EP1460710B1 - Mikrowellenbauelement zur Dissipation oder Dämpfung von Leistung - Google Patents

Mikrowellenbauelement zur Dissipation oder Dämpfung von Leistung Download PDF

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Publication number
EP1460710B1
EP1460710B1 EP04290686.7A EP04290686A EP1460710B1 EP 1460710 B1 EP1460710 B1 EP 1460710B1 EP 04290686 A EP04290686 A EP 04290686A EP 1460710 B1 EP1460710 B1 EP 1460710B1
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EP
European Patent Office
Prior art keywords
resistive layer
region
fact
substrate
ground
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP04290686.7A
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English (en)
French (fr)
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EP1460710A1 (de
Inventor
André Fournier
Laurent Boillot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiall SA
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Radiall SA
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/22—Attenuating devices
    • H01P1/227—Strip line attenuators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/24—Terminating devices
    • H01P1/26—Dissipative terminations
    • H01P1/268—Strip line terminations

Definitions

  • the present invention relates to a microwave device for the dissipation or attenuation of power.
  • the present invention relates in particular to a resistive load device of medium to high power, that is to say of the order of a few watts to 200 Watts, in particular for use in base stations of cellular radio or local networks wireless type WLAN.
  • Such a device used in a microwave system, serves in particular to dissipate, in the event of a malfunction, in the form of heat, the non-active energy of the system, in particular the energy transported in a microwave line.
  • Such a microwave line may be constituted by a dielectric substrate, one side carries a conductive strip and the other side a metal ground area, the conductive strip being connected to a resistive layer deposited on the substrate.
  • microstrip This embodiment is generally referred to as "microstrip".
  • the impedance of such a microwave line is generally 50 Ohms.
  • the resistive load device may be housed in a housing connected to the system by a cable, which allows the device to be in contact with a cooling radiator. This device is commonly called remote load.
  • the device can be attached directly to a system equipment, for example on a circuit thereof.
  • the patent EP 0 092 137 discloses a resistive load device having an insulating substrate on which adjacent resistive layers in the form of circular sectors are deposited.
  • the outer arc of a resistive layer constitutes the input of the device and the inner arc the output. This device aims to allow a uniform and greater dissipation of the caloric power.
  • the patent application FR 2,486,720 describes a device for terminating a microwave transmission line, comprising a dielectric substrate with, on one side, a resistive layer constituting a termination charge.
  • the resistive layer may have a trapezoid shape whose large base constitutes the input for the microwave line and whose small base is connected to a mass metallization.
  • a conductive, transverse strip may be deposited on the resistive layer, in contact with the conductive strip and connecting two metallizations for forming with a ground plane two capacitors.
  • the patent US 6,326,862 discloses an electrical termination system having a housing in which is disposed a dielectric substrate carrying a termination circuit element.
  • the housing has a relatively high first cavity, above the junction of the inner conductor of the coaxial cable on the dielectric substrate. This first cavity opens into a second cavity of lower height. This double cavity aims to correct the impedance defects.
  • the patent US 4,267,531 discloses a device comprising a resistive film sandwiched between two dielectrics, on which sheets are arranged.
  • the present invention aims in particular to provide a new microwave device, including a resistive charging device, type "microstrip”, to substantially reduce impedance defects, and this for a wide frequency range.
  • the invention thus relates to a microwave device, in particular a resistive load device or an attenuator, intended for power dissipation or attenuation, as defined in claims 1 or 13.
  • the first region may have a dimension transverse to the axis of the resistive layer, lower than that of the second region.
  • the capacitive fault at the input of the resistive layer is reduced.
  • the or each first region of the resistive layer has a shape converging towards the conductive strip, this first region may for example be substantially trapezoidal, the conductive strip or strips connecting to the resistive layer by the small base of the trapezoid.
  • the entire resistive layer may have a substantially trapezoidal shape, in which case the ground area is connected to this layer by the large base of the trapezium.
  • the second region is substantially rectangular and the mass zone is connected to this region by one side of the rectangle.
  • the resistive layer comprises two first regions each connected to a conductive strip and to a second rectangular central region connected to the ground zone.
  • the invention makes it possible to reduce the impedance defects by covering the resistive layer, at least partially, by a ground plane connected to the mass zone and isolated from the ground. resistive layer by an insulating layer.
  • the invention by combining the aforementioned forms of the resistive layer and the presence of the ground plane above the resistive layer, a reduction of the capacitance and induction defects is obtained, thus a better microwave adaptation, for frequencies up to about 8 GHz.
  • the device according to the invention may have a relatively low cost.
  • the ground plane does not completely cover the input region, being set back from the junction between the or a conductive strip and the resistive layer or layers.
  • the ground plane can completely cover the second region of the resistive layer or layers.
  • the ground plane extends transversely over the entire width of the resistive layer or layers.
  • the above ground plane advantageously comes into electrical contact with the ground zone, at the rear of the resistive layer.
  • the abovementioned ground plane connects to lateral zones of mass extending on slices of the substrate, in particular those which are parallel to the axis of the resistive layer.
  • These lateral zones of mass may consist of metallizations carried out on these slices.
  • the insulating layer may be a layer of glass deposited for example by screen printing on the resistive layer.
  • the mass zone on the substrate may be connected to a mass range on the other side of the substrate, in particular by one or more metallizations on a wafer of the substrate or, alternatively, by metallized bores made in the thickness of the substrate.
  • the device comprises an insert comprising a conductive wall that is applied to the insulating layer and defines the ground plane.
  • the insert comprises at least one lateral conductive arm connected to the ground plane and adapted to be applied on a wafer of the substrate and optionally, if necessary, on one side. aforementioned lateral conductive tracks.
  • the insert may comprise at least one elastically deformable and conductive tab adapted to be applied on a wall of the housing, thereby providing the electrical connection between the ground plane of the device and the wall of the housing .
  • the insert may also be arranged to retain the substrate on the bottom of the housing.
  • a metallurgical bond for example brazing
  • the substrate on the bottom of the housing its maintenance in the housing being of a mechanical nature.
  • the substrate can then be devoid of metallization on its face opposite to that carrying the resistive layer, the ground plane being connected to the body of the housing.
  • the insert may for example comprise at least one fixing portion for fixing it, in particular by brazing on a support.
  • the invention may comprise at least one elastically deformable and conductive tab adapted to be applied on a wall of a housing.
  • the insert may comprise at least one fixing part for fixing it, in particular by brazing, to a support.
  • the first region has a dimension transverse to the longitudinal axis of the resistive layer, lower than that of the second region.
  • the device may comprise two conductive strips and the resistive layer comprise two first trapezoidal regions each connected to a conductive strip and a second central rectangular region connected to the ground area.
  • a device 1 forming a microwave resistive load intended for power dissipation comprising a resistive layer 2 deposited on a face 4 of an insulating substrate 3, the resistive layer 2 being connected, on the one hand, to a conductive strip 5 and, on the other hand, to a mass zone 6 also deposited on the face 4 of the insulating substrate 3.
  • the device 1 is intended to be used in a microwave system.
  • the substrate 3 may be made of ceramic, in particular alumina or aluminum nitride (A1N).
  • the substrate 3 forms with the conductive strip 5 and a mass range 8 located on a face 7 opposite the face 4 a microwave line.
  • the mass range 8 can be brewed on a support, not shown.
  • the ground area 6 can be connected to the ground area 8 by one or more metallizations made on a wafer 3a of the substrate 3 or by metallized bores made in the thickness of the substrate 3.
  • the resistive layer 2 may be deposited on the substrate 3 by screen printing or in a thin layer, for example.
  • the resistive layer 2 comprises an input region 2a having a substantially isosceles trapezoidal shape, the conductive strip 5 being connected to this region 2a by the small base 10 of the trapezium.
  • the region 2a extends, on the opposite side to the small base 10, by a rectangular region 2b whose long side coincides with the large base of the trapezium.
  • the mass zone 6 is connected to the resistive layer 2 along a long side 11 of the rectangle.
  • the resistive layer 2 has a longitudinal axis X which is, in this example, parallel to the conductive strip 5.
  • This particular form of the resistive layer 2 notably makes it possible to reduce the capacitive defects at the input of the resistive layer.
  • FIGS. Figures 2 and 3 To further improve the microwave adaptation of the device 1, it is possible, as illustrated in FIGS. Figures 2 and 3 to extend the mass zone 4 by a ground plane 12 partially covering the resistive layer 2.
  • the resistive layer 2 is entirely covered with an insulating layer 13, which is constituted for example by a layer of glass deposited by screen printing.
  • the ground plane 12 has a rectangular shape of length substantially equal to the width of the substrate.
  • the ground plane 12 covers the ground area 6 and is set back from the small base 10 of the trapezium.
  • the ground plane 12 completely covers the region 2b of the resistive layer 2 and leaves clear the junction portion between the conductive strip 5 and the resistive layer 2.
  • the ground plane 12 is made from a conductive paste deposited on the insulating layer 13.
  • the ground area 6 can be connected to two lateral conductive tracks 14, 15, parallel to the axis X.
  • the ground plane 12 comes to cover these tracks 14, 15, being in contact with them.
  • the slices 3a of the substrate 3 parallel to the X axis may be metallized and be electrically connected to the ground plane 12.
  • the device 1 ' is housed in a housing 20, which may be remote from the microwave system to be brought into contact with a cooling radiator in particular.
  • the device 1 'differs from the device 1 previously described in that the ground plane does not consist of a layer of a conductive material deposited on the substrate, but is defined by a central wall 23 of a metal insert 22 being applied to the substrate 3.
  • the conductive strip 5 is intended to be connected to the central conductor of a coaxial cable 21 mounted at one end on the housing 20.
  • the insert 22 comprises on either side of the central wall 23 two lateral arms 24 intended to be applied on two parallel edges of the substrate 3 and on the conductive tracks 14, 15. These arms 24 each comprise a portion 24a vertical application on a wafer of the substrate 3.
  • the insert 22 has on its upper face an elastically deformable and conductive tab 25 adapted to be applied on a conductive cover 26 of the housing 20. According to the invention, it is possible to provide a plurality of conductive tabs 25.
  • the resistive layer 2 is obtained by depositing a conductive paste on the substrate 3.
  • the insert 22 in the example considered, keeps the substrate 3 on the bottom of the housing 20, the maintenance being of a mechanical nature.
  • the lug or tabs 25 also make it possible to make an electrical contact between the ground zone 6 and the housing 20.
  • the insert 22 ' may be free of an elastically deformable tab 25 and its lateral arms 24' may have extensions 31 allowing brazing the insert 22 on a support 30.
  • This support 30 may be constituted by a circuit or a metal flange fixed on the equipment of the system, for example.
  • the microwave device according to the invention can be further arranged as an attenuator.
  • An embodiment of an attenuator device is illustrated in FIG. figure 6 .
  • the resistive layer 2 ' has a symmetrical configuration comprising two trapezoidal regions 2'a connected by their large bases to the long sides of a rectangular central region 2'b whose short sides are connected to the ground.
  • the trapezoidal regions 2'b are connected by their small bases to conductive strips 5.

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  • Non-Reversible Transmitting Devices (AREA)

Claims (16)

  1. Mikrowellenbauelement (1; 1'), zur Dissipation oder Dämpfung von Leistung, insbesondere Bauelement, das eine resistive Last oder einen Dämpfer bildet, mit:
    - einem isolierenden Substrat (3),
    - wenigstens einer leitenden Bahn (5) einer Mikrowellenleitung auf einer Oberfläche (4) des Substrats,
    - wenigstens einer Massezone (6),
    - wenigstens einer Widerstandsschicht (2; 2'), die auf der vorgenannten Oberfläche (4) des Substrats angeordnet ist, wobei die Masseschicht (2; 2') wenigstens ein erstes Gebiet (2a; 2'a), an welches sich die genannte leitende Bahn (5) anschließt, und ein zweites Gebiet (2b; 2'b) aufweist, das mit der Massezone (6) verbunden ist, wobei die Widerstandsschicht (2) eine Längsachse (X) hat,
    bei welchem Bauelement:
    - die Widerstandsschicht (2; 2') zumindest zum Teil von einer Masseebene (12) bedeckt ist, die mit der Massezone (6) verbunden und gegenüber der Widerstandsschicht (2; 2') durch eine isolierende Schicht (13) isoliert ist,
    - die Masseebene (12) ein leitendes Material aufweist, das durch Siebdruck auf die isolierende Schicht (13) aufgebracht ist,
    dadurch gekennzeichnet, dass das Substrat (3) beiderseits der Widerstandsschicht (2; 2') zwei seitliche Leiterbahnen (14, 15) trägt, die mit der genannten Massezone (6) verbunden sind, wobei die Masseebene (12) diese Leiterbahnen (14, 15) überdeckt.
  2. Bauelement nach Anspruch 1, dadurch gekennzeichnet, dass das erste Gebiet (2a; 2'a) der Widerstandsschicht (2; 2') eine Form hat, die sich zu der leitenden Bahn (5) verjüngt.
  3. Bauelement nach Anspruch 2, dadurch gekennzeichnet, dass das oder jedes erste Gebiet (2a, 2'a) eine im wesentlichen trapezförmige Gestalt hat, wobei das oder die leitenden Bahnen (5) sich über die kleinere Grundseite (10) des Trapezes an die Widerstandsschicht anschließen.
  4. Bauelement nach Anspruch 3, das eine resistive Last bildet, dadurch gekennzeichnet, dass die Widerstandsschicht (2) insgesamt eine im wesentlichen trapezförmige Gestalt hat, wobei die Massezone (6) sich an diese Widerstandsschicht (2) über die große Grundseite des Trapezes anschließt.
  5. Bauelement nach einem der Ansprüche 1 bis 3, das eine resistive Last bildet, dadurch gekennzeichnet, dass das zweite Gebiet (2b) im wesentlichen rechteckig ist und die Massezone (6) sich an dieses Gebiet über eine Seite des Rechtecks anschließt.
  6. Bauelement nach einem der Ansprüche 1 bis 3, das einen Dämpfer bildet, dadurch gekennzeichnet, dass es zwei leitende Bahnen (5) aufweist und dass die Widerstandsschicht (2') zwei erste trapezförmige Gebiete (2'a) aufweist, die sich jeweils an eine leitende Bahn (5) anschließen, und ein zweites rechteckiges zentrales Gebiet (2'd), das an die Massezone (6) angeschlossen ist.
  7. Bauelement nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass die Masseebene (12) das erste Gebiet (2a; 2'a) nicht vollständig bedeckt und gegenüber der Verbindung zwischen der leitenden Bahn (5) und der Widerstandsschicht (2; 2') zurückspringt.
  8. Bauelement nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass die Masseebene (12) das zweite Gebiet (2b; 2'b) vollständig bedeckt.
  9. Bauelement nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass die Masseebene (12) sich in Querrichtung über die gesamte Breite der Widerstandsschicht (2; 2') erstreckt.
  10. Bauelement nach einem der vorstehenden Ansprüche, bei dem die Massezone (6) auf dem Substrat gebildet ist und an das zweite Gebiet (2d, 2'd) angrenzt, dadurch gekennzeichnet, dass die Masseebene (12) auf der Rückseite der Widerstandsschicht mit dieser Massezone in elektrischem Kontakt steht.
  11. Bauelement nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass die Masseebene (12) sich an seitliche Massezonen anschließt, die sich über Ränder des Substrats (3) erstrecken.
  12. Bauelement nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass das erste Gebiet (2a; 2'a) quer zu der Längsachse (X) der Widerstandsschicht eine Abmessung hat, die kleiner ist als diejenige des zweiten Gebietes (2b; 2'b),
  13. Mikrowellenbauelement (1; 1'), zur Dissipation oder Dämpfung von Leistung, insbesondere Bauelement, das eine resistive Last oder einen Dämpfer bildet, mit
    - einem isolierenden Substrat (3);
    - wenigstens einer leitenden Bahn (5) einer Mikrowellenleitung auf einer Oberfläche (4) des Substrats (3),
    - wenigstens einer Massezone (6),
    - wenigstens einer Widerstandsschicht (2; 2'), die auf der vorgenannten Oberfläche (4) des Substrats angeordnet ist, wobei die Widerstandsschicht (2; 2') wenigstens ein erstes Gebiet (2a; 2'a), an welches sich die genannte leitende Bahn (5) anschließt; und ein zweites Gebiet (2b 2'b) aufweist, das mit der Massezone (6) verbunden ist, wobei die Widerstandsschicht (2) eine Längsachse (X) hat,
    bei welchem Bauelement:
    - die Widerstandsschicht (2; 2') zumindest zum Teil von einer Masseebene (12) bedeckt ist, die mit der Massezone (6) verbunden und gegenüber der Widerstandsschicht (2; 2') durch eine isolierende Schicht (13) isoliert ist,
    - welches Bauelement dadurch gekennzeichnet ist, dass es einen Einsatz (22) aufweist, der eine leitende Wand (23) aufweist, die sich an die isolierende Schicht (13) anlegt und die Masseebene (12) definiert, und zwei seitliche Arme (24) beiderseits der leitenden Wand (23), und dadurch, dass der Einsatz (22) dazu ausgebildet ist, das Substrat (3) auf dem Boden eines Gehäuses (20) zu halten, in welchem das Bauelement untergebracht ist,
    und dadurch, dass das Substrat (3) beiderseits der Widerstandsschicht (2; 2') zwei seitliche Leiterbahnen (14, 15) trägt, die mit der genannten Massezone (6) verbunden sind, wobei die Masseebene (12) diese Leiterbahnen (14, 15) überdeckt, und die beiden seitlichen Arme des Einsatzes dazu bestimmt sind, sich an die Leiterbahnen (14, 15) anzulegen.
  14. Bauelement nach Anspruch 13, dadurch gekennzeichnet, dass der Einsatz wenigstens eine elastisch verformbare und leitende Zunge (25) aufweist, die dazu eingerichtet ist, sich an eine Wand des Gehäuses (20) anzulegen.
  15. Bauelement nach einem der Ansprüche 13 und 14, dadurch gekennzeichnet, dass der Einsatz wenigstens einen Befestigungsteil (31) aufweist, der seine Befestigung, insbesondere durch Löten, auf einem Träger (30) ermöglicht.
  16. Bauelement nach einem der Ansprüche 13 bis 15, dadurch gekennzeichnet dass das erste Gebiet (2a; 2'a) quer zu der Längsachse (X) der Widerstandsschicht eine Abmessung hat, die kleiner ist als diejenige des zweiten Gebietes (2a; 2'b).
EP04290686.7A 2003-03-19 2004-03-12 Mikrowellenbauelement zur Dissipation oder Dämpfung von Leistung Expired - Lifetime EP1460710B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0303339 2003-03-19
FR0303339A FR2852738A1 (fr) 2003-03-19 2003-03-19 Dispositif hyperfrequence destine a la dissipation ou a l'attenuation de puissance.

Publications (2)

Publication Number Publication Date
EP1460710A1 EP1460710A1 (de) 2004-09-22
EP1460710B1 true EP1460710B1 (de) 2014-05-21

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EP04290686.7A Expired - Lifetime EP1460710B1 (de) 2003-03-19 2004-03-12 Mikrowellenbauelement zur Dissipation oder Dämpfung von Leistung

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US (1) US7161244B2 (de)
EP (1) EP1460710B1 (de)
FR (1) FR2852738A1 (de)

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DE202005013515U1 (de) * 2005-08-26 2005-11-03 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg HF-Abschlusswiderstand mit einer planaren Schichtstruktur
DE202006018768U1 (de) * 2006-12-12 2007-02-15 Rosenberger Hochfrequenztechnik Gmbh & Co.Kg HF-Abschlusswiderstand in Flanschbauweise
WO2008108350A1 (ja) * 2007-03-08 2008-09-12 Nec Corporation 容量素子、プリント配線基板、半導体パッケージ及び半導体回路
US20090015355A1 (en) * 2007-07-12 2009-01-15 Endwave Corporation Compensated attenuator
DE202008009225U1 (de) * 2008-07-09 2008-09-18 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Streifenleitung mit Durchkontaktierung
US8207796B2 (en) * 2009-10-20 2012-06-26 Delphi Technologies, Inc. Stripline termination circuit having resonators
JP2019121311A (ja) * 2018-01-11 2019-07-22 シャープ株式会社 基板、表示装置及び基板の製造方法
EP3912175A4 (de) 2019-01-15 2022-10-12 Smiths Interconnect Americas, Inc. Hochfrequenz-spiralabschluss
CN111168721B (zh) * 2020-03-11 2023-09-26 深圳市筑汀智能科技有限公司 一种机器人输送系统中的接地地板块

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FR2852738A1 (fr) 2004-09-24
EP1460710A1 (de) 2004-09-22
US7161244B2 (en) 2007-01-09
US20040227232A1 (en) 2004-11-18

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