EP1461471A2 - Derivate von polymeren für die metallbehandlung - Google Patents
Derivate von polymeren für die metallbehandlungInfo
- Publication number
- EP1461471A2 EP1461471A2 EP02795278A EP02795278A EP1461471A2 EP 1461471 A2 EP1461471 A2 EP 1461471A2 EP 02795278 A EP02795278 A EP 02795278A EP 02795278 A EP02795278 A EP 02795278A EP 1461471 A2 EP1461471 A2 EP 1461471A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- component
- optionally
- metal
- polymer
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 153
- 239000002184 metal Substances 0.000 title claims abstract description 153
- 229920000642 polymer Polymers 0.000 title claims abstract description 102
- 150000002739 metals Chemical class 0.000 title claims abstract description 46
- 239000000203 mixture Substances 0.000 claims abstract description 117
- 238000000034 method Methods 0.000 claims abstract description 65
- 229920003023 plastic Polymers 0.000 claims abstract description 32
- 239000004033 plastic Substances 0.000 claims abstract description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 32
- 150000001875 compounds Chemical class 0.000 claims abstract description 31
- 125000003277 amino group Chemical group 0.000 claims abstract description 24
- 229910001092 metal group alloy Inorganic materials 0.000 claims abstract description 17
- 150000001491 aromatic compounds Chemical class 0.000 claims abstract description 15
- 239000002270 dispersing agent Substances 0.000 claims abstract description 6
- 239000003995 emulsifying agent Substances 0.000 claims abstract description 6
- 239000000375 suspending agent Substances 0.000 claims abstract description 5
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims abstract 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 53
- -1 transition metal cations Chemical class 0.000 claims description 47
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 claims description 41
- 238000005260 corrosion Methods 0.000 claims description 36
- 230000007797 corrosion Effects 0.000 claims description 35
- 238000000151 deposition Methods 0.000 claims description 31
- 230000008021 deposition Effects 0.000 claims description 28
- 229910052725 zinc Inorganic materials 0.000 claims description 25
- 239000002253 acid Substances 0.000 claims description 23
- 150000003839 salts Chemical class 0.000 claims description 22
- 239000000126 substance Substances 0.000 claims description 20
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 18
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 18
- 238000005554 pickling Methods 0.000 claims description 16
- 239000000654 additive Substances 0.000 claims description 14
- 239000003112 inhibitor Substances 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- 229920001577 copolymer Polymers 0.000 claims description 11
- 238000001465 metallisation Methods 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 11
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 9
- 229910052742 iron Inorganic materials 0.000 claims description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 8
- 229910052748 manganese Inorganic materials 0.000 claims description 8
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052723 transition metal Inorganic materials 0.000 claims description 7
- 238000005406 washing Methods 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 150000003460 sulfonic acids Chemical class 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 5
- 229910052791 calcium Inorganic materials 0.000 claims description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- 239000008139 complexing agent Substances 0.000 claims description 4
- 230000001804 emulsifying effect Effects 0.000 claims description 4
- UYMKPFRHYYNDTL-UHFFFAOYSA-N ethenamine Chemical compound NC=C UYMKPFRHYYNDTL-UHFFFAOYSA-N 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical compound C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- KDXKERNSBIXSRK-YFKPBYRVSA-N L-lysine Chemical compound NCCCC[C@H](N)C(O)=O KDXKERNSBIXSRK-YFKPBYRVSA-N 0.000 claims description 3
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 claims description 3
- 239000004472 Lysine Substances 0.000 claims description 3
- 239000002585 base Substances 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- 239000003921 oil Substances 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims 1
- 150000001342 alkaline earth metals Chemical class 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000011701 zinc Substances 0.000 description 25
- 229910045601 alloy Inorganic materials 0.000 description 23
- 239000000956 alloy Substances 0.000 description 23
- 239000000243 solution Substances 0.000 description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- 150000003254 radicals Chemical class 0.000 description 18
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 17
- 150000001299 aldehydes Chemical class 0.000 description 17
- 239000007795 chemical reaction product Substances 0.000 description 17
- 125000005842 heteroatom Chemical group 0.000 description 16
- 229960003742 phenol Drugs 0.000 description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 14
- 229910052739 hydrogen Inorganic materials 0.000 description 13
- 229910000831 Steel Inorganic materials 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 239000001257 hydrogen Substances 0.000 description 12
- 239000010959 steel Substances 0.000 description 12
- 125000000217 alkyl group Chemical group 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 11
- 235000013824 polyphenols Nutrition 0.000 description 11
- 235000014113 dietary fatty acids Nutrition 0.000 description 10
- 229930195729 fatty acid Chemical class 0.000 description 10
- 239000000194 fatty acid Chemical class 0.000 description 10
- 150000004665 fatty acids Chemical class 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 9
- 238000010422 painting Methods 0.000 description 9
- 238000002161 passivation Methods 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 238000004381 surface treatment Methods 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 229920002873 Polyethylenimine Polymers 0.000 description 7
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 7
- 125000002877 alkyl aryl group Chemical group 0.000 description 7
- 239000011572 manganese Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 229910052718 tin Inorganic materials 0.000 description 7
- 239000011135 tin Substances 0.000 description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 125000003342 alkenyl group Chemical group 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 239000011651 chromium Substances 0.000 description 6
- 125000000753 cycloalkyl group Chemical group 0.000 description 6
- 239000011734 sodium Substances 0.000 description 6
- FSSPGSAQUIYDCN-UHFFFAOYSA-N 1,3-Propane sultone Chemical compound O=S1(=O)CCCO1 FSSPGSAQUIYDCN-UHFFFAOYSA-N 0.000 description 5
- 238000006683 Mannich reaction Methods 0.000 description 5
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical class C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 5
- 239000011575 calcium Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 238000009472 formulation Methods 0.000 description 5
- 230000002401 inhibitory effect Effects 0.000 description 5
- 229910052749 magnesium Inorganic materials 0.000 description 5
- 239000011777 magnesium Substances 0.000 description 5
- 239000001993 wax Substances 0.000 description 5
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000004202 carbamide Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 150000002431 hydrogen Chemical class 0.000 description 4
- ZRSNZINYAWTAHE-UHFFFAOYSA-N p-methoxybenzaldehyde Chemical compound COC1=CC=C(C=O)C=C1 ZRSNZINYAWTAHE-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 150000003014 phosphoric acid esters Chemical class 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 229920000656 polylysine Polymers 0.000 description 4
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- RPACBEVZENYWOL-XFULWGLBSA-M sodium;(2r)-2-[6-(4-chlorophenoxy)hexyl]oxirane-2-carboxylate Chemical compound [Na+].C=1C=C(Cl)C=CC=1OCCCCCC[C@]1(C(=O)[O-])CO1 RPACBEVZENYWOL-XFULWGLBSA-M 0.000 description 4
- DZGWFCGJZKJUFP-UHFFFAOYSA-N tyramine Chemical compound NCCC1=CC=C(O)C=C1 DZGWFCGJZKJUFP-UHFFFAOYSA-N 0.000 description 4
- JWYUFVNJZUSCSM-UHFFFAOYSA-N 2-aminobenzimidazole Chemical compound C1=CC=C2NC(N)=NC2=C1 JWYUFVNJZUSCSM-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000006957 Michael reaction Methods 0.000 description 3
- 108010039918 Polylysine Proteins 0.000 description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910001297 Zn alloy Inorganic materials 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 229910052783 alkali metal Inorganic materials 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical class OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- DLDJFQGPPSQZKI-UHFFFAOYSA-N but-2-yne-1,4-diol Chemical compound OCC#CCO DLDJFQGPPSQZKI-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000008098 formaldehyde solution Substances 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 229910052745 lead Inorganic materials 0.000 description 3
- 239000011133 lead Substances 0.000 description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 3
- 229920000768 polyamine Polymers 0.000 description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- TVDSBUOJIPERQY-UHFFFAOYSA-N prop-2-yn-1-ol Chemical compound OCC#C TVDSBUOJIPERQY-UHFFFAOYSA-N 0.000 description 3
- 150000004760 silicates Chemical class 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 150000003568 thioethers Chemical class 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- CCVYRRGZDBSHFU-UHFFFAOYSA-N (2-hydroxyphenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC=C1O CCVYRRGZDBSHFU-UHFFFAOYSA-N 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 2
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 2
- GKQHIYSTBXDYNQ-UHFFFAOYSA-M 1-dodecylpyridin-1-ium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+]1=CC=CC=C1 GKQHIYSTBXDYNQ-UHFFFAOYSA-M 0.000 description 2
- IXWOUPGDGMCKGT-UHFFFAOYSA-N 2,3-dihydroxybenzaldehyde Chemical compound OC1=CC=CC(C=O)=C1O IXWOUPGDGMCKGT-UHFFFAOYSA-N 0.000 description 2
- GLDQAMYCGOIJDV-UHFFFAOYSA-N 2,3-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1O GLDQAMYCGOIJDV-UHFFFAOYSA-N 0.000 description 2
- IUNJCFABHJZSKB-UHFFFAOYSA-N 2,4-dihydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C(O)=C1 IUNJCFABHJZSKB-UHFFFAOYSA-N 0.000 description 2
- UIAFKZKHHVMJGS-UHFFFAOYSA-N 2,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1O UIAFKZKHHVMJGS-UHFFFAOYSA-N 0.000 description 2
- CLFRCXCBWIQVRN-UHFFFAOYSA-N 2,5-dihydroxybenzaldehyde Chemical compound OC1=CC=C(O)C(C=O)=C1 CLFRCXCBWIQVRN-UHFFFAOYSA-N 0.000 description 2
- WXTMDXOMEHJXQO-UHFFFAOYSA-N 2,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC=C1O WXTMDXOMEHJXQO-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- MNIOHLDHJBOXAH-UHFFFAOYSA-N 2-(ethylaminomethyl)-2-sulfooctanoic acid Chemical compound CCCCCCC(S(O)(=O)=O)(C(O)=O)CNCC MNIOHLDHJBOXAH-UHFFFAOYSA-N 0.000 description 2
- FTZILAQGHINQQR-UHFFFAOYSA-N 2-Methylpentanal Chemical compound CCCC(C)C=O FTZILAQGHINQQR-UHFFFAOYSA-N 0.000 description 2
- CYMRPDYINXWJFU-UHFFFAOYSA-N 2-carbamoylbenzoic acid Chemical class NC(=O)C1=CC=CC=C1C(O)=O CYMRPDYINXWJFU-UHFFFAOYSA-N 0.000 description 2
- FPYUJUBAXZAQNL-UHFFFAOYSA-N 2-chlorobenzaldehyde Chemical compound ClC1=CC=CC=C1C=O FPYUJUBAXZAQNL-UHFFFAOYSA-N 0.000 description 2
- GCDBEYOJCZLKMC-UHFFFAOYSA-N 2-hydroxyanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(O)=CC=C3C(=O)C2=C1 GCDBEYOJCZLKMC-UHFFFAOYSA-N 0.000 description 2
- YGHRJJRRZDOVPD-UHFFFAOYSA-N 3-methylbutanal Chemical compound CC(C)CC=O YGHRJJRRZDOVPD-UHFFFAOYSA-N 0.000 description 2
- WHSXTWFYRGOBGO-UHFFFAOYSA-N 3-methylsalicylic acid Chemical compound CC1=CC=CC(C(O)=O)=C1O WHSXTWFYRGOBGO-UHFFFAOYSA-N 0.000 description 2
- TXFPEBPIARQUIG-UHFFFAOYSA-N 4'-hydroxyacetophenone Chemical compound CC(=O)C1=CC=C(O)C=C1 TXFPEBPIARQUIG-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- NPFYZDNDJHZQKY-UHFFFAOYSA-N 4-Hydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 NPFYZDNDJHZQKY-UHFFFAOYSA-N 0.000 description 2
- GOUHYARYYWKXHS-UHFFFAOYSA-N 4-formylbenzoic acid Chemical compound OC(=O)C1=CC=C(C=O)C=C1 GOUHYARYYWKXHS-UHFFFAOYSA-N 0.000 description 2
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
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- JZJXKEWVUBVOEH-UHFFFAOYSA-N n,n-diethylprop-2-yn-1-amine Chemical compound CCN(CC)CC#C JZJXKEWVUBVOEH-UHFFFAOYSA-N 0.000 description 1
- ILBIXZPOMJFOJP-UHFFFAOYSA-N n,n-dimethylprop-2-yn-1-amine Chemical compound CN(C)CC#C ILBIXZPOMJFOJP-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- PCILLCXFKWDRMK-UHFFFAOYSA-N naphthalene-1,4-diol Chemical compound C1=CC=C2C(O)=CC=C(O)C2=C1 PCILLCXFKWDRMK-UHFFFAOYSA-N 0.000 description 1
- DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 229960003512 nicotinic acid Drugs 0.000 description 1
- 235000001968 nicotinic acid Nutrition 0.000 description 1
- 239000011664 nicotinic acid Substances 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 229940054441 o-phthalaldehyde Drugs 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229960003540 oxyquinoline Drugs 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- ZWLUXSQADUDCSB-UHFFFAOYSA-N phthalaldehyde Chemical compound O=CC1=CC=CC=C1C=O ZWLUXSQADUDCSB-UHFFFAOYSA-N 0.000 description 1
- 229940081066 picolinic acid Drugs 0.000 description 1
- QXYMVUZOGFVPGH-UHFFFAOYSA-N picramic acid Chemical compound NC1=CC([N+]([O-])=O)=CC([N+]([O-])=O)=C1O QXYMVUZOGFVPGH-UHFFFAOYSA-N 0.000 description 1
- 238000013166 platelet test Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920005646 polycarboxylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920003009 polyurethane dispersion Polymers 0.000 description 1
- 229910001414 potassium ion Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- JWQSOOZHYMZRBT-UHFFFAOYSA-N propan-2-ylsulfamic acid Chemical compound CC(C)NS(O)(=O)=O JWQSOOZHYMZRBT-UHFFFAOYSA-N 0.000 description 1
- 239000000473 propyl gallate Substances 0.000 description 1
- 235000010388 propyl gallate Nutrition 0.000 description 1
- 229940075579 propyl gallate Drugs 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011814 protection agent Substances 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 150000004059 quinone derivatives Chemical class 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000002207 retinal effect Effects 0.000 description 1
- NCYCYZXNIZJOKI-OVSJKPMPSA-N retinal group Chemical group C\C(=C/C=O)\C=C\C=C(\C=C\C1=C(CCCC1(C)C)C)/C NCYCYZXNIZJOKI-OVSJKPMPSA-N 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- DGSDBJMBHCQYGN-UHFFFAOYSA-M sodium;2-ethylhexyl sulfate Chemical compound [Na+].CCCCC(CC)COS([O-])(=O)=O DGSDBJMBHCQYGN-UHFFFAOYSA-M 0.000 description 1
- LIBWRRJGKWQFSD-UHFFFAOYSA-M sodium;2-nitrobenzenesulfonate Chemical compound [Na+].[O-][N+](=O)C1=CC=CC=C1S([O-])(=O)=O LIBWRRJGKWQFSD-UHFFFAOYSA-M 0.000 description 1
- FRTIVUOKBXDGPD-UHFFFAOYSA-M sodium;3-sulfanylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CCCS FRTIVUOKBXDGPD-UHFFFAOYSA-M 0.000 description 1
- BWYYYTVSBPRQCN-UHFFFAOYSA-M sodium;ethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=C BWYYYTVSBPRQCN-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229920006301 statistical copolymer Polymers 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 229920001864 tannin Polymers 0.000 description 1
- 239000001648 tannin Substances 0.000 description 1
- 235000018553 tannin Nutrition 0.000 description 1
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 229960000984 tocofersolan Drugs 0.000 description 1
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000005170 trihydroxybenzoic acids Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229940045136 urea Drugs 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 239000002076 α-tocopherol Substances 0.000 description 1
- 235000004835 α-tocopherol Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
- C09D125/02—Homopolymers or copolymers of hydrocarbons
- C09D125/04—Homopolymers or copolymers of styrene
- C09D125/08—Copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
- C09D161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09D161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C09D161/14—Modified phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/07—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing phosphates
- C23C22/08—Orthophosphates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/34—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing fluorides or complex fluorides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/78—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/82—After-treatment
- C23C22/83—Chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
Definitions
- the invention relates to compositions for the treatment of metal surfaces, ner driving for the anti-corrosion treatment of metal surfaces, the use of polymers for the treatment of metal surfaces and polymers suitable for the treatment of metal surfaces.
- the invention further relates to a composition and a method for the deposition of metals or metal alloys on plastic surfaces.
- Corrosion of metals is a problem in the manufacture, processing and use of articles containing metals.
- Protective films and corrosion inhibitors are therefore used to slow down or prevent corrosion. While a protective film is permanently applied to the metal, a corrosion inhibitor is preferably added to substances, in particular liquid mixtures, which would cause or accelerate corrosion on contact with the metal. Both the protective films and the corrosion inhibitors can be in the form of polymers or contain polymers. Compositions in which no toxic chromate has to be used are of particular interest. Such compositions are already known from the prior art.
- US 4,992,116 relates to aqueous chromium-free compositions and a process for the treatment of aluminum.
- These compositions contain phosphate ions, a compound containing an element from the group Zr, Ti, Hf and Si, based on fluorozirconic, fluorotitanic, fluorohafhium and fluorosilicic acid.
- the compositions further contain a polyphenol obtained by Mannich reaction of an amine with a compound selected from the group consisting of polyalkenylphenols and tannins.
- Aluminum surfaces show just as good adhesion and corrosion resistance as compositions containing chromium.
- WO 92/07973 relates to chromium-free corrosion protection agents for the treatment of aluminum or aluminum alloys which have a water-soluble or water-dispersible polymer.
- the compositions according to WO 92/07973 are an acidic aqueous solution which, in addition to water, contains fluorozirconic acid, optionally dispersed SiO 2 , a solvent different from water, a surfactant, and 3- (N-C ⁇ . 4 -alkyl-N- Contain 2-hydroxyethylaminomethyl) -4-hydroxystyrene.
- these special compositions are particularly suitable for the treatment of aluminum surfaces.
- DE-A 100 10 758 relates to a method for the corrosion-protecting treatment of vehicle bodies or household appliances which at least partially have a metallic surface which consists at least 90% of zinc, aluminum and / or magnesium and / or alloys of these metals with one another or with other alloy components ,
- This process includes cleaning, passivating and painting the surfaces.
- an aqueous solution is used, which contains organic polymers in addition to complex fluorides of Ti, Zr, Hf, Si and / or B.
- the organic polymers used are preferably poly-4-vinylphenol compounds. These polyvinyl compounds are preferably obtainable by condensation of a polyvinylphenol with formaldehyde or paraformaldehyde and a secondary organic amine.
- the object of the present invention is therefore to provide compositions for the surface treatment of metals which result in at least one of the following improvements in the metal surface: improved corrosion protection, improved adhesion for subsequent coating layers (for example painting or Metal deposition), passivation, smoother surface (when shining, pickling, electropolishing). It is also an object of the present invention to provide processes for the surface treatment of metals and of polymers suitable as components for the compositions according to the invention which meet the requirements mentioned. The present invention is also intended to provide additives for the deposition of metals. Furthermore, compositions and methods for the deposition of metals or metal alloys on plastic surfaces are to be provided.
- composition for the treatment of metal surfaces comprising:
- component A To dissolve (component A) or to disperse, suspend or emulsify as component B;
- component C optionally surface-active compounds, dispersants, suspending agents and / or emulsifiers as component C.
- This composition according to the invention can be used in all processes for metal treatment, in particular in those in which corrosion of a metal surface can occur.
- Such processes are, for example, the passivation, in particular phosphating, of metal surfaces, preferably chromate-free, the pickling of metal surfaces, the sealing of metal surfaces and the metal deposition on metal surfaces, for example by nickel plating, galvanizing, tin plating, copper plating or alloy deposition.
- the compositions can be used to produce paints or rust converters.
- compositions comprising do this Polymer (component A) used according to the invention has a good inhibiting action and good adhesion of protective films or of a coating layer applied thereon (for example a lacquer layer or chemically or electrochemically deposited metal layers) on the metal surface.
- a coating layer applied thereon for example a lacquer layer or chemically or electrochemically deposited metal layers
- the compositions according to the invention can be used to deposit metals on plastic surfaces, for example in the manufacture of printed circuit boards.
- compositions according to the invention are preferably corrosion-inhibiting compositions which are used in processes for the surface treatment of metals in which corrosion of the metal surface can occur or which are intended to prevent corrosion.
- Suitable metal surfaces are generally technically customary materials selected from the group consisting of aluminum and magnesium alloys, steel, copper, zinc, tin, nickel, chromium and technically customary alloys of these metals.
- Other suitable metal surfaces are precious metals, especially gold and silver and their alloys.
- metal coatings which can be produced chemically or electrochemically, selected from the group consisting of zinc and its alloys, preferably metallic zinc, zinc / iron, zinc / nickel, zinc / manganese or zinc / Cobalt alloys, tin and its alloys, preferably metallic tin, tin alloys containing Cu, Sb, Pb, Ag, Bi and Zn, particularly preferably those used as solders, for example in the manufacture and processing of printed circuit boards and copper preferably in the form in which it is used on printed circuit boards and metallized plastic parts.
- zinc and its alloys preferably metallic zinc, zinc / iron, zinc / nickel, zinc / manganese or zinc / Cobalt alloys
- tin and its alloys preferably metallic tin, tin alloys containing Cu, Sb, Pb, Ag, Bi and Zn, particularly preferably those used as solders, for example in the manufacture and processing of printed circuit boards and copper preferably in the form in which it is used on printed circuit boards and metallized plastic
- compositions according to the invention are used for pickling or passivating, in particular phosphating, metal surfaces, metal surfaces made of steel, cast iron, zinc, aluminum, magnesium and / or alloys of these metals with one another or with other alloy components are preferred. In these cases, zinc and aluminum and alloys of these metals with other alloy components are particularly preferred.
- compositions according to the invention are used for the deposition of metals on metal surfaces, then the zinc coating and deposition of zinc alloys as well as for copper and nickel plating steel surfaces preferred and for tinning (also Sn alloys) copper and steel.
- composition according to the invention for the treatment of metal surfaces that are not pretreated. However, it is preferred that the metal surfaces have been cleaned at least before treatment with the composition according to the invention. Cleaning preferably includes degreasing the metal surface. Suitable cleaning or degreasing processes are known to the person skilled in the art. It is also possible to use the composition according to the invention in a process step following pickling or passivation of the metal surface, for example in a painting step.
- the compositions according to the invention can also be used as cleaning, pickling and polishing formulations which contain additives known to the person skilled in the art and can be used in corresponding processes.
- compositions according to the invention can also be used for the deposition of metals or metal alloys on plastic surfaces.
- present application therefore also relates to compositions for the deposition of metals on plastic surfaces comprising:
- at least one aromatic compound as component Ab which is a phenol or quinone or has a phenolic or quinoid structural unit; ac) optionally an aldehyde as component Ac;
- component C optionally surface-active compounds, dispersants, suspending agents and / or emulsifiers as component C.
- compositions which are suitable for nickel-plating and copper-plating of plastic surfaces, for example for copper-plating, are preferred PCB production.
- the plastic surfaces are prepared for metallization using standard technical processes.
- the compositions according to the invention serve to metallize the plastic, but can optionally also be used in the pretreatment for the metallization.
- compositions are understood to mean both the ready-to-use compositions and concentrates.
- concentrations given below for the individual components relate to the ready-to-use compositions.
- concentrations of the individual components in concentrates are correspondingly higher.
- Component A is a polymer composed of at least one polymer containing amino groups as component Aa and at least one aromatic compound as component Ab, which is a phenol or quinone or has a phenolic or quinoid structural unit.
- the polymer contains as component Ac a building block resulting from a reaction with an aldehyde.
- polymers are to be understood as meaning those compounds which have at least three repeat units, preferably more than 10 repeat units.
- the weight average molecular weight of the polymers used according to the invention is generally 500 to 5,000,000 g / mol, preferably 1000 to 1,500,000 g / mol.
- the polymer can also be crosslinked, so that no molecular weight can be stated, although the polymer can be dispersed, emulsified or suspended in customary industrial solvents.
- Component Aa is a polymer containing amino groups.
- Polymers preferably used are polyethyleneimine, polyvinylamine, poly (vinylformamide-co-vinylamine), polylysine and polyaminostyrene.
- Derivatives of polyamines which still have amino groups are also suitable, for example the reaction products of polyamines with carboxylic acids or sulfonic acids or carboxymethylation products of polyamines.
- Other suitable and particularly preferred polymers are derivatives of polycarboxylates containing amino groups, in particular the reaction products of diamines and Copolymers containing repeating maleic acid, acrylic acid or methacrylic acid, such as the reaction products of styrene-maleic anhydride copolymers with diamines.
- Polymers of the formulas (I) and (II) are very particularly preferred:
- R is an organic radical, preferably an alkylene, cycloalkylene, arylene, arylalkylene or alkylarylene radical.
- This radical can be interrupted by heteroatoms or can be substituted as desired, suitable substituents being alkyl, alkenyl, aryl, alkylaryl or arylalkyl radicals, which in turn can be interrupted by heteroatoms or substituted by heteroatom-containing groups.
- R is preferably a C 2-32 alkylene radical, particularly preferably a C 2- ⁇ alkylene radical which can be interrupted by heteroatoms selected from -N- and -O- and which carry C 6 -6 alkyl radicals or heteroatom-containing groups, for example amino groups can Particularly preferred radicals are ethyl, n-butyl and n-hexyl radicals.
- R ', R "and R'" independently of one another denote hydrogen or any organic radicals.
- Suitable organic radicals are generally alkyl, cycloalkyl, alkenyl, aryl, alkylaryl and arylalkyl radicals, which can optionally be interrupted by heteroatoms or substituted with heteroatom-containing groups.
- R ', R "and R” preferably independently of one another denote hydrogen or hydrocarbon, particularly preferably hydrogen, -6- alkyl, C ö -io-aryl, very particularly preferably methyl, ethyl, i-propyl, n-propyl, phenyl.
- polymers containing amino groups are commercially available (polyethyleneimine, polyvinylamine) or can be prepared by methods known to those skilled in the art. Suitable processes for the production of polyvinylamine are e.g. in EP-A 216 387, DE-A 38 42 820, DE-A 195 266 26, DE-A 195 159 43.
- the particularly preferred polymers of the formulas (I) and (II) can be prepared, for example, according to the process disclosed in US 4,046,748.
- the polymers containing amino groups are generally in desalted form.
- the degree of hydrolysis is generally from 0.5 to 100%, preferably from 50 to 100%.
- the component Ab is a phenol or quinone or a compound which has a phenolic or quinoid structural unit.
- Suitable quinones or quinone derivatives are generally systems derived from o-benzoquinone or from p-benzoquinone. Systems derived from p-benzoquinone are preferably used. Compounds of the general formula (III) are particularly preferred:
- R 1 , R 2 , R 3 and R 4 can independently be hydrogen, alkyl, alkenyl, cycloalkyl, aryl, alkylaryl or arylalkyl radicals.
- R 1 to R 4 are preferably, independently of one another, hydrogen or C 1 to C 1 alkyl radicals, C 2 to C 1 alkenyl radicals, C 6 to C 4 aryl radicals or C 5 to C 6 cycloalkyl radicals. It is also possible that R 1 and R and / or R 3 and R 4 each together form a cyclic radical which can be saturated or unsaturated.
- This cyclic radical is preferably a cycle of a total of six carbon atoms, two carbon atoms originating from the basic structure in formula (III).
- radicals mentioned can in turn be substituted with alkyl, alkenyl, cycloalkyl, aryl, arylalkyl or alkylaryl radicals or interrupted by heteroatoms or substituted with heteroatom-containing groups.
- the radicals R 1 to R 4 in formula (III) are particularly preferably independently of one another hydrogen and methyl, particularly preferably used compounds of the formula (III) are selected from the group consisting of benzoquinone, 2,3,5-trimethylbenzoquinone, 2,6 -Dimethylbenzoquinone, naphthoquinone and anthraquinone.
- Suitable phenols or compounds which have a phenolic or quinoid structural unit are compounds of the general formula (IV):
- radicals R 5 , R 6 , R 7 , R 8 and R 9 independently of one another have the meaning given for R 1 to R 4 . Furthermore, the radicals R 5 and R 6 , or R 6 and R 7 , or R 7 and R 8 , or R 8 and R 9 together can form a cyclic radical, as is the case for R 1 and R 2 or R 3 and R 4 is defined. Furthermore, one or two of the radicals R 5 to R 9 can mean -O " M + .
- M " in formula (IV) means hydrogen or a cation.
- M + is an alkali metal cation, preferably a sodium or potassium ion.
- M + is a divalent or polyvalent cation, preferably an alkaline earth metal cation or Zn, Mn or Cr (III), particularly preferably magnesium or calcium.
- R 5 to R 9 can furthermore be - SO ⁇ M, - NO 2 , halogen, - COO M *, -C (O) R “" (in which R “" is hydrogen, an alkyl, aryl, Is cycloalkyl, aralkyl or alkaryl), -N (R “") 2 , -OR “” or -SH or other functional groups which are known to the person skilled in the art. In general, only one of the radicals R 5 to R 9 has one of the latter meanings.
- Preferred compounds of the formula (IV) are 1-, 2- or 3-valent phenols which can be substituted by the radicals mentioned above. In addition to the phenolic compounds mentioned, their salts are also suitable.
- Particularly preferred compounds of the formula (IV) are phenol, 4,4'-dihydroxydiphenyl sulfide, dihydroxydiphenyl sulfoxide, phenolsulfonic acid, 1,4-dihydroxy naphthalene, nitrophenol, (N, N-dimethylamino) -l-phenol, hydroxythioanisole, pyrogallol, phloroglucinol, 1, 2,4-trihydroxybenzene, 2,2 ', 4,4'-tetrahydroxybenzophenone, salicylic acid, 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, 2,5-dihydroxybenzoic acid, trihydroxybenzoic acids such as gallic acid, alkyl salicylates such as ethyl salicylate, Alkyl 3,4-dihydroxybenzoates such as ethyl 3,4- dihydroxybenzoates, alkyl gallates such as propyl gallate, 2,3-dihydroxybenzal
- Phenol and pyrocatechol are particularly preferably used.
- the polymer (component A) is optionally from an aldehyde as a further step.
- component Ac built up.
- This additional component is present, for example, when the polymer is produced by a Mannich reaction. in the in general, all aldehydes are suitable as component Ac. Aldehydes of the formula (V) are preferably used.
- R 10 denotes hydrogen, alkyl, alkenyl, cycloalkyl, aryl, aralkyl and alkaryl. It is possible for the R 10 radical to be substituted by heteroatoms or groups bearing heteroatoms. It is also possible that the radicals mentioned for R 10 are interrupted by heteroatoms.
- R is preferably hydrogen, Ci- 14 -alkyl, Cj. _ 1 - alkenyl, C 5 - 16 - cycloalkyl, C 6 - 14 - aryl, C 7 - 14 - aralkyl or C 7 - 18 alkaryl.
- heteroatom-containing radicals selected from the group consisting of halogen, preferably chlorine or bromine, NO 2 , SH, OH, acetyl, carboxyl, (-C (O) -phenyl) or interrupted by heteroatoms.
- the radical R 10 can in turn itself be substituted with alkyl, cycloalkyl, aryl, alkaryl or aralkyl radicals, which in turn can carry groups containing heteroatoms or whose chain or cycle can be interrupted by heteroatoms.
- At least one component is particularly preferably selected from the group consisting of formaldehyde, ethanal, propanal, butanal, citronellal, benzaldehyde, 2-chlorobenzaldehyde, 2-hydroxybenzaldehyde, 2-propenal, 3,3-dimethylacrolein, 4-methylbenzaldehyde , ⁇ - (lj-dimethylethy ⁇ -benzaldehyde ⁇ anisaldehyde, 4-chloro-benzaldehyde, 3-hydroxy-2,2-dimethyl-propanal, 7-hydroxy-3,7-dimethyl-octanal, N-hexanal, 2-furfural , 3-methyl-4-oxo-2-butenoic acid methyl ester, 3-methylbutanal, 2-ethylhexanal, 2-methylpropanal, 2-phenylpropionaldehyde, 3,7-dimethylocta-2,6-dien
- the polymers (component A) can be prepared by methods known to those skilled in the art. Polymers obtained by the Michael reaction (Rl) are preferred and those that are obtained by adding a suitable aldehyde (component Ac) in the sense of a Mannich reaction (R2). A Michael reaction (Rl) is shown below using the example of benzoquinone:
- R 11 denotes hydrogen or an organic radical depending on the polymer containing component A amino groups.
- R is preferably hydrogen or methyl.
- Component A is generally present in the compositions according to the invention in an amount of from 0.01 to 400 g / 1, preferably from 0.2 to 100 g / 1, particularly preferably from 1 to 50 g / 1, based on one liter of the Composition used.
- the exact amount of component A depends on the particular method for treating metal surfaces and on the particular metal surface.
- Component B is water or another solvent which is suitable for dissolving or dispersing, suspending or emulsifying the polymer (component A).
- Suitable other solvents besides water are, for example, aliphatic or aromatic solvents such as benzene, toluene and xylene, halogenated solvents such as methylene chloride and chloroform, alcohols such as methanol and ethanol, ethers such as diethyl ether and tetrahydrofuran, polyethers, in particular polyethylene glycol, ketones such as acetone, and mixtures these solvents with each other and or with water. Water is particularly preferably used exclusively as solvent.
- the pH is determined by the type of application.
- pickling and phosphating baths are generally strongly acidic and galvanic baths are basic or acidic, depending on the type of bath.
- Suitable pH values for the specific applications are known to the person skilled in the art.
- the amount of water or another solvent depends on whether the composition according to the invention is a ready-to-use composition or a concentrate, and on the particular application. Basically, the amount results from the concentrations of the individual components specified for the ready-to-use composition.
- the composition according to the invention can additionally contain surface-active compounds, emulsifiers and / or dispersants.
- Suitable surface-active compounds are surfactants, which can be cationic, anionic, zwitterionic or nonionic.
- Suitable surfactants are, for example, alkyl and alkenyl alkoxylates of the R-EO n / PO m type, where R is generally linear or branched C 6 -C 30 -alkyl radicals, preferably C 8 -C 20 -alkyl radicals and EO for an ethylene oxide unit and PO represents a propylene oxide unit, where EO and PO can be arranged in any order and n and m are independently> 1 and ⁇ 100, preferably> 3 and ⁇ 50, for example Emulan®, Lutensol® and Plurafac® (from BASF) , Alkylphenol ethoxylates, EO / PO block copolymers (Pluronic®, from BASF), alkyl
- composition according to the invention is generally 0.01-100 g / 1, preferably 0.1 to 20 g / 1.
- the composition according to the invention is used for the treatment of metal surfaces and, in addition to components A, B and optionally C:
- compositions are particularly suitable for pickling or passivating, in particular phosphating or as a rust converter for the metal surfaces mentioned in the present application.
- Suitable as component D are salts, acids and bases based on transition metal cations, transition metal oxo anions, fluorometalates or lanthanoids.
- Suitable transition metal cations are, in particular, fluorometalates of Ti (IV), Zr (IV), Hf (IV) and / or Si (IV), suitable lanthanoids, in particular Ce. Tungsten and molybdates are also suitable.
- compositions according to the present application containing component D are particularly suitable either for depositing a corrosion-protective layer on a metal surface or for enhancing the corrosion-protective effect of a corrosion layer already deposited on the metal surface.
- the polymers (component A) used according to the invention have an excellent corrosion protection effect in the compositions according to the invention.
- the amount of component D is - if component D is contained in the compositions according to the invention - preferably 0.02 to 20 g / 1.
- compositions according to the invention can further comprise at least one acid selected from the group consisting of phosphoric acid, sulfuric acid, sulfonic acids such as methanesulfonic acid, ninylsulfonic acid, AUylsulfonic acid, m-nitrobenzenesulfonic acid, naphthalenesulfonic acid and derivatives thereof, nitric acid, hydrofluoric acid and hydrochloric acid.
- the type of acid used depends on the type of treatment of the metal surface. For example, phosphoric acid is generally used in phosphating baths for phosphating steel surfaces. In this case, the composition according to the invention is a phosphating solution.
- non-layer-forming phosphating solutions which are solutions that have no divalent metals.
- Such "non-layer-forming" phosphating solutions are, for example, in the form of an iron phosphating solution.
- the phosphating solutions contain ions of divalent metals, e.g. As zinc and / or manganese, the phosphating solutions are available as so-called “layer-forming” phosphating solutions.
- Compositions containing nitric acid according to the present application are particularly “for. Surface treatment of . Zinc and its alloys are suitable, while compositions containing hydrofluoric acid are particularly suitable for the surface treatment of aluminum and its alloys.
- the amount of acid used can vary depending on the application. In general, if component E is contained in the compositions according to the invention, 0.2 to 200 g / 1, preferably 2 to 100 g / 1, of component E are used.
- compositions of the invention can be in addition to or instead of
- Components D and / or E contain at least one further corrosion inhibitor.
- Suitable corrosion inhibitors are selected from the group consisting of butynediol,
- Benzotriazole aldehydes, amine carboxylates, amino and nitrophenols, amino alcohols, Aminobenzimidazole, amininoimidazolines, aminotriazole, benzimidazolamines, benzothiazoles, derivatives of benzotriazole, boric acid esters with various alkanolamines such as, for example, boric acid diethanolamine esters, carboxylic acids and their esters, quinoline derivatives, dibenzyl sulfoxide, dicarboxylic acids, fatty acids, fatty acids, fatty acids, fatty acids, fatty acids, fatty acids, fatty acids derivatives, urea and its derivatives, lauryl pyridinium chloride, maleic acid amides, mercaptobenzimidazole, N-2-ethylhexyl-3-aminosulfopropionic acid, phosphonium salts, phthalic acid amides, amine- and sodium-
- Butynediol and benzotriazole are preferably used as further corrosion inhibitors.
- the corrosion inhibitors if they are used at all in the compositions, are used in an amount of generally 0.01 to 50 g / 1, preferably 0.1 to 20 g / 1, particularly preferably 1 to 10 g / 1.
- compositions according to the invention are preferably free of Cr (VI). If the compounds mentioned (component G) are nevertheless used, compounds selected from Fe, Zn, Zr and Ca are preferably used.
- the amount of these compounds in the compositions according to the invention - if these compounds are present at all - is generally 0.01 to 100 g / 1, preferably 0.1 to 50 g / 1, particularly preferably 1 to 20 g / 1.
- compositions according to the invention can contain further auxiliaries and additives.
- auxiliaries and additives include conductivity pigments or conductive fillers, for example iron phosphide, vanadium carbide, titanium nitride, carbon black, graphite, molybdenum disulfide or barium sulfate doped with tin or antimony, with iron phosphide being preferred.
- conductivity pigments or conductive fillers are added to the compositions according to the invention in order to improve the weldability of the metal surfaces to be treated or to improve a subsequent coating with electrocoat materials.
- silica suspensions can be used, particularly when the compositions are used to treat aluminum-containing surfaces.
- additives are generally in finely divided form, i.e. their average particle diameters are generally 0.005 to 5 ⁇ m, preferably 0.05 to 2.5 ⁇ m.
- the amount of auxiliaries and additives is generally 0.1 to 50, preferably 2 to 35,% by weight, based on the total mass of the compositions according to the invention.
- compositions according to the invention can furthermore contain additives to improve the forming behavior, for example wax-based derivatives based on natural or synthetic waxes, e.g. Waxes based on acrylic acid, polyethylene, polytetrafluoroethylene (PTFE) waxes or wax derivatives or paraffins and their oxidation products.
- Waxes based on acrylic acid, polyethylene, polytetrafluoroethylene (PTFE) waxes or wax derivatives or paraffins and their oxidation products.
- compositions according to the invention can contain polymer dispersions based on styrene, 4-hydroxystyrene, butadiene, acrylic acid, acrylic acid esters, acrylic acid amides, acrylates, methacrylic acid, methacrylic acid esters, methacrylic acid amides, methacrylates and derivatives of acrylamide. It is also possible that the compositions according to the invention contain polyurethane dispersions and polyester urethane dispersions or polyurea dispersions.
- compositions according to the invention are polyethylene glycols, polypropylene glycols, copolymers of ethylene oxide and copolymers of propylene oxide. If the compositions according to the invention are used in powder coatings, they can additionally contain epoxy resins and / or condensation resins of formaldehyde with phenol, urea, melamine, phenolsulfonic acid or naphthalenesulfonic acid.
- compositions according to the invention when used in rust converters, they can additionally contain polyvinyl butyral.
- compositions according to the invention containing component A can be used in all applications for the treatment of metal surfaces, in particular in those applications in which the corrosion of metal surfaces can be a problem.
- examples of such applications are paint stripping, metal pickling, electropolishing, chemical deburring, chemical and electrochemical metal deposition (in particular of Cu, Ni, Pd, Zn, Co, Mn, Fe, Mg, Sn, Pb, Bi, Ag, Au and their alloys), Conversion layer formation (in particular no-rinse conversion layer formation, i.e.
- the type of application corresponds to technically customary methods with the addition that the compositions according to the invention are used together with other components which are technically customary for the corresponding application, or that. them in additional .
- Treatment steps are brought into contact with the metal, such as spraying, dipping, painting or electro-painting using suitable formulations of the corrosion-inhibiting compositions according to the invention, such as solutions, emulsions, dispersions, suspensions or aerosols.
- compositions for metal deposition comprising, in addition to components A, B and, if appropriate, C:
- compositions according to the invention are particularly suitable for the deposition of metals or metal alloys on metal or plastic surfaces. Suitable metal surfaces have already been mentioned above.
- the deposition of metals or metal alloys on plastic surfaces is preferably carried out in the manufacture of printed circuit boards. The deposition is preferably carried out in a chemical or electrochemical process.
- Suitable metal oxides or metal salts are the oxides or salts of metals selected from the group consisting of Zn, Ni, Cu, Au, Pd, Sn, Co, Mn, Fe, Mg, Pb, Bi and Ag.
- the metals can be deposited in the form of the metal used or - if different metals are used - in the form of alloys of the metals mentioned with one another or with other metals.
- Preferred alloys are CuZn, CuSn, CuNi, SnPb, SnAgBiCu, SnAgCu, SnBi, SnAg, SnCu, NiPd, MP, ZnFe, ZnNi, ZnCo and ZnMn.
- the stated constituents of the alloys can be contained in the alloy in any concentration.
- Zn, Cu and Ni and alloys of these metals are particularly preferably deposited with other metals or with one another.
- Ni and Cu are particularly preferred when depositing metals or metal alloys on plastic surfaces.
- the metals, as _ metal salts selected from the corresponding sulfates, sulfonic acid salts, chlorides, carbonates, sulfamates, fluoroborates, cyanides and acetates are used.
- the concentration of the metal ions in the compositions according to the invention is generally 0.01 to 100 g / 1, preferably 0.1 to 50 g / 1, particularly preferably 2 to 20 g / 1, based on the amount of the metal used.
- compositions according to the invention can optionally additionally contain a complexing agent.
- Suitable complexing agents are, for example, ethylenediaminetetraacetic acid. acid (EDTA), ethylenediamine (ED), citric acid and salts of the compounds mentioned.
- compositions according to the invention may optionally further contain at least one acid or an alkali metal or alkaline earth metal salt of the corresponding acid, preferably selected from the group consisting of HNO 3 , H 2 SO 4 , H PO, formic acid and acetic acid.
- the acid is generally used in an amount of 0.5 to 700 g / 1, preferably 5 to 200 g / 1.
- compositions according to the invention may contain further additives, which may vary depending on the intended use, the metal to be deposited, the objective and the method used.
- Suitable additives are l- (2-vinylpyridinium) -2-ethylsulfobetaine, l, l-dimethyl-2-propynyl-l-amine, 1-pyridinium-2-ethylsulfobetaine, 1-pyridinium-2-hy droxy-3 - propylsulfobetaine, 1-pyridinium-3-propylsulfobetaine, 2,2'-dichlorodiethyl ether, 2,5-dimethyl-3-hexyne-2,5-diol, 2-butyne-1,4-diol, 2-butyne-1,4 -diolethoxylate, 2-butyne-l, 4-diolpropoxylate, 3- (2-benzothiazolylthio)
- Methylamido sulfonic acid N, N, N ', N , -TetraMs (2-hydroxypropyl) ethylenediamine, N, N-diethyl-2-propyne-1-amine, N, N-diethyl-4-amino-2-butyne 1 -ol, N, N-dimethyl-2-propyne-1-amine, N-2-ethylhexyl-3-aminosulfopropionic acid, N-allylpyridinium chloride, sodium salt of sulfated alkylphenol ethoxylates, sodium 2-ethylhexyl sulfate, nicotinic acid, nitrilotriacetic acid and salts derived therefrom , Nitrobenzenesulfonic acid sodium salt, N-methallylpyridinium chloride, ortho-chlorobenzaldehyde, phosphonium salts, phthalic acid amides, picolinic
- compositions according to the invention in accordance with this embodiment, metal deposits in particular are possible by electrochemical or chemical means. Whether an electrochemical or chemical deposition is carried out depends on the metal, the metal surface and the desired result.
- the present application also relates to a method for treating a metal surface, the metal surface being brought into contact with a polymer (component A), composed of: aa) at least one polymer containing amino groups as component Aa, ab) at least one aromatic.
- component A which is a phenol or a quinone or has a phenolic or quinoid structural unit, and ac) optionally an aldehyde as component Ac.
- Suitable methods are e.g. Paint stripping, metal pickling, electropolishing, chemical deburring, chemical and electrochemical metal deposition, conversion layer formation (in particular no-rinse conversion layer formation), corrosion protection (in particular on copper, for example in the manufacture of printed circuit boards and on steel), lubrication and greasing (in particular in cold forming).
- the polymer in the process according to the invention, can be present in solution, emulsion, suspension or aerosol.
- the polymer (component A) is preferably present in one of the compositions according to the invention mentioned above.
- the type of application corresponds to technically customary methods with the addition that the polymers (component A) used according to the invention are used together with other components which are technically usual for the corresponding application or that they are brought into contact with the metal in additional treatment steps, such as, for example, spraying, dipping, painting or electro-painting using suitable formulations of the polymers.
- a metal surface is brought into contact with a composition which has components A, B and optionally C, or with a composition which, in addition to components A, B and optionally C, as components, components D and / or E and / or F and / or G and / or H.
- Suitable components B to H are listed above.
- pickling or passivation in particular phosphating of the metal surface, is preferably carried out. Suitable process steps and devices for passivation, in particular phosphating or for pickling metal surfaces, are known to the person skilled in the art.
- the treatment of the metal surfaces is carried out by spraying a composition according to the invention onto the metal surface or dipping the metal surface into a composition according to the invention, depending on the number, size and shape of the parts to be treated.
- compositions according to the invention containing phosphoric acid as component E can be applied by a “roll-on” or “dry-in-place” or “no-rinse” method, the phosphating composition according to the invention being applied the metal strip is applied and dried without rinsing, a polymer film being formed.
- Another object of the present application is a method comprising the steps: a) optionally cleaning the metal surface to remove oils, fats and dirt, b) optionally washing with water, c) optionally pickling to remove rust or other oxides, optionally in Presence of the polymer used according to the invention (component A), d) optionally washing with water, e) treatment of the metal surface in the presence of the polymer used according to the invention (component A), f) optionally washing with water, g) optionally aftertreatment, optionally in the presence of the polymer used according to the invention (component A).
- the treatment of the metal surface in step e) can be passivation, in particular phosphating, by methods known to the person skilled in the art.
- a protective layer, film or impregnation is applied to the metal. If phosphating is carried out in step e), post-treatment of the metal surface in step g) with passivating additives is possible.
- washing with water takes place between the individual process steps in order to avoid contamination of the solution required for the respective subsequent step with components of the solution used in the previous step.
- step a) cleaning and treating the metal surface in the presence of the polymer used according to the invention (component A), preferably passivating (step e)) can also be carried out in one step, i.e. with a formulation that, in addition to the usual cleaning agents, also the inventive. Contains composition.
- the metal surface can be provided with a lacquer.
- the painting is also carried out by methods known to those skilled in the art.
- a further preferred embodiment of the present application relates to a method for the deposition of metals or metal alloys on a metal surface, the metal surface being brought into contact with a composition which contains components A, B and optionally C, or with a composition which additionally the components A, B and optionally C as further components the components I, optionally J, optionally K and optionally L contains.
- Suitable components A, B, C, I, J, K, L have already been mentioned above.
- Another embodiment of the present application relates to a method for depositing metals or metal alloys on a plastic surface, the plastic surface being brought into contact with a polymer (component A), composed of aa) at least one polymer containing amino groups as component Aa, ab) at least an aromatic compound as component Ab, which is a phenol or quinone or has a phenolic or quinoid structural unit, ac) optionally an aldehyde as component Ac.
- the plastic surface is preferably brought into contact with a composition which contains components A, B and, if appropriate, C, or with a composition which, in addition to components A, B and, if appropriate, C, components I, optionally contains J, optionally K and optionally L.
- Suitable components A, B, C, I, J, K, L have already been mentioned above.
- a deposition of metals or metal alloys on a plastic surface is generally carried out in a plastic metallization, in particular in the production of printed circuit boards.
- the deposition of metals or metal alloys on metal or plastic surfaces takes place chemically or electrochemically in a particularly preferred embodiment.
- Such methods are known to the person skilled in the art.
- Chemical or electrochemical gold deposition, chemical or electrochemical copper deposition, chemical or electrochemical nickel deposition, chemical palladium deposition, electrochemical zinc deposition, electrochemical tin deposition are particularly preferably carried out in the process according to the invention.
- the processes mentioned also include their alloys with other elements; CuZn, CuSn, CuNi, SnPb, SnAgBiCu, SnAgCu, SnBi, SnAg, SnCu, NiPd, NiP, ZnFe, ZnNi, ZnCo, ZnMn are particularly preferred, the components of the alloy mentioned being able to be contained in the alloy in any concentration.
- Processes are also in accordance with the invention in which conductive polymers are deposited, these being considered in the broadest sense as metals.
- a conductive polymer is polypyrrole.
- Further embodiments of the method according to the invention are e.g. Cleaning, etching, polishing and pickling processes, in which, in addition to the use of component A according to the invention, acids, oxidizing agents and corrosion inhibitors as well as dissolved metal salts are used, as well as processes for the production of printed circuit boards in which compositions containing component A are used both in the metallization of the Printed circuit board including the holes contained therein as well as for surface treatment of the circuit board can be used.
- Compositions containing component A can be used on the one hand in the surface treatment of metals present on the printed circuit board, for example with the aim of protecting against corrosion or in improving the solderability, as well as in processes in which non-conductive surfaces are used as part of the metal deposition with those used according to the invention Compositions containing component A are treated, for example with the aim of through-contacting printed circuit boards.
- component A erfihdühgsgemäO used polymer (component A) in the processes mentioned, especially for the pickling or passivating, in particular phosphating metal surfaces or for the deposition of metals on metal or plastic surfaces, it is possible to use the polymers according to the invention (component A ) add wherever corrosion protection is desired.
- the present application also relates to the use of polymers (component A) composed of aa) at least one polymer containing amino groups as component Aa, ab) at least one aromatic compound as component Ab, which is a phenol or quinone or a phenolic or quinoid structural unit and ac) optionally an aldehyde as component Ac for the treatment of metal.
- the polymers (component A) are preferably used to inhibit corrosion of metal surfaces. Polymers used with preference and suitable metal surfaces and suitable processes for inhibiting corrosion or processes in which the polymers mentioned can be used have already been mentioned above.
- Another preferred use relates to the use of polymers composed of aa) at least one polymer containing amino groups as component Aa, ab) at least one aromatic compound as component Ab which is a phenol or a quinone or has a phenolic or quinoid structural unit, ac) optionally an aldehyde as component Ac for the deposition of metals or metal alloys on a plastic surface.
- component A are polymers which are obtained by reacting at least one polymer containing amino groups with an aromatic compound and optionally an aldehyde.
- polymers containing amino groups are suitable, inter alia, polyvinylamine, polyvinylformamide and polylysine and copolymers containing vinylamine, vinylformamide and lysine as repeating units.
- reaction products of these amino group-containing polymers with an aromatic compound which is a phenol or quinone or has a phenolic or quinoid strocture unit in particular with benzoquinone in the sense of a Michael reaction (Rl), or with phenol or catechol in the presence of an aldehyde in the sense of a Mannich reaction (R2) are not known from the prior art.
- the present application therefore also relates to polymers composed of a) at least one polymer or copolymer composed of at least one repeating unit selected from the group consisting of vinylamine, vinylformamide and lysine as component A'a, b) benzoquinone, phenol or catechol as component A. 'b and c) optionally an aldehyde as component A'c.
- Suitable aldehydes have already been listed above under component Ac. Suitable production processes for the production of the polymers according to the invention have also already been listed above. 28
- These polymers are particularly suitable for use in the compositions according to the invention and in the processes according to the invention for the treatment of metal or plastic surfaces, preferably for the treatment of metal surfaces, and for use for the treatment of metal or plastic surfaces, preferably for corrosion inhibition of metal surfaces.
- Example A4 0.275 g of pyrocatechol are added to a solution of 32 g of polylysine in 62.7 g of water. The reaction mixture is heated to 60-70 ° C and mixed with 0.203 g of an aqueous formaldehyde solution (37 wt.%). After cooling, the reaction product is used as component A.
- 0.081 g of p-benzoquinone is introduced into a mixture of 50 g of polyethyleneimine (Lupasol PR 8515 from BASF Aktiengesellschaft, Ludwigshafen am Rhein) and 100 g of water with cooling.
- the reaction product is used as component A.
- 0.083 g of pyrocatechol are added to a mixture of N4 parts of polymer and 100 g of water while cooling. At room temperature, 0.203 g of an aqueous formaldehyde solution (37% by weight) are added and the mixture is then heated to 60-70 ° C. After cooling, the reaction product is used as component A.
- Steel sheets which are galvanically coated with zinc, are treated with the following formulations by dipping for 60 seconds at 50 ° C.:
- Aluminum sheet is anodized at a current density of 15 A / dm and 100 ° C in a solution of the following composition: H 3 PO 4 70% by weight, H 2 SO 4 10% by weight, HNO 3 4% by weight, boric acid 0.5% by weight, NH 5 F 2 16% by weight, reaction product from example (A2) 9.5% by weight ,
- Cast iron is immersed for 15 s at room temperature in a solution consisting of 10% H 2 SO 4 and 30% by weight of the reaction product from Example A5.
- 100 g of a polymer dispersion (30% solids content consisting of a copolymer of the composition 47% by weight of n-butyl acrylate, 50% by weight of styrene, 3% by weight of acrylic acid) are mixed with 100 g of water and 2 g of the reaction product from Example AI and for Painting of a galvanized steel sheet passivated with HNO 3 (0.05% by weight).
- Example B12 Electrochemical zinc alloy deposition
- Galvanic baths of the following composition are used for the electrochemical deposition of an alloy layer made of zinc and a further metal M at 40 ° C. and a current density of 1.5 A / dm 2 .
- the metal M is optionally cobalt, iron, nickel or manganese.
- examples BI to B1 are tested in the salt spray test and have a service life that is 5-30% longer than in comparable processes in which the polymers C are not used.
- the compounds AI to A9 are each added to 1 g in 99 g of an aqueous solution which is 0.04 molar in NaCl. Plates of known mass made of 1.0037 steel are placed in the solution and stored therein for 7 days. Adhesive rust is then removed from the plates, rinsed, dried and weighed. The inhibition efficiency of substances AI to A9 is calculated from the mass loss ⁇ m.p robe when stored in relation to the mass loss when stored without inhibitor ⁇ m 0 . It applies
- Each of the substances AI to A9 is used as a test substance in the following test:
- Phosphating solution A 25 g phosphoric acid (85%), 10 g Na acetate, 5 g test substance,
- Phosphating solution C 25 g phosphoric acid (85%), 10 g Na acetate, 45 g test substance,
- Phosphating solution D (comparison request): 25 g phosphoric acid (85%), 10 g Na acetate, water 965 g
- sheets 1-5 have significantly less rust than sheets 6 and 7.
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Treatment Of Metals (AREA)
- Paints Or Removers (AREA)
- Removal Of Specific Substances (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Anti-Oxidant Or Stabilizer Compositions (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Chemically Coating (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10164671 | 2001-12-27 | ||
| DE10164671A DE10164671A1 (de) | 2001-12-27 | 2001-12-27 | Derivate von Polymeren für die Metallbehandlung |
| PCT/EP2002/014786 WO2003056062A2 (de) | 2001-12-27 | 2002-12-27 | Derivate von polymeren für die metallbehandlung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1461471A2 true EP1461471A2 (de) | 2004-09-29 |
Family
ID=7711264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP02795278A Withdrawn EP1461471A2 (de) | 2001-12-27 | 2002-12-27 | Derivate von polymeren für die metallbehandlung |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20050126427A1 (enExample) |
| EP (1) | EP1461471A2 (enExample) |
| JP (1) | JP2005513275A (enExample) |
| KR (1) | KR20040073527A (enExample) |
| CN (1) | CN1620523A (enExample) |
| AU (1) | AU2002360089A1 (enExample) |
| CA (1) | CA2472120A1 (enExample) |
| DE (1) | DE10164671A1 (enExample) |
| MX (1) | MXPA04006294A (enExample) |
| PL (1) | PL371192A1 (enExample) |
| WO (1) | WO2003056062A2 (enExample) |
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| ES2420912T3 (es) * | 2002-12-24 | 2013-08-27 | Chemetall Gmbh | Agente de revestimiento por conversión química y metal tratado superficialmente |
| JP2005126734A (ja) * | 2003-10-21 | 2005-05-19 | C Uyemura & Co Ltd | 無電解ニッケルめっき浴及びそれを用いためっき方法 |
| US20060240191A1 (en) * | 2005-04-21 | 2006-10-26 | The U.S. Of America As Represented By The Secretary Of The Navy | Composition and process for preparing chromium-zirconium coatings on metal substrates |
| US7811391B2 (en) * | 2005-04-21 | 2010-10-12 | The United States Of America As Represented By The Secretary Of The Navy | Composition and process for preparing protective coatings on metal substrates |
| JP2007138264A (ja) * | 2005-11-21 | 2007-06-07 | Noguchi Koki Kk | 鉄鋼表面の防錆処理剤 |
| JP4828231B2 (ja) * | 2006-01-05 | 2011-11-30 | 日新製鋼株式会社 | リン酸塩処理液 |
| CA2642715C (en) * | 2006-02-23 | 2014-05-06 | Henkel Ag & Co. Kgaa | Acid inhibitor compositions for metal cleaning and/or pickling |
| ES2463446T3 (es) * | 2006-08-08 | 2014-05-28 | The Boeing Company | Recubrimiento de conversión sin cromo |
| US9476125B2 (en) | 2006-08-08 | 2016-10-25 | The Boeing Company | Chromium-free conversion coating |
| US8278258B2 (en) * | 2007-02-01 | 2012-10-02 | Henkel Ag & Co. Kgaa | Acid inhibitor compositions for metal cleaning and/or pickling |
| JP5317433B2 (ja) * | 2007-06-06 | 2013-10-16 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 酸性金合金めっき液 |
| US20110147225A1 (en) * | 2007-07-20 | 2011-06-23 | Rohm And Haas Electronic Materials Llc | High speed method for plating palladium and palladium alloys |
| WO2009079550A1 (en) * | 2007-12-17 | 2009-06-25 | Flexplay Technologies, Inc. | Limited life optical media |
| WO2013058803A1 (en) | 2011-03-28 | 2013-04-25 | Hitachi Chemical Research Center, Inc. | Polymers for thin film coatings |
| KR101275082B1 (ko) * | 2011-05-17 | 2013-06-17 | 주식회사 삼녹 | 녹 제거제 및 녹 제거 방법 |
| JP5798939B2 (ja) * | 2012-01-25 | 2015-10-21 | 富士フイルム株式会社 | エッチング方法、およびこれに用いられるエッチング液 |
| CN104099649B (zh) * | 2014-06-25 | 2016-08-24 | 武汉钢铁(集团)公司 | 用于电镀锡板的钝化剂 |
| MX380571B (es) | 2015-04-15 | 2025-03-12 | Henkel Ag & Co Kgaa | Revestimientos protectores contra corrosión delgados que incorporan polímeros de poliamidoamina. |
| DE102016203771A1 (de) * | 2016-03-08 | 2017-09-14 | Henkel Ag & Co. Kgaa | Fluorid-freie Zirkonium-basierte Metallvorbehandlung zur Passivierung |
| JP7035021B2 (ja) * | 2016-08-23 | 2022-03-14 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | ジ-又はポリアミンとα,β-不飽和カルボン酸誘導体との反応生成物として得られる接着促進剤の金属表面処理のための使用 |
| RU2644157C1 (ru) * | 2016-12-13 | 2018-02-08 | Евгений Александрович Курко | Средство для химической очистки металлических поверхностей |
| PL3559312T3 (pl) | 2016-12-22 | 2024-08-05 | Henkel Ag & Co. Kgaa | Produkty reakcji związków katecholowych i funkcjonalizowanych związków będących współreagentami do zastosowań do obróbki wstępnej metalu |
| WO2018119376A1 (en) * | 2016-12-22 | 2018-06-28 | Henkel Ag & Co. Kgaa | Treatment of conversion-coated metal substrates with preformed reaction products of catechol compounds and functionalized co-reactant compounds |
| CA3041335C (en) * | 2016-12-22 | 2024-04-23 | Louis Patrick RECTOR | Use of preformed reaction products of catechol compounds and functionalized co-reactant compounds to reduce oxidation of bare metal surfaces |
| CN107299364A (zh) * | 2017-06-07 | 2017-10-27 | 常州富思通管道有限公司 | 一种镀锌光亮剂及其制备方法 |
| ES2847957T3 (es) * | 2018-06-11 | 2021-08-04 | Atotech Deutschland Gmbh | Un baño ácido de galvanoplastia de zinc o aleación de zinc-níquel para el depósito de una capa de zinc o aleación de zinc-níquel |
| DE102019101449A1 (de) | 2019-01-21 | 2020-07-23 | Carl Freudenberg Kg | Oberflächenbehandlung von eloxiertem Aluminium |
| PL3699247T3 (pl) * | 2019-02-21 | 2022-05-09 | Henkel Ag & Co. Kgaa | Podkład na bazie wody do wytłaczania dla polietylenu |
| WO2020197963A1 (en) | 2019-03-22 | 2020-10-01 | Henkel Ag & Co. Kgaa | Coatings for waterproofing electronic components |
| PL3889318T3 (pl) * | 2020-04-03 | 2023-06-26 | Atotech Deutschland GmbH & Co. KG | Sposób wytwarzania czarnej warstwy pasywującej na stopie cynkowo-żelazowym i kompozycja do pasywacji czarnej |
| US20230332011A1 (en) * | 2020-08-28 | 2023-10-19 | Basf Coatings Gmbh | Solvent-Borne, Two-Pack, Anticorrosion Coating Composition |
| CN113976529A (zh) * | 2021-10-25 | 2022-01-28 | 宁波江丰电子材料股份有限公司 | 一种铜靶材的清洗方法 |
| CN116410154A (zh) * | 2021-12-31 | 2023-07-11 | 中国石油天然气股份有限公司 | 一种化合物及其合成方法以及含该化合物的超高温井下缓蚀剂 |
| CN116731571B (zh) * | 2023-05-05 | 2024-07-12 | 上海三银涂料科技股份有限公司 | 一种低表面处理钢结构用水性转锈底漆及其制备方法 |
| CN117384503B (zh) * | 2023-10-13 | 2024-05-10 | 青岛恩泽化工有限公司 | 一种高效缓释防闪锈剂的制备方法及其应用 |
| CN117363134B (zh) * | 2023-10-31 | 2024-06-25 | 浙江鱼童新材料股份有限公司 | 一种环氧带锈涂料 |
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| DE3121015C2 (de) * | 1981-05-27 | 1986-12-04 | Friedr. Blasberg GmbH und Co KG, 5650 Solingen | Verfahren zur Aktivierung von gebeizten Oberflächen und Lösung zur Durchführung desselben |
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| DE10010758A1 (de) * | 2000-03-04 | 2001-09-06 | Henkel Kgaa | Korrosionsschutzverfahren für Metalloberflächen |
-
2001
- 2001-12-27 DE DE10164671A patent/DE10164671A1/de not_active Withdrawn
-
2002
- 2002-12-27 AU AU2002360089A patent/AU2002360089A1/en not_active Abandoned
- 2002-12-27 KR KR10-2004-7010239A patent/KR20040073527A/ko not_active Withdrawn
- 2002-12-27 WO PCT/EP2002/014786 patent/WO2003056062A2/de not_active Ceased
- 2002-12-27 JP JP2003556576A patent/JP2005513275A/ja not_active Withdrawn
- 2002-12-27 US US10/500,313 patent/US20050126427A1/en not_active Abandoned
- 2002-12-27 PL PL02371192A patent/PL371192A1/xx not_active Application Discontinuation
- 2002-12-27 CN CNA028280458A patent/CN1620523A/zh active Pending
- 2002-12-27 CA CA002472120A patent/CA2472120A1/en not_active Abandoned
- 2002-12-27 EP EP02795278A patent/EP1461471A2/de not_active Withdrawn
-
2004
- 2004-06-25 MX MXPA04006294A patent/MXPA04006294A/es unknown
Non-Patent Citations (1)
| Title |
|---|
| See references of WO03056062A2 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1620523A (zh) | 2005-05-25 |
| JP2005513275A (ja) | 2005-05-12 |
| AU2002360089A1 (en) | 2003-07-15 |
| MXPA04006294A (es) | 2004-10-04 |
| DE10164671A1 (de) | 2003-07-10 |
| WO2003056062A3 (de) | 2004-01-15 |
| CA2472120A1 (en) | 2003-07-10 |
| KR20040073527A (ko) | 2004-08-19 |
| WO2003056062A2 (de) | 2003-07-10 |
| US20050126427A1 (en) | 2005-06-16 |
| PL371192A1 (en) | 2005-06-13 |
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