EP1365289A4 - Precursor-zusammensetzung für photopositivharz und damit hergestelltes display - Google Patents

Precursor-zusammensetzung für photopositivharz und damit hergestelltes display

Info

Publication number
EP1365289A4
EP1365289A4 EP02700653A EP02700653A EP1365289A4 EP 1365289 A4 EP1365289 A4 EP 1365289A4 EP 02700653 A EP02700653 A EP 02700653A EP 02700653 A EP02700653 A EP 02700653A EP 1365289 A4 EP1365289 A4 EP 1365289A4
Authority
EP
European Patent Office
Prior art keywords
same
photosensitive resin
precursor composition
positive photosensitive
display made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP02700653A
Other languages
English (en)
French (fr)
Other versions
EP1365289B1 (de
EP1365289A1 (de
Inventor
Mitsuhito Suwa
Kazuto Miyoshi
Masao Tomikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of EP1365289A1 publication Critical patent/EP1365289A1/de
Publication of EP1365289A4 publication Critical patent/EP1365289A4/de
Application granted granted Critical
Publication of EP1365289B1 publication Critical patent/EP1365289B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/107—Polyamide or polyurethane
EP02700653.5A 2001-02-26 2002-02-21 Precursor-zusammensetzung für photopositivharz und damit hergestelltes display Expired - Lifetime EP1365289B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001004951 2001-02-26
JP2001049951 2001-02-26
PCT/JP2002/001517 WO2002069041A1 (fr) 2001-02-26 2002-02-21 Composition precurseur de resine photosensible positive et affichage fabrique au moyen de cette composition

Publications (3)

Publication Number Publication Date
EP1365289A1 EP1365289A1 (de) 2003-11-26
EP1365289A4 true EP1365289A4 (de) 2006-09-27
EP1365289B1 EP1365289B1 (de) 2016-04-20

Family

ID=18910985

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02700653.5A Expired - Lifetime EP1365289B1 (de) 2001-02-26 2002-02-21 Precursor-zusammensetzung für photopositivharz und damit hergestelltes display

Country Status (6)

Country Link
US (1) US6933087B2 (de)
EP (1) EP1365289B1 (de)
KR (1) KR100840472B1 (de)
CN (3) CN100362429C (de)
TW (1) TW574620B (de)
WO (1) WO2002069041A1 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4665333B2 (ja) * 2000-11-27 2011-04-06 東レ株式会社 ポジ型感光性樹脂前駆体組成物
KR100905682B1 (ko) * 2001-09-26 2009-07-03 닛산 가가쿠 고교 가부시키 가이샤 포지티브형 감광성 폴리이미드 수지 조성물
TWI360565B (en) * 2003-07-09 2012-03-21 Toray Industries Photosensitive resin precursor composition
JP4244309B2 (ja) * 2003-09-12 2009-03-25 富士フイルム株式会社 平版印刷版原版
JP4207960B2 (ja) * 2004-01-14 2009-01-14 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、パターンの製造法及び電子部品
US7416822B2 (en) * 2004-01-20 2008-08-26 Asahi Kasei Emd Corporation Resin and resin composition
US7638254B2 (en) * 2004-05-07 2009-12-29 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin composition, method for forming pattern, and electronic part
EP1744213B1 (de) * 2004-05-07 2014-09-03 Hitachi Chemical DuPont Microsystems Ltd. Positiv-lichtempfindliche harzzusammensetzung, verfahren zur strukturerzeugung und elektronische komponente
EP1662319A3 (de) * 2004-11-24 2009-05-27 Toray Industries, Inc. Lichtempfindliche Harzzusammensetzung
JP2006206756A (ja) * 2005-01-28 2006-08-10 Sony Chem Corp ポリイミド化合物及びフレキシブル配線板
KR100787352B1 (ko) * 2005-02-23 2007-12-18 주식회사 하이닉스반도체 하드마스크용 조성물 및 이를 이용한 반도체 소자의 패턴형성 방법
KR100981830B1 (ko) * 2005-09-22 2010-09-13 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 네거티브형 감광성 수지 조성물, 패턴 형성방법 및전자부품
CN101331625B (zh) * 2005-10-28 2016-03-09 日产化学工业株式会社 用于喷雾或喷墨涂覆的电荷传输性清漆
WO2007148384A1 (ja) * 2006-06-20 2007-12-27 Hitachi Chemical Dupont Microsystems Ltd. ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品
KR100833706B1 (ko) * 2007-02-01 2008-05-29 삼성전자주식회사 감광성 폴리이미드 조성물, 폴리이미드 필름 및 이를 이용한 반도체 소자
KR20090128385A (ko) 2007-02-13 2009-12-15 도레이 카부시키가이샤 포지티브형 감광성 수지 조성물
EP2133743B1 (de) * 2007-03-12 2018-01-24 Hitachi Chemical DuPont Microsystems, Ltd. Lichtempfindliche harzzusammensetzung, prozess zur herstellung eines strukturierten gehärteten films unter deren verwendung und elektronisches bauteil
ATE547743T1 (de) * 2007-03-14 2012-03-15 Fujifilm Corp Lichtempfindliche zusammensetzung und herstellungsverfahren für ein gehärtetes reliefmuster
JP5316417B2 (ja) * 2007-10-29 2013-10-16 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
KR100914064B1 (ko) * 2008-03-19 2009-08-28 제일모직주식회사 포지티브형 감광성 수지 조성물
CN102047181B (zh) * 2008-05-29 2013-01-23 旭化成电子材料株式会社 感光性树脂组合物
KR101632965B1 (ko) * 2008-12-29 2016-06-24 삼성디스플레이 주식회사 포토레지스트 조성물 및 박막 트랜지스터 기판의 제조 방법
CN101770169B (zh) * 2008-12-30 2012-03-21 乐凯集团第二胶片厂 一种高分辨力高感光度的阳图平印版感光组合物
US8257901B2 (en) 2009-03-10 2012-09-04 Lg Chem, Ltd. Polyimide-based polymers, copolymers thereof and positive type photoresist compositions comprising the same
KR101186675B1 (ko) * 2010-01-22 2012-09-27 금호석유화학 주식회사 포지티브형 감광성 조성물
KR20120066923A (ko) 2010-12-15 2012-06-25 제일모직주식회사 신규 페놀 화합물 및 이를 포함하는 포지티브형 감광성 수지 조성물
KR101423539B1 (ko) 2010-12-20 2014-07-25 삼성전자 주식회사 포지티브형 감광성 수지 조성물
WO2013077364A1 (ja) * 2011-11-25 2013-05-30 日産化学工業株式会社 ディスプレイ基板用樹脂組成物
CN108475016B (zh) * 2016-01-20 2021-09-10 日产化学工业株式会社 正型感光性树脂组合物
CN107793565B (zh) * 2017-11-03 2020-11-17 杭州超通科技有限公司 一种光敏聚酰亚胺及其制备方法
CN113467187B (zh) 2021-07-27 2022-05-10 吉林奥来德光电材料股份有限公司 树脂组合物、树脂膜及显示器件
KR20230020836A (ko) * 2021-08-04 2023-02-13 주식회사 동진쎄미켐 감광성 수지 조성물 및 이를 포함하는 표시 장치
CN114316263B (zh) * 2022-01-17 2023-02-03 深圳职业技术学院 交联型聚酰胺酸酯、其制备方法、包含其的聚酰亚胺组合物及聚酰亚胺树脂膜的制备方法
KR20240015965A (ko) * 2022-07-28 2024-02-06 주식회사 동진쎄미켐 경화막, 이를 형성하는 감광성 수지 조성물 및 표시장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0134753B1 (ko) * 1993-02-26 1998-04-18 사토 후미오 폴리아미드산 조성물
US6103443A (en) * 1997-11-21 2000-08-15 Clariant Finance Lmited Photoresist composition containing a novel polymer
JP3514167B2 (ja) * 1998-05-14 2004-03-31 東レ株式会社 感光性耐熱性樹脂前駆体組成物
EP1037112B1 (de) * 1998-09-09 2004-11-24 Toray Industries, Inc. Vorläufer einer photoempfindlichen harzzusammensetzung und verfahren zu dessen herstellung
JP2000221677A (ja) * 1999-02-02 2000-08-11 Hitachi Ltd ポジ型感光性樹脂組成物およびポジ型感光性樹脂のパターン形成法
JP3641963B2 (ja) * 1999-02-15 2005-04-27 双葉電子工業株式会社 有機ｅｌ素子とその製造方法
JP4154086B2 (ja) * 1999-07-29 2008-09-24 日立化成工業株式会社 感光性重合体組成物、パターンの製造法及び電子部品
KR100766648B1 (ko) * 2000-10-31 2007-10-15 인텔 코포레이션 포지티브형 감광성 수지 조성물，포지티브형 감광성 수지조성물의 제조방법 및 반도체장치
JP4665333B2 (ja) * 2000-11-27 2011-04-06 東レ株式会社 ポジ型感光性樹脂前駆体組成物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *

Also Published As

Publication number Publication date
CN100362429C (zh) 2008-01-16
KR100840472B1 (ko) 2008-06-20
WO2002069041A1 (fr) 2002-09-06
US6933087B2 (en) 2005-08-23
EP1365289B1 (de) 2016-04-20
CN101017327A (zh) 2007-08-15
US20030194631A1 (en) 2003-10-16
CN1457454A (zh) 2003-11-19
CN101017328A (zh) 2007-08-15
KR20030053471A (ko) 2003-06-28
EP1365289A1 (de) 2003-11-26
CN101017327B (zh) 2010-09-29
CN101017328B (zh) 2011-12-14
TW574620B (en) 2004-02-01

Similar Documents

Publication Publication Date Title
EP1365289A4 (de) Precursor-zusammensetzung für photopositivharz und damit hergestelltes display
TWI340606B (en) Polymer compound and polymer luminous element using the same
HK1057263A1 (en) Chronograph with two rotational directions
AU2003289187A1 (en) Perfluoroallyloxy compound and liquid-crystal composition containing the compound
AU2003281404A1 (en) Photosensitive resin composition and photosensitive element using the same
EP1751620A4 (de) Lichtempfindliche harzzusammensetzung und lcd damit
SG110036A1 (en) Propylene-based resin composition and film made of the same
AU2002220208A8 (en) Gear assembly with alignment feature and level sensor employing the same
GB0129728D0 (en) Plymeric film
EP1434091A4 (de) Positive strahlungsempfindliche harzzusammensetzung mit chemischer verstärkung
SG93928A1 (en) Electroconductive resin composition
GB0118796D0 (en) Copolyester film
HK1052058A1 (en) Jumper structure and timepiece having the same
EP1484621A4 (de) Harzzusammensetzung zur benutzung in optischen elementen, optisches element und projektionsschirm
SG110037A1 (en) Propylene-based resin composition and film made of the same
AU2003213432A1 (en) Photosensitive resin composition and use thereof
GB2395485B (en) Resin composition
GB2380226B (en) Resin bracket and opening/shutting mechanism using the same
AU2001260720A1 (en) Photosensitive resin composition and photosensitive material using the same
AU6066401A (en) Photosensitive resin composition and photosensitive material using the same
AU2001264383A1 (en) The light-diffusing film and composition for the same
HK1056613A1 (en) Hand and timepiece using the hand
GB0129547D0 (en) Film
AU2002244930A1 (en) Adhesive resin composition and multilayer structure made with the same
PL112565U1 (en) Phial with closure

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

17P Request for examination filed

Effective date: 20021115

A4 Supplementary search report drawn up and despatched

Effective date: 20060829

17Q First examination report despatched

Effective date: 20111212

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20151106

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 793073

Country of ref document: AT

Kind code of ref document: T

Effective date: 20160515

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 60247980

Country of ref document: DE

REG Reference to a national code

Ref country code: SE

Ref legal event code: TRGR

REG Reference to a national code

Ref country code: NL

Ref legal event code: FP

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 793073

Country of ref document: AT

Kind code of ref document: T

Effective date: 20160420

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160822

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160420

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160420

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160721

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160420

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 60247980

Country of ref document: DE

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 16

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160420

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20170123

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160420

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170221

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 17

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170221

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 20180213

Year of fee payment: 17

REG Reference to a national code

Ref country code: SE

Ref legal event code: EUG

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160420

Ref country code: SE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190222

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160420

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20210113

Year of fee payment: 20

Ref country code: FI

Payment date: 20210209

Year of fee payment: 20

Ref country code: CH

Payment date: 20210217

Year of fee payment: 20

Ref country code: FR

Payment date: 20210113

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20210209

Year of fee payment: 20

Ref country code: GB

Payment date: 20210210

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20210112

Year of fee payment: 20

REG Reference to a national code

Ref country code: DE

Ref legal event code: R071

Ref document number: 60247980

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: MK

Effective date: 20220220

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: GB

Ref legal event code: PE20

Expiry date: 20220220

REG Reference to a national code

Ref country code: FI

Ref legal event code: MAE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

Effective date: 20220220