EP1369004A1 - Procede et dispositif de protection permettant de monter un composant electronique sensible a la temperature - Google Patents

Procede et dispositif de protection permettant de monter un composant electronique sensible a la temperature

Info

Publication number
EP1369004A1
EP1369004A1 EP02718111A EP02718111A EP1369004A1 EP 1369004 A1 EP1369004 A1 EP 1369004A1 EP 02718111 A EP02718111 A EP 02718111A EP 02718111 A EP02718111 A EP 02718111A EP 1369004 A1 EP1369004 A1 EP 1369004A1
Authority
EP
European Patent Office
Prior art keywords
component
protective device
soldering
protective
solder connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02718111A
Other languages
German (de)
English (en)
Inventor
Ulrich Ensslin
Norbert Niemczyk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mercedes Benz Group AG
Original Assignee
DaimlerChrysler AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DaimlerChrysler AG filed Critical DaimlerChrysler AG
Publication of EP1369004A1 publication Critical patent/EP1369004A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Definitions

  • the invention relates to a method for assembling a temperature-sensitive electronic component according to the preamble of claim 1 and a protective device according to the preamble of claim 3.
  • Many electronic and electrical assemblies and components include temperature-sensitive electrical and / or electronic components, such as heat-sensitive integrated circuits, lithium batteries, oscillator crystals, optoelectronic components.
  • the electrical contacts provided on the components must be reliably connected to conductor tracks on a circuit board and / or to electrical contacts of other components.
  • This assembly is often carried out using a soldering process in which the solder connections provided on the component are soldered to the circuit board. For each component there is a safe area for the soldering time and temperature in which good soldered connections can be made.
  • the temperature-sensitive electrical and electronic components must not be heated too much to avoid permanent damage.
  • DE 196 07 726 AI shows a component for surface mounting on a printed circuit board, which is to be protected by a reflective metal foil attached to the component against excessive heating by the heat rays acting during the soldering. Although this metal foil also protects the component against the heat radiation which acts on the component from the side facing away from the circuit board, it does not offer any protection against the heat radiation acting on the component on the circuit board side.
  • a printed circuit board is known from JP 030 36796 A, the upper and lower layers of which are metallized; this is to achieve improved heat dissipation from the components inserted into the printed circuit board via connecting pins to the printed circuit board.
  • this metallization means that no thermal protection of the components can be achieved during high-temperature dip soldering.
  • an adjustable capacitor it is known from the generic DE-OS 29 49 914 to cover the region of the component projecting through the circuit board with a cap; to protect capacitors, which should be accessible through an opening in the circuit board after soldering, it is further proposed to protect this opening during the soldering by a protective plate which is removed after the soldering.
  • Such a protective plate can protect the capacitor against heat and solder vapor acting on the underside of the circuit board, which could damage the capacitor in the event of an uncovered opening; however, the plate does not offer any protection against the heat, which is exerted on the component by the heat of the soldering furnace or the solder bath from all sides. Such a protective plate can therefore only offer insufficient protection for particularly temperature-sensitive components.
  • the invention is therefore based on the object of providing a method and a protective device by means of which a temperature-sensitive component can be protected particularly effectively against heat during the soldering.
  • the component is then provided with a protective cover with a removable protective device during the soldering process, which surrounds the component in sections and protects against the environmental influences during the soldering process.
  • the protective device is thermally coupled to the component and thus has the effect that the heat introduced into the component from the solder bath during soldering is (at least partially) dissipated to the protective device. As a result, the heating of the interior of the component during soldering and the risk of functional damage to the component can be considerably reduced.
  • the protective device is advantageously coupled to the solder connections of the component, so that the heat introduced into the solder connections from the solder bath is not completely passed on to the component, but instead is partially dissipated via the protective device (see claim 2).
  • the protective cover expediently has a thermally insulating material on its inner wall facing the component and is provided at least in sections with a coating with high thermal conductivity on its outer wall facing away from the component (see claim 6).
  • the coating of the outer wall with high thermal conductivity ensures that heat radiation, which acts on the component from the outside, is distributed along the outer wall of the protective cover, reflected and thus prevented from the component.
  • the thermally insulating material from which the inner wall of the protective cover facing the component is made means that any heat introduced into the reflective outer wall is preferably radiated outward and only to a small extent in the direction of the component.
  • thermalally insulating means a material with low thermal conductivity, such as polyester, polyethylene, polyamide, etc.
  • the thermally conductive outer wall of the protective sleeve is thermally coupled to the component, preferably to the solder connections of the component.
  • part of the heat that is introduced into the solder connections from the hot solder bath during the soldering process is passed on to the outer wall of the protective sheath and from there is radiated into the surroundings. This leads to a particularly quick dissipation of the soldering heat and thus a particularly effective protection of the temperature-sensitive component.
  • the protective device is formed from a thermally iso- er PH 3 ⁇ rt H- s: rt tr 1 3 ⁇ co rt N o tö ⁇ t ⁇ sS ⁇ Q? H ⁇ er P- co ⁇ S3 tr tr
  • Figures la and 1b sectional views of an electrical component with a protective device designed as a bladder;
  • Fig. Lc the manufacture of the bladder from a piece of film
  • FIG. 2 shows a sectional view of the electrical component with a protective device designed as an elastic clip.
  • FIGs la and lb show schematic sectional views of a circuit board 1, on the back 2 a printed circuit 3 is provided.
  • This circuit board 1 is to be equipped with an optoelectronic emitter 4 and an optoelectronic receiver 5.
  • the components 4, 5 have solder connections 6, which are pushed through openings 7 in the circuit board 1 and are soldered to the printed circuit 3 on the side 2 of the circuit board 1 facing away from the components 4, 5.
  • the components 4, 5 must be exposed to elevated temperatures over long periods during the soldering: for example, during wave soldering, the component 4, 5 which is plugged onto the circuit board 1 is first slowly warmed up to about 100 degrees. This is followed by the actual soldering, which typically takes place at around 260 degrees and lasts for at least 5 seconds, followed by the solidification phase, during which the component slowly cools down.
  • DJ DJ ⁇ ⁇ 53 P ⁇ DJ P ⁇ P 3 P ⁇ 3 3 N rt 3 ⁇ P- CL tr 3 3 3 P- vQ ⁇ P ⁇ CL 1 CL P ⁇ 1 ⁇ ⁇ P- 1
  • FIG. 2 An alternative embodiment of the protective device 8 'according to the invention is shown in FIG. 2:
  • the protective device 8' is here formed by an elastic clip 20 which has an elastic clamping bracket 21 and two handles 22.
  • the metal clamping edges 23 provided at the end on the clamping bracket 21 are pressed together by the clamping bracket 21 and act on both sides of the solder connections 6 of the components 4, 5, so that they are in mechanical and thermal contact with the solder connections.
  • a protective sheath 24 is arranged between the clamping edges 23 and envelops the components in the assembled position of the clamp 20 with the components 4, 5.
  • the protective cover 24 consists of the thermally insulating film 15 described above, the outer wall 10 of which is provided with a metallic coating 11; the metallic outer wall 11 is thermally bonded to the clamping edges 23, so that heat which is introduced in the area of the solder connections 6 can be dissipated via the clamping edges 23 to the outer wall 11 of the protective sleeve 24.
  • the protective sleeve 24 protects the components 4, 5 during the soldering process against the penetration of heat radiation, and on the other hand the clamping edges 23 conduct the heat of soldering introduced at the solder connections 6 to the protective sleeve 24 and the handles 22 and thus prevent the components 4, 5 from being damaged in their interior by the strong heat.
  • the clamp 20 is preferably solid and made of a metallic material.
  • the metallic outer wall 11 can consist of a thick metal foil, so that the protective cover 24 also has a high thermal mass.
  • a particularly effective cooling of the components 4, 5 can be achieved if the cavity 18 is arranged inside the protective cover 24 with a cooled additional material 25 (indicated by hatching in FIG. 2) before the clip is attached.
  • the protective device 8,8' can also be coupled to the housing of the component 4,5.
  • the protective cover for optoelectronic components has been described; however, the protective cover can generally also be used for any temperature-sensitive electrical and electronic components.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Les composants électroniques et électriques (4, 5) sensibles à la température, qui sont connectés par brasage à une platine (1) au cours du montage, doivent être protégés de la chaleur lors du brasage, afin d'éviter d'endommager de façon permanente les composants (4, 5). Selon la présente invention, les connexions soudées (6) du composant (4, 5) sont couplées thermiquement à un dispositif de protection (8) lors du processus de brasage, de façon qu'une partie de la chaleur induite dans les connexions soudées (6) lors du processus de brasage est transmise au dispositif de protection (8). Ce dispositif de protection (8) comprend une enveloppe de protection (9), qui entoure le composant (4, 5) par sections. Il est avantageux que cette enveloppe de protection (9) soit constituée d'une matière d'isolation thermique et qu'elle comprenne par sections un revêtement (11) présentant un haut pouvoir de réflexion thermique, sur sa paroi extérieure (10) opposée au composant (4, 5).
EP02718111A 2001-03-13 2002-02-08 Procede et dispositif de protection permettant de monter un composant electronique sensible a la temperature Withdrawn EP1369004A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10112355 2001-03-13
DE10112355A DE10112355C1 (de) 2001-03-13 2001-03-13 Verfahren und Schutzvorrichtung zur Montage eines temperaturempfindlichen elektronischen Bauteils
PCT/EP2002/001325 WO2002074028A1 (fr) 2001-03-13 2002-02-08 Procede et dispositif de protection permettant de monter un composant electronique sensible a la temperature

Publications (1)

Publication Number Publication Date
EP1369004A1 true EP1369004A1 (fr) 2003-12-10

Family

ID=7677490

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02718111A Withdrawn EP1369004A1 (fr) 2001-03-13 2002-02-08 Procede et dispositif de protection permettant de monter un composant electronique sensible a la temperature

Country Status (5)

Country Link
US (1) US7134592B2 (fr)
EP (1) EP1369004A1 (fr)
JP (1) JP2004523916A (fr)
DE (1) DE10112355C1 (fr)
WO (1) WO2002074028A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2412790B (en) * 2004-04-02 2007-12-05 Univ City Hong Kong Process for assembly of electronic devices
JP2006173282A (ja) * 2004-12-14 2006-06-29 Denso Corp 電子部品のはんだ付け方法及びその装置
EP2465896A1 (fr) 2010-12-14 2012-06-20 LANXESS Deutschland GmbH Compositions de polyester
TWI442853B (zh) 2011-10-31 2014-06-21 Ibm 在一熱製程中保護一熱敏感元件的方法及保護裝置
US9317643B2 (en) 2014-05-22 2016-04-19 International Business Machines Corporation Technology for temperature sensitive components in thermal processing
FR3058005B1 (fr) * 2016-10-21 2018-10-26 Sagemcom Broadband Sas Bobine destinee a enrouler un troncon de cable de type cable de fibre optique
JP2020087941A (ja) * 2018-11-14 2020-06-04 トヨタ自動車株式会社 回路基板の製造方法及び回路基板

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US3031738A (en) * 1959-05-08 1962-05-01 Navigation Computer Corp Method for mounting electrical apparatus
US3723943A (en) * 1971-02-10 1973-03-27 Western Electric Co Methods of securing flat integrated circuits to printed wiring boards and a support device therefor
DE2129918B2 (de) * 1971-06-16 1976-01-29 Siemens AG, 1000 Berlin und 8000 München Schutzvorrichtung fuer elektrische bauteile
JPS4851254A (fr) 1971-10-28 1973-07-18
GB1330716A (en) * 1972-08-18 1973-09-19 Gen Electric Co Ltd Electronic components
JPS5583291A (en) * 1978-12-20 1980-06-23 Alps Electric Co Ltd Method of mounting electronic part
US4216051A (en) * 1979-07-11 1980-08-05 Bell Telephone Laboratories, Incorporated Apparatus for making bondable finger contacts
JPS6355577U (fr) 1986-09-29 1988-04-14
JPH02155109A (ja) * 1988-12-06 1990-06-14 Toshiba Corp 回路基板装置
JPH0336796A (ja) 1989-07-04 1991-02-18 Ibiden Co Ltd 表面実装部品用シールドプリント配線板
US5008776A (en) * 1990-06-06 1991-04-16 Sgs-Thomson Microelectronics, Inc. Zero power IC module
US6021046A (en) * 1993-06-09 2000-02-01 Dallas Semiconductor Corporation Thermal protection of electrical elements systems
US5644475A (en) * 1994-09-30 1997-07-01 Allen-Bradley Company, Inc. Solder mask for a finger connector on a single in-line package module
AU695731B2 (en) * 1995-06-21 1998-08-20 Illinois Tool Works Inc. Infrared shield for capacitors
DE19607726A1 (de) * 1996-02-29 1997-09-04 Vacuumschmelze Gmbh Verfahren zur Vermeidung von Schäden beim Löten oberflächenmontierbarer Bauelemente (SMD's)
DE19618227A1 (de) * 1996-05-07 1997-11-13 Herbert Streckfus Gmbh Verfahren und Vorrichtung zum Verlöten von elektronischen Bauelementen auf einer Leiterplatte
JPH10135589A (ja) * 1996-10-31 1998-05-22 Nec Kansai Ltd プリント基板、その製法及びプリント基板への挿入型電子部品のはんだ付け方法
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Also Published As

Publication number Publication date
DE10112355C1 (de) 2002-06-13
JP2004523916A (ja) 2004-08-05
US7134592B2 (en) 2006-11-14
WO2002074028A1 (fr) 2002-09-19
US20040124233A1 (en) 2004-07-01

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