WO2004006271A1 - Element isolant a conductivite thermique elevee et son procede de fabrication, bobine electromagnetique et dispositif electromagnetique - Google Patents

Element isolant a conductivite thermique elevee et son procede de fabrication, bobine electromagnetique et dispositif electromagnetique Download PDF

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Publication number
WO2004006271A1
WO2004006271A1 PCT/JP2003/008564 JP0308564W WO2004006271A1 WO 2004006271 A1 WO2004006271 A1 WO 2004006271A1 JP 0308564 W JP0308564 W JP 0308564W WO 2004006271 A1 WO2004006271 A1 WO 2004006271A1
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WO
WIPO (PCT)
Prior art keywords
particles
thermal conductivity
insulating member
tape
layer
Prior art date
Application number
PCT/JP2003/008564
Other languages
English (en)
Japanese (ja)
Inventor
Tetsushi Okamoto
Hiroyoshi Tsuchiya
Fumio Sawa
Noriyuki Iwata
Mitsuhiko Koyama
Yukio Suzuki
Akihiko Suzuki
Tooru Ootaka
Shigehito Ishii
Susumu Nagano
Original Assignee
Kabushiki Kaisha Toshiba
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002196363A external-priority patent/JP2004035782A/ja
Priority claimed from JP2003144919A external-priority patent/JP4625615B2/ja
Application filed by Kabushiki Kaisha Toshiba filed Critical Kabushiki Kaisha Toshiba
Priority to EP03741216A priority Critical patent/EP1530223B1/fr
Priority to DE60326072T priority patent/DE60326072D1/de
Publication of WO2004006271A1 publication Critical patent/WO2004006271A1/fr
Priority to US11/028,227 priority patent/US7524557B2/en
Priority to US12/415,738 priority patent/US20090197102A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12—Insulating of windings
    • H01F41/127—Encapsulating or impregnating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/323—Insulation between winding turns, between winding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/327—Encapsulating or impregnating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/06—Insulation of windings

Definitions

  • the present invention relates to a tape-shaped or sheet-shaped high heat conductive insulating member used for an electromagnetic coil of an electromagnetic device such as a generator, a motor, and a transformer, and a method for manufacturing the same.
  • the present invention relates to an electromagnetic coil and an electromagnetic device manufactured using the same.
  • One of the measures to improve the cooling performance of electromagnetic coils is to increase the thermal conductivity of electrically insulating tapes and sheet members used around the electromagnetic coils.
  • Japanese Patent Application Laid-Open No. 2002-933257 discloses, as an electrical insulating material used for an electromagnetic coil, a high-thermal-conductivity my-force base sheet having a backing material containing an inorganic powder. Have been. However, the electrical insulating material of this prior document is used for a backing material. Since the material with high thermal conductivity does not show sufficient thermal conductivity, the thermal conductivity is not enough for the insulation layer of the electromagnetic coil.
  • Japanese Patent Application Laid-Open No. H11-13232-162 discloses that in order to improve the thermal conductivity of an insulating layer, a crystalline epoxy resin is used for the resin of the insulating layer. It is disclosed to improve However, the crystalline epoxy resin of this prior art is in a solid state at room temperature, and is difficult to handle.
  • Japanese Patent Application Laid-Open No. H10-1743433 discloses an electromagnetic coil in which a heat conductive sheet is alternately wound around a winding conductor in order to improve the thermal conductivity of an insulating layer.
  • a heat conductive sheet is alternately wound around a winding conductor in order to improve the thermal conductivity of an insulating layer.
  • the conventional electric insulating material causes problems such as insufficient heat conductivity and a troublesome, time-consuming and costly manufacturing process.
  • An object of the present invention is to provide a highly versatile high heat conductive insulating member which has high thermal conductivity without being restricted by the components of the resin, can be easily manufactured, and has high versatility and a method for manufacturing the same.
  • Another object of the present invention is to provide an electromagnetic coil and an electromagnetic device using such a high heat conductive insulating member.
  • the high thermal conductive insulating member according to the present invention includes: a resin substrate; first particles dispersed in the resin substrate and having a thermal conductivity of lWZmK or more and 30 OW / mK or less; No. 3 having a thermal conductivity of 0.5 WZm K or more and 30 O WZm K or less dispersed in the resin base material And characterized in that:
  • the high thermal conductive insulating member of the present invention By combining the high thermal conductive insulating member of the present invention with a conventional My tape for a wound conductor (Cu coil), it has both excellent heat dissipation characteristics (cooling ability) and insulating properties. Supplied electromagnetic coil.
  • the highly heat conductive insulating member of the present invention may be used alone.
  • the high heat conductive insulating member according to the present invention is a tape-shaped or sheet-shaped high heat conductive insulating member having a my-force layer and a backing material layer, wherein the backing material layer comprises: a resin base; First particles having a thermal conductivity of lWZm K or more and 30 OW / mK or less dispersed in the material; and 0.5 WZmK or more 30 OW / m dispersed in the resin base material. And a second particle having a thermal conductivity of K or less, and.
  • the high thermal conductive insulating member according to the present invention is a tape- or sheet-like high thermal conductive insulating member having a my power layer and a backing material layer, wherein the my power layer has a myica scales force.
  • Ranaru my capeno ⁇ . (Mica paper) and second particles having a thermal conductivity of 0.5 WZm K or more and 30 O WZm K or less dispersed in the paper I do.
  • the reason for setting the upper limit of the thermal conductivity ⁇ of the first particles to 300 WZm K or less is that the thermal conductivity exceeds this; when metal powder or carbon nanotubes having I are filled, the electrical conductivity ⁇ becomes excessively large. This is because the insulation of the member is impaired.
  • the reason for setting the lower limit of the thermal conductivity of the second particles to 0.5 WZm K is that desired thermal radiation characteristics cannot be obtained with a thermal conductivity ⁇ lower than 0.5 WZm K.
  • the reason for setting the upper limit of the thermal conductivity ⁇ of the second particles to 30 OO WZm K or less is substantially the same as the reason for the first particles. However, if the condition that the volume content of the second particles is 33.3 Vo 1% or less is satisfied (see FIG. 30), metals such as gold, copper, and iron are used as the second particles. And carbon can be limitedly filled. If this condition is satisfied, there is no possibility that the insulating properties of the member will be impaired.
  • the diameter of the second particles is preferably smaller than the diameter of the first particles, and more preferably 0.15 times or less the diameter of the first particles. Is most preferred. The reason is that when the particle size ratio of the second particles to the first particles approaches 0.15, the thermal conductivity decreases as shown in FIG.
  • the diameter of the first particles is in the range of 0.05 ⁇ to ⁇ ⁇ (50 nm to L 05 nm). If the diameter of the first particles is less than 0.05 ⁇ , it is difficult to uniformly disperse the particles in the layer, and there is a possibility that the electric breakdown strength of the electric insulation is reduced. On the other hand, if the diameter of the first particles exceeds 100 // m, the flatness of the tape member and the sheet member is impaired, and the thickness tends to be uneven. .
  • the diameter of the second particles is at least 0.15 times or less of the diameter of the my flakes. This is also because the thermal conductivity L decreases when the particle size ratio of the my flakes to the second particles approaches 0.15.
  • the first particles are boron nitride, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, diamond-like carbon, and carbon-like. It is composed of one or more selected from the group consisting of diamond, silicon carbide, layered silicate clay minerals, and my strength. This is because particles of these materials show a thermal conductivity of 1 WZ m K or more and 30 OW / m K or less in a normal state.
  • the second particles are boron nitride, carbon, aluminum nitride aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, and diamond. It is composed of one or more selected from the group consisting of carbonaceous carbon, carbonaceous diamond, silicon carbide, gold, copper, iron, layered silicate clay minerals, and myricite. In particular, it is most preferred that the second particles comprise either carbon or aluminum oxide. Carbon particles such as carbon black are suitable for improving the thermal conductivity; L of the member of the present invention. Also, aluminum oxide
  • -Palm particles are suitable not only for improving the thermal conductivity; I of the member of the present invention, but also for not impairing the insulation of the member.
  • the content of the second particles in the backing material layer is preferably 0.5 Vo 1% or more, and most preferably 1 Vo 1% or more. This is because when the content of the second particles is increased, the thermal conductivity is improved. In particular, when 1 Vo 1% or more of the second particles is contained, the thermal conductivity I of the member is remarkably improved as shown in FIGS.
  • the content of the second particles is based on the sum of the second particles and the resin. It is preferable that the pressure be 33.3 vol% or less, and more preferably 23 V o 1% or less. This is because if the content of the second particles is excessive, the electrical conductivity ⁇ becomes excessive. In particular, when the content of the second particles exceeds 33.3 vol%, as shown in FIG. 30, the electric conductivity ⁇ becomes excessive, and the insulating property of the member deteriorates.
  • the backing material layer may be provided on both sides of the My backing layer, and the My backing layer may be provided on both sides of the backing layer (see Fig. 15).
  • the backing material layer may be wider than the my backing layer, and the my backing layer may be wider than the backing layer (see Fig. 18).
  • the total thickness of the high thermal conductive insulating member should be 0.2 to 0.6 mm for tape and 0.2 to 0.8 mm for sheet. Thickness of my force layer and backing material The ratio is preferably in the range of 6: 4 to 4: 6, and more preferably in the range of 11: 9 to 9:11.
  • the method for manufacturing a high thermal conductive insulating member according to the present invention is a method for manufacturing a tape-shaped or sheet-shaped high thermal conductive insulating member having a my-force layer and a backing material layer, comprising: (a) 1 W / The first particles having a thermal conductivity of not less than m K and 30 O WZm K and the second particles having a thermal conductivity of not less than 0.5 W / m K and not more than 30 O WZm K and the resin solution (B) impregnating the impregnated material with the kneaded material, and (c) heating and curing the kneaded material impregnated in the impregnated material, thereby obtaining a backing material layer , (d) The backing material layer is laminated and adhered to mica paper, and (e) the backing material layer and the mica paper which are laminated and adhered are pressed from above and below with a ronor press (roller press). In addition, it is shaped into a tape or sheet
  • the impregnated body may be either glass cloth or resin film.
  • follow step B1 steps S1 to S3 shown in FIG.
  • follow step B2 steps S11 and S12 shown in FIG. It is preferable to use the hot roll press method for the roll press.
  • a single press is a single press only once, but a multi-stage press in which two or three presses are repeated may be used.
  • the method for manufacturing a high thermal conductive insulating member according to the present invention is a method for manufacturing a tape-shaped or sheet-shaped high thermal conductive insulating member having a my force layer and a backing material layer, wherein (i) 0. A second particle having a thermal conductivity of 5 W / m K or more and 300 W_ / m K or less, mica scales and a solvent are mixed and stirred at a predetermined ratio, and (ii) the mixing and stirring The material is filtered through a predetermined filter and dried to obtain a mica paper. (Iii) The mica paper is bonded to a backing material layer and adhered.
  • the my scales have a high aspect ratio, they are easily agglomerated and hardened, and even after the solvent is volatilized, the shape thereof is maintained and the highly thermally conductive particles are well retained. When a small amount of binder resin is added, the shape retention and particle retention are further improved.
  • the electromagnetic coil according to the present invention is characterized in that the wound conductor is insulated and coated using the above-mentioned tape-like high heat conductive insulating member.
  • An electromagnetic device includes the above-described electromagnetic coil.
  • tape refers to an elongated band-shaped member that is wound around a portion that requires insulating coating.
  • the term “sheet” refers to a member that is not only wound around a portion that requires insulating coating but has a predetermined spread that covers the portion.
  • the insulation sheet is used, for example, to insulate the connection portion where the electromagnetic coils are braided.
  • my power refers to one that includes not only natural my power produced from the natural world but also artificially produced industrial power. Although there are two types of my power, firing my power and non-firing my power, in the present invention, it is preferable to use firing my power. This is because the firing force at firing at a predetermined temperature makes the shape more scaly and increases electrical insulation.
  • my paper refers to a mixture of myca scales and a solvent (7-alcohols), which is mixed and agitated in the manner of papermaking. A thin film or foil obtained by filtering and drying. By cutting such a mica paper into a predetermined size, a my power tape or a mycash can be obtained.
  • carbon refers to a carbon-based material having a structure in which layers formed by ⁇ bonds are bonded by an intermolecular force, such as carbon black and contact black.
  • Black channel black, lonor black, disk black, thermo black, gas black, furnace black, oil furnace black, naphthalene black It is a generic term that includes black, anthracene black, acetylene black, ayumanore black, vegetable black, ketjen black (Ketjen B lack), and graphite.
  • artificial diamond refers to an industrially produced diamond excluding natural diamonds produced from the natural world, and carbon atoms are formed by sp 3 bonds. A structure that is bonded to each other and crystallized.
  • diamond-like carbon refers to a carbon-based material relatively close to carbon as defined above, whose main part is carbon, and a part of which is the diamond as defined above. This includes organizations.
  • carbon-like diamond refers to a carbon-based material relatively close to the diamond defined above. A mixture of carbon and diamond structure as defined above.
  • binder resin refers to a filler used to hold and fix highly thermally conductive particles in a backing material layer or a force layer.
  • component of the resin is not specified in the member of the present invention, in general, any one of epoxy resin, polypropylene resin, and silicone resin (including silicone rubber) is used.
  • FIG. 1 is a process diagram showing a method for manufacturing a highly thermally conductive insulating member according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing a high heat conductive insulating member according to the first embodiment of the present invention.
  • Fig. 3 is a characteristic diagram showing the effect of carbon black addition on the thermal conductivity of insulating tape containing boron nitride.
  • Fig. 4 is a characteristic diagram showing the effect of carbon black on the thermal conductivity of insulating tape.
  • Figure 5 is a schematic cross-sectional view of an electromagnetic coil.
  • Figure 6 is an enlarged view showing the first and second particles.
  • Fig. 7 is a characteristic diagram showing the relationship between the particle size ratio l og (d2 / d l) and the thermal conductivity; I.
  • Figure 8 is a characteristic diagram showing the relationship between the amount of aluminum oxide filling and the thermal conductivity of epoxy resin.
  • FIG. 9 is a process chart showing a manufacturing method according to another embodiment.
  • Figure 10 shows a cross section of the backing material (resin-impregnated glass cloth). Pattern diagram.
  • Fig. 11 is a schematic cross-sectional view showing another backing material (resin-impregnated glass cloth).
  • FIG. 12 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.
  • FIG. 13 is a process chart showing a manufacturing method of another embodiment.
  • FIG. 14 is a schematic cross-sectional view showing a high heat conductive insulating member according to another embodiment.
  • FIG. 15 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.
  • FIG. 16 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.
  • FIG. 17 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.
  • FIG. 18 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.
  • -Fig. 19 is an equivalent circuit diagram conceptually showing the heat conduction characteristics of the main insulating layer of the high thermal conductive insulating member.
  • FIG. 20 is a schematic cross-sectional view showing another high thermal conductive insulating member.
  • Fig. 21 is an equivalent circuit diagram conceptually showing the heat conduction characteristics of the main insulating layer of another high thermal conductive insulating member.
  • FIG. 22 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.
  • FIG. 23 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.
  • FIG. 24 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.
  • FIG. 25 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.
  • FIG. 26 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.
  • FIG. 27 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.
  • FIG. 28 is a bar graph showing the effect of the present invention.
  • Figure 29 is a characteristic diagram showing the effect of carbon black addition on the thermal conductivity of insulating tape containing boron nitride.
  • FIG. 30 is a characteristic diagram showing the results of examining the effects of the carbon particle content on the thermal conductivity ⁇ and the electrical conductivity a.
  • FIG. 31 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.
  • FIG. 32 is a process chart showing a manufacturing method of another embodiment.
  • FIG. 33 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.
  • the above stirred mixture is passed through, for example, a 0.5 mm ⁇ 0.5 mm grid grid in the manner of papermaking to prepare a raw sheet (step 2).
  • the green sheet was heated to a predetermined temperature and dried to obtain mica paper 1 (step K3).
  • a binder resin, boron nitride particles, and carbon black particles are prepared in a mass ratio of 24.7: 74.2: 1.1. And kneaded (step S 1).
  • Asahi Samaru (trade name) manufactured by Asahi Carbon Co., Ltd. was used for the carbon black.
  • the average particle size of the carbon black was 90 ⁇ m.
  • the shape of the carbon black particles was spherical.
  • HP-1C AW product model number manufactured by Mizushima Alloy Iron Co., Ltd.
  • the above kneaded material was applied to a glass cloth having a thickness of 0.333 mm (step S2).
  • the coating amount per unit area of the kneaded material was 400 g / m 2.
  • the coated material was cured by heating to a temperature of 120 ° C., whereby a backing material 2 was obtained (step S 3).
  • the mica paper 1 and the backing material 2 are bonded together with an adhesive (step S4).
  • the adhesive was applied to either the mica paper 1 or the backing material 2, and both were superposed and hot roll pressed. An epoxy resin was used as the adhesive.
  • the adhesive, the mica paper 1 and the backing material 2 are cured by heating to a temperature of 150 ° C., thereby obtaining a my-force sheet (process S5). .
  • steps S4 and S5 Since the processes of steps S4 and S5 are performed continuously, the mica sheet is wide and long.
  • Such a my-power sheet was cut into a width of 35 mm to obtain a my-power tape 10 shown in FIG. 2 (step S6).
  • Boron nitride particles with thermal conductivity of 1 W / mK or more (first particles) and carbon black particles with thermal conductivity of 0.5 W, mK or more in material layer 2 (first particles) (Second particles) are both dispersed in the resin 4. '
  • a laser flash method was used to evaluate and measure the thermal conductivity of the tape member (or the small seam member).
  • Tc300-: ⁇ ⁇ manufactured by Vacuum Riko Co., Ltd. was used as a thermal conductivity measuring device. Specifically, the thermal conductivity ⁇ was evaluated by irradiating one side of a sample having a thickness of l mm with a pulsed laser beam and measuring the temperature rise on the opposite side (back side).
  • a laser analysis type particle size distribution analyzer was used for particle size measurement.
  • LMS-24 of Seisin Corporation was used as the particle size measuring instrument.
  • the measured particle size is the average particle size.
  • the horizontal axis shows the volume ratio of carbon black (Vo 1%), and the vertical axis shows the thermal conductivity ⁇ (W / m) when the carbon black is dispersed in epoxy resin.
  • FIG. 9 is a characteristic diagram showing the dependence of the thermal conductivity on the power-bon black filling amount with respect to K).
  • particles with a thermal conductivity of 1 W / mK and an average particle size of 90 nm were used.
  • a heat conductive sheet having a high thermal conductivity can be obtained by adding a small amount of carbon black to the epoxy resin.
  • the heat conductive sheet 2 is used as a backing material and laminated with a mica paper 1 manufactured by slicing my strength flakes to form a mica sheet through a slit.
  • the my power sheet-1 and the heat conductive sheet 2 (backing material) were bonded together using a bisphenol A type epoxy resin adhesive.
  • Table 1 shows the thermal conductivity index and composition of the My power tape manufactured with the thickness ratio of My power layer 1 and heat conductive sheet 2 set to 1: 1.
  • the “thermal conductivity index” refers to a unitless relative value calculated using Comparative Example 1 as a reference value 1. Comparative Example 1 Comparative Example 2 Example 1
  • the tape filled with boron nitride (Comparative Example 1) showed a thermal conductivity ⁇ that was 1.8 times that of the tape not filled (Comparative Example 2).
  • the tape (Example 1) to which chromium was added exhibited thermal conductivity as high as 1.93 times.
  • FIG. 9 is a characteristic diagram showing the dependence of the thermal conductivity of a My tape on the carbon black filling rate as a meter.
  • the “thermal conductivity index” refers to a unitless relative value calculated using Comparative Example 2 shown in Table 2 as a reference value 1.
  • the thermal conductivity of the My power tape is increased by adding the carbon black.
  • the carbon black filling amount is 1 V ⁇ 1 ° / 0 or more
  • a thermal conductivity index of about 2.5% can be obtained. Therefore, the thermal conductivity I of My force tape is Conductivity increases in proportion to.
  • a my-strength tape 10 is wound to a predetermined thickness on the outer periphery of a winding conductor 5 (bar coil) having a rectangular cross section. Further, a release tape (not shown) was wound. A semi-cylindrical rubber contact jig (not shown) was pressed against each of the four surfaces of the roll. At this time, an iron plate (not shown) with a thickness of 2 mm was inserted between the jig and the wound body. In addition, a heat-shrinkable tube (not shown) was wound around the contact jig three times in a 2/3 overlap. The diameter of the heat-shrinkable tube was about 50 mm.
  • This wound body was immersed in an epoxy resin liquid, and impregnated with the epoxy resin in a vacuum atmosphere. After impregnation with the resin, the wound body was placed in a heating furnace, and the epoxy resin was cured under heating conditions of holding at 150 ° C. for 24 hours. The heat-shrinkable tube, patch jig, iron plate, and release tape were removed to obtain an electromagnetic coil.
  • the insulating layer 6 having a high thermal conductivity is formed as a result.
  • Such an electromagnetic coil is excellent in cooling performance and can increase the current flowing through the winding conductor 5, so that the efficiency is high. If the efficiency is the same, the cross-sectional area of the wound conductor 5 can be reduced, so that the electromagnetic coil is small. Become As a result, the manufacturing cost of the electromagnetic coil is reduced.
  • the thermal conductivity of the main insulation can be reduced from the conventional 0.22 W / mK to 1 WZm. It was about K.
  • the temperature rise of the electromagnetic coil was reduced from 70 K to 4 OK. This makes it possible to increase the density of the current flowing through the electromagnetic coil and reduce the amount of copper used. This made it possible to increase the current density flowing through the electromagnetic coil and reduce the amount of copper used by about 30%.
  • a tape member having a high thermal conductivity can be obtained easily and easily, and the tape member is wound around a coil conductor to be insulated and coated, thereby achieving high heat conductivity.
  • Electromagnetic coils and electromagnetic equipment can be made small and inexpensive to manufacture.
  • boron nitride particles and carbon black particles were used as materials for forming the high thermal conductive backing material. It is thought that the reason for achieving high thermal conductivity can be achieved by replacing the resin layer with carbon black. That is, high thermal conductivity can be obtained by the main filler having high thermal conductivity and the carbon particles filling the gaps.
  • the main filler (first particles) having high thermal conductivity in order to achieve high thermal conductivity, and thus the main filler (first particles) is required.
  • the second particles for example, carbon black particles, to enter the gap filled with fine particles.
  • the main heat-conductive filler is densely packed.
  • high thermal conductivity is obtained by limiting the particle size d 2 of the second filler 8. And high thermal conductivity can be realized.
  • FIG. 7 shows the logarithm of the particle size ratio (d2Zd1) between the first particle and the second particle on the horizontal axis, and the thermal conductivity; I on the vertical axis.
  • FIG. 3 is a characteristic diagram showing a change in thermal conductivity ⁇ with respect to a particle diameter ratio of the particles of FIG. As is apparent from this figure, the thermal conductivity increases in a range where the particle size ratio of the second particles to the first particles is smaller than around 0.1 times.
  • Fig. 8 is a plot of the relationship between the aluminum oxide particles in epoxy resin and the volumetric content (vol%) of the epoxy resin on the horizontal axis, and the thermal conductivity ⁇ on the vertical axis.
  • FIG. In this case, an anoreminium oxide particle having an average particle size of 70 nm was filled in the epoxy resin instead of the carbon black particle having an average particle size of 90 nm.
  • the thermal conductivity was increased as the filling amount of the aluminum oxide particles was increased.
  • the material to which aluminum oxide particles were added at 2 V o 1% obtained a thermal conductivity; L exceeding 7 WZmK. It has been found that high thermal conductivity can be obtained by using this as a backing material.
  • aluminum oxide particles have a higher electrical resistance than carbon black particles, and thus provide a tape with excellent insulation performance.
  • Aluminum oxide is a spherical particle having an average particle size of 70 nm.
  • NanoTekA 1203_HT product model number manufactured by C Kasei Co., Ltd. was used as the aluminum oxide particles.
  • boron nitride was used as the first particle, but aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, artificial diamond, and diamond as alternative materials.
  • C-like carbon or silicon carbide may be used. -With these substitute materials, the same effect as in the present embodiment can be obtained.
  • car pump black and aluminum oxide were used as the second particles, but boron nitride, carbon dioxide, aluminum nitride, magnesium oxide, magnesium oxide, It is also possible to use silicon nitride, artificial diamond, diamond-like carbon silicon carbide, gold, copper, iron, layered silicate clay minerals, and My power. The same effect as in the present embodiment can be obtained by these substitute materials.
  • high thermal conductive particles are filled like the my force layer.
  • Glass cloth 25 was used as the backing material.
  • 2.83 g of my force scales and 0.125 g of alumina particles were mixed in 300 cc of water and stirred (step S21).
  • NanoTekA 1203-HT commercial model number
  • the average particle size of the alumina particles was 70 m.
  • the shape of the alumina particles was spherical.
  • the calcined mai scale was used for the mai scales, and the average particle size of the mai scales was 15 ⁇ m.
  • the above stirred mixture was filtered through a 0.5 mm ⁇ 0.5 mm grid grid in a papermaking manner to produce a raw sheet (step S22).
  • the raw sheet was heated to 120 ° C. and dried to obtain mica paper (step S23).
  • This mica paper was bonded to glass cross 25 using an adhesive (step S24).
  • Epoxy resin was used as the adhesive.
  • the adhesive, the mica paper 1 and the backing material 2 were cured by heating to a temperature of 150 ° C., thereby obtaining a my-force sheet (process S25). ). Since these processes S24 and S25 are performed continuously, the my strength sheet is wide and long. Such a mica sheet was cut into a width of 35 mm to obtain a my strength tape 11A shown in FIG. 10 (step S26).
  • FIG. 10 is a cross-sectional view of a my force tape 11A in which any one of the high thermal conductive particles obtained in the above-described embodiment is dispersed and arranged in glass cloth.
  • a film or tape member is made by impregnating a resin into the glass cross 25, a highly heat conductive tape (film) is produced by incorporating the highly heat conductive particles 26. can do.
  • the tape made in this way as a material for the self-powered tape, a self-powered tape having high thermal conductivity can be obtained.
  • FIG. 11 is a cross-sectional view showing a tape 11B in which a plurality of tapes of the above embodiment are stacked.
  • the first particles having a thermal conductivity of 0.5 W nom K or more were filled and dispersed in the My force layer 9.
  • the my-force layer 11 was manufactured by an ordinary method, and a thermal conductive sheet 9 having a high thermal conductivity was used as a backing material. In this case, the my-force layer 11 has a lower thermal conductivity than the backing material layer 9, so that the my-force layer 11 acts as a thermal barrier.
  • alumina particles having an average particle diameter of 70 nm were mixed with mica paper.
  • mica paper and alumina particles were stirred in distilled water. Then, it was applied on a cloth having a mesh of 0.05 ⁇ , and dried to form a my-force sheet.
  • the my-force sheet itself has a thermal conductivity of about 0.6 W / mK, but if the my-force layer 11 made of mica paper alone is impregnated with resin, the thermal conductivity will be about 0.6 W / mK.
  • the thermal conductivity of the my layer filled with alumina particles is 0
  • the main insulating layer having high thermal conductivity was formed by forming the electromagnetic coil using the tape of the present embodiment.
  • FIGS. 1 to K 3 A fourth embodiment in which a film (substitute material for glass cross) is used for the backing material layer will be described with reference to FIGS.
  • This embodiment is substantially the same as the first embodiment except for the backing material production process B2. Therefore, in the present embodiment, the description of the mica paper producing steps K 1 to K 3 and the mica force tape producing steps S 4 to S 6 will be omitted.
  • step S11 0.13 g of binder resin, 2.83 g of boron nitride particles, and 0.125 g of alumina particles were kneaded (step S11). .
  • the kneaded material was press-cured at a temperature of 150 ° C. using a hot roll press machine, thereby obtaining a backing material (step S12).
  • the fifth embodiment will be described with reference to FIG.
  • the member 10 B of the present embodiment is a combination of the backing material layer 2 of the first embodiment and the my-force layer 9 of the third embodiment described above.
  • the thermal conductivity of the my force tape 10B is further increased, and the heat radiation property is improved. It is estimated that the thermal conductivity of 10 mm of my force tape of this embodiment is about 0.66 W / m 2.
  • the thermal conductivity of the my force tape 10C itself can be improved.
  • an electromagnetic force S having excellent heat radiation characteristics can be obtained.
  • the width of the tape is shifted by using a myka tape 10 composed of a low thermal conductive layer (my power layer) 13 and a high thermal conductive layer (high thermal conductive backing material layer) 12 on one side thereof.
  • 7 shows a cross section of the main insulating layer when the tape is wound around the surface of the wound conductor 5 while being shifted by half (W / 2) of the tape width W.
  • This main insulating layer is arranged such that the low thermal conductive layer 13 is always sandwiched between the high thermal conductive layer 12 and the high thermal conductive layer 12. In the insulating layer 6 using this configuration 10D, it is difficult to obtain high thermal conductivity because the thermal conductivity of the low thermal conductive layer 13 is low.
  • the width of the tape is shifted by half (W / 2) of the tape width W by using a self-powered tape 10 C having the low thermal conductive layer 13 and the high thermal conductive layer 12 formed on both sides thereof.
  • the coil conductor surface 2 shows a cross section of the main insulating layer when wound around.
  • the heat conducting paths are formed in the main insulating layer while the backing materials having high thermal conductivity are continuously connected to each other. Therefore, by forming the high thermal conductive layer 12 on both surfaces of the low thermal conductive layer 13, it is possible to obtain a high thermal conductivity.
  • the thermal conductivity is high and the production is easy. It is possible to easily obtain an electromagnetic coil and an electromagnetic device having high thermal conductivity.
  • the low-thermal-conductivity layer is used as the my power layer, and a layer with a relatively low thermal conductivity is sandwiched between the high-thermal-conductivity layers.
  • High thermal conductivity can also be obtained by sandwiching between the my layers.
  • a my layer containing the second particles having a thermal conductivity of 0.5 WZ m K or more on both sides of the backing material layer a high heat conductivity is obtained and high heat is easily manufactured. Conducted electromagnetic coils and electromagnetic devices can be obtained.
  • the backing material layer 2 having high thermal conductivity is configured to be wider than the My force layer 1. That is, the width W 2 of the backing material layer 2 is It was bigger.
  • an equivalent circuit as shown in FIGS. 19 and 21 is considered when calculating the thermal conductivity of the main insulating layer.
  • the main insulating layer When forming the main insulating layer, a layer having a high thermal conductivity and a relatively low thermal conductive layer are combined to form the main insulating layer.
  • the reason that a low thermal conductivity exists is that the main insulating layer is originally formed to obtain electrical insulation, and the high thermal conductive material using the filler used in the present invention is an insulating rupture. Due to the risk of degrading the characteristics. Depending on the device, it is necessary to form a layer that is thermally conductive but has high dielectric breakdown characteristics.
  • a configuration with high thermal conductivity was realized by using a high thermal conductor for the backing material.
  • the equivalent circuit of such a configuration has the thermal conductivity 14 of the low thermal conductive layer and the thermal conductivity 15 of the high thermal conductive layer, and the my power layer has a thermal conductivity. Since it acts as a barrier, when it is formed into a coil shape, it is difficult to conduct heat through the my layer.
  • high thermal conductivity can be obtained by making the high thermal conductive backing layer 2 wider than the my force layer 1.
  • FIG. 20 shows a cross section of the main insulating layer when the high thermal conductive layer 12 is wider than the low thermal conductive layer 13. It is considered that high thermal conductivity can be obtained because the high thermal conductive layer 12 is connected through the coil main insulating layer. As shown in Fig. 21, the equivalent circuit of this configuration has a high thermal conductivity because the thermal conductivity 16 of the wide part bypasses the thermal conductivity 14 of the low-thermal-conductivity layer. rate Can be obtained.
  • Table 2 shows that the thermal conductivity of the My layer is 0.22 W / mK and the thermal conductivity of the backing material layer is 4 W / mK. The difference in the thermal conductivity index when the width of the material layer is increased is shown.
  • the tape in which the backing material layer 2 of high thermal conductivity was wide was used as the sample of Example 2, and the tape in which the My force layer 1 and the backing material layer 2 had the same width was used as the sample of Comparative Example 3.
  • the “thermal conductivity index” is a unitless relative value when Comparative Example 3 is set to the reference value 1.
  • one of the two force tapes (the tape 10 is illustrated in the figure) described in the above embodiment is used as an electromagnetic coil, and the upper and lower surfaces thereof are inverted. , And between tapes The winding width is shifted by half of the tape width W (WZ 2) and wound alternately.
  • the high thermal conductive material having a thermal conductivity of 4 W / m K described in the first embodiment is used for the backing material.
  • My force is used as the low thermal conductive layer, 0.22 WZm K is obtained.
  • the cross section is as shown in Fig. 23, and the heat conduction at this time is When the two tapes are wound alternately using two tapes with their upper and lower surfaces reversed, and the gap between the tapes is shifted by half (W / 2) of the tape width W, as shown in Figure 22 As shown, the thermal conductivity at this time was 1.2 times.
  • the key point in this method is how to continuously form a heat conduction path in the main insulating layer.
  • the high thermal conductive layer 12 can be formed separately from the My force tape. That is, as shown in FIG. 25, the tape 13 of the above-described embodiment was used as a self-powered tape, and this was alternately used with the high thermal conductive tape 16 having a thermal conductivity of 1 W / mK or more.
  • the main insulation layer is formed by winding.
  • the cross section of the main insulating layer formed in this way is as shown in FIG.
  • a thermal conductive tape with a thermal conductivity of lW / mK or more an isop Use a tape containing 4 V o 1% of aluminum oxide in a propylene-based elastomer.
  • the eleventh embodiment will be described with reference to FIG.
  • the shifting width between the tapes when winding the my force tape is made smaller than WZ2.
  • FIG. 16 is a cross section of the main insulating layer when it is wound with a shift of WZ2.
  • the high heat conductive layer forms a heat conductive path continuously up to the second layer.
  • Fig. 26 shows the cross section of the main insulating layer (3 WZ 4 overlap winding) wound at a quarter of the tape width W (WZ 4).
  • a heat conduction path is formed continuously up to the eyes. If a long continuous path is formed in the thickness direction of the main insulating layer, a portion having low thermal conductivity such as an impregnating resin is not formed, so that a higher thermal conductivity can be obtained.
  • Table 3 shows the thermal conductivities of the coil sample (Example 3) and the coil sample (Example 4) with W2 as the shift width between the tapes when winding the My force tape. Shown in comparison.
  • the thermal conductivity index in this table is a unitless relative value calculated using the thermal conductivity of the sample of Example 3 as the reference value 1.
  • Table 3 As is clear from the table, the thermal conductivity of Example 4 (W / 4 offset width) was 1.1 times that of Example 3 (W / 2).
  • the cooling capacity of the electromagnetic device is further improved, and the electromagnetic device can be further miniaturized.
  • the electromagnetic devices include rotating machines, generators, and transformers.
  • An electric motor as a rotating machine is illustrated in US Pat. No. 4,760,296.
  • the document also shows a transformer.
  • a generator as a rotating machine is illustrated in U.S. Pat. No. 6,452,294 B1.
  • FIG. 27 The 12th embodiment will be described with reference to FIGS. 27 and 28.
  • FIG. 28 The 12th embodiment will be described with reference to FIGS. 27 and 28.
  • the composite material including the first particles 22 and the resin 21 and the second particles 23 are compounded.
  • the first particles 22 are materials having a thermal conductivity of at least lWZmK or more.
  • the second particles 23 are materials having a different kind or a different particle diameter from the first particles 22.
  • the thermal conductivity, I, of the two samples thus prepared was measured by the laser flash method.
  • the first sample had no carbon black 23 and consisted only of boron nitride 22 and epoxy resin 1.
  • the boron nitride particles 22 have a thermal conductivity of about 60 W / mK alone and an average particle diameter of 16 ⁇ . After dispersing by volume%, for example, it is press-cured by a hot press machine to a thickness of 1.5 mm. In this example, only one hot press was used to press-harden the sample, but a multi-stage hot press two or three times may be used. .
  • the second sample was composed of carbon black 23, boron nitride 22 and epoxy resin 21.
  • Carbon black (Asahi Thermal (trade name) manufactured by Asahi Carbon Co., Ltd.) 5 Vo 1% against 60 Vo 1% boron nitride having an average particle size of 16 ⁇ by volume ratio using a stirrer The mixture was stirred for 2 minutes and dispersed in epoxy resin 21 as a filler.
  • the thermal conductivity can be improved about twice by adding only a small amount of carbon black 23 as compared to the sample consisting of boron nitride alone.
  • the epoxy resin 22 is used as a surface treatment agent for improving the binding property, for example, a binder resin (coupling agent).
  • a binder resin coupling agent
  • the present invention is not limited to this. Since it can be used for any resin, such as a resin of the system type, a highly heat-conductive member having high versatility and high heat conductivity is provided irrespective of the components of the resin.
  • silicon nitride particles are used as the first particles 22, but instead of aluminum nitride, aluminum oxide, aluminum oxide, magnesium oxide, silicon nitride, silicon oxide, and the like.
  • carbon black particles are used as the second particles 23.However, the present invention is not limited to this. For example, boron nitride particles having different particle diameters, for example, having an average particle diameter of 3 ⁇ m are used. Is also good. Further, as the second particles 23, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, diamond-like carbon, Carbon diamond, silicon carbide, gold, copper, iron, layered silicate clay One or two or more selected from the group of minerals and my strength may be used.
  • the second particles 23 have a thermal conductivity of at least 0.5 W / mK or more.
  • the reason that the thermal conductivity I was able to be greatly improved by the member 21 of the above embodiment is that the gap formed when the first particles 22 were filled was determined by the second particles 23. It is inferred that this was because the hole was filled. According to this inference, it is preferable to use, as the second particles 23, those having a higher thermal conductivity ⁇ than the resin 21.
  • the thermal conductivity of aluminum nitride (A1 ⁇ ); I is 10 OW / mK. Therefore, the thermal conductivity of the member 21 can be improved by adding the anode nitride particles as the second particles 23 to the composite material composed of boron nitride and resin. It will be further improved.
  • boron nitride was used as the first particles 22, and epoxy resin was used as the binder resin 21. Furthermore, carbon black (Asahi Thermal (trade name) manufactured by Asahi Carbon Co., Ltd.) is used as the second particles 23, and the carbon black content is 0.5 Vo1. %, So that the thermal conductivity is further improved. It became clear what to do.
  • the horizontal axis shows the volume content of carbon black (V o 1%) with respect to the volume excluding boron nitride, and the vertical axis shows the thermal conductivity I (W / m K).
  • the characteristic line ⁇ indicates the change in the thermal conductivity; I.
  • the content of the carbon black particles 24 is set to 33.3 vol% or less with respect to the total of the resin 21 and the carbon black particles 24. did.
  • the carbon black particles 24 have high conductivity, so when used as an electrical insulating material, an increase in electrical conductivity affects the performance of the product. It is preferable to give
  • the horizontal axis shows the volume content of carbon particles (V o 1%) with respect to the total volume of resin and carbon particles, and the vertical axis on the left side shows the thermal conductivity; (W / m K).
  • the electrical conductivity ⁇ (S Zm) plotted on the vertical axis on the right It is a characteristic diagram shown.
  • the characteristic line F shows the change of the thermal conductivity; I, and the characteristic line G shows the change of the electric conductivity ⁇ .
  • the sample is adjusted so that the content of the carbon black particles is 33.3 Vo 1% or less based on the total of the epoxy resin 21 and the carbon black particles. Accordingly, a highly heat-conductive member having high versatility, high heat conductivity, and insulating properties is obtained regardless of the components of the epoxy resin 21 (the 16th embodiment).
  • aluminum nitride particles (particle size of less than 1 micron to nanometer) as the second particles 24 are the first particles.
  • the particles were made smaller than the boron nitride particles (particle size: 1 micron to 100 micron).
  • Aluminum nitride has a purity of 3 N and a molecular weight of 41.0.
  • ALI04 PB product model number
  • ALI04 PB product model number
  • the particle diameter of the aluminum nitride particles 24 becomes larger than that of the boron nitride particles 22, the heat conduction path that contributes to the thermal conductivity ⁇ formed by the boron nitride particles 22 is cut off. This leads to a decrease in the thermal conductivity ⁇ .
  • the raw material charging step S31 when the boron nitride particles 22 and the carbon black particles 23 are charged into a molding machine (not shown), a coupling agent (binder resin) described later is simultaneously charged.
  • the stirring / drying step S32 the raw materials and the like obtained in the raw material charging step S31 are stirred and dried.
  • the epoxy main agent of the two-liquid mixing type is poured into the raw material in a state of agitation and drying, and kneaded with the raw material.
  • the epoxy main agent in the kneaded state kneaded in the kneading step S33 is further kneaded with a curing agent as an epoxy auxiliary agent.
  • the hot press hardening step S35 thereafter, hardening is performed by a hot press.
  • the product obtaining step S36 takes out the product obtained in the hot press hardening step S35.
  • a carbon black particle available from Asahi Riki Ibon Co., Ltd .; ) was stirred for 2 minutes with a stirrer, and the silane coupling agent A189 (manufactured by Nippon Tunica) dissolved in ethanol at 1 ° / ⁇ . 3 g of the solution was added in three portions, and stirring was continued. After that, the filler was air-dried for 24 hours and subjected to a cutting treatment. The filler is dispersed in epoxy resin, and the total volume ratio of boron nitride and carbon black is 65 V o 1. /. Thus, a sheet material was prepared by press hardening to a thickness of 1.5 mm by a hot press.
  • the thermal conductivity of the plate member thus obtained was measured to be 6.8 WZmK.
  • the thermal conductivity ⁇ was increased by about 0.5 W / mK compared to the conventional case where no coupling agent was used. This is thought to be due to the fact that the bonding force between the fillers became stronger via the resin, which promoted the transmission of phonon. available.
  • a high thermal conductive member having a high thermal conductivity can be obtained.
  • the member of the above embodiment is used to form a tape or a film.
  • the member of this embodiment exhibits high thermal conductivity due to the physical dispersion state of the filler, and is extremely versatile.
  • a pellet of polyethylene 27, boron nitride particles 22 and carpump particles 23 are kneaded, and this is placed between two pressing plates 28, which is then hot-pressed ( By heating and pressurizing (not shown), a tape with a high thermal conductivity becomes a finolem.
  • the material used for the film is not limited to polyethylene, but may be any of various thermoplastic resins, thermosetting resins, and elastomers.
  • an isoprene-based elastomer for example, this is more elastic than a thermoplastic resin or a thermosetting resin. Due to its high modulus, the resulting film products have excellent flexibility.
  • the first particles boron nitride, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond
  • the second particles include boron nitride, carbon, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, and diamond-like.
  • One or more types of particles selected from the group consisting of carbon, diamond, silicon carbide, gold, copper, iron, layered silicate clay minerals, and myric can be used. .
  • a cast resin, a cast resin in transformer; a winding conductor 5 to be used is covered with any one of the insulating members of the above embodiment.
  • the structure of the cast resin transformer is described, for example, in U.S. Pat. No. 4,760,296.
  • the thermal conductivity of the insulating layer 6 could be increased by about 1.5 times. This improves the cooling efficiency of the electromagnetic coil and allows it to flow through the coil.
  • the current density could be increased by about 20%.
  • the coil dimensions could be reduced. As a result, it has become possible to manufacture a miniaturized cast resin transformer. Industrial applicability
  • the thermal conductivity (lambda) is high and the high heat conductive insulating member excellent in the heat dissipation characteristic is provided. Further, according to the present invention, there is provided a method for producing a highly thermally conductive insulating member having high versatility and easy production. Further, according to the present invention, there is provided a small electromagnetic coil and an electromagnetic device having excellent heat radiation characteristics.

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  • Manufacturing & Machinery (AREA)
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  • Laminated Bodies (AREA)

Abstract

L'invention concerne un élément isolant à conductivité thermique élevée en forme de ruban ou de feuille, son procédé de fabrication, une bobine électromagnétique comprenant cet élément isolant à conductivité thermique élevée, ainsi qu'un dispositif électromagnétique, tel qu'un générateur d'énergie, comprenant cette bobine électromagnétique. Il est nécessaire d'améliorer les propriétés de refroidissement d'une bobine électromagnétique d'un dispositif électrique en vue d'en augmenter l'efficacité et d'en réduire la taille et le coût de fabrication. Pour ce faire, on a tenté d'augmenter la conductivité thermique d'un élément isolant en forme de ruban ou de feuille de la bobine électromagnétique. Toutefois, des problèmes ont été rencontrés du fait que la conductivité thermique des éléments isolants classiques est insuffisante, seuls des composants de résine spéciaux pouvant être utilisés. Selon l'invention, pour résoudre les problèmes susmentionnés, ledit élément isolant en forme de ruban ou de feuille est constitué d'un matériau caractérisé en ce que des premières particules présentant une conductivité thermique comprise entre 1 et 300 W/mK et des secondes particules présentant une conductivité thermique comprise entre 0,5 et 300 W/mK sont dispersées dans une base de résine.
PCT/JP2003/008564 2002-07-04 2003-07-04 Element isolant a conductivite thermique elevee et son procede de fabrication, bobine electromagnetique et dispositif electromagnetique WO2004006271A1 (fr)

Priority Applications (4)

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EP03741216A EP1530223B1 (fr) 2002-07-04 2003-07-04 Element isolant a conductivite thermique elevee et son procede de fabrication, bobine electromagnetique et dispositif electromagnetique
DE60326072T DE60326072D1 (de) 2002-07-04 2003-07-04 Isolationselement mit hoher thermischer leitfähigkeit, verfahren zu dessen herstellung, elektromagnetische spule und elektromagnetische vorrichtung
US11/028,227 US7524557B2 (en) 2002-07-04 2005-01-04 Highly heat conductive insulating member, method of manufacturing the same and electromagnetic device
US12/415,738 US20090197102A1 (en) 2002-07-04 2009-03-31 Highly heat conductive insulating member, method of manufacturing the same and electromagnetic device

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JP2002-196363 2002-07-04
JP2002196363A JP2004035782A (ja) 2002-07-04 2002-07-04 高熱伝導性材料及びその製造方法
JP2003144919A JP4625615B2 (ja) 2003-05-22 2003-05-22 テープ部材とその製造方法及びテープ部材を用いた電磁コイル並びに電磁機器
JP2003-144919 2003-05-22

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JP4599063B2 (ja) * 2004-01-15 2010-12-15 株式会社東芝 コイル巻回用絶縁テープ
JP2005199562A (ja) * 2004-01-15 2005-07-28 Toshiba Corp テープ部材或いはシート部材並びにテープ部材或いはシート部材の製造方法
US7837817B2 (en) 2004-06-15 2010-11-23 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
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US7553781B2 (en) 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
US8685534B2 (en) 2004-06-15 2014-04-01 Siemens Energy, Inc. High thermal conductivity materials aligned within resins
US8313832B2 (en) 2004-06-15 2012-11-20 Siemens Energy, Inc. Insulation paper with high thermal conductivity materials
US8216672B2 (en) 2004-06-15 2012-07-10 Siemens Energy, Inc. Structured resin systems with high thermal conductivity fillers
US7268293B2 (en) 2004-06-15 2007-09-11 Siemen Power Generation, Inc. Surface coating of lapped insulation tape
WO2006002014A1 (fr) 2004-06-15 2006-01-05 Siemens Power Generation, Inc. Revetements du type diamant pour materiaux de remplissage de taille nanometrique
WO2006002010A3 (fr) * 2004-06-15 2006-02-09 Siemens Power Generation Inc Revetement de surface de bande d'isolant rubane
JP2008503060A (ja) * 2004-06-15 2008-01-31 シーメンス パワー ジェネレーション インコーポレイテッド 包囲した絶縁テープの表面被覆
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US7776392B2 (en) 2005-04-15 2010-08-17 Siemens Energy, Inc. Composite insulation tape with loaded HTC materials
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EP1530223B1 (fr) 2009-02-04
DE60326072D1 (de) 2009-03-19
EP1530223A1 (fr) 2005-05-11
EP1530223A4 (fr) 2006-06-28
CN1324615C (zh) 2007-07-04
CN1666303A (zh) 2005-09-07

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