EP1369004A1

EP1369004A1 - Method and protective device for mounting a temperature-sensitive electronic component

Info

Publication number: EP1369004A1
Application number: EP02718111A
Authority: EP
Inventors: Ulrich Ensslin; Norbert Niemczyk
Original assignee: DaimlerChrysler AG
Current assignee: Mercedes Benz Group AG
Priority date: 2001-03-13
Filing date: 2002-02-08
Publication date: 2003-12-10
Also published as: WO2002074028A1; US7134592B2; JP2004523916A; US20040124233A1; DE10112355C1

Abstract

Temperature-sensitive electrical and electronic components (4, 5), which are connected, during mounting, to a printed circuit board (1) by means of soldering, have to be protected from heat during soldering in order to prevent permanent damages to the components (4, 5). According to the invention, the soldered connections (6) of the component (4, 5) are thermally coupled to a protective device (8) during the soldering process whereby transferring a portion of the heat that is introduced into the soldered connections (6) during the soldering process. The protective device (8) additionally comprises a protective enclosure (9) that encloses the component (4, 5) at least in sections. The protective enclosure (9) is advantageously comprised of a thermally insulating material and its outer wall (10) facing away from the component (4, 5) is provided in sections with a coating (11) that has a high thermal reflecting power.

Description

Method and protective device for mounting a temperature-sensitive electronic component

The invention relates to a method for assembling a temperature-sensitive electronic component according to the preamble of claim 1 and a protective device according to the preamble of claim 3.

Many electronic and electrical assemblies and components include temperature-sensitive electrical and / or electronic components, such as heat-sensitive integrated circuits, lithium batteries, oscillator crystals, optoelectronic components. In the course of the assembly of such an assembly, the electrical contacts provided on the components must be reliably connected to conductor tracks on a circuit board and / or to electrical contacts of other components. This assembly is often carried out using a soldering process in which the solder connections provided on the component are soldered to the circuit board. For each component there is a safe area for the soldering time and temperature in which good soldered connections can be made. At the same time, the temperature-sensitive electrical and electronic components must not be heated too much to avoid permanent damage. Thus, when soldering heat-sensitive components, there are contradictory requirements, on the one hand to ensure a sufficiently high soldering temperature for soldering in the area of the solder connections, and on the other hand to keep the temperature sufficiently low in the temperature-sensitive areas of the components that no damage to the components occurs. In order to avoid excessive heating of temperature-sensitive components during the soldering of SMD applications, US Pat. No. 5,913,552 proposes to provide the components in question with a cover which is placed over the components to be soldered from above. This cover forms a heat shield against heat radiation, which acts on the side of the components facing away from the circuit board during infrared soldering or vapor phase soldering. - However, such a cover is only suitable for use in SMD applications in which the solder connections of the components are connected to the component-facing side of the circuit board using a reflow soldering process. If, however, the solder connections of the components are to be passed through openings in the circuit board and (for example by immersion or wave soldering) are to be soldered to conductor tracks on the side facing away from the component, a cover known from US Pat. since the heat in this case mainly affects the component on the circuit board side.

DE 196 07 726 AI shows a component for surface mounting on a printed circuit board, which is to be protected by a reflective metal foil attached to the component against excessive heating by the heat rays acting during the soldering. Although this metal foil also protects the component against the heat radiation which acts on the component from the side facing away from the circuit board, it does not offer any protection against the heat radiation acting on the component on the circuit board side.

Furthermore, a printed circuit board is known from JP 030 36796 A, the upper and lower layers of which are metallized; this is to achieve improved heat dissipation from the components inserted into the printed circuit board via connecting pins to the printed circuit board. However, this metallization means that no thermal protection of the components can be achieved during high-temperature dip soldering. For solder protection of a component projecting through the circuit board, in particular an adjustable capacitor, it is known from the generic DE-OS 29 49 914 to cover the region of the component projecting through the circuit board with a cap; to protect capacitors, which should be accessible through an opening in the circuit board after soldering, it is further proposed to protect this opening during the soldering by a protective plate which is removed after the soldering. Such a protective plate can protect the capacitor against heat and solder vapor acting on the underside of the circuit board, which could damage the capacitor in the event of an uncovered opening; however, the plate does not offer any protection against the heat, which is exerted on the component by the heat of the soldering furnace or the solder bath from all sides. Such a protective plate can therefore only offer insufficient protection for particularly temperature-sensitive components.

The invention is therefore based on the object of providing a method and a protective device by means of which a temperature-sensitive component can be protected particularly effectively against heat during the soldering.

The object is achieved by the features of claims 1 and 3.

The component is then provided with a protective cover with a removable protective device during the soldering process, which surrounds the component in sections and protects against the environmental influences during the soldering process. The protective device is thermally coupled to the component and thus has the effect that the heat introduced into the component from the solder bath during soldering is (at least partially) dissipated to the protective device. As a result, the heating of the interior of the component during soldering and the risk of functional damage to the component can be considerably reduced. The protective device is advantageously coupled to the solder connections of the component, so that the heat introduced into the solder connections from the solder bath is not completely passed on to the component, but instead is partially dissipated via the protective device (see claim 2).

The protective cover expediently has a thermally insulating material on its inner wall facing the component and is provided at least in sections with a coating with high thermal conductivity on its outer wall facing away from the component (see claim 6). The coating of the outer wall with high thermal conductivity ensures that heat radiation, which acts on the component from the outside, is distributed along the outer wall of the protective cover, reflected and thus prevented from the component. The thermally insulating material from which the inner wall of the protective cover facing the component is made means that any heat introduced into the reflective outer wall is preferably radiated outward and only to a small extent in the direction of the component. In this context, "thermally insulating" means a material with low thermal conductivity, such as polyester, polyethylene, polyamide, etc.

In order to achieve a particularly good protective effect of the component against the heat during soldering, the thermally conductive outer wall of the protective sleeve is thermally coupled to the component, preferably to the solder connections of the component. As a result, part of the heat that is introduced into the solder connections from the hot solder bath during the soldering process is passed on to the outer wall of the protective sheath and from there is radiated into the surroundings. This leads to a particularly quick dissipation of the soldering heat and thus a particularly effective protection of the temperature-sensitive component.

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Figures la and 1b: sectional views of an electrical component with a protective device designed as a bladder;

Fig. Lc: the manufacture of the bladder from a piece of film;

2 shows a sectional view of the electrical component with a protective device designed as an elastic clip.

Figures la and lb show schematic sectional views of a circuit board 1, on the back 2 a printed circuit 3 is provided. This circuit board 1 is to be equipped with an optoelectronic emitter 4 and an optoelectronic receiver 5. For this purpose, the components 4, 5 have solder connections 6, which are pushed through openings 7 in the circuit board 1 and are soldered to the printed circuit 3 on the side 2 of the circuit board 1 facing away from the components 4, 5.

Many optoelectronic components 4, 5 are temperature sensitive and are damaged if they overheat too much. In particular, the emitter 4 must not be exposed to excessive temperatures, since otherwise its radiation characteristic changes. With temperature effects of> 100 degrees, the emitter 4 noticeably loses optical performance and suffers permanent damage, since the transmission properties of the synthetic resin contained in the emitter deteriorate considerably at these elevated temperatures.

On the other hand, in order to achieve a good soldering result, the components 4, 5 must be exposed to elevated temperatures over long periods during the soldering: for example, during wave soldering, the component 4, 5 which is plugged onto the circuit board 1 is first slowly warmed up to about 100 degrees. This is followed by the actual soldering, which typically takes place at around 260 degrees and lasts for at least 5 seconds, followed by the solidification phase, during which the component slowly cools down. When using DJ co DJ er co Φ 03 1 DJ <£> co 03 3 CΛ D Ω rt 03 03 co tö co L rt Hl rt P- α φ tc

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An alternative embodiment of the protective device 8 'according to the invention is shown in FIG. 2: The protective device 8' is here formed by an elastic clip 20 which has an elastic clamping bracket 21 and two handles 22. The metal clamping edges 23 provided at the end on the clamping bracket 21 are pressed together by the clamping bracket 21 and act on both sides of the solder connections 6 of the components 4, 5, so that they are in mechanical and thermal contact with the solder connections. A protective sheath 24 is arranged between the clamping edges 23 and envelops the components in the assembled position of the clamp 20 with the components 4, 5. The protective cover 24 consists of the thermally insulating film 15 described above, the outer wall 10 of which is provided with a metallic coating 11; the metallic outer wall 11 is thermally bonded to the clamping edges 23, so that heat which is introduced in the area of the solder connections 6 can be dissipated via the clamping edges 23 to the outer wall 11 of the protective sleeve 24. If the clip 20 is placed on the components 4, 5 before the soldering process begins, the protective sleeve 24 protects the components 4, 5 during the soldering process against the penetration of heat radiation, and on the other hand the clamping edges 23 conduct the heat of soldering introduced at the solder connections 6 to the protective sleeve 24 and the handles 22 and thus prevent the components 4, 5 from being damaged in their interior by the strong heat.

In order to ensure good heat dissipation, the clamp 20 is preferably solid and made of a metallic material. Alternatively or additionally, the metallic outer wall 11 can consist of a thick metal foil, so that the protective cover 24 also has a high thermal mass.

A particularly effective cooling of the components 4, 5 can be achieved if the cavity 18 is arranged inside the protective cover 24 with a cooled additional material 25 (indicated by hatching in FIG. 2) before the clip is attached. In addition to the coupling of the protective device 8,8 'shown in the figures to the solder connections 6 of the component 4,5, the protective device 8,8' can also be coupled to the housing of the component 4,5.

In the exemplary embodiments described so far, the effect of the protective cover for optoelectronic components has been described; however, the protective cover can generally also be used for any temperature-sensitive electrical and electronic components.

.oOo.

Claims

claims

1. Method for mounting a temperature-sensitive electronic component on a circuit board,

the circuit board has openings for carrying out solder connections provided on the component,

a removable protective device is provided which protects the component during assembly,

- In the course of this assembly, the component is first brought so close to the board that the solder connections protrude through the openings in the board,

- The solder connections are then connected using a soldering process to a conductor track provided on the side of the circuit board facing away from the component

- and finally, after the soldering process has ended, the protective device is removed, that is to say, as a result of the soldering process,

- That the component (4,5) is thermally coupled to the protective device (8,8 ') during the soldering process, so that part of the heat introduced into the soldering connections (6) during the soldering process to the protective device (8,8') is forwarded.

2. The method according to claim 1, so that the protective device (8, 8 ') is thermally coupled to the solder connections (6) of the component (4, 5) during the soldering process.

3. The method according to claim 1 or 2, characterized in that the solder connections (6) of the component (4, 5) are connected to the circuit board (1) by means of wave soldering.

4.Protection device for a temperature-sensitive electronic component, in particular an optoelectronic component, for use during an assembly process in which the solder connections provided on the component are connected to a conductor track provided on the side of a circuit board facing away from the component, that is to say,

- that the protective device (8,8 ') can be removed from the component (4,5),

- That the protective device (8,8 ') is a protective cover

(9,15,24), which partially surrounds the component (4,5),

- And that the protective device (8,8 ') can be thermally coupled to the component (4,5).

5. Protection device according to claim 4, so that the protection device (8, 8 ') can be thermally coupled to the solder connections (6) of the component (4, 5).

6. Protection device according to claim 4 or 5, characterized in that the protective cover (9, 15, 24) is thermally insulating in the region of its inner wall (16) facing the component and at least on its outer wall (10) facing away from the component (4, 5) sectionally has a coating (11) with high thermal conductivity.

7. Protection device according to one of claims 4 to 6, characterized in that the protection device (8) is formed by a closed bladder (9), through the wall (12) of which the solder connections (6) protrude. Protective device according to one of Claims 4 to 6, characterized in that the protective device (8 ') comprises an elastic clip (20) connected to the protective sheath (24), by means of which, in the assembled position of the protective device (8') with the component (4, 5 ) the protective sheath (24) can be fixed and thermally coupled to the component (4, 5), in particular to the solder connections (6).

oöo,