4 48 08 4 A7 B7 經濟部智慧財產局員Η消費合作社印製 五、發明説明（f) 本發明係有翮於一種高深寬比（high aspect ratio) 微小結構之製造方法•其高深寬比微小結構係應用 於三次元微小零組件，如徹馬達、微閥、微噴嘴、 微流道等，具發展潛力之微小結構產品者。 按製造高深寬比及精確之微小結構，常使用之技 術有深刻電鑄模造製程（LIGA)，替代性光刻法（LIGA like)及厚 UV 光阻顯影製程（UV photolithography)， 前者（LIGA)係利用同步辐射光源之X光深刻，利用 此製程製造高深寬比及精確微小結構之顯影時，由 於X光照射時之劑童衰減和擴散路徑，使其顯影時 間過久，反而造成光刻結構之劣化，因此，得不到 高深寬比及精確之微小結構，同時，使用UGA製 程須使用龐大且昂貴之同步輻射光源，使其製造成 本増加•至於後者使用替代性光刻法有紫外光微影 (UV photolithography) ’ 反應性離子蝕刻（reactive ion etching, RIE)及準分子雷射微加工（excimer laser micromachining)等，這座取代性光刻法的成本雖違 低於同步輻射X光，钽光刻精度也由X光深刻術的 次微米精度降低到微米左右，且深寬比也相對降低* 使用厚UV光阻顯影製程，雖其製造成本較低，但 其深寬比及精確度均較LIGA差。上述前、後兩者 均因複雜、昂貴，故從商業化的角度分析之，較不 經濟，亦較不可行* 本案發明人有鑒於此，乃加研究改良，揭示本發 明之新穎具有高深寬比之微小結構之製造方法。 本發明之目的，旨在提供一種微小結構之製造方 法係包括下列步驟者： -3------- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先聞讀背面之注意事項再填3Τ本頁) 訂 -線 4 48 0 8 4 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（>) a. 製備一電鍍液； b. 選擇一聚合物基材彼能吸收該電鍍液之溶劑 而為該溶劑所膨潤者；將該聚合物基材表面 處理；並在該基材外表面形成一層電絕緣之 保護罩薄膜； c. 將該聚合物基材精密切割以形成三次元微小 結構圖樣，該圔樣含有多数深穴者； d. 將該聚合物基材密接於該電鋳系統所需之一 陰極板上*並將該聚合物基材浸於該電鋳系 統所加入之電鍍液之中俾容該電鍍液之溶劑 質傳進入該聚合物基材中以膨潤該聚合物基 材以縮小該圖樣中各深穴之直徑或寬度者； e. 於電鋳系統中進行電鑄，將金屬沈積入該聚 合物基材之深穴中；以及 f. 解析該聚合物基材之電鍍液溶劑使聚合物基材 收縮而能與電鑄所成之微小結構分離者，將 電鑄之微小結構成品脫模製得高深寬比（可大 於100)之微小結構者〃 本發明之可取實體，可由以下說明書配合所附諸 圖式而得以明晰之。 圖式之簡單說明： 第1圖顯示本發明之主要製程步驟》 第2画為本發明電鑄系統設備圖。 第3圖為本發明之聚合物基材精密切割後之頂視 圖。 第4圖為本發明微小結構產品之示意圖。 圖號說明： 本紙張尺度適用中國國家標準（CyS ) Α4規格（210X297^楚一) — (請先聞讀背面之注意事項再I寫本頁) 4d8084 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（$ ) L···聚合物基材；2.·.·薄膜； 3·.·.深穴； 4..··電鍵液；5….膨潤部份；6.…飽和膨潤試片； 7，·. _陰極鎳板；8.··.電簿系統；9…可變速直流馬達； ίΟ·...搛拌器；11….電熱管；12....溫度控制器； 13”·.熟電偶（感應器）；14....電源供應器； 15..·.電鑄產品。 本發明用以製造高深寬比微小結構之原理茲敘述 如下： 將一高分子材料（即聚合物，〗）加以加工，可使用 雷射或使用精密尺寸較小的PCD (polycrystal diamond)刀具給予切割，目前最精密技術如使用PCD 刀具可在lcm厚度之高分子材料切割成300jum之 孔洞’且保有其良好之精度及粗糙度，但此孔洞之 深寬比約只33(或更小）者。 該高分子材料若置於電鍍液系統中，則電鍍液中 之溶劑分子將會質傳到高分子材料內部之自由體積 (free volume)內，並増加其分子鏈距離，進而產生 一些性質改變，如玻璃轉換溫度下降，體積膨脹 (swelling)，機械性質下降等，此為本發明的理論架 構之一。 本發明使用蒸鍍、電鍍或塗佈技術於高分子材料 表面形成一層與高分子材料密著性良好之保護罩薄 膜，以阻止電鑄用之電鍍液進入高分子材料內》使 用PCD刀具或雷射加工技術給予加工成型*產生許 多縱深之深穴•接著將加工後之高分子材料置於一 電鍍液系統中，彼相同於後續之電鑄用之電鍍液系 統者，使電鑛液進入加工部份（沒有薄膜保護區域） 5 — — — ———-------裝-!--訂--I-----* 線· ΛΙ—"/ ·.). (請先閱讀背面之注意事''寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公餐） 448084 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（<) 之深穴中，則加工部份之高分子處將因溶劑質傅， 而產生局部膨潤，促使加工尺寸（亦即深穴之寬度或 直徑）縮小；但不改變其側壁之粗糙度，而此縮小尺 寸之大小係目前雷射或電子束切割所無法達到者； 而其加工深度是LIGA，LIGA-like，或厚UV光阻 顯影製程等無法達成者（因習知者之深度小於2細I); 切割尺寸之縮小係受溶劑質傳含量及質傳溫度所聚 饗，因此不管該質傳行為是Fickian擴散，CaseH擴 散或不正常（anomolus)擴散均可找出縮小之穩定尺 寸與質傅飽和吸收置及質傅溫度關係，如是*依照 道些函數相對應關係，可找出我們所需要縮小之尺 寸變化置，而該尺寸係指飽和質傅（亦即，溶劑不再 質傳到高分子材料者）所相對應之穩定尺寸者，亦指 溶劑至高分子之質傳行為中，在某一定質傳溫度下 會有一定之飽和溶劑吸收置及相對之膨潤尺寸量。 但由於高分子材料切割加工及質傳膨潤後，係使 用電鑄方式以製造微小結構者，因此，其質傳溶劑 係採用電鑄時所用之電鍍液包括相同組成濃度及溫 度，以使在電鑄過程，切割部份之已膨潤高分子不 會因電鍍液濃度、組成及溫度之差異•產生再次質 傅或解析現象，而改變其穩定尺寸者，基於此，若 要產生大量膨潤，所選定之材料往往係與電鑄用之 電鍍液相容者但不產生溶脹（膨潤）之破壊。 參閱第1圖及第2圖，茲就使用上述原理以製造 本發明高深寬比微小結構之製程步驟敘述如下： 1-製備電鍍液（4)以便加入一電鎮系統（8)之電鍍液 槽（81)中，以便進行電鑄製程者（有關電鋳細節容 6 表紙張尺度it用中國國家標準(CNS)A4規格（210 X 297公i) ---! I I------^ i — -----^---------^ (請先閲讀背面之注意事項ϋ寫本頁) 4480b. A7 B7 五、發明說明（Γ〉 以下再述）； 2. 將可大童吸收電鑄用之電鍍液（一般含有大量水溶 液者）之親水性高分子材料（聚合物）基材（1)，如親 水性聚氨基甲酸乙酯（PU)，親水性壓克力樹脂 者》表面給予平整、抛光及潔靜後，使用塗佈機 塗佈，或蒸鍍方式（如PVC或CVD) *或無電解電 镀將基材表面塗佈、加上一層保護罩薄膜（2)，此 薄膜性質係可阻止電鍍質傳進入高分子材料內 部，且不會在質傳或後績電鑄過程自髙分子材料 表面產生剝離（debonding)或被電解液溶解者，見 第〗圖（a)[註：該高分子村料不會被電鍍液所溶 出。]; 3. 使用精密切割工具及方法如雷射加工，電子束加 工，PCD(poly-crystal diamond)切割該高分子材 料0)成為微小結構之圖樣，以形成圖樣之多數深 穴（3)者*其切割圖樣之深穴（3)以可同時獲得最 佳尺寸及形狀精度*最小側壁粗糙度及最小尺寸 為主*見第1圖（b); 4. 將切割過之高分子材料（1)與陰極鎳板（7)緊密貼 合，置於與電鋳相同之電鍍液（4)系統中並採行相 同之質傳溫度，使電鍍液（4)，質傳到被切割之高 分子材料（1)之中，使切割處產生膨潤（5)，而使 切割尺寸[即深穴（3)之直徑或寬度]因而變小，此 時仍維持其精度，待[電鍍液（4)]質傳的量及衍生 膨潤的尺寸直到飽和為止’此時’圖樣尺寸維持 其一定值，見第1圖（C); 5. 在電錆系統（8)中，令已產生飽和膨潤試片（6)彼 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） . — — I—---------05.--- 「： (請先閱讀背面之注意事項斤填寫本頁) Γ 經濟部智慧財產局員Η消費合作社印製 經濟部智慧財產局員工消費合作社印製 4 4. S 0 B 4 A7 B7 五、發明說明（έ) 已與陰極鎳板（7)緊密貼合者進行電鋳，利用可铤 速直流馬達（9)騍動攪拌器（10)，以攪拌電鍍液 (4) *使其電鍍液（4)之濃度均勻，另外，使用電 熱管（H)給予電镀液加熱*及使用溫度控制器（12) 及熱電偶或感應器（13)，使電鍍液之溫度維持恆 定，在施加電鍍時，先用電鍍液將切割圖樣內之 氣泡給予趨走，以避免產生各個微小画樣，因生 長速度不同，造成不均質之電鍍，以避免電鍍較 快者恆快，電鍍較慢者恆慢之問題產生；接著使 用電源供應器（14)，施加相當之電流及電壓者， 參見第2圖； 6.待電鑄到所需要高度或深度（H)後，關掉電源供應 器（14)，飽和膨潤試片（6)與陰極鎳板（7)自電鑄系 統（8)取出，並將電鍍液（4)解析（如使用加熱或擴 散原理），將飽和膨潤試片（6)內之電鍍液（4)解析， 此時高分子之圖樣尺寸又回復近原來加工之切割 圖樣（3)，因此，電鍍物與高分子加工側壁可輕易 分離，經脫模取出電鋳物產品（15); 有關本發明製法可依下列實施例，以具體描述本 發明製程* 唯所述之實施例旨在說明本發明之方法，但本發 明並不限制在該實施例及画面中，本發明可於不違 反本發明之精神及範躊下作適度之修飾與改變。 窨施例： 首先將親水性聚氨基甲酸乙酯（PU)之板材（厚1 cm)之上下表面給予平整及抛光，並使用不溶於水 之油墨或柿油等均勻塗佈於板材之六面上*使用 8 本紙張又度適用^國ΙΪ家標承（CNS)A4規格（210 X 297公釐7 I I----— — In----I-----訂 I-------II - V、·-/ (請先間讀背面之注意事項坪填寫本頁)4 48 08 4 A7 B7 Printed by a member of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by a consumer cooperative. V. Description of the invention (f) The present invention is a method for manufacturing a micro structure with a high aspect ratio. Its micro structure with a high aspect ratio It is applied to three-dimensional micro-components, such as motors, micro-valves, micro-nozzles, micro-flow channels, etc., and micro-structure products with development potential. According to the manufacture of high-aspect-ratio and precise microstructures, the commonly used technologies are deep electroforming mold manufacturing process (LIGA), alternative photolithography (LIGA like), and thick UV photolithography, the former (LIGA) The X-ray of the synchrotron light source is deep. When this process is used to produce high-aspect-ratio and precise microstructure development, the development time of the agent is too long due to the attenuation and diffusion path of the agent during X-ray irradiation, which in turn causes photolithographic structures. Degradation, therefore, high aspect ratio and precise microstructures cannot be obtained. At the same time, the use of UGA manufacturing processes requires the use of large and expensive synchrotron light sources, which increases the manufacturing cost. UV photolithography '' reactive ion etching (RIE) and excimer laser micromachining, etc. Although the cost of this alternative photolithography method is inferior to that of synchrotron X-ray, tantalum The lithographic accuracy has also been reduced from the sub-micron accuracy of X-ray immersion to about a micron, and the aspect ratio is also relatively reduced. * A thick UV photoresist development process is used. This causes low, but the aspect ratio and the difference in accuracy compared LIGA. Both the former and the latter are complicated and expensive. Therefore, from the perspective of commercialization, it is less economical and less feasible. In view of this, the inventor of this case has researched and improved to reveal the novelty of the present invention. Compared to the manufacturing method of micro structures. The purpose of the present invention is to provide a method for manufacturing a micro structure which includes the following steps: -3 ------- This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (please listen first Read the notes on the back and fill in the 3T page) Order-line 4 48 0 8 4 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (>) a. Prepare a plating solution; b. Choose one The polymer substrate can absorb the solvent of the plating solution and be swollen by the solvent; the surface of the polymer substrate is treated; and an electrically insulating protective cover film is formed on the outer surface of the substrate; c. The polymerization Material substrate is precisely cut to form a three-dimensional microstructure pattern, the sample contains most deep holes; d. The polymer substrate is tightly attached to a cathode plate required for the electric cell system * and the polymer substrate is The material is immersed in the electroplating solution added by the electroplating system, and the solvent of the electroplating solution is transferred into the polymer substrate to swell the polymer substrate to reduce the diameter or width of each deep cavity in the pattern. E. Electroforming in an electro-hydraulic system, Is deposited in the deep cavity of the polymer substrate; and f. Analysis of the electroplating solution solvent of the polymer substrate causes the polymer substrate to shrink and separate from the microstructure formed by electroforming, The finished product of the structure is demolded to obtain a small structure with a high aspect ratio (which can be greater than 100). The desirable entity of the present invention can be made clear by the following description in conjunction with the accompanying drawings. Brief description of the drawings: Figure 1 shows the main process steps of the present invention. Figure 2 is a diagram of the equipment of the electroforming system of the present invention. Figure 3 is a top view of the polymer substrate of the present invention after precision cutting. FIG. 4 is a schematic diagram of a micro-structured product according to the present invention. Drawing number description: This paper size applies to China National Standard (CyS) Α4 specification (210X297 ^ Chu Yi) — (Please read the precautions on the back before writing this page) 4d8084 A7 B7 Printed by the Consumers ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs Fifth, description of the invention ($) L · ·· polymer substrate; 2. ··· film; 3 ···· deep cavity; 4. ··· key fluid; 5 .... swelling part; 6 .... Saturated swelling test strip; 7, ·. _ Cathode nickel plate; 8 ... book system; 9 ... variable speed DC motor; ίΟ ...... mixer; 11 .... heating tube; 12 .... Temperature controller; 13 ".. cooked couple (inductor); 14 .... power supply; 15 ...... electroformed product. The principle of the present invention for manufacturing microstructures with high aspect ratio is described as follows: A polymer material (ie, polymer) is processed and can be cut by laser or by using a PCD (polycrystal diamond) tool with a small size. At present, the most precise technology such as using PCD tools can The material is cut into a hole of 300jum 'and has good accuracy and roughness, but the depth-to-width ratio of this hole is only about 33 (or less) If the polymer material is placed in a plating solution system, the solvent molecules in the plating solution will be mass-transmitted into the free volume inside the polymer material, and the molecular chain distance will be increased to produce some property changes. For example, the glass transition temperature decreases, volume expansion (swelling), mechanical properties decrease, etc. This is one of the theoretical frameworks of the present invention. The present invention uses evaporation, electroplating or coating technology to form a layer with the polymer material on the surface of the polymer material Protective cover film with good adhesion to prevent electroplating bath from entering polymer materials. "Using PCD cutters or laser processing technology to give processing molding. * A lot of deep holes are created. Then the processed polymer material is processed. Placed in an electroplating bath system, they are the same as the electroplating bath system used in subsequent electroforming, so that the electric ore bath enters the processing part (there is no film protection area) 5 — — — ———————- Install-!-Order--I ----- * Line · ΛΙ— " / ·.). (Please read the notes on the back first '' to write this page) The paper size applies to Chinese National Standards (CNS) A4 size (210 X 297 meals) 448084 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. In the deep hole of the invention description (<), the polymer part of the processing part will be partially swollen due to the solvent quality, which will promote the processing size (also (Ie, the width or diameter of the deep hole) is reduced; but the roughness of its side wall is not changed, and the size of the reduced size is currently unattainable by laser or electron beam cutting; and its processing depth is LIGA, LIGA-like, or Those who cannot achieve the thick UV photoresist development process (because the depth of the known person is less than 2 fine I); the reduction of the cutting size is caused by the mass content of the solvent and the mass temperature, so regardless of the mass transfer behavior is Fickian diffusion, CaseH diffusion or abnormal (anomolus) diffusion can find the reduced stable size and the relationship between the mass absorption saturation absorption and the mass temperature. If it is * according to the corresponding relationship of these functions, we can find the size variation we need to reduce. And the size refers to the stable size corresponding to the saturated mass (that is, the solvent is no longer mass-transmitted to the polymer material), and also refers to the mass-transmission behavior of the solvent to the polymer. The solvent must be saturated at a given temperature of the absorption mass transfer set size and relative amount of swelling. However, after the polymer material is cut and processed and mass transfer swelled, it is electroformed to make microstructures. Therefore, the mass transfer solvent is the electroplating solution used when electroforming includes the same composition concentration and temperature, so that During the casting process, the swollen polymer in the cut part will not change its stable size due to the difference in concentration, composition and temperature of the plating solution. Based on this, if a large amount of swelling is to be generated, the selected The material is often compatible with electroplating solutions for electroforming but does not cause swelling (swelling). Referring to FIG. 1 and FIG. 2, the process steps for manufacturing the high aspect ratio microstructure of the present invention using the above principles are described as follows: 1- Preparing a plating solution (4) for adding a plating solution tank of an electric ballast system (8) (81), in order to carry out the electroforming process (the details of the electric capacity are shown in Table 6 and the paper size is in Chinese National Standard (CNS) A4 specification (210 X 297 male i) ---! I I ------ ^ i — ----- ^ --------- ^ (Please read the notes on the reverse side and write this page) 4480b. A7 B7 V. Description of the invention (Γ> will be described below) 2. The hydrophilic polymer material (polymer) substrate (1), such as hydrophilic polyurethane (PU), which can absorb the electroplating solution (usually containing a large amount of aqueous solution) for electroforming of older children, hydrophilic acrylic After the surface of the resin is smoothed, polished and cleaned, it is coated with a coater, or vapor deposition (such as PVC or CVD) * or electroless plating to coat the surface of the substrate and add a protective cover film (2) The nature of this film can prevent the mass transfer of electroplating into the interior of polymer materials, and it will not be produced on the surface of molecular materials during mass transfer or subsequent electroforming. Those who are debonding or dissolved by the electrolyte, see figure (a) [Note: The polymer material will not be dissolved by the plating solution.]; 3. Use precision cutting tools and methods such as laser processing, electronics Beam processing, PCD (poly-crystal diamond) cutting the polymer material 0) into a pattern of microstructures to form the majority of deep holes (3) of the pattern * the deep holes (3) of the cutting pattern can be obtained at the same time the best Dimensional and shape accuracy * The smallest side wall roughness and the smallest dimension are the main * see Figure 1 (b); 4. The cut polymer material (1) is closely attached to the cathode nickel plate (7),鋳 The same electroplating solution (4) is used in the system and the same mass transfer temperature is adopted, so that the electroplating solution (4) is transferred to the polymer material (1) to be cut, so that the cutting place is swollen (5), As a result, the cutting size [that is, the diameter or width of the deep cavity (3)] is reduced, and its accuracy is still maintained at this time, until the amount of mass transferred from the [plating solution (4)] and the size of the derived swelling are saturated until this time. 'The pattern size maintains a certain value, see Figure 1 (C); 5. In the electric system (8), the saturated expansion Test piece (6) The paper size of the paper is applicable to China National Standard (CNS) A4 (210 X 297 mm). — — I —--------- 05 .--- ": (Please read first Note on the back, please fill out this page) Γ Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives Printed by the Consumer Cooperatives of the Ministry of Economic Affairs Intellectual Property Bureau Printed by the Consumer Cooperatives 4 4. S 0 B 4 A7 B7 V. Description of the invention The plate (7) is closely adhered to electricity, and the stirrer (10) is driven by a high-speed DC motor (9) to stir the plating solution (4) * to make the concentration of the plating solution (4) uniform. In addition, Use an electric heating tube (H) to heat the plating solution * and use a temperature controller (12) and a thermocouple or sensor (13) to keep the temperature of the plating solution constant. When applying plating, first use a plating solution to cut the cutting pattern The air bubbles inside are given away to avoid the production of various small patterns. Due to the different growth speeds, non-uniform plating is caused to avoid the problems of faster plating and constant plating, and slow plating of slow plating. Then use a power supply. (14) For those who apply equivalent current and voltage, refer to Figure 2; 6. After the required height or depth (H), turn off the power supply (14), take out the saturated swelling test piece (6) and the cathode nickel plate (7) from the electroforming system (8), and analyze the plating solution (4) (If using the principle of heating or diffusion), analyze the electroplating solution (4) in the saturated swelling test piece (6). At this time, the size of the polymer pattern returns to the original cutting pattern (3). Therefore, the electroplating material and the The polymer processing side wall can be easily separated, and the electric product (15) can be taken out by demolding. The manufacturing method of the present invention can be described in detail according to the following examples. However, the present invention is not limited to the embodiments and pictures, and the present invention can be appropriately modified and changed without violating the spirit and scope of the present invention.例 Examples: Firstly, smooth and polish the upper and lower surfaces of a hydrophilic polyurethane (PU) sheet (1 cm thick), and apply the water-insoluble ink or persimmon oil to the six sides of the sheet Top * Use 8 papers again suitable for ^ National Ⅰ family standard (CNS) A4 specifications (210 X 297 mm 7 I I -------- In ---- I ----- Order I-- ----- II-V 、 ·-/ (Please read the notes on the back first and fill in this page)
4 48 C B A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（7) 193nm波長之C02雷射，於板材鑽成100X 100之孔 洞，其孔洞直徑丸約為400//m見第3圖，且其孔 洞內側壁之粗糙度Ra約lym。將此板材與陰極鎳 板緊密貼合，置於電鑄用之相同電鍍液（氨基磺酸鎳） 中，質傳溫度（與電鎮溫度相同）為40°C，其鍍液成 分：氨基磺酸鎳16L，硼酸0.8L，氣化鎳0.4L及光 澤劑0.4L，在調配過程加熱至攝氏35度使其完全溶 解氨基磺酸鎳溶液，並加入去離子水使其比重成為 40(原溶液比重52,去離子水比重10)，其間使用波 美計量測其比重*並使用PH測定儀使其PH約等於 4，如PH值小於4.0則可加入碳酸鎳做調整，於電 鑄溫度40°C下給予質傳，直到飽和吸收為止，此時 膨潤後之孔徑為l〇〇#m·將膨潤之板材彼已與陰極 鎳板緊密貼合者逕於電鎮系統中進行電鑄，施加2.0V 之電力及2.0A給予電鑄54小時後，板材自電鑄系 統取出，於10CTC空氣爐給予解析後再脫模，得到如 圖第4圖及第1圖（f)之電鑄微小結構；由第4圖知 經本發明所製得之三次元之圓柱，其深寬比高達 100;利用本發明不僅可使精度及粗糙度維持和雷射 加工相同，且可在較低成本下製得髙深寬比之微小 三次元結構，並可將此微小結構之電鑄物翻製（copy) 成模仁，以嵌入方式固著於模座上*供高分子射出 成型熱壓成型*金靥與陶瓷粉末射出成型或熱軋成 型之量產製造*目前習用之微小結構製造方法均無 法達到此功效*益顯本發明之新穎及進步性。 由實施例可知，原來基材之深穴直徑（do)約400 微米，怛經膨潤后，深穴之直徑（d)已縮小為100微 9 本紙張尺度適ϋ國國家標^(210^~2ϋϊΊ ------------^裝-------訂---------線·' <請先閲讀背面之注意事項填寫本頁) 在經濟部智慧財產局員工消費合作社印製 4 A7 _B7_'___ 五、發明説明（f) 米，故孔徑縮小率（<Vd) / d。X 100¾ = (400- 100) / 400X 100?« =75¾ *孔徑已大大縮小，也大大地提昇 本發明微小結構物之深寬比* 本發明成功製得形狀複雜之三次元微小結構，深 寬比特別高（大於1〇〇)，由於其製造成本低廉，且步 驟簡化，製程簡單，上述之本發明功效，改進了習 知方法耗時且製造效率低之缺點，迄今未有任何習 用之製程方法足以媲美之。事實上，本發明之方法 並不限於親水性PU等材料，其形狀也不限定為圓 柱或螺旋狀、塔層條形之製作，對於可使電鍍液質 傅產生大量膨潤之高分子材料，均可同樣利用本發 明之方法，製得精確及高深寬比之微小結構。亦可 利用可吸收電鍍液及不可吸收電鍍液之高分子任意 組合，而製得不同形狀，不同階梯之微小結樺。 本發明關鍵之所在，為因本發明揭示了利用聚合 物因電解液之膨潤而縮小了深穴（3)之直徑（寬度）， 而大大提高了深寬比，針對第1圖所示，設深（高） 度均為H，精密加工後未膨潤、縮小孔徑前之深穴（3) 之起始寬度（直徑）為D1，而膨潤、縮小后之深穴寬 度（直徑）為D2，則可得不同之深寬比如下： RfH/DrR!為精密加工[第1圖（b)]之起始深寬比； R2= H/D2，R2為縮小后[第1圖（〇]之深寬比《4 48 CB A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (7) A C02 laser with a wavelength of 193nm was drilled into a 100X 100 hole in the sheet. The diameter of the hole is about 400 // m. 3, and the roughness Ra of the inner wall of the hole is about lym. This sheet is closely adhered to the cathode nickel plate and placed in the same plating solution (nickel sulfamate) used for electroforming. The mass transfer temperature (same as the ballast temperature) is 40 ° C. The composition of the plating solution: aminosulfonic acid 16L of nickel acid, 0.8L of boric acid, 0.4L of vaporized nickel and 0.4L of gloss agent. During the preparation process, it is heated to 35 degrees Celsius to completely dissolve the nickel sulfamate solution, and deionized water is added to make the specific gravity 40 (the original solution). Specific gravity 52, deionized water specific gravity 10), during which the specific gravity is measured with Baume meter * and the pH is used to make the pH approximately equal to 4. If the pH is less than 4.0, nickel carbonate can be added for adjustment, and the electroforming temperature is 40 Mass transfer at ° C until saturated absorption, at this time the pore diameter after swelling is 100 # m. The swelling plate has been closely adhered to the cathode nickel plate, and electroformed in an electric ballast system. After 54 hours of electroforming at 2.0V power and 2.0A, the sheet was taken out of the electroforming system, and then analyzed in a 10CTC air furnace, and then demoulded to obtain the electroformed microstructures shown in Figure 4 and Figure 1 (f). ; From Figure 4 knows the three-dimensional cylinder made by the present invention, its aspect ratio is as high as 100; By using the invention, not only the accuracy and roughness can be maintained the same as that of laser processing, but also a small three-dimensional structure of the aspect ratio can be obtained at a lower cost, and the electroformed product of this minute structure can be copied. ) Formed into mold core, fixed on the mold base by embedding method * For polymer injection molding and hot pressing molding * Mass production of gold mold and ceramic powder injection molding or hot rolling molding * The currently used micro-structure manufacturing methods cannot reach This effect * benefits the novel and progressive nature of the invention. It can be known from the examples that the original deep hole diameter (do) of the base material is about 400 micrometers. After swelling, the diameter of the deep hole (d) has been reduced to 100 micron. 9 This paper is suitable for the national standard ^ (210 ^ ~ 2ϋϊΊ ------------ ^ Installation ------- Order --------- Line · '< Please read the precautions on the back first and fill in this page) Printed by the Consumer Cooperatives of the Ministry of Intellectual Property Bureau 4 A7 _B7 _'___ 5. Description of the invention (f) meters, so the aperture reduction rate (< Vd) / d. X 100¾ = (400- 100) / 400X 100? «= 75¾ * The aperture has been greatly reduced, and the aspect ratio of the micro-structures of the present invention has been greatly improved. The ratio is particularly high (greater than 100). Because of its low manufacturing cost, simplified steps, and simple process, the effectiveness of the present invention described above improves the disadvantages of the time-consuming and low manufacturing efficiency of the conventional method. So far, there is no conventional process. The method is comparable. In fact, the method of the present invention is not limited to materials such as hydrophilic PU, and its shape is not limited to the production of cylindrical or spiral, tower-shaped strips. For polymer materials that can produce a large amount of swelling in the electroplating solution, The method of the present invention can also be used to produce precise and high-aspect-ratio microstructures. It is also possible to use any combination of polymers that can absorb the electroplating solution and non-absorbable electroplating solution to make tiny shapes of different shapes and different steps. The key point of the present invention is to reduce the diameter (width) of the deep cavity (3) by using the polymer due to the swelling of the electrolyte due to the disclosure of the present invention, thereby greatly improving the aspect ratio. As shown in FIG. The depth (height) is H. After precision machining, the initial width (diameter) of the deep hole (3) before swelling and shrinking the hole diameter is D1, and the deep hole width (diameter) after swelling and shrinking is D2, then The different depth and width can be obtained as follows: RfH / DrR! Is the initial aspect ratio of precision machining [Figure 1 (b)]; R2 = H / D2, R2 is the depth after reduction [Figure 1 (〇)] Aspect ratio
因〇2小於D,，故R2大於I，此為本發明得以大大 提高深寬比之理。例如依PCD方法精密加工所得之 深穴孔徑（〇丨）為300微米，高度（H)為9.9麵，則深 寬比（RD為33;經本發明處理后；孔徑（D2)縮為75 微米，高度同為（H)，此時之深寬比（R2)則増為33 X I----------裝-- ^ί/ (請先閲讀背面之注意事項再填腎本頁) 線 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） A7 B7 五、發明説明（7) 300/75= 132，大大増髙了深寬比*有利於微小製造 之微小化。 而電鋳完成，解析該聚合物中之電鍍液時，僅須 假以簡單之加熱（或擴散）步驟，即能解析電解液， 收縮聚合物，使與電鑲之微小結構成品分離，而極 便於脫模，不必如習知之蝕刻（itching)法，必須耗 用蝕刻溶劑，構成環保污染的間題，本發明則無污 染之困擾，可謂裨益環保^ . 本發明利用聚合物之膨潤與收縮（解析電鍍液）， 有如％可逆反應〃（reversible reaction)之簡單程序， 但卻能大大提高微小結構之深寬比，此尤為本發明 之關鍵精髓與新穎特徵之所在*配合其他相醑之步 驟，遂提洪了本發明遠優於習知方法之新穎、進步 性。 本發明可於不違本發明之精神及範囔下加以修飾 應甩。例如親水性聚合物可選用親水性PU以外之 親水性聚合物，如親水性壓克力樹脂等等》又電簿 用之金屣，合金等則可使用：鎳、銅、金、鎳鈷及 鎳鐵等。 (請先閲讀背面之注$項再填戴本頁) ，tT- 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家橾準（CNS ) A4規格（210X297公釐） / ·Because O2 is smaller than D, R2 is larger than I, which is the reason that the aspect ratio of the present invention can be greatly improved. For example, the deep hole diameter (〇 丨) obtained by precision machining according to the PCD method is 300 microns, and the height (H) is 9.9 planes, then the aspect ratio (RD is 33; after the treatment of the present invention; the aperture (D2) is reduced to 75 microns, The height is also (H), and the aspect ratio (R2) at this time is 33 X I ---------- install-^ ί / (Please read the precautions on the back before filling the kidney book Page) The size of the paper is applicable to the Chinese National Standard (CNS) A4 (210X297 mm) A7 B7 V. Description of the invention (7) 300/75 = 132, which greatly reduces the aspect ratio * It is conducive to the miniaturization of micro manufacturing When the electrolysis is completed, when analyzing the electroplating solution in the polymer, only a simple heating (or diffusion) step is required, which can analyze the electrolyte, shrink the polymer, and separate it from the finished micro-structured electrical structure. It is very easy to demould, and it does not need to use the etching method as in the conventional method. It must consume an etching solvent, which constitutes the problem of environmental pollution. The present invention has no pollution problems and can be described as beneficial to the environment ^. The present invention utilizes the swelling and shrinkage of polymers (Analytical plating solution), as simple as a% reversible reaction However, it can greatly improve the aspect ratio of microstructures. This is especially the key essence and novel features of the present invention. * In conjunction with other related steps, it has improved the novelness and advancement of the present invention far better than conventional methods. The present invention can be modified without departing from the spirit and scope of the present invention. For example, hydrophilic polymers other than hydrophilic PU can be used, such as hydrophilic acrylic resin, etc. Gold tincture, alloys, etc. can be used: nickel, copper, gold, nickel-cobalt, nickel-iron, etc. (please read the note on the back before filling in this page), tT- printed by the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The paper size of the paper is applicable to China National Standard (CNS) A4 (210X297 mm) / ·