EP1382091A2 - Connection housing for an electronic component - Google Patents

Connection housing for an electronic component

Info

Publication number
EP1382091A2
EP1382091A2 EP02732379A EP02732379A EP1382091A2 EP 1382091 A2 EP1382091 A2 EP 1382091A2 EP 02732379 A EP02732379 A EP 02732379A EP 02732379 A EP02732379 A EP 02732379A EP 1382091 A2 EP1382091 A2 EP 1382091A2
Authority
EP
European Patent Office
Prior art keywords
component
base body
housing according
underside
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02732379A
Other languages
German (de)
French (fr)
Inventor
Dirk Striebel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Siemens Production and Logistics Systems AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Production and Logistics Systems AG filed Critical Siemens AG
Publication of EP1382091A2 publication Critical patent/EP1382091A2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Definitions

  • connection housing for at least one electronic component with a trough-shaped base made of insulating material, which has a support surface for the component on its upper side enclosed by side walls and at least on one side of the component between its support surface and the edge of the base body internal contacts for electrical connection with component connections of the component and molded on its underside from insulating material, at least partially coated with contact metal to form external contacts, the internal contacts being connected via conductor tracks to respectively assigned external contacts.
  • US Pat. No. 5,069,626 A discloses a connection housing for electrical components, preferably integrated circuits, which is formed from insulating material and on the underside of which a large number of crenellated bumps are circumferentially arranged which serve as external contacts with a metal coating.
  • a chip is arranged on the upper side in the middle area, the connections of which are connected via bond wires to conductor tracks which radiate in groove-like fashion
  • depressions of the base body run to the outer edge and are connected to the external contacts there via vertical grooves or through holes.
  • This housing which can be locked at the top with a cap, has a very large expansion compared to the actual component, which is justified when a component, for example an IC, has to be contacted with a very large number of connections.
  • EP 0 782 765 also already discloses an injection-molded, three-dimensional substrate made of an electrically insulating polymer, on the underside of which polymer bumps formed during injection molding are arranged in a flat manner.
  • This Technology is called PSGA (Polymer stud grid array) designated ⁇ net.
  • the polymer bumps are provided with a solderable end surface and thus form external connections which are connected via integrated conductor tracks to internal connections for a semiconductor component arranged on the substrate.
  • the polymer bumps serve as elastic spacers of the module with respect to a printed circuit board and are thus able to compensate for different expansions between the printed circuit board and the intermediate carrier.
  • the semiconductor component can either be contacted on the underside of the intermediate carrier via bond wires and connected via conductor tracks to the polymer bumps formed on the same side.
  • Micro-holes with a diameter of less than 200 ⁇ m are provided for the plated-through hole, which are coated with a conductive surface. Since such micro bores can hardly be produced with mechanical drills anymore, it has started to be produced by laser drilling. However, injection molding can only be used to form base bodies with a certain minimum thickness, which up to now has not allowed the economical use of a laser to make the necessary micro-holes.
  • EP 0 645 953 A1 also discloses a method for producing a substrate, in which the substrate is provided with a depression in which the component is sunk in order to keep the overall thickness of the module small.
  • the through bores for the electrical connection of the different substrate planes lie in the region of the full thickness of the substrate, while only relatively wide holes for heat dissipation are provided below the component, which are molded during injection molding.
  • the aim of the present invention is to provide a connection housing of the type mentioned at the beginning, in which the contacting from the component via the inner connections on the upper side to the outer connections on the lower side can be produced in a space-saving and economical manner.
  • the housing should be able to be securely locked and sealed in a simple manner.
  • the base body has micro-holes serving as vias in the area of the support surface for the component, and in that each micro-hole is connected to an internal contact via an interconnect and to an external contact on the underside via an interconnect.
  • the total area of the housing can be kept slightly larger than that of the component itself , so that only little space is required on a circuit board.
  • conductor tracks in the interior they are also well protected against external influences, whereby thermal influences are less effective.
  • conductor structures on the top and bottom of the base body, including micro-bores can be produced at very high speed by laser structuring and laser drilling, so that economical production is possible.
  • the internal contacts which are expediently arranged only on one side in the edge region in the case of components with relatively few connections, are formed by cams of the base body which are at least partially coated with contact metal, the conductor tracks to the micro holes being roof-shaped sloping side walls of these cams run. Through these inclined side walls, such conductor tracks can also be formed in one operation by laser structuring.
  • the base body in the area of the microholes has a reduced thickness of the base through a recess, the conductor tracks each running over ramp-shaped, beveled side walls of the recess.
  • the depression is preferably provided on the underside of the base body. It can subsequently be filled with a potting compound in order to seal the microbores.
  • the microbores are not only much easier and more economical to produce than with a normal-thick base body, but the contact coating to be applied is also easier and more reliable to produce because of the shorter length of the bores.
  • FIG. 1 shows a connection carrier designed according to the invention with a cover, in which an invisible component is arranged
  • FIG. 2 shows a view from above of the connection carrier from FIG. 1 (without component)
  • FIG. 3 shows a view of the underside of the connection carrier from FIG. 1
  • FIG. 4 shows a section IV-IV through the connection carrier with component in FIG. 1
  • Figure 5 is a sectional view V-V of Figure 4.
  • FIG. 6 shows an enlarged detail VI from FIG. 4 (without
  • connection carrier shown in the drawing consists of a base body 1, which is injection molded three-dimensionally from a polymeric plastic. In the example shown it is also provided with integrally formed of the same material bumps 3 of the basic body towards the top side tenrow circumferential Be ⁇ 2. On its underside. These cusps are provided at least on their end faces with connection contacts 4 in the form of a metal coating. In addition, they are at least partially metallized on their flanks in order to form conductor tracks to be described later.
  • the base body 1 has a support surface 5 for a component 6 (see FIGS. 4 and 5), which can be, for example, a surface acoustic wave filter or some other electronic component.
  • a component 6 see FIGS. 4 and 5
  • cams 7 are provided in a number corresponding to the number of component connections between the support surface 5 for the component 5 and a side wall 2.
  • the cams 7 have at least one sloping side flank 7a.
  • the cams 7 are each provided with internal contacts 8 in the form of a metal coating.
  • the metal coating extends in the form of a conductor track at least over one of the inclined side flanks 7a to the base of the support surface 5.
  • further cams with internal contacts along the other long sides of the base body 1, that is to say between the component 6 and the side walls 2 are provided.
  • the base body 1 has in its central region on the underside a depression 9 which has sloping side walls 9a and thus forms a through-contact region 10 in the base of the base body 1, the thickness d2 of which is substantially less than the thickness d1 of the actual base body 1 (see Figure 6).
  • a series of micro-bores 11 is provided, the inner walls of which are provided with a contact coating 12, which continues at the lower end in the form of a conductor track 13 over the inclined side wall 9a of the depression 9 and on the underside of the base body 1 to form an associated one Hump 3 or extends to the external contact 4 carried by the bump.
  • this contact coating 12 continues in the form of a conductor track 14 to an associated internal contact 8 on a cam 7.
  • the base body is first molded by injection molding, including the side walls 2, the bumps 4 and the depression 9 on the underside and the cams 7 on the top side.
  • the required micro-bores 11 are then produced in the region of the depression 9 or the via region 10 by means of a laser bore.
  • These micro bores or vias have a diameter of 200 ⁇ m or preferably less, for example.
  • the micro-holes are then lined with a coating of contact metal.
  • both the top and the bottom of the base body 1 are coated with contact metal. Then these metal layers on the top and on the bottom of the base body are structured with a laser so that interconnects 13 and 14 isolated from each other and the internal contacts 8 on the cams 7 and the external contacts 4 on the bumps 3 are saved and isolated from each other.
  • This structuring can be done with a laser alone.
  • a known method is also possible in which the metal layer is initially covered with an etching resist, the conductor track structures are exposed with the laser by removing the etching resist, and metal regions which are not required are etched away.
  • the component 6 is then placed on the support surface 5 of the base body, and its component connections are connected to associated internal contacts 8 via bonding wires 15.
  • the side walls 2 of the base body are higher than the component 6 to be inserted.
  • This keeps a predetermined cavity 16 above the component, which is closed off with a cover 17.
  • the cavity 16 can, however, also be filled with a material with predetermined properties, for example for a specific wave propagation. In this case, the termination at the desired height above the component could also be obtained without an additional cover 17.
  • the recess 9 on the underside can also be filled with a sealing compound and sealed.
  • a corresponding depression on the top side of the base body 1 could be provided.
  • the bumps 3 are provided with external contacts 4 only in one row on one side of the base body.
  • the opposite bumps 3 thus only serve as spacers to ensure a symmetrical support and, if necessary, attachment of the base body to a printed circuit board.
  • the component in flip-chip technology can thus be placed directly on the internal contacts with its component connections downward, so that these do not take up any space next to the component. It is also conceivable to produce the microbores using a suitable mechanical punching or drilling method instead of the laser drilling described.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Multi-Conductor Connections (AREA)
  • Casings For Electric Apparatus (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

The connection housing comprises a base body (1) with lateral walls (2), which extend around the base body on the top and which enclose the component (6) to be inserted as well as inner contacts (8) that are arranged between the component and at least one lateral wall. Polymer protuberances (3) for forming outer contacts (4) are shaped onto the underside. The connection between the inner contacts (8) of the top and the outer contacts (4) of the underside is effected by micro-boreholes (11) that are located underneath the component (6) in the middle area of the base body (1). This results in the provision of a housing, which requires little space on a printed circuit board and which can be economically produced preferably while using laser structuring.

Description

Beschreibungdescription
Anschlußgehäuse für ein elektronisches BauelementJunction box for an electronic component
Die Erfindung betrifft ein Anschlußgehäuse für mindestens ein elektronisches Bauelement mit einem wannenförmigen, aus Isolierstoff geformten Grundkörper, der auf seiner von Seitenwänden umschlossenen Oberseite eine Auflagefläche für das Bauelement sowie mindestens auf einer Seite des Bauelementes zwischen dessen Auflagefläche und dem Rand des Grundkörpers Innenkontakte zur elektrischen Verbindung mit Bauteilanschlüssen des Bauelementes und auf seiner Unterseite aus Isolierstoff angeformte, zumindest teilweise zur Bildung von Außenkontakten mit Kontaktmetall beschichtete Höcker aufweist, wobei die Innenkontakte über Leiterbahnen mit jeweils zugeordneten Außenkontakten verbunden sind.The invention relates to a connection housing for at least one electronic component with a trough-shaped base made of insulating material, which has a support surface for the component on its upper side enclosed by side walls and at least on one side of the component between its support surface and the edge of the base body internal contacts for electrical connection with component connections of the component and molded on its underside from insulating material, at least partially coated with contact metal to form external contacts, the internal contacts being connected via conductor tracks to respectively assigned external contacts.
Aus der US 5 069 626 A ist ein aus Isolierstoff geformtes Anschlußgehäuse für elektrische Bauelemente, vorzugsweise inte- grierte Schaltkreise, bekannt, auf dessen Unterseite im Randbereich umlaufend eine große Zahl von zinnenartigen Höckern angeordnet ist, die mit einer Metallbeschichtung als Außenkontakte dienen. Auf der Oberseite ist im Mittelbereich ein Chip angeordnet, dessen Anschlüsse über Bonddrähte mit Lei- terbahnen verbunden sind, die strahlenförmig in nutartigenUS Pat. No. 5,069,626 A discloses a connection housing for electrical components, preferably integrated circuits, which is formed from insulating material and on the underside of which a large number of crenellated bumps are circumferentially arranged which serve as external contacts with a metal coating. A chip is arranged on the upper side in the middle area, the connections of which are connected via bond wires to conductor tracks which radiate in groove-like fashion
Vertiefungen des Grundkörpers zum Außenrand verlaufen und dort über senkrechte Nuten oder Durchgangslöcher mit den Außenkontakten verbunden sind. Dieses Gehäuse, das nach oben mit einer Kappe abschließbar ist, besitzt im Vergleich zum eigentlichen Bauelement eine sehr große Ausdehnung, die dann gerechtfertigt ist, wenn ein Bauelement, zum Beispiel ein IC, mit sehr vielen Anschlüssen kontaktiert werden muß.Depressions of the base body run to the outer edge and are connected to the external contacts there via vertical grooves or through holes. This housing, which can be locked at the top with a cap, has a very large expansion compared to the actual component, which is justified when a component, for example an IC, has to be contacted with a very large number of connections.
Aus der EP 0 782 765 ist ebenfalls bereits ein spritzgegosse- nes, dreidimensionales Substrat aus einem elektrisch isolierenden Polymer bekannt, auf dessen Unterseite beim Spritzgießen mitgeformte Polymerhöcker flächig angeordnet sind. Diese Technologie wird als PSGA (Polymer Stud Grid Array) bezeich¬ net. Die Polymerhöcker sind mit einer lötbaren Endoberfläche versehen und bilden so Außenanschlüsse, die über integrierte Leiterzüge mit Innenanschlüssen für eine auf dem Substrat an- geordnete Halbleiterkomponente verbunden sind. Die Polymerhöcker dienen als elastische Abstandshalter des Moduls gegenüber einer Leiterplatte und sind so in der Lage, unterschiedliche Ausdehnungen zwischen Leiterplatte und Zwischenträger auszugleichen. Die Halbleiterkomponente kann entweder auf der Unterseite des Zwischenträgers über Bonddrähte kontaktiert und über Leiterbahnen mit den auf der gleichen Seite angeformten Polymerhöckern verbunden sein. Möglich ist aber auch eine Anordnung des Chips auf der Oberseite des Zwischenträgers, wobei eine Verbindung mit der Unterseite und den Poly- merhöckern über Durchkontaktierungs-Löcher in Betracht kommt. Für die Durchkontaktierung werden Mikrobohrungen mit einem Durchmesser von weniger als 200 um (sog. Vias oder μ-Vias) vorgesehen, die mit einer leitenden Oberfläche beschichtet werden. Da derartige Mikrobohrungen mit mechanischen Bohrern kaum noch erzeugt werden können, ist man dazu übergegangen, diese durch Laserbohren zu erzeugen. Allerdings können durch Spritzgießen nur Grundkörper mit einer bestimmten Mindestdik- ke geformt werden, die bisher einen wirtschaftlichen Einsatz eines Lasers zum Einbringen der erforderlichen Mikrobohrungen nicht gestattet.EP 0 782 765 also already discloses an injection-molded, three-dimensional substrate made of an electrically insulating polymer, on the underside of which polymer bumps formed during injection molding are arranged in a flat manner. This Technology is called PSGA (Polymer stud grid array) designated ¬ net. The polymer bumps are provided with a solderable end surface and thus form external connections which are connected via integrated conductor tracks to internal connections for a semiconductor component arranged on the substrate. The polymer bumps serve as elastic spacers of the module with respect to a printed circuit board and are thus able to compensate for different expansions between the printed circuit board and the intermediate carrier. The semiconductor component can either be contacted on the underside of the intermediate carrier via bond wires and connected via conductor tracks to the polymer bumps formed on the same side. However, it is also possible to arrange the chip on the top of the intermediate carrier, a connection with the bottom and the polymer bumps via via holes being considered. Micro-holes with a diameter of less than 200 μm (so-called vias or μ-vias) are provided for the plated-through hole, which are coated with a conductive surface. Since such micro bores can hardly be produced with mechanical drills anymore, it has started to be produced by laser drilling. However, injection molding can only be used to form base bodies with a certain minimum thickness, which up to now has not allowed the economical use of a laser to make the necessary micro-holes.
Aus der EP 0 645 953 AI ist weiterhin ein Verfahren zur Herstellung eines Substrates bekannt, bei dem das Substrat mit einer Mulde versehen wird, in welcher das Bauelement versenkt angeordnet ist, um die Gesamtdicke des Moduls gering zu halten. Die Durchgangsbohrungen zur elektrischen Verbindung der unterschiedlichen Substratebenen liegen allerdings im Bereich der vollen Dicke des Substrats, während unterhalb des Bauelements lediglich relativ weite, beim Spritzgießen angeformte Löcher zur Wärmeabfuhr vorgesehen sind. Ziel der vorliegenden Erfindung ist es, ein Anschlußgehäuse der eingangs genannten Art anzugeben, bei dem die Kontaktie- rung von dem Bauelement über die Innenanschlüsse auf der Oberseite zu den Außenanschlüssen auf der Unterseite platz- sparend und wirtschaftlich hergestellt werden können. Außerdem soll das Gehäuse auf einfache Weise sicher abgeschlossen und abgedichtet werden können.EP 0 645 953 A1 also discloses a method for producing a substrate, in which the substrate is provided with a depression in which the component is sunk in order to keep the overall thickness of the module small. The through bores for the electrical connection of the different substrate planes, however, lie in the region of the full thickness of the substrate, while only relatively wide holes for heat dissipation are provided below the component, which are molded during injection molding. The aim of the present invention is to provide a connection housing of the type mentioned at the beginning, in which the contacting from the component via the inner connections on the upper side to the outer connections on the lower side can be produced in a space-saving and economical manner. In addition, the housing should be able to be securely locked and sealed in a simple manner.
Erfindungsgemäß wird dieses Ziel dadurch erreicht, daß der Grundkörper im Bereich der Auflagefläche für das Bauelement als Durchkontaktierungen dienende Mikrobohrungen aufweist und daß jede Mikrobohrung auf der Oberseite über eine Leiterbahn mit einem Innenkontakt und auf der Unterseite über eine Leiterbahn mit einem Außenkontakt verbunden ist.According to the invention, this object is achieved in that the base body has micro-holes serving as vias in the area of the support surface for the component, and in that each micro-hole is connected to an internal contact via an interconnect and to an external contact on the underside via an interconnect.
Durch die erfindungsgemäße geometrische Gestaltung, bei der auf der Oberseite neben dem Bauelement lediglich die erforderliche Anzahl von Innenkontakten vorgesehen ist und die Durchkontaktierungen zur Unterseite in den Bereich unterhalb des Bauelementes verlegt sind, kann die Gesamtfläche des Gehäuses wenig größer als die des Bauelementes selbst gehalten werden, so daß auf einer Leiterplatte nur wenig Platz beansprucht wird. Durch die Führung der Leiterbahnen im Innenbereich sind diese auch gut gegen Einflüsse von außen ge- schützt, wobei thermische Einflüsse auch weniger zur Geltung kommen. Vor allem aber sind Leiterstrukturen auf der Oberseite und der Unterseite des Grundkörpers einschließlich von Mikrobohrungen mit sehr hoher Geschwindigkeit durch Laserstrukturieren und Laserbohren herzustellen, so daß eine wirt- schaftliche Fertigung möglich ist.Due to the geometric design according to the invention, in which only the required number of internal contacts is provided on the top in addition to the component and the through contacts to the bottom are laid in the region below the component, the total area of the housing can be kept slightly larger than that of the component itself , so that only little space is required on a circuit board. By guiding the conductor tracks in the interior, they are also well protected against external influences, whereby thermal influences are less effective. Above all, however, conductor structures on the top and bottom of the base body, including micro-bores, can be produced at very high speed by laser structuring and laser drilling, so that economical production is possible.
Die Innenkontakte, die bei Bauelementen mit relativ wenig Anschlüssen zweckmäßigerweise lediglich auf einer Seite im Randbereich angeordnet sind, werden in einer bevorzugten Aus- führungsform der Erfindung durch zumindest teilweise mit Kontaktmetall beschichtete Nocken des Grundkörpers gebildet, wobei die Leiterbahnen zu den Mikrobohrungen über dachförmig abgeschrägte Seitenwände dieser Nocken verlaufen. Durch diese schrägen Seitenwände können auch derartige Leiterbahnen in einem Arbeitsgang durch Laserstrukturieren geformt werden.In a preferred embodiment of the invention, the internal contacts, which are expediently arranged only on one side in the edge region in the case of components with relatively few connections, are formed by cams of the base body which are at least partially coated with contact metal, the conductor tracks to the micro holes being roof-shaped sloping side walls of these cams run. Through these inclined side walls, such conductor tracks can also be formed in one operation by laser structuring.
In weiterer Ausgestaltung weist der Grundkörper im Bereich der Mikrolöcher durch eine Vertiefung eine verminderte Dicke des Bodens auf, wobei die Leiterbahnen jeweils über rampen- för ig abgeschrägte Seitenwände der Vertiefung verlaufen. Vorzugsweise ist die Vertiefung auf der Unterseite des Grund- körpers vorgesehen. Sie kann nachträglich durch eine Vergußmasse gefüllt sein, um die Mikrobohrungen abzudichten. Im Bereich der verringerten Wandstärke sind die Mikrobohrungen nicht nur wesentlich einfacher und wirtschaftlicher herzustellen als bei einem normal dicken Grundkörper, sondern die aufzubringende Kontaktbeschichtung ist auch wegen der geringeren Länge der Bohrungen einfacher und zuverlässiger herzustellen .In a further embodiment, the base body in the area of the microholes has a reduced thickness of the base through a recess, the conductor tracks each running over ramp-shaped, beveled side walls of the recess. The depression is preferably provided on the underside of the base body. It can subsequently be filled with a potting compound in order to seal the microbores. In the area of reduced wall thickness, the microbores are not only much easier and more economical to produce than with a normal-thick base body, but the contact coating to be applied is also easier and more reliable to produce because of the shorter length of the bores.
Die Erfindung wird nachfolgend an Ausführungsbeispielen an- hand der Zeichnungen näher erläutert. Es zeigtThe invention is explained in more detail below using exemplary embodiments with reference to the drawings. It shows
Figur 1 einen erfindungsgemäß gestalteten Anschlußträger mit Deckel, in dem ein nicht sichtbares Bauelement angeordnet ist, Figur 2 eine Ansicht von oben auf den Anschlußträger von Figur 1 (ohne Bauelement) ,1 shows a connection carrier designed according to the invention with a cover, in which an invisible component is arranged, FIG. 2 shows a view from above of the connection carrier from FIG. 1 (without component),
Figur 3 eine Ansicht auf die Unterseite des Anschlußträgers von Figur 1, Figur 4 einen Schnitt IV-IV durch den Anschlußträger mit Bau- element in Figur 1,3 shows a view of the underside of the connection carrier from FIG. 1, FIG. 4 shows a section IV-IV through the connection carrier with component in FIG. 1,
Figur 5 eine Schnittansicht V-V aus Figur 4 undFigure 5 is a sectional view V-V of Figure 4 and
Figur 6 einen vergrößerter Ausschnitt VI aus Figur 4 (ohneFIG. 6 shows an enlarged detail VI from FIG. 4 (without
Bauelement) .Component).
Der in der Zeichnung dargestellte Anschlußträger besteht aus einem Grundkörper 1, der dreidimensional aus einem polymeren Kunststoff spritzgegossen ist. Im gezeigten Beispiel besitzt dieser Grundkörper zur Oberseite hin seitlich umlaufende Sei¬ tenwände 2. An seiner Unterseite ist er mit ebenfalls aus dem gleichen Material angeformten Höckern 3 versehen. Diese Hök- ker sind zumindest auf ihren Endflächen mit Anschlußkontakten 4 in Form einer Metallbeschichtung versehen. Außerdem sind sie an ihren Flanken zumindest teilweise metallisiert, um später noch zu beschreibende Leiterbahnen zu bilden.The connection carrier shown in the drawing consists of a base body 1, which is injection molded three-dimensionally from a polymeric plastic. In the example shown it is also provided with integrally formed of the same material bumps 3 of the basic body towards the top side tenwände circumferential Be ¬ 2. On its underside. These cusps are provided at least on their end faces with connection contacts 4 in the form of a metal coating. In addition, they are at least partially metallized on their flanks in order to form conductor tracks to be described later.
Im Inneren weist der Grundkörper 1 eine Auflagefläche 5 für ein Bauelement 6 (siehe Figur 4 und 5) auf, das beispielsweise ein Oberflächenwellenfilter oder irgendein anderes elektronisches Bauelement sein kann. In einem von dem Bauelement 6 nicht belegten Seitenabschnitt sind zwischen der Auflagefläche 5 für das Bauelement 5 und einer Seitenwand 2 jeweils Nocken 7 in einer der Anzahl der Bauelementanschlüsse entsprechenden Zahl vorgesehen. Die Nocken 7 besitzen zumindest eine schräg abfallende Seitenflanke 7a. Auf ihrer Oberseite sind die Nocken 7 jeweils mit Innenkontakten 8 in Form einer Metallbeschichtung versehen. Die Metallbeschichtung zieht sich in Form einer Leiterbahn zumindest über eine der schrägen Seitenflanken 7a auf den Grund der Auflagefläche 5. Für Bauelemente mit einer größeren Anzahl von Anschlüssen könnten natürlich auch weitere Nocken mit Innenkontakten entlang der übrigen Längsseiten des Grundkörpers 1, also zwischen dem Bauelement 6 und den Seitenwänden 2, vorgesehen werden.Inside, the base body 1 has a support surface 5 for a component 6 (see FIGS. 4 and 5), which can be, for example, a surface acoustic wave filter or some other electronic component. In a side section which is not occupied by the component 6, cams 7 are provided in a number corresponding to the number of component connections between the support surface 5 for the component 5 and a side wall 2. The cams 7 have at least one sloping side flank 7a. On their top, the cams 7 are each provided with internal contacts 8 in the form of a metal coating. The metal coating extends in the form of a conductor track at least over one of the inclined side flanks 7a to the base of the support surface 5. For components with a larger number of connections, of course, further cams with internal contacts along the other long sides of the base body 1, that is to say between the component 6 and the side walls 2 are provided.
Der Grundkörper 1 besitzt in seinem Mittelbereich auf der Unterseite eine Vertiefung 9, die schräg abfallende Seitenwände 9a besitzt und so einen Durchkontaktierungsbereich 10 im Bo- den des Grundkörpers 1 bildet, dessen Dicke d2 wesentlich geringer ist als die Dicke dl des eigentlichen Grundkörpers 1 (siehe Figur 6). In diesem Durchkontaktierungsbereich 10 ist eine Reihe von Mikrobohrungen 11 vorgesehen, deren Innenwände mit einer Kontaktbeschichtung 12 versehen sind, die sich am unteren Ende in Form einer Leiterbahn 13 über die schräge Seitenwand 9a der Vertiefung 9 fortsetzt und auf der Unterseite des Grundkörpers 1 zu einem zugehörigen Höcker 3 bzw. zu dem von dem Höcker getragenen Außenkontakt 4 erstreckt. Auf der Oberseite setzt sich diese Kontaktbeschichtung 12 in Form einer Leiterbahn 14 zu einem zugehörigen Innenkontakt 8 auf einem Nocken 7 fort.The base body 1 has in its central region on the underside a depression 9 which has sloping side walls 9a and thus forms a through-contact region 10 in the base of the base body 1, the thickness d2 of which is substantially less than the thickness d1 of the actual base body 1 (see Figure 6). In this through-contact area 10, a series of micro-bores 11 is provided, the inner walls of which are provided with a contact coating 12, which continues at the lower end in the form of a conductor track 13 over the inclined side wall 9a of the depression 9 and on the underside of the base body 1 to form an associated one Hump 3 or extends to the external contact 4 carried by the bump. On the top, this contact coating 12 continues in the form of a conductor track 14 to an associated internal contact 8 on a cam 7.
Bei der Herstellung des erfindungsgemäßen Anschlußträgers wird zunächst der Grundkörper durch Spritzgießen einschließlich der Seitenwände 2, der Höcker 4 und der Vertiefung 9 auf der Unterseite sowie der Nocken 7 auf der Oberseite ausge- formt. Im Bereich der Vertiefung 9 bzw. des Durchkontaktie- rungsbereiches 10 werden dann die erforderlichen Mikrobohrungen 11 mittels Laserbohrung erzeugt. Diese Mikrobohrungen oder Vias besitzen beispielsweise einen Durchmesser von 200 μm oder vorzugsweise weniger. Danach werden die Mikrobohrun- gen mit einer Beschichtung aus Kontaktmetall ausgekleidet.In the manufacture of the connection carrier according to the invention, the base body is first molded by injection molding, including the side walls 2, the bumps 4 and the depression 9 on the underside and the cams 7 on the top side. The required micro-bores 11 are then produced in the region of the depression 9 or the via region 10 by means of a laser bore. These micro bores or vias have a diameter of 200 μm or preferably less, for example. The micro-holes are then lined with a coating of contact metal.
Außerdem werden sowohl die Oberseite als auch die Unterseite des Grundkörpers 1 mit Kontaktmetall beschichtet. Danach werden diese Metallschichten auf der Oberseite und auf der Unterseite des Grundkörpers mit einem Laser so strukturiert, daß voneinander isolierte Leiterbahnen 13 und 14 und die Innenkontakte 8 auf den Nocken 7 sowie die Außenkontakte 4 auf den Höckern 3 freigespart und gegeneinander isoliert sind. Diese Strukturierung kann mit einem Laser allein erfolgen. Möglich ist aber auch ein bekanntes Verfahren, bei dem die Metallschicht zunächst mit einem Ätzresist bedeckt, die Lei- terbahnstrukturen mit dem Laser durch Abtragen des Ätzresists freigelegt und nicht benötigte Metallbereiche weggeätzt werden.In addition, both the top and the bottom of the base body 1 are coated with contact metal. Then these metal layers on the top and on the bottom of the base body are structured with a laser so that interconnects 13 and 14 isolated from each other and the internal contacts 8 on the cams 7 and the external contacts 4 on the bumps 3 are saved and isolated from each other. This structuring can be done with a laser alone. However, a known method is also possible in which the metal layer is initially covered with an etching resist, the conductor track structures are exposed with the laser by removing the etching resist, and metal regions which are not required are etched away.
Das Bauelement 6 wird dann auf die Auflagefläche 5 des Grundkörpers gelegt, und seine Bauteilanschlüsse werden über Bonddrähte 15 mit zugehörigen Innenkontakten 8 verbunden. Wie anhand von Figur 4 und 5 zu sehen ist, sind die Seitenwände 2 des Grundkörpers höher als das einzulegende Bauelement 6. Da- durch wird über dem Bauelement ein vorgegebener Hohlraum 16 freigehalten, der mit einem Deckel 17 abgeschlossen wird. Dies ist beispielsweise für Bauelemente wie Oberflächenwel- lenfilter und dergleichen von Bedeutung. Der Hohlraum 16 kann aber auch mit einem Material mit vorgegebenen Eigenschaften, etwa für eine bestimmte Wellenausbreitung, gefüllt werden. In diesem Fall könnte der Abschluß in der gewünschten Höhe über dem Bauelement auch ohne zusätzlichem Deckel 17 erhalten werden.The component 6 is then placed on the support surface 5 of the base body, and its component connections are connected to associated internal contacts 8 via bonding wires 15. As can be seen from FIGS. 4 and 5, the side walls 2 of the base body are higher than the component 6 to be inserted. This keeps a predetermined cavity 16 above the component, which is closed off with a cover 17. This is for example for components such as surface lenfilter and the like of importance. The cavity 16 can, however, also be filled with a material with predetermined properties, for example for a specific wave propagation. In this case, the termination at the desired height above the component could also be obtained without an additional cover 17.
Die Vertiefung 9 an der Unterseite kann ebenfalls mit einer Vergußmasse gefüllt und abgedichtet werden. Wie bereits frü- her erwähnt, könnte anstelle oder zusätzlich zu der Vertiefung 9 an der Unterseite eine entsprechende Vertiefung an der Oberseite des Grundkörpers 1 vorgesehen werden. Natürlich ist es auch möglich, mehrere Vertiefungen nebeneinander vorzusehen und dadurch mehrere Durchkontaktierungsbereiche im Grund- körper auszubilden.The recess 9 on the underside can also be filled with a sealing compound and sealed. As already mentioned earlier, instead of or in addition to the depression 9 on the underside, a corresponding depression on the top side of the base body 1 could be provided. Of course, it is also possible to provide several depressions next to one another and thereby to form a plurality of through-contact areas in the base body.
Wie in Figur 3 weiterhin zu sehen ist, sind bei dem Ausführungsbeispiel die Höcker 3 lediglich in einer Reihe auf einer Seite des Grundkörpers mit Außenkontakten 4 versehen. Die ge- genüberliegenden Höcker 3 dienen somit lediglich als Abstandhalter, um eine symmetrische Auflage und gegebenenfalls Befestigung des Grundkörpers auf einer Leiterplatte zu gewährleisten.As can also be seen in FIG. 3, in the exemplary embodiment the bumps 3 are provided with external contacts 4 only in one row on one side of the base body. The opposite bumps 3 thus only serve as spacers to ensure a symmetrical support and, if necessary, attachment of the base body to a printed circuit board.
Natürlich sind auch andere Ausführungsformen und Abwandlungen gegenüber dem dargestellten und beschriebenen Beispiel möglich. So kann das Bauelement in der Flip-Chip-Technologie unmittelbar mit seinen Bauteilanschlüssen nach unten auf die Innenkontakte aufgesetzt werden, so daß diese keinen Platz neben dem Bauelement beanspruchen. Auch ist es denkbar, die Mikrobohrungen anstatt durch das beschriebene Laserbohren mit einem geeigneten mechanischen Stanz- oder Bohrverfahren zu erzeugen. Of course, other embodiments and modifications to the illustrated and described example are also possible. The component in flip-chip technology can thus be placed directly on the internal contacts with its component connections downward, so that these do not take up any space next to the component. It is also conceivable to produce the microbores using a suitable mechanical punching or drilling method instead of the laser drilling described.

Claims

Patentansprüche claims
1. Anschlußgehäuse für mindestens ein elektronisches Bauele¬ ment (6) mit einem wannenförmigen, aus Isolierstoff geformten Grundkörper (1), der auf seiner von Seitenwänden (2) umschlossenen Oberseite eine Auflagefläche (5) für das Bauelement (6) sowie Innenkontakte (8) mindestens auf einer Seite des Bauelementes (6) zwischen dessen Auflagefläche und einer Seitenwand des Grundkörpers zur elektrischen Verbindung mit Bauteilanschlüssen des Bauelementes (6) und auf seiner Unterseite aus Isolierstoff angeformte, zumindest teilweise zur Bildung von Außenkontakten (4) mit Kontaktmetall beschichtete Höcker (3) aufweist, wobei die Innenkontakte (8) über Leiterbahnen (14) mit jeweils zugeordneten Außenkontakten (4) ver- bunden sind, d a d u r c h g e k e n n z e i c h n e t , daß der Grundkörper (1) im Bereich der Auflagefläche (5) für das Bauelement (6) als Durchkontaktierung dienende Mikrobohrungen (11) aufweist und daß jede Mikrobohrung (11) auf der Oberseite über eine Leiterbahn (14) mit einem Innenkontakt und auf der Unterseite über eine Leiterbahn (13) mit einem Außenkontakt (4) verbunden ist.1. Connection housing for at least one electronic component ¬ element (6) with a trough-shaped, molded from insulating material base body (1), on its side walls (2) enclosed top side a support surface (5) for the component (6) and internal contacts (8 ) at least on one side of the component (6) between its support surface and a side wall of the base body for electrical connection to component connections of the component (6) and on its underside made of insulating material, at least partially molded with contact metal to form external contacts (4) with contact metal ( 3), the internal contacts (8) being connected via conductor tracks (14) to respectively assigned external contacts (4), characterized in that the base body (1) in the area of the contact surface (5) for the component (6) as a via serving micro holes (11) and that each micro hole (11) on the top with a conductor track (14) an internal contact and on the underside is connected to an external contact (4) via a conductor track (13).
2. Gehäuse nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß die Innenkontakte (8) durch eine Metallbeschichtung von angeformten Nocken (7) des Grundkörpers (1) gebildet sind, wobei die Leiterbahnen (14) zu den Mikrobohrungen über dachförmig abgeschrägte Seitenwände (7a) der Nocken (8) verlaufen.2. Housing according to claim 1, characterized in that the internal contacts (8) are formed by a metal coating of molded cams (7) of the base body (1), wherein the conductor tracks (14) to the micro holes via roof-shaped beveled side walls (7a) of the cams (8) run.
3. Gehäuse nach Anspruch 1 und 2, d a d u r c h g e k e n n z e i c h n e t , daß der Grundkörper im Bereich der Mikrobohrungen (11) durch eine Vertiefung (9) eine verminderte Dicke (b2) aufweist, wobei die Lei- terbahnen (13) über rampenförmig abgeschrägte Seitenwände (9a) der Vertiefung geführt sind. 3. Housing according to claim 1 and 2, characterized in that the base body in the area of the micro bores (11) has a reduced thickness (b2) through a recess (9), the conductor tracks (13) via ramp-shaped beveled side walls (9a) the deepening are led.
4. Gehäuse nach Anspruch 3, d a d u r c h g e k e n n z e i c h n e t , daß die Vertiefung (9) in der Unterseite des Grundkörpers (1) vorgesehen ist.4. Housing according to claim 3, so that the recess (9) is provided in the underside of the base body (1).
5. Gehäuse nach Anspruch 3 oder 4, d a d u r c h g e k e n n z e i c h n e t , daß die Vertiefung nachträglich mit Vergußmasse gefüllt ist.5. Housing according to claim 3 or 4, d a d u r c h g e k e n n z e i c h n e t that the recess is subsequently filled with potting compound.
6. Mit einem Bauelement bestücktes Anschlußgehäuse nach einem der Anspr che 1 bis 5, d a d u r c h g e k e n n z e i c h n e t , daß das Bauelement (6) mit seiner Anschlußseite nach oben auf der Auflagefläche (5) des Grundkörpers (1) angeordnet ist und daß An- Schlußelemente des Bauelementes (6) über Bonddrähte (15) mit den Innenkontakten (8) des Gehäuses verbunden sind.6. Equipped with a component connector housing according to one of Anspr che 1 to 5, characterized in that the component (6) with its connection side up on the support surface (5) of the base body (1) is arranged and that connecting elements of the component ( 6) are connected to the internal contacts (8) of the housing via bonding wires (15).
7. Gehäuse nach Anspruch 6, d a d u r c h g e k e n n z e i c h n e t , daß das Bau- element (6) ein für Oberflächenwellen empfindliches Bauelement ist.7. Housing according to claim 6, so that the component (6) is a component sensitive to surface waves.
8. Gehäuse nach Anspruch 6 oder 7, d a d u r c h g e k e n n z e i c h n e t , daß die Sei- tenwände (2) des Grundkörpers die Höhe des Bauelementes (6) übersteigen und daß der Raum über dem Bauelement (6) durch einen flachen, mit den Oberkanten der Seitenwände (2) verbundenen Deckel (17) verschlossen ist.8. Housing according to claim 6 or 7, characterized in that the side walls (2) of the base body exceed the height of the component (6) and that the space above the component (6) by a flat, with the upper edges of the side walls (2nd ) connected lid (17) is closed.
9. Gehäuse nach einem der Ansprüche 6 bis 8, d a d u r c h g e k e n n z e i c h n e t , daß durch den Deckel über dem Bauelement ein leerer Hohlraum (169 gebildet ist. 9. Housing according to one of claims 6 to 8, characterized in that an empty cavity (169 is formed by the cover over the component.
10. Gehäuse nach Anspruch 8, d a d u r c h g e k e n n z e i c h n e t , daß der Raum über dem Bauelement (6) mit einem Material vorgegebener Wellenausbreitung gefüllt ist.10. Housing according to claim 8, d a d u r c h g e k e n n z e i c h n e t that the space above the component (6) is filled with a material predetermined wave propagation.
11. Gehäuse nach einem der Ansprüche 1 bis 10, d a d u r c h g e k e n n z e i c h n e t , daß auf der Unterseite des Grundkörpers symmetrisch einander gegenüberliegende Höcker vorgesehen sind, wobei lediglich ein Teil der Höcker (3) Außenanschlüsse (4) trägt, während die übrigen Höcker (3) als Abstandhalter dienen. 11. Housing according to one of claims 1 to 10, characterized in that symmetrically opposite bumps are provided on the underside of the base body, only part of the bumps (3) carrying external connections (4), while the other bumps (3) as spacers serve.
EP02732379A 2001-04-25 2002-04-08 Connection housing for an electronic component Withdrawn EP1382091A2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10120256A DE10120256C1 (en) 2001-04-25 2001-04-25 Junction box for an electronic component
DE10120256 2001-04-25
PCT/DE2002/001280 WO2002089257A2 (en) 2001-04-25 2002-04-08 Connection housing for an electronic component

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Publication Number Publication Date
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JP (1) JP2004524711A (en)
KR (1) KR20040015139A (en)
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DE10120256C1 (en) 2002-11-28
US20040132321A1 (en) 2004-07-08
US6953892B2 (en) 2005-10-11
WO2002089257A3 (en) 2003-01-03
WO2002089257A2 (en) 2002-11-07
KR20040015139A (en) 2004-02-18
JP2004524711A (en) 2004-08-12

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