Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07745—Mounting details of integrated circuit chips
  • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
  • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
  • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07745—Mounting details of integrated circuit chips
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
  • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
  • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/181—Encapsulation
  • H01L2924/1815—Shape
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
  • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0011—Working of insulating substrates or insulating layers
  • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
  • H05K3/305—Affixing by adhesive
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/49126—Assembling bases
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
  • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Definitions

• the invention relates to a method for producing a microcircuit card comprising a support card and a module carrying the microcircuit, the module being installed in an open cavity of said support card.
• the object of the invention is more particularly to combat a type of fraud consisting in dismantling such a module without affecting its functionality, in order to transplant it into another support card.
• microcircuit cards in all areas constantly challenges security criteria.
• One of these criteria is the fact that an attempt to extract the module from the support card must result in failure, that is to say by destruction of the microcircuit and / or of its connections.
• the module which is installed in the cavity of the support card consists of a support film forming a printed circuit, carrying the microcircuit on one of its faces.
• the module is glued to a peripheral flat defined between the opening and the bottom of the cavity, the microcircuit, often coated, being housed in the cavity itself. It is relatively easy to insert a tool between the edge of the cavity and that of the module, to peel it off. If this operation is carried out with care, this detachment does not lead to the destruction of the microcircuit and / or its connections. It has been proposed to add a drop of glue connecting the bottom of the cavity to the coating of the microcircuit.
• Another technique proposed by the applicant consists in depositing the microcircuit protection resin in the cavity itself and in coating the microcircuit in this resin before its polymerization. This technique makes the module more difficult to dismantle, but the results are difficult to master because they depend to a large extent on the adhesion of the resin to the walls of the cavity and in particular the bottom thereof.
• the invention aims to improve this technique.
• the invention relates to a method for producing a microcircuit card comprising a card body and a module comprising a support film forming a printed circuit carrying said microcircuit on one of its faces, according to which said module is fixed in a cavity of said card body using a resin at least partially filling said cavity and coating said microcircuit, characterized in that the adhesion of the resin to the wall of the cavity is increased so that it is significantly greater than its adhesion to said support film of said module.
• the adhesion of the resin can be adjusted by carrying out an appropriate surface treatment of the walls of the cavity and more particularly of the bottom thereof.
• This surface treatment which results in an increase in roughness and / or a chemical modification of the treated surface, has the result of very significantly increasing the adhesion of the resin to the treated surface and in particular making it very superior. to the adhesion of this same resin on the support film of the module.
• a fraudster attempts to dismantle the module, by inserting a tool between the edge of the cavity and that of the module, the force exerted is best reflected by the separation of the support film from the resin, the microcircuit and its connection wires remaining embedded in the resin attached to the cavity. Consequently, the module thus removed becomes unusable.
• the card body in a plastic material known as having a low surface energy (typically less than 45 mN / m) that is to say intrinsically having low adhesion with the resin usually used for coating in the bottom of the cavity, or even with the adhesive for fixing the module, at the periphery of the cavity.
• a plastic material known as having a low surface energy (typically less than 45 mN / m) that is to say intrinsically having low adhesion with the resin usually used for coating in the bottom of the cavity, or even with the adhesive for fixing the module, at the periphery of the cavity.
• the materials known for their low surface energy and relatively little used until now in the field of cards microcircuits are also those which have the best characteristics from the point of view of mechanical and thermal resistance, which makes it possible to hope for a longer service life of the microcircuit card.
• the card body may be produced so that at least the bottom of the cavity is made of polyethylene terephthalate called PET or else polycarbonate or else polybutylene terephthalate called PBT.
• PET polyethylene terephthalate
• PBT polybutylene terephthalate
• the entire card body need not be made of such a material.
• the card body is produced by laminating several layers of plastic materials, possibly different, it will suffice that the layer which is located at the depth of the bottom of the cavity, is made of plastic material called low surface energy for example chosen from one of the materials mentioned above.
• PET it is possible in particular to use polyethylene terephthalate in a film called PETF.
• the cavity can be produced after laminating, by lamination in the thickness of said card body, making sure that this operation is carried out at the right depth to release the plastic with low surface energy, so that it forms the bottom of the cavity.
• the counterbore can be implemented in a card body in one piece, that is to say made in a single block of plastic material with low surface energy.
• Another possibility is to produce the card body by molding in which case, the formation of the cavity can be defined during molding.
• the plastic material used for molding is chosen for its low surface energy, for example in one of the materials indicated above.
• a laser beam treatment can be used which generates mechanical and / or chemical modifications of the treated surface. Good results are obtained with a laser beam generator called YAG or a laser beam generator of the C0 2 type.
• the treatment may consist of a chemical modification of the bottom surface by exposure to ultraviolet rays, for example by means of a lamp, possibly by combining it with a laser treatment by the use of an eximere laser beam generator, emitting in the field of ultraviolet.
• Eximere lasers in particular of the argon-fluorine or xenonchlorine type, can be used for this purpose.
• the laser treatment has the advantage of combining chemical modifications and the creation of microcavities, which are particularly favorable for increasing the adhesion of the resin.
• the operating parameters of the processing means indicated above can be precisely adjusted to control the modification of the surface condition of a plastic material and more particularly of a plastic material with low surface energy.
• the process is completed in a known manner by depositing a desired quantity of resin at the bottom of the cavity thus treated and by positioning the module in the cavity so that its microcircuit is embedded in the liquid resin.
• the resin is polymerized.
• This polymerization can be obtained, depending on the type of resin used, by a heat treatment or by exposure to ultraviolet light followed, after installation of the module, by heat treatment.
• the adhesive used to fix the module to the peripheral flat part of the cavity can be a cold-bonding adhesive or a hot-reactivatable adhesive.
• the resin adheres both to the interior surface of the module and to that of the treated cavity. However, the adhesion of the resin on the module is much lower than the adhesion of this same resin on the bottom of the cavity. This results in the destruction of the module in the event of an attempt to extract it.
• FIG. 1 is a diagram illustrating the manufacture of the card body and the cavity;
• FIG. 1a illustrates a variant of the step of Figure 1;
• FIG. 3 illustrates the layout of a microcircuit module in the cavity
• FIG. 5 illustrates the destruction of the module in the event of an attempt to extract it fraudulently.
• the method of the invention comprises the successive operations illustrated by FIGS. 1 to 5.
• a card body 11 made of plastic material having a low surface energy is formed.
• the card body is molded so that a cavity 12 is defined during molding itself by the particular shape of one of the elements of the mold 14.
• the cavity 12a can be obtained by mechanical treatment of the counterbore type.
• the card body has been defined by laminating several films of different plastic materials, it will be possible to ensure that the film located at the maximum depth of the counterbore is made of plastic material known as low surface energy since this film constituting the bottom of the cavity must undergo the envisaged treatment.
• one of these surface treatments is shown diagrammatically, namely the exposure of the bottom 16 of the cavity 12, at least, to a laser beam 18 produced by a generator 19, for example of the YAG type.
• the cavity has a peripheral flat 20 on which the edge of the module rests. This peripheral flat may possibly be subjected to the same treatment.
• a conventional module 22 composed of a support film 23 forming a printed circuit defining connection areas 24, 25 of metal.
• a microcircuit 26 is bonded to the other side of the printed circuit. Its input-outputs are connected by wires 28 to the various connection pads of the printed circuit.
• a hot-reactivatable adhesive 29 is deposited on the face of the support film 23 which carries the microcircuit 26, at the periphery of said support film. Furthermore, a predetermined quantity of resin 30 is deposited in the cavity and the module 22 is positioned in the cavity so that the microcircuit becomes embedded in the still liquid resin. The adhesive 29 rests on him on the peripheral flat 20 of the cavity. When the module is installed in this way, the still liquid resin fills substantially the entire cavity or at least a large part of it. The resin is especially applied against the inner face of the support film 23, all around the microcircuit. The resin embraces the latter. This is the situation illustrated in FIG. 4. When the resin is polymerized, the module adheres perfectly to the card body 11.
• the resin 30 including the microcircuit 26 and its connection wires 28 remains stuck at the bottom of the cavity while the support film 23 of the module detaches from the resin causing the separation between the connection wires 28 and the microcircuit 26 on the one hand and the electrical connection pads 25 on the other hand.
• the module becomes unusable and can no longer be reinstalled in another card body.

Landscapes

• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Computer Security & Cryptography (AREA)
• General Engineering & Computer Science (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Power Engineering (AREA)
• Credit Cards Or The Like (AREA)
• Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Applications Claiming Priority (3)

Publications (1)

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ID=8870702

Family Applications (1)

Country Status (9)

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• 2001
  • 2001-12-19 FR FR0116483A patent/FR2833801B1/fr not_active Expired - Lifetime
• 2002
  • 2002-12-18 MX MXPA04006036A patent/MXPA04006036A/es active IP Right Grant
  • 2002-12-18 AU AU2002365005A patent/AU2002365005A1/en not_active Abandoned
  • 2002-12-18 CA CA2470229A patent/CA2470229C/fr not_active Expired - Lifetime
  • 2002-12-18 WO PCT/FR2002/004426 patent/WO2003052822A2/fr active Application Filing
  • 2002-12-18 CN CNB028254457A patent/CN100351863C/zh not_active Expired - Lifetime
  • 2002-12-18 US US10/499,359 patent/US7584537B2/en not_active Expired - Lifetime
  • 2002-12-18 JP JP2003553620A patent/JP4327600B2/ja not_active Expired - Lifetime
  • 2002-12-18 EP EP02804942A patent/EP1464083A2/fr not_active Ceased

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