EP1382091A2 - Boitier de connexion pour un composant electronique - Google Patents

Boitier de connexion pour un composant electronique

Info

Publication number
EP1382091A2
EP1382091A2 EP02732379A EP02732379A EP1382091A2 EP 1382091 A2 EP1382091 A2 EP 1382091A2 EP 02732379 A EP02732379 A EP 02732379A EP 02732379 A EP02732379 A EP 02732379A EP 1382091 A2 EP1382091 A2 EP 1382091A2
Authority
EP
European Patent Office
Prior art keywords
component
base body
housing according
underside
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02732379A
Other languages
German (de)
English (en)
Inventor
Dirk Striebel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Siemens Production and Logistics Systems AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Production and Logistics Systems AG filed Critical Siemens AG
Publication of EP1382091A2 publication Critical patent/EP1382091A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Definitions

  • connection housing for at least one electronic component with a trough-shaped base made of insulating material, which has a support surface for the component on its upper side enclosed by side walls and at least on one side of the component between its support surface and the edge of the base body internal contacts for electrical connection with component connections of the component and molded on its underside from insulating material, at least partially coated with contact metal to form external contacts, the internal contacts being connected via conductor tracks to respectively assigned external contacts.
  • US Pat. No. 5,069,626 A discloses a connection housing for electrical components, preferably integrated circuits, which is formed from insulating material and on the underside of which a large number of crenellated bumps are circumferentially arranged which serve as external contacts with a metal coating.
  • a chip is arranged on the upper side in the middle area, the connections of which are connected via bond wires to conductor tracks which radiate in groove-like fashion
  • depressions of the base body run to the outer edge and are connected to the external contacts there via vertical grooves or through holes.
  • This housing which can be locked at the top with a cap, has a very large expansion compared to the actual component, which is justified when a component, for example an IC, has to be contacted with a very large number of connections.
  • EP 0 782 765 also already discloses an injection-molded, three-dimensional substrate made of an electrically insulating polymer, on the underside of which polymer bumps formed during injection molding are arranged in a flat manner.
  • This Technology is called PSGA (Polymer stud grid array) designated ⁇ net.
  • the polymer bumps are provided with a solderable end surface and thus form external connections which are connected via integrated conductor tracks to internal connections for a semiconductor component arranged on the substrate.
  • the polymer bumps serve as elastic spacers of the module with respect to a printed circuit board and are thus able to compensate for different expansions between the printed circuit board and the intermediate carrier.
  • the semiconductor component can either be contacted on the underside of the intermediate carrier via bond wires and connected via conductor tracks to the polymer bumps formed on the same side.
  • Micro-holes with a diameter of less than 200 ⁇ m are provided for the plated-through hole, which are coated with a conductive surface. Since such micro bores can hardly be produced with mechanical drills anymore, it has started to be produced by laser drilling. However, injection molding can only be used to form base bodies with a certain minimum thickness, which up to now has not allowed the economical use of a laser to make the necessary micro-holes.
  • EP 0 645 953 A1 also discloses a method for producing a substrate, in which the substrate is provided with a depression in which the component is sunk in order to keep the overall thickness of the module small.
  • the through bores for the electrical connection of the different substrate planes lie in the region of the full thickness of the substrate, while only relatively wide holes for heat dissipation are provided below the component, which are molded during injection molding.
  • the aim of the present invention is to provide a connection housing of the type mentioned at the beginning, in which the contacting from the component via the inner connections on the upper side to the outer connections on the lower side can be produced in a space-saving and economical manner.
  • the housing should be able to be securely locked and sealed in a simple manner.
  • the base body has micro-holes serving as vias in the area of the support surface for the component, and in that each micro-hole is connected to an internal contact via an interconnect and to an external contact on the underside via an interconnect.
  • the total area of the housing can be kept slightly larger than that of the component itself , so that only little space is required on a circuit board.
  • conductor tracks in the interior they are also well protected against external influences, whereby thermal influences are less effective.
  • conductor structures on the top and bottom of the base body, including micro-bores can be produced at very high speed by laser structuring and laser drilling, so that economical production is possible.
  • the internal contacts which are expediently arranged only on one side in the edge region in the case of components with relatively few connections, are formed by cams of the base body which are at least partially coated with contact metal, the conductor tracks to the micro holes being roof-shaped sloping side walls of these cams run. Through these inclined side walls, such conductor tracks can also be formed in one operation by laser structuring.
  • the base body in the area of the microholes has a reduced thickness of the base through a recess, the conductor tracks each running over ramp-shaped, beveled side walls of the recess.
  • the depression is preferably provided on the underside of the base body. It can subsequently be filled with a potting compound in order to seal the microbores.
  • the microbores are not only much easier and more economical to produce than with a normal-thick base body, but the contact coating to be applied is also easier and more reliable to produce because of the shorter length of the bores.
  • FIG. 1 shows a connection carrier designed according to the invention with a cover, in which an invisible component is arranged
  • FIG. 2 shows a view from above of the connection carrier from FIG. 1 (without component)
  • FIG. 3 shows a view of the underside of the connection carrier from FIG. 1
  • FIG. 4 shows a section IV-IV through the connection carrier with component in FIG. 1
  • Figure 5 is a sectional view V-V of Figure 4.
  • FIG. 6 shows an enlarged detail VI from FIG. 4 (without
  • connection carrier shown in the drawing consists of a base body 1, which is injection molded three-dimensionally from a polymeric plastic. In the example shown it is also provided with integrally formed of the same material bumps 3 of the basic body towards the top side tenrow circumferential Be ⁇ 2. On its underside. These cusps are provided at least on their end faces with connection contacts 4 in the form of a metal coating. In addition, they are at least partially metallized on their flanks in order to form conductor tracks to be described later.
  • the base body 1 has a support surface 5 for a component 6 (see FIGS. 4 and 5), which can be, for example, a surface acoustic wave filter or some other electronic component.
  • a component 6 see FIGS. 4 and 5
  • cams 7 are provided in a number corresponding to the number of component connections between the support surface 5 for the component 5 and a side wall 2.
  • the cams 7 have at least one sloping side flank 7a.
  • the cams 7 are each provided with internal contacts 8 in the form of a metal coating.
  • the metal coating extends in the form of a conductor track at least over one of the inclined side flanks 7a to the base of the support surface 5.
  • further cams with internal contacts along the other long sides of the base body 1, that is to say between the component 6 and the side walls 2 are provided.
  • the base body 1 has in its central region on the underside a depression 9 which has sloping side walls 9a and thus forms a through-contact region 10 in the base of the base body 1, the thickness d2 of which is substantially less than the thickness d1 of the actual base body 1 (see Figure 6).
  • a series of micro-bores 11 is provided, the inner walls of which are provided with a contact coating 12, which continues at the lower end in the form of a conductor track 13 over the inclined side wall 9a of the depression 9 and on the underside of the base body 1 to form an associated one Hump 3 or extends to the external contact 4 carried by the bump.
  • this contact coating 12 continues in the form of a conductor track 14 to an associated internal contact 8 on a cam 7.
  • the base body is first molded by injection molding, including the side walls 2, the bumps 4 and the depression 9 on the underside and the cams 7 on the top side.
  • the required micro-bores 11 are then produced in the region of the depression 9 or the via region 10 by means of a laser bore.
  • These micro bores or vias have a diameter of 200 ⁇ m or preferably less, for example.
  • the micro-holes are then lined with a coating of contact metal.
  • both the top and the bottom of the base body 1 are coated with contact metal. Then these metal layers on the top and on the bottom of the base body are structured with a laser so that interconnects 13 and 14 isolated from each other and the internal contacts 8 on the cams 7 and the external contacts 4 on the bumps 3 are saved and isolated from each other.
  • This structuring can be done with a laser alone.
  • a known method is also possible in which the metal layer is initially covered with an etching resist, the conductor track structures are exposed with the laser by removing the etching resist, and metal regions which are not required are etched away.
  • the component 6 is then placed on the support surface 5 of the base body, and its component connections are connected to associated internal contacts 8 via bonding wires 15.
  • the side walls 2 of the base body are higher than the component 6 to be inserted.
  • This keeps a predetermined cavity 16 above the component, which is closed off with a cover 17.
  • the cavity 16 can, however, also be filled with a material with predetermined properties, for example for a specific wave propagation. In this case, the termination at the desired height above the component could also be obtained without an additional cover 17.
  • the recess 9 on the underside can also be filled with a sealing compound and sealed.
  • a corresponding depression on the top side of the base body 1 could be provided.
  • the bumps 3 are provided with external contacts 4 only in one row on one side of the base body.
  • the opposite bumps 3 thus only serve as spacers to ensure a symmetrical support and, if necessary, attachment of the base body to a printed circuit board.
  • the component in flip-chip technology can thus be placed directly on the internal contacts with its component connections downward, so that these do not take up any space next to the component. It is also conceivable to produce the microbores using a suitable mechanical punching or drilling method instead of the laser drilling described.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Multi-Conductor Connections (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne un boîtier de connexion comprenant un corps de base (1) à parois latérales (2) circulaires sur la face supérieure, qui entourent le composant à mettre en oeuvre (6) ainsi que des contacts intérieurs (8) situés entre le composant et au moins une paroi latérale. Sur la face inférieure du boîtier sont façonnés des bossages de polymères (3) formant des contacts extérieurs (4). La connexion entre les contacts intérieurs (8) de la face supérieure et les contacts extérieurs (4) de la face inférieure se fait par l'intermédiaire de micro-orifices (11) situés dans la zone centrale du corps de base (1) en dessous du composant (6). On obtient ainsi un boîtier nécessitant peu de place sur une carte de circuits imprimés et pouvant être produit économiquement, de préférence par structuration laser.
EP02732379A 2001-04-25 2002-04-08 Boitier de connexion pour un composant electronique Withdrawn EP1382091A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10120256 2001-04-25
DE10120256A DE10120256C1 (de) 2001-04-25 2001-04-25 Anschlußgehäuse für ein elektronisches Bauelement
PCT/DE2002/001280 WO2002089257A2 (fr) 2001-04-25 2002-04-08 Boitier de connexion pour un composant electronique

Publications (1)

Publication Number Publication Date
EP1382091A2 true EP1382091A2 (fr) 2004-01-21

Family

ID=7682668

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02732379A Withdrawn EP1382091A2 (fr) 2001-04-25 2002-04-08 Boitier de connexion pour un composant electronique

Country Status (6)

Country Link
US (1) US6953892B2 (fr)
EP (1) EP1382091A2 (fr)
JP (1) JP2004524711A (fr)
KR (1) KR20040015139A (fr)
DE (1) DE10120256C1 (fr)
WO (1) WO2002089257A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10225685A1 (de) * 2002-06-10 2003-12-24 Siemens Dematic Ag Verfahren zur Erzeugung von Löchern in einem elektrischen Schaltungssubstrat
US7155821B1 (en) * 2004-06-30 2007-01-02 Emc Corporation Techniques for manufacturing a circuit board having a countersunk via
DE102010026953B4 (de) * 2010-07-12 2015-02-26 Continental Automotive Gmbh Gehäuse einer elektronischen Schaltung für eine Kraftstoffpumpe
DE102015116595A1 (de) 2015-09-30 2017-03-30 Osram Opto Semiconductors Gmbh Bauelement mit einem Licht emittierenden Halbleiterchip

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US5069626A (en) * 1987-07-01 1991-12-03 Western Digital Corporation Plated plastic castellated interconnect for electrical components
JP2647194B2 (ja) * 1989-04-17 1997-08-27 住友電気工業株式会社 半導体用パッケージの封止方法
US4991291A (en) * 1989-12-29 1991-02-12 Isotronics, Inc. Method for fabricating a fold-up frame
JPH059441A (ja) 1991-07-02 1993-01-19 Nitto Denko Corp プリント基板用シート状接着材
JPH0590441A (ja) * 1991-09-26 1993-04-09 Ibiden Co Ltd リードレスチツプキヤリア
DE59403626D1 (de) * 1993-09-29 1997-09-11 Siemens Nv Verfahren zur Herstellung einer zwei- oder mehrlagigen Verdrahtung und danach hergestellte zwei- oder mehrlagige Verdrahtung
WO1996009646A1 (fr) 1994-09-23 1996-03-28 Siemens N.V. Ensemble grille a bossages polymeres
JP3576727B2 (ja) * 1996-12-10 2004-10-13 株式会社デンソー 表面実装型パッケージ
AU5505498A (en) * 1996-12-19 1998-07-15 Telefonaktiebolaget Lm Ericsson (Publ) Flip-chip type connection with elastic contacts
KR100234719B1 (ko) * 1997-03-14 1999-12-15 김영환 에리어 어레이 패키지 및 그 제조방법
US6118072A (en) * 1997-12-03 2000-09-12 Teledyne Technologies Incorp. Device having a flexible circuit disposed within a conductive tube and method of making same
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TW420853B (en) * 1998-07-10 2001-02-01 Siemens Ag Method of manufacturing the wiring with electric conducting interconnect between the over-side and the underside of the substrate and the wiring with such interconnect
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US6713676B2 (en) * 2000-11-15 2004-03-30 Texas Instruments Incorporated System and method for converting a DC input voltage to a DC output voltage

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Title
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Also Published As

Publication number Publication date
US20040132321A1 (en) 2004-07-08
JP2004524711A (ja) 2004-08-12
WO2002089257A3 (fr) 2003-01-03
DE10120256C1 (de) 2002-11-28
KR20040015139A (ko) 2004-02-18
WO2002089257A2 (fr) 2002-11-07
US6953892B2 (en) 2005-10-11

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