EP1318371A2 - Wärmeübertragungsfläche mit einer aufgalvanisierten Mikrostruktur von Vorsprüngen - Google Patents
Wärmeübertragungsfläche mit einer aufgalvanisierten Mikrostruktur von Vorsprüngen Download PDFInfo
- Publication number
- EP1318371A2 EP1318371A2 EP02027031A EP02027031A EP1318371A2 EP 1318371 A2 EP1318371 A2 EP 1318371A2 EP 02027031 A EP02027031 A EP 02027031A EP 02027031 A EP02027031 A EP 02027031A EP 1318371 A2 EP1318371 A2 EP 1318371A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat transfer
- pin
- transfer surface
- shaped projections
- projections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
- F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/124—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and being formed of pins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S165/00—Heat exchange
- Y10S165/905—Materials of manufacture
Definitions
- the invention relates to a heat transfer surface on rohroder plate-shaped bodies with one from the base outstanding microstructure of protrusions with a Minimum height of 10 microns are galvanized to the base area as well a method for producing such heat transfer surfaces.
- the temperature difference T - T ⁇ can thus be considered minimum required overheating of the boiling liquid in the present bubble size are interpreted with the radius r. she can be reduced by that bubbles of large dimensions - So with large r - are generated by appropriate intervention. there the heating heat transfer surface is a central Meaning too. A favorable design of this Heat transfer surface can increase the efficiency of heat transfer significantly increase boiling. What is desired is a Heat transfer surface with a microstructure, which at a lowest possible temperature difference to the highest possible Bubble density with large bubble radius leads. this is a Prerequisite for efficient transfer of heat from the Heat transfer surface to the fluid.
- microstructures with cavities suitable which after the tearing off of the bubbles by the be flooded surrounding liquid.
- the in the cavities formed vapor bubbles expand during the growth phase into the fluid adjacent to the heat transfer surface and rupture when a systemic critical size is exceeded by this Heat transfer surface in the way that steam residues in the Remain cavities and serve as germs for subsequent bubbles.
- This complex task will be in terms of Heat transfer surface in conjunction with the above mentioned generic term solved in that the base completely or partially covered with projections that these projections in Form of ordered microstructures are applied and a Pin shape, which with its longitudinal axis either perpendicular or at an angle between 30 ° and 90 ° to Base area extends.
- These features will be the first time a Heat transfer surface created in the microstructure area, whose projections are pin-shaped and with their Longitudinal axis extend perpendicular or transverse to the base.
- the cavities which are completely open both to the outside and between the individual pin-shaped projections, can ensure excellent film condensation, the film always being able to flow away unimpeded in all directions. This can ensure excellent thermal efficiency as well as unusually large heat transfer of these heat transfer surfaces designed in this way.
- the heat transfer surface according to the invention also allows to vary the surface density and the thickness of the pin-shaped projections depending on the viscosity of the impinging fluid, namely between 10 2 / cm 2 and 10 8 / cm 2 at a thickness between 100 .mu.m and 0.2 .mu.m , The large porosity of this microstructure favors the nucleate boiling decisively the heat transfer process.
- the length of the pen shape may vary depending on the size and specific Function of the heat transfer surface between 10 ⁇ m and 195 ⁇ m lie.
- the external configuration of the pen shape is added one and the same heat transfer surface designed the same.
- the Thickness of the pin shape can be between 0.2 .mu.m and 100 .mu.m.
- This clear width can be between the pin-shaped projections depending on the desired Heat transfer surface and beauf bedem fluid between 0.6 microns and 1000 microns are.
- the pin-shaped Projections in the form of a cylindrical column.
- the pin-shaped projections as a cone or truncated cone.
- the pin-shaped projections of several consist of truncated cone stumps.
- the pin-shaped Projections provided with a cylindrical stand whose free End has a mushroom shape.
- the free End is provided with a spherical or a partial spherical shape.
- the tubular However, body should have at least one interior or Have outer diameter of 2 mm.
- the preparation of the above Heat transfer surfaces is based on a method for Production of a heat transfer surface on tubular or plate-shaped bodies with one over a base area excellent microstructure with a minimum height of 10 microns of galvanized projections, the base with a Plastic film is coated and galvanized, as in the U.S. Patents 4,288,897, 4,129,181, 4,246,057, and 4,219,078 has been described.
- the thickness of the polymer membrane, the distribution and size of the micropores in this membrane in terms of their Areal density as well as the length of the plating process can the above-described pin-shaped projections in their entirety, the ordered microstructure on the base form the heat transfer surface, depending on the requirements of the Heat transfer process in terms of specific Properties of the fluid (viscosity, thermal conductivity, Surface tension) so determine how it is the respective Evaporation or condensation process required.
- too Kernspurfilter called used, wherein the micropores in the Membrane by ion irradiation and by a subsequent Etching process by means of an alkali, for example a NaOH solution, be formed.
- the membrane Upon completion of the plating process, i. to final formation of the desired shape and length of the pin-shaped projections, the membrane is stripped and characterized exposed the entire heat transfer surface.
- a polymer film 1 is first with irradiated fast, heavy ions whose energies up to several MeV / nucleon can be.
- the penetrating ions leave in their sphere of influence a changed structure of the Polymer film, the so-called latent ion track (track).
- These Structure shows increased reactivity alkaline solutions, e.g. a NaOH solution.
- the thus prepared ion track membrane 1 is shown in FIG. 3 and 4 on a heat transfer surface as the base 3a of a tubular or plate-shaped body 4 nationwide or only partially applied.
- the Galvanic deposition takes place first on the entire, from Electrolytes wetted surface instead. After a relatively short Duration of time, which is essentially determined by the roughness of the Ion trail membrane 1 depends, this is galvanic deposition only to those released from the micropores 2 Surface areas 5 limited (see Fig. 3).
- the shape of the resulting pin-shaped projections. 6 the microstructure 7 depends on the shape of the Micropores 2, their mutual arrangement as well as crucial from the duration of the electroplating process.
- a short one Galvanization process leads to pin-shaped projections 6, whose Length L is smaller than the thickness D of the ion track membrane. 1 formed polymer film is, as FIG. 5 shows.
- the tips 6a may reach the surface 1a of the ion track 1 and then have a length L which is the thickness D of the Ion track membrane 1 corresponds; this is shown in FIGS. 9 and 10 in FIG Compound with Fig. 5 shown.
- Fig. 13 illustrates the wrapping of a tubular body 4 with a strip-shaped ion track membrane 1, in which an etching process open micropores 2 are introduced.
- Fig. 14 shows on a plate-shaped body 4 a Microstructure 7 of pin-shaped projections 6, made up of put together a plurality of frustoconical sections 9, which protrude perpendicularly from the base 3a.
- Fig. 14a shows the perspective top view of a plate-shaped body 4, with a microstructure 7 of pin-shaped Projections 6 in a cylindrical shape, perpendicular to the Base 3a protrude.
- This microstructure 7 corresponds to the to FIGS. 9 and 10 described.
- Fig. 14b shows a plate-shaped body 4 with a Microstructure 7 of pin-shaped projections 6, which from the Base surface 3a protrude and to this at an angle ⁇ of 60 ° are inclined.
- the Ionenspurmembran 1 comes depending on Shape and height of the micropores 2 and the duration of the Galvanmaschinesvones a microstructure 7 to the fore, whose pin-shaped projections 6 have a cylindrical shape (for example, as shown in FIG and 9) or a mushroom shape (see Figs. 7 and 11) or a cone shape or a truncated cone shape or one of several have stacked truncated cones 9 of FIG. 14.
- the pin-shaped projections 6 with a hemisphere, a ball or a dome shape be provided.
- the tubular body 4 according to FIG. 13 should have an outer or inner diameter D a , D i of at least 2 mm in order to enable such a microstructure 7.
- the thickness d (see FIG. 9) of the pin-shaped projections 6 depends essentially on the width w (see FIG. 1) of the micropores 2. It is deliberately not of diameters, but of "thickness" and “width” spoken, because a diameter always means a circular diameter, which is only partially the case in the present case due to the roughness of the pin-shaped projections 6 on its outer surface 6b. Also, the micropores 2, contrary to the graphic representation by no means on a circular shape.
- the length L of the projections 6 Since the length L of the projections 6 the same Electroplating process and thus the same galvanization time are subjected, they are on one and the same base 3a in FIG essentially constant. In this case, the length L of the pin-shaped Projections 6 depending on the size and specific function of Heat transfer surface 3 are between 10 microns and 195 microns.
- the thickness d can be between 100 ⁇ m and 0.2 ⁇ m, whereby a number of pin-shaped projections 6 of 10 2 / cm 2 to 10 8 / cm 2 can be formed correspondingly per unit area. It is also essential to the invention that the pin-shaped projections 6 extend with their longitudinal axis 6c (see FIGS. 7 and 9) approximately perpendicularly or at an angle between 30 ° and 90 ° to the base surface 3a.
- width W of the micropores 2 is the inside width W between the pin-shaped projections 6 according to FIGS. 1 and 7 differ. This clear width W is depending on the desired Heat transfer surface 3 between 0.6 microns and 1000 microns.
- the thickness D the ion track membrane 1, the width w of the micropores 2 and the Clear distance W between the micropores 2 and thus the pin-shaped projections 6 is formed with a microstructure.
- 7 provided heat transfer surface 3, in particular in Processes of phase transformation as heat transfer surface 3 recommends. It should be noted that the original Base 3a by the addition of the surface of the pin-shaped Projections 6 significantly increased. For this reason is under the heat transfer surface 3 is not the base 3a of rohroder plate-shaped body 4 understood, but the entire Heat transfer surface, that is including the Overall surface of the microstructure 7.
- the tubular body 4 is flowed through, for example, on its inner side 10 by a hot fluid which cools from the beginning A of the body 4 to the end E from an inlet temperature T 0 to an outlet temperature T 1 .
- a bubble germinates in the vicinity of the base surface 3a, which grows steadily with the temperature difference T 0 -T 1 , penetrates the inside width W between two projections 6 and forms a small bubble 12 there.
- phase II this bubble 12 has grown to a medium bubble 13.
- the bladder 14 has a large radius r and tears off a short time later at the point 15. Since a seed 16 always remains between the pin-shaped projections 6, the space between the pin-shaped projections 6 can not be flooded by the liquid. This seed 16 leads to the formation of a new bubble 12 according to the phase I.
- the bubble radius r according to the phase III can be between 2 .mu.m and 10 .mu.m, if, for example, the inside width W between the pin-shaped projections 6 and their length L are formed accordingly ( see also FIGS. 7 and 9).
- FIGS. 17 to 19 show a heat transfer surface 3 pin-shaped projections 6 in stochastic order on a Body 4, the length scale for a distance of 20 microns is displayed. One recognizes clearly the roughness of the pin-shaped projections 6 both at its free end and at its lateral surface 6b.
- FIGS. 18 and 19 show a heat transfer surface 3 pin-shaped projections 6 in stochastic order whose free End having a mushroom mold 8.
- the respective length scale of 50 ⁇ m and 5 ⁇ m are shown in the illustration.
- the projections 6 in the form of ordered Microstructures 7 are applied and have a pin shape, the with its longitudinal axis 6c approximately perpendicular to the base 3a extends (see Fig. 5 to 12). It goes without saying that depending on Formation of the ion track membrane 1, the projections 6 the Cover surface 3a completely or partially.
- Bladder boiling has the effect of FIGS. 17 to 19 apparent porosity of the microstructure 7 crucial to the Heat transfer.
- the application of the above-described manufacturing process allows the number of pin-shaped projections 6 per Area unit and the arrangement of the pin-shaped projections. 6 and thus the porosity of the microstructure 7 by varying the Density of the irradiation ions on the polymer membrane 1 den Conditions of bubble boiling in a stochastic, however orderly manner in accordance with the etch regime to link. As a result, optimal conditions for nucleate boiling can be achieved by the design of the heat transfer surface 3 in Realize micro-area, what with all the cutting, mechanical process is not possible.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Geometry (AREA)
- Electroplating Methods And Accessories (AREA)
- Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
Description
- r =
- den Blasenradius,
- σ =
- die Oberflächenspannung der Flüssigkeit,
- Δh =
- die Verdampfungsenthalpie,
- =
- die Dampfdichte,
- T =
- die Flüssigkeitstemperatur,
- T∞ =
- die Gleichgewichtstemperatur an einer ebenen Phasengrenze.
- Polymerfolie / Ionenspurmembran
- 1
- Oberfläche der Ionenspurmembran 1
- 1a
- Mikroporen
- 2
- gesamte Wärmeübertragungsfläche
- 3
- Grundfläche
- 3a
- rohr- und plattenförmiger Körper
- 4
- Porenoberfläche
- 5
- stiftförmige Vorsprünge
- 6
- Spitzen der Vorsprünge 6
- 6a
- Außenoberfläche der Vorsprünge 6
- 6b
- Längsachse der Vorsprünge 6
- 6c
- Mikrostruktur
- 7
- Pilzform der freien Enden der Vorsprünge 6
- 8
- kegelstumpfförmige Teilabschnitte der Vorsprünge 6
- 9
- Innenseite des rohrförmigen Körpers 4
- 10
- Außenseite des rohrförmigen Körpers 4
- 11
- Blasen unterschiedlicher Größe
- 12, 13, 14
- Stelle für das Abreißen der Blase
- 15
- Keim einer Blase
- 16
- Anfang des rohrförmigen Körpers 4
- A
- Ende des rohrförmigen Körpers 4
- E
- Dicke der Polymerfolie 1
- D
- Dicke der stiftförmigen Vorsprünge 6
- d
- Außen- und Innendurchmesser des rohrförmigen Körpers 4
- Da, Di
- Neigungswinkel der stiftförmigen Vorsprünge 6 zur Grundfläche 3a
- α
- Länge der Vorsprünge 6
- L
- Blasenradius
- r
- Temperaturen
- T, T0, T1, T∞
- Weite der Mikroporen 2
- w
- lichte Weite zwischen den Vorsprüngen 6
- W
Claims (17)
- Wärmeübertragungsfläche auf rohr- oder plattenförmigen Körpern mit einer aus der Grundfläche herausragenden Mikrostruktur von Vorsprüngen, die mit einer Mindesthöhe von 10 µm auf die Grundfläche galvanisiert sind, dadurch gekennzeichnet, daß die Grundfläche (3a) ganz oder teilweise mit Vorsprüngen (6) bedeckt ist, daß diese Vorsprünge (6) in Form von geordneten Mikrostrukturen (7) aufgebracht sind und eine Stiftform aufweisen, die sich mit ihrer Längsachse (6c) entweder senkrecht oder unter einem Winkel (α) zwischen 30° und 90° zur Grundfläche (3a) erstreckt.
- Wärmeübertragungsfläche nach Anspruch 1, dadurch gekennzeichnet, daß die Anzahl der Vorsprünge je Flächeneinheit in Abhängigkeit von der Dicke (d) der stiftförmigen Vorsprünge (6) gestaltet ist und für eine Anzahl von 102/cm2 bis 108/cm2 zwischen 100 µm und 0,2 µm liegt.
- Wärmeübertragungsfläche nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Länge (L) der stiftförmigen Vorsprünge (6) auf ein und derselben Wärmeübertragungsfläche (3) konstant ist.
- Wärmeübertragungsfläche nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die Länge (L) der stiftförmigen Vorsprünge (6) je nach Größe und spezifischer Funktion der Wärmeübertragungsfläche (3) zwischen 10 µm und 195 µm liegt.
- Wärmeübertragungsfläche nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß die Außenkonfiguration der stiftförmigen Vorsprünge (6) bei ein und derselben Wärmeübertragungsfläche (3) gleich ist.
- Wärmeübertragungsfläche nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß die lichte Weite (W) zwischen den stiftförmigen Vorsprüngen (6) bei ein und derselben Wärmeübertragungsfläche (3) regelmäßig ist.
- Wärmeübertragungsfläche nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß die lichte Weite (W) zwischen den stiftförmigen Vorsprüngen (6) je nach gewünschter Wärmeübertragungsfläche (3) zwischen 0,6 µm und 1000 µm liegt.
- Wärmeübertragungsfläche nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß die stiftförmigen Vorsprünge (6) die Form einer zylindrischen Säule aufweisen.
- Wärmeübertragungsfläche nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß die stiftförmigen Vorsprünge (6) als Kegel oder als Kegelstumpf gestaltet sind.
- Wärmeübertragungsfläche nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß die stiftförmigen Vorsprünge (6) mit einer Form von mehreren aufeinandergesetzter Kegelstümpfe (9) versehen sind.
- Wärmeübertragungsfläche nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß die stiftförmigen Vorsprünge (6) mit einem zylindrischen Ständer versehen sind, dessen freies Ende eine Pilzform (8) aufweist.
- Wärmeübertragungsfläche nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß die stiftförmigen Vorsprünge (6) einen zylindrischen Ständer bilden, dessen freies Ende mit einer Kugel- oder Teilkugelform versehen ist.
- Wärmeübertragungsfläche nach einem der Ansprüche 1 bis 12, dadurch gekennzeichnet, daß ein rohrförmiger, mit den stiftförmigen Vorsprüngen (6) versehener Körper (4) einen Außen- oder Innendurchmesser (Da, Di) von mindestens 2 mm aufweist.
- Wärmeübertragungsfläche nach einem der Ansprüche 1 bis 13, dadurch gekennzeichnet, daß die stiftförmigen Vorsprünge (6) aus allen galvanisch abscheidbaren Werkstoffen herstellbar sind.
- Verfahren zur Herstellung einer Wärmeübertragungsfläche auf rohr- oder plattenförmigen Körpern mit einer über eine Grundfläche hervorragenden Mikrostruktur mit einer Mindesthöhe von 10 µm von aufgalvanisierten Vorsprüngen, wobei die Grundfläche mit einer Kunststoffolie belegt und galvanisiert wird nach den Ansprüchen 1 bis 14, dadurch gekennzeichnet, daß eine mit Mikroporen (2) versehene Polymermembran (1) als Kunststoffolie flächendeckend auf die Grundfläche (3a) aufgebracht wird und im anschließenden Galvanisierungsprozeß der die Grundfläche (3a) tragende Körper (4) als eine der Elektroden geschaltet wird und nach Erreichen der gewünschten Länge (L) und Form der sich in den Mikroporen (2) bildenden stiftförmigen Vorsprünge (6) der Galvanisierungsprozeß unterbrochen und sodann die Polymermembran (1) entfernt wird.
- Verfahren nach Anspruch 15, dadurch gekennzeichnet, daß als Polymermembran (1) eine Ionenspurmembran, auch Kernspurfilter genannt, verwendet werden.
- Verfahren nach Anspruch 15 oder 16, dadurch gekennzeichnet, daß die Mikroporen (2) in der Polymermembran (1) durch Ionenbestrahlung sowie in einem anschließenden Ätzprozeß mittels einer Lauge gebildet werden.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10159860 | 2001-12-06 | ||
DE10159860A DE10159860C2 (de) | 2001-12-06 | 2001-12-06 | Wärmeübertragungsfläche mit einer aufgalvanisierten Mikrostruktur von Vorsprüngen |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1318371A2 true EP1318371A2 (de) | 2003-06-11 |
EP1318371A3 EP1318371A3 (de) | 2005-07-13 |
EP1318371B1 EP1318371B1 (de) | 2008-01-16 |
Family
ID=7708207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02027031A Expired - Lifetime EP1318371B1 (de) | 2001-12-06 | 2002-12-03 | Verwendung einer Fläche zur Wärmeübertragung, insbesondere für Verdampfungs- und Kondensationsprozesse von Fluiden |
Country Status (6)
Country | Link |
---|---|
US (1) | US6736204B2 (de) |
EP (1) | EP1318371B1 (de) |
AT (1) | ATE384237T1 (de) |
DE (2) | DE10159860C2 (de) |
ES (1) | ES2300414T3 (de) |
PT (1) | PT1318371E (de) |
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WO2011029918A1 (fr) * | 2009-09-14 | 2011-03-17 | Commissariat à l'énergie atomique et aux énergies alternatives | Dispositif d'echange thermique a ebullition convective et confinee a efficacite amelioree |
WO2011029917A1 (fr) * | 2009-09-14 | 2011-03-17 | Commissariat à l'énergie atomique et aux énergies alternatives | Dispositif d'echange thermique a efficacite amelioree |
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US7743821B2 (en) | 2006-07-26 | 2010-06-29 | General Electric Company | Air cooled heat exchanger with enhanced heat transfer coefficient fins |
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DE202007013730U1 (de) | 2007-10-01 | 2008-07-31 | Hellwig, Udo, Prof. Dr. | Vollstab mit behandelter Oberfläche zur Verwendung von chemischen Reaktionen in einem Reaktor als Katalysator |
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Also Published As
Publication number | Publication date |
---|---|
DE50211546D1 (de) | 2008-03-06 |
EP1318371A3 (de) | 2005-07-13 |
US6736204B2 (en) | 2004-05-18 |
PT1318371E (pt) | 2008-04-22 |
ATE384237T1 (de) | 2008-02-15 |
US20030136547A1 (en) | 2003-07-24 |
EP1318371B1 (de) | 2008-01-16 |
DE10159860A1 (de) | 2003-07-24 |
DE10159860C2 (de) | 2003-12-04 |
ES2300414T3 (es) | 2008-06-16 |
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