particles 22.
  • aluminum nitride has a molecular amount of 41.0 at a purity of 3N.
  • ALI04PB product model number of Japan Pure Chemical Co., Ltd. was used as aluminum nitride. It is alternatively possible to use a commercial product of Tachyon Co., LTd. as aluminum nitride.
  • the aluminum nitride particles 24 serves to fill the interstices created in the epoxy resin 21 by the boron nitride particles 22, thereby making it possible to exhibit a high heat conductivity ⁇ .
  • the aluminum particles 24 are larger in particle size than the boron nitride particles 22, the heat conductive paths created of the boron nitride particles 22 and contributing to the heat conductivity ⁇ are shut off, which causes the lowering of the heat conductivity ⁇ .
  • the particle diameter of the aluminum nitride particles was set smaller than that of the boron nitride particles.
  • boron nitride particles 22 and carbon black particles 23 are loaded in a molding machine (not shown) and at the same time, a coupling agent (binder resin), which will be later explained, is loaded.
  • a coupling agent binder resin
  • a stirring and drying step S32 the raw material loading step S31 is stirred and dried.
  • a two-liquid mixture type epoxy main agent is injected into the raw material while it is in a stirred and dried state, and the raw material and the others are kneaded.
  • a kneading step S34 an epoxy sub-agent is mixed to the epoxy main agent in a kneaded state obtained in the kneading step S33 and the resultant is further kneaded.
  • a hot press curing step S35 the resultant is then cured by hot press.
  • a product obtaining S36 the product obtained in the hot press curing step S35 is unloaded.
  • filling material was diffused in an epoxy resin such that the volume ratio of a total of boron nitride and carbon black is 65% by volume of the entire amount. Then, the resultant was subjected to a hot press to press and cure it, thereby preparing a plate member.
  • the heat conductivity ⁇ of thus obtained plate member was measured and it was 8.6 W/mK. As compared to a conventional case where a coupling agent was not used, the result indicated that the heat conductivity ⁇ was improved by about 0.5 W/mK. The reason for this is considered that the bonding force between filling materials became strong via the resin, which promoted the transmission of phonons. Thus, when the coupling agent is loaded at the same time as the timing of loading the raw materials, a highly heat conductive material having a high heat conductivity was obtained.
  • the coupling agent not only the silane coupling agent, but also a zircon-based or titanium-based agent is clearly as effective as that.
  • it is one way to carry out the coupling treatment with an epoxy resin; however it is alternatively possible for a sufficient effect that the surface of the filling material is modified with a carboxylic group or hydroxyl group and they are made to react with each other to directly increase the bonding force.
  • the material of the above-described embodiment was employed and formed into a tape-like or film-like shape.
  • the material of this embodiment exhibits a high heat conductivity by a physically dispersed state of the filling material, and has an extremely high versatility.
  • polyethylene pellets 27, boron nitride particles 22 and carbon black particles 23 are mixed and kneaded, and the kneaded mixture was placed between two press plates 28. Then, using a hot press machine (not shown), the kneaded mixture was heated and pressed to form a tape or film having a high heat conductivity.
  • the material used for the film is not limited to polyethylene, but any one of various types of thermoplastic resins, thermosetting resins and elastomers may be used.
  • the elasticity becomes higher as compared to the case of a thermoplastic resin or thermosetting resin, and therefore a film product or the like thus obtained with a high plasticity can be obtained.
  • the first particles one or more types of particles selected from the group consisting of boron nitride, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, diamond-like carbon, carbon-like diamond, silicon carbide, laminar silicate clay mineral and mica.
  • the second particles one or more types of particles selected from the group consisting of boron nitride, carbon, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, diamond-like carbon, carbon-like diamond, silicon carbide, gold, cupper, iron, laminar silicate clay mineral and mica.
  • a wire-wounded conductor 5 which is used for a cast resin transformer, is covered by an insulating member of any one of the above-described embodiments.
  • the structure of the cast resin transformer is discussed in, for example, U.S. Patent No. 4,760,296.
  • the heat conductivity ⁇ of the insulating layer 6 could be increased by about 1.5 times.
  • the cooling efficiency of the electromagnetic coil was improved and the density of the current flowing through the coil could be increased by about 20%. Further, the measurements of the coil could be reduced. As a result, it became possible to manufacture a small-sized cast resin transformer.
  • a highly heat conductive insulating member that has a high heat conductivity ⁇ and an excellent heat radiating property. Further, according to the invention, there can be provided a method of manufacturing a highly versatile and highly heat conductive insulating member easily. Further, a small-sized electromagnetic coil having an excellent heat radiating property as well as an electromagnetic device can be provided.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulating Bodies (AREA)
  • Laminated Bodies (AREA)
EP03741216A 2002-07-04 2003-07-04 Element isolant a conductivite thermique elevee et son procede de fabrication, bobine electromagnetique et dispositif electromagnetique Expired - Lifetime EP1530223B1 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002196363A JP2004035782A (ja) 2002-07-04 2002-07-04 高熱伝導性材料及びその製造方法
JP2002196363 2002-07-04
JP2003144919A JP4625615B2 (ja) 2003-05-22 2003-05-22 テープ部材とその製造方法及びテープ部材を用いた電磁コイル並びに電磁機器
JP2003144919 2003-05-22
PCT/JP2003/008564 WO2004006271A1 (fr) 2002-07-04 2003-07-04 Element isolant a conductivite thermique elevee et son procede de fabrication, bobine electromagnetique et dispositif electromagnetique

Publications (3)

Publication Number Publication Date
EP1530223A1 true EP1530223A1 (fr) 2005-05-11
EP1530223A4 EP1530223A4 (fr) 2006-06-28
EP1530223B1 EP1530223B1 (fr) 2009-02-04

Family

ID=30117385

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03741216A Expired - Lifetime EP1530223B1 (fr) 2002-07-04 2003-07-04 Element isolant a conductivite thermique elevee et son procede de fabrication, bobine electromagnetique et dispositif electromagnetique

Country Status (4)

Country Link
EP (1) EP1530223B1 (fr)
CN (1) CN1324615C (fr)
DE (1) DE60326072D1 (fr)
WO (1) WO2004006271A1 (fr)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006002014A1 (fr) * 2004-06-15 2006-01-05 Siemens Power Generation, Inc. Revetements du type diamant pour materiaux de remplissage de taille nanometrique
WO2006118536A1 (fr) * 2005-05-04 2006-11-09 Abb Research Ltd. Materiau d’isolation electrique, dispositif electrique et procede de fabrication de materiau d’isolation electrique
EP1772877A1 (fr) * 2005-06-02 2007-04-11 STS Spezial-Transformatoren-Stockach GmbH & Co. KG Transformateur MF avec meilleure dissipation thermique
WO2007114873A1 (fr) * 2006-04-03 2007-10-11 Siemens Power Generation, Inc. Mélange de particules greffées et non greffées dans une résine
US7651963B2 (en) 2005-04-15 2010-01-26 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
US7776392B2 (en) 2005-04-15 2010-08-17 Siemens Energy, Inc. Composite insulation tape with loaded HTC materials
US7781057B2 (en) 2005-06-14 2010-08-24 Siemens Energy, Inc. Seeding resins for enhancing the crystallinity of polymeric substructures
US7781063B2 (en) 2003-07-11 2010-08-24 Siemens Energy, Inc. High thermal conductivity materials with grafted surface functional groups
US7837817B2 (en) 2004-06-15 2010-11-23 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
US7846853B2 (en) 2005-04-15 2010-12-07 Siemens Energy, Inc. Multi-layered platelet structure
US7851059B2 (en) 2005-06-14 2010-12-14 Siemens Energy, Inc. Nano and meso shell-core control of physical properties and performance of electrically insulating composites
US7955661B2 (en) 2005-06-14 2011-06-07 Siemens Energy, Inc. Treatment of micropores in mica materials
US8039530B2 (en) 2003-07-11 2011-10-18 Siemens Energy, Inc. High thermal conductivity materials with grafted surface functional groups
US8216672B2 (en) 2004-06-15 2012-07-10 Siemens Energy, Inc. Structured resin systems with high thermal conductivity fillers
US8357433B2 (en) 2005-06-14 2013-01-22 Siemens Energy, Inc. Polymer brushes
US8685534B2 (en) 2004-06-15 2014-04-01 Siemens Energy, Inc. High thermal conductivity materials aligned within resins
WO2017103078A1 (fr) * 2015-12-17 2017-06-22 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif electronique comportant au moins une inductance comprenant des moyens de gestion thermique passifs
WO2017103075A1 (fr) * 2015-12-17 2017-06-22 Commissariat A L'energie Atomique Et Aux Energies Alternatives Noyaux d'inductance monolithique integrant un drain thermique
US10410784B2 (en) 2016-05-31 2019-09-10 Shindengen Electric Manufacturing Co., Ltd. Magnetic component
US10748700B2 (en) 2016-05-31 2020-08-18 Shindengen Electric Manufacturing Co., Ltd. Coil structure and magnetic component

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4599063B2 (ja) * 2004-01-15 2010-12-15 株式会社東芝 コイル巻回用絶縁テープ
US7268293B2 (en) * 2004-06-15 2007-09-11 Siemen Power Generation, Inc. Surface coating of lapped insulation tape
JP5597106B2 (ja) * 2010-11-19 2014-10-01 住友電気工業株式会社 リアクトル
JP5798210B2 (ja) * 2013-07-10 2015-10-21 デクセリアルズ株式会社 熱伝導性シート
CN103559950A (zh) * 2013-10-09 2014-02-05 王子跃 一种散热电线的技术制作方法
JP6028267B2 (ja) 2015-03-05 2016-11-16 株式会社明電舎 回転電機のコイル
CN104943162A (zh) * 2015-05-05 2015-09-30 上海和鸣变压器有限公司 一种超导变压器用玻璃钢筒制造工艺
CN105097148B (zh) * 2015-07-31 2017-03-08 江苏神马电力股份有限公司 复合绝缘子芯棒及其制备方法及复合绝缘子
CN109075643A (zh) * 2016-07-01 2018-12-21 东芝三菱电机产业系统株式会社 绝缘结构制造方法、绝缘结构及旋转电机
CN106531288B (zh) * 2016-11-02 2018-10-19 株洲时代电气绝缘有限责任公司 一种少胶云母带及其制备方法
US20180191228A1 (en) * 2016-12-29 2018-07-05 General Electric Magnetic apparatus having electrically insulating layer
CN107573564B (zh) * 2017-08-31 2020-08-25 四川大学 一种高分子基绝缘导热复合材料
CN110014541B (zh) * 2017-09-11 2021-08-27 苏州大学 四层结构树脂基复合材料
US20210074472A1 (en) * 2018-03-09 2021-03-11 Marvis White Thermally conductive composite dielectric materials
CN108872401B (zh) * 2018-08-27 2023-11-10 中南大学 一种抗高温、耐磨的电磁超声横波换能器及其制作方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000297204A (ja) * 1999-04-16 2000-10-24 Toshiba Corp エポキシ樹脂組成物および回転電機コイルおよび注型樹脂組成物および回転電機

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55147753U (fr) * 1979-04-12 1980-10-23
JPS6130041U (ja) * 1984-07-27 1986-02-22 株式会社岡部マイカ工業所 放熱絶縁シ−ト
JPS63105412A (ja) * 1986-10-20 1988-05-10 富士電機株式会社 コイル絶縁用集成マイカプリプレグテ−プ
JPH0945133A (ja) * 1995-08-01 1997-02-14 Japan Mica Ind Co Ltd マイカ基材シート状体及び絶縁コイル
JPH1169687A (ja) * 1997-08-21 1999-03-09 Toshiba Corp 電磁コイル及びその製造方法
EP0966001A1 (fr) * 1998-06-17 1999-12-22 COMPAGNIE ROYALE ASTURIENNE DES MINES, Société Anonyme Procédé de réalisation d'un produit micacé se présentant de préférence sous la forme d'un ruban de mica et produit obtenu
JP2000294061A (ja) * 1999-04-05 2000-10-20 Hitachi Ltd 絶縁材及び電機巻線
JP2001061247A (ja) * 1999-08-23 2001-03-06 Toshiba Corp 回転電機の固定子コイル
CN1215490C (zh) * 1999-08-27 2005-08-17 株式会社日立制作所 绝缘材料和电机绕组及其制造方法
JP4116236B2 (ja) * 2000-10-06 2008-07-09 東芝アイテック株式会社 積層部材およびそれを用いた回転電機

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000297204A (ja) * 1999-04-16 2000-10-24 Toshiba Corp エポキシ樹脂組成物および回転電機コイルおよび注型樹脂組成物および回転電機

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 13, 5 February 2001 (2001-02-05) & JP 2000 297204 A (TOSHIBA CORP), 24 October 2000 (2000-10-24) *
See also references of WO2004006271A1 *

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7781063B2 (en) 2003-07-11 2010-08-24 Siemens Energy, Inc. High thermal conductivity materials with grafted surface functional groups
US8039530B2 (en) 2003-07-11 2011-10-18 Siemens Energy, Inc. High thermal conductivity materials with grafted surface functional groups
US7837817B2 (en) 2004-06-15 2010-11-23 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
US8685534B2 (en) 2004-06-15 2014-04-01 Siemens Energy, Inc. High thermal conductivity materials aligned within resins
US8313832B2 (en) 2004-06-15 2012-11-20 Siemens Energy, Inc. Insulation paper with high thermal conductivity materials
WO2006002014A1 (fr) * 2004-06-15 2006-01-05 Siemens Power Generation, Inc. Revetements du type diamant pour materiaux de remplissage de taille nanometrique
US8216672B2 (en) 2004-06-15 2012-07-10 Siemens Energy, Inc. Structured resin systems with high thermal conductivity fillers
US7651963B2 (en) 2005-04-15 2010-01-26 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
US7776392B2 (en) 2005-04-15 2010-08-17 Siemens Energy, Inc. Composite insulation tape with loaded HTC materials
US7846853B2 (en) 2005-04-15 2010-12-07 Siemens Energy, Inc. Multi-layered platelet structure
US8277613B2 (en) 2005-04-15 2012-10-02 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
WO2006118536A1 (fr) * 2005-05-04 2006-11-09 Abb Research Ltd. Materiau d’isolation electrique, dispositif electrique et procede de fabrication de materiau d’isolation electrique
EP1772877A1 (fr) * 2005-06-02 2007-04-11 STS Spezial-Transformatoren-Stockach GmbH & Co. KG Transformateur MF avec meilleure dissipation thermique
US7781057B2 (en) 2005-06-14 2010-08-24 Siemens Energy, Inc. Seeding resins for enhancing the crystallinity of polymeric substructures
US7955661B2 (en) 2005-06-14 2011-06-07 Siemens Energy, Inc. Treatment of micropores in mica materials
US7851059B2 (en) 2005-06-14 2010-12-14 Siemens Energy, Inc. Nano and meso shell-core control of physical properties and performance of electrically insulating composites
US7655295B2 (en) 2005-06-14 2010-02-02 Siemens Energy, Inc. Mix of grafted and non-grafted particles in a resin
US8357433B2 (en) 2005-06-14 2013-01-22 Siemens Energy, Inc. Polymer brushes
US8383007B2 (en) 2005-06-14 2013-02-26 Siemens Energy, Inc. Seeding resins for enhancing the crystallinity of polymeric substructures
KR101405836B1 (ko) * 2006-04-03 2014-06-12 지멘스 에너지, 인코포레이티드 수지 내 그래프트된 및 비-그래프트된 입자의 혼합물
WO2007114873A1 (fr) * 2006-04-03 2007-10-11 Siemens Power Generation, Inc. Mélange de particules greffées et non greffées dans une résine
WO2017103078A1 (fr) * 2015-12-17 2017-06-22 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif electronique comportant au moins une inductance comprenant des moyens de gestion thermique passifs
WO2017103075A1 (fr) * 2015-12-17 2017-06-22 Commissariat A L'energie Atomique Et Aux Energies Alternatives Noyaux d'inductance monolithique integrant un drain thermique
FR3045923A1 (fr) * 2015-12-17 2017-06-23 Commissariat Energie Atomique Noyaux d'inductance monolithique integrant un drain thermique
FR3045922A1 (fr) * 2015-12-17 2017-06-23 Commissariat Energie Atomique Dispositif electronique comportant au moins une inductance comprenant des moyens de gestion thermique passifs
US10629353B2 (en) 2015-12-17 2020-04-21 Commissariat A L'energie Atomique Et Aux Energies Alternatives Electronic device including at least one inductor comprising passive heat management means
US10410784B2 (en) 2016-05-31 2019-09-10 Shindengen Electric Manufacturing Co., Ltd. Magnetic component
US10748700B2 (en) 2016-05-31 2020-08-18 Shindengen Electric Manufacturing Co., Ltd. Coil structure and magnetic component

Also Published As

Publication number Publication date
CN1666303A (zh) 2005-09-07
CN1324615C (zh) 2007-07-04
EP1530223B1 (fr) 2009-02-04
DE60326072D1 (de) 2009-03-19
EP1530223A4 (fr) 2006-06-28
WO2004006271A1 (fr) 2004-01-15

Similar Documents

Publication Publication Date Title
US7524557B2 (en) Highly heat conductive insulating member, method of manufacturing the same and electromagnetic device
EP1530223B1 (fr) Element isolant a conductivite thermique elevee et son procede de fabrication, bobine electromagnetique et dispositif electromagnetique
CN104051145B (zh) 电感器及其制造方法
EP1968168B1 (fr) Isolateur de bobine, bobine d'armature isolée par l'isolateur de bobine et machine éléctrique rotative électrique dotée de la bobine d'armature
CN111391440B (zh) 具有频率选择性电磁屏蔽的绝缘导热聚合物复合材料及其制备方法
EP1727160A1 (fr) Element en bande, element en feuille et procede de fabrication de l'element en bande ou de l'element en feuille
KR20030057358A (ko) 전자소자를 냉각하는 방법 및 그 방법을 이용하는열전도성 쉬트
WO1993011655A1 (fr) Materiau suscepteur a rayonnements electromagnetiques utilisant des particules d'un alliage amorphe ferromagnetique
US5310598A (en) Radio wave absorbing material
KR19980703168A (ko) 전도성 중합체 조성물 및 소자
CN114600567A (zh) 散热片及其制备方法
JP2012023261A (ja) 磁性体シート及びこの磁性体シートを用いた磁性体コア
KR102126062B1 (ko) 연자성 복합 재료 및 그 제조방법
CN111469329B (zh) 一种发热片的制备方法及应用该制备方法制得的发热片
KR101900528B1 (ko) 전자기파 차폐시트, 및 이의 제조방법
CN111548586B (zh) 聚合物基复合导热材料及其制备方法和应用
CN101183575A (zh) 具有过流和esd双重防护的新型插件热敏元件及其制造方法
KR20170097340A (ko) 탄소나노튜브를 이용한 면상발열체 필름
JP2009088214A (ja) サーミスタ
JP4625615B2 (ja) テープ部材とその製造方法及びテープ部材を用いた電磁コイル並びに電磁機器
CN113573552B (zh) 一种用于无线充电的磁屏蔽结构及其制造方法
KR101844551B1 (ko) 복합 용도의 자성 시트 및 이를 포함하는 안테나 장치
KR20230090886A (ko) 저유전 방열 복합시트 및 그 제조 방법
JP5159812B2 (ja) 回転電機
CN114927259A (zh) 一种高介电强度的高导热多胶环氧玻璃丝粉云母带及制造方法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20050104

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

RBV Designated contracting states (corrected)

Designated state(s): CH DE FR LI

A4 Supplementary search report drawn up and despatched

Effective date: 20060529

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): CH DE FR LI

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

Ref country code: CH

Ref legal event code: NV

Representative=s name: E. BLUM & CO. AG PATENT- UND MARKENANWAELTE VSP

REF Corresponds to:

Ref document number: 60326072

Country of ref document: DE

Date of ref document: 20090319

Kind code of ref document: P

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20091105

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 14

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 15

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 16

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20220523

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20220524

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 20220801

Year of fee payment: 20

REG Reference to a national code

Ref country code: DE

Ref legal event code: R071

Ref document number: 60326072

Country of ref document: DE

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL