ATE384237T1 - Verwendung einer fläche zur wärmeübertragung, insbesondere für verdampfungs- und kondensationsprozesse von fluiden - Google Patents

Verwendung einer fläche zur wärmeübertragung, insbesondere für verdampfungs- und kondensationsprozesse von fluiden

Info

Publication number
ATE384237T1
ATE384237T1 AT02027031T AT02027031T ATE384237T1 AT E384237 T1 ATE384237 T1 AT E384237T1 AT 02027031 T AT02027031 T AT 02027031T AT 02027031 T AT02027031 T AT 02027031T AT E384237 T1 ATE384237 T1 AT E384237T1
Authority
AT
Austria
Prior art keywords
micro
heat transfer
fluids
evaporation
condensation processes
Prior art date
Application number
AT02027031T
Other languages
English (en)
Inventor
Dieter Gollan
Jovan Prof Dr-Ing Mitrovic
Andreas Schulz
Helmut Pietsch
Original Assignee
Micryon Technik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micryon Technik Gmbh filed Critical Micryon Technik Gmbh
Application granted granted Critical
Publication of ATE384237T1 publication Critical patent/ATE384237T1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/124—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and being formed of pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/905—Materials of manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Geometry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
AT02027031T 2001-12-06 2002-12-03 Verwendung einer fläche zur wärmeübertragung, insbesondere für verdampfungs- und kondensationsprozesse von fluiden ATE384237T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10159860A DE10159860C2 (de) 2001-12-06 2001-12-06 Wärmeübertragungsfläche mit einer aufgalvanisierten Mikrostruktur von Vorsprüngen

Publications (1)

Publication Number Publication Date
ATE384237T1 true ATE384237T1 (de) 2008-02-15

Family

ID=7708207

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02027031T ATE384237T1 (de) 2001-12-06 2002-12-03 Verwendung einer fläche zur wärmeübertragung, insbesondere für verdampfungs- und kondensationsprozesse von fluiden

Country Status (6)

Country Link
US (1) US6736204B2 (de)
EP (1) EP1318371B1 (de)
AT (1) ATE384237T1 (de)
DE (2) DE10159860C2 (de)
ES (1) ES2300414T3 (de)
PT (1) PT1318371E (de)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7082032B1 (en) * 2003-08-25 2006-07-25 Hewlett-Packard Development Company, L.P. Heat dissipation device with tilted fins
US7365980B2 (en) * 2003-11-13 2008-04-29 Intel Corporation Micropin heat exchanger
US20070028588A1 (en) * 2005-08-03 2007-02-08 General Electric Company Heat transfer apparatus and systems including the apparatus
TWI276396B (en) * 2006-01-13 2007-03-11 Ind Tech Res Inst Closed-loop latent heat cooling method, and capillary force or non-nozzle module thereof
US7743821B2 (en) 2006-07-26 2010-06-29 General Electric Company Air cooled heat exchanger with enhanced heat transfer coefficient fins
US20080078535A1 (en) * 2006-10-03 2008-04-03 General Electric Company Heat exchanger tube with enhanced heat transfer co-efficient and related method
DE202007013730U1 (de) 2007-10-01 2008-07-31 Hellwig, Udo, Prof. Dr. Vollstab mit behandelter Oberfläche zur Verwendung von chemischen Reaktionen in einem Reaktor als Katalysator
DE202007014218U1 (de) 2007-10-10 2008-07-10 Hellwig, Udo, Prof. Dr.-Ing. Einrichtung zum Temperieren flüssiger oder gasförmiger Medien in solarthemischen Anlagen
DE102008030423B4 (de) * 2007-12-05 2016-03-03 GIB - Gesellschaft für Innovation im Bauwesen mbH Rohr mit einer durch Noppen Oberflächenprofil-modifizierten Außenmantelfläche
DE102007059153A1 (de) 2007-12-06 2009-06-10 Erk Eckrohrkessel Gmbh Verfahren zur Erhöhung der Effektivität des Wärme- und Stofftransportes sowie der chemischen Reaktivität und Selektivität von Anlagen zur Übertragung von Wärmeenergie sowie von Anlagen zur technischen Reaktionsführung insbesondere der heterogenen Katalyse, dazu verwendete mit eingeformten Strukturen ausgebildete Bauteile und Verfahren für die Herstellung von Mikrostrukturen auf diesen Bauteilen
DE202007018013U1 (de) 2007-12-22 2008-07-03 Hellwig, Udo, Prof. Dr. Solarpumpe
DE102008025544A1 (de) 2008-05-27 2009-12-03 Thomas Endrullat Verfahren und Vorrichtung zur optimierten Kühlung elektronischer Bauelement in der Computertechnik
US8266802B2 (en) * 2008-06-18 2012-09-18 International Business Machines Corporation Cooling apparatus and method of fabrication thereof with jet impingement structure integrally formed on thermally conductive pin fins
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
US20100263842A1 (en) * 2009-04-17 2010-10-21 General Electric Company Heat exchanger with surface-treated substrate
EP2260996B1 (de) 2009-06-13 2016-03-16 Galvanoform Gesellschaft für Galvanoplastik mbh Formschale und Verfahren zur Herstellung einer Formschale
FR2950134B1 (fr) * 2009-09-14 2011-12-09 Commissariat Energie Atomique Dispositif d'echange thermique a ebullition convective et confinee a efficacite amelioree
FR2950133B1 (fr) * 2009-09-14 2011-12-09 Commissariat Energie Atomique Dispositif d'echange thermique a efficacite amelioree
USD622229S1 (en) * 2009-11-09 2010-08-24 Foxsemicon Integrated Technology, Inc. Illumination device
WO2011162849A2 (en) * 2010-04-01 2011-12-29 The Board Of Regents Of The Nevada System Of Higher Education, On Behalf Of The University Of Nevada, Reno Device having nano-coated porous integral fins
JP4964327B2 (ja) * 2010-04-28 2012-06-27 株式会社神戸製鋼所 熱交換用プレートの元板材、及び熱交換用プレートの元板材の製造方法
CN102466424A (zh) * 2010-11-10 2012-05-23 珠海格力节能环保制冷技术研究中心有限公司 传热管、降膜蒸发器传热管及降膜蒸发器
JP5398767B2 (ja) * 2011-03-17 2014-01-29 シャープ株式会社 放熱装置及び光学走査装置並びに画像形成装置
US20140202677A1 (en) * 2011-09-16 2014-07-24 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Original plate material for heat-exchanging plate and heat-exchanging plate using the same
US9417017B2 (en) 2012-03-20 2016-08-16 Thermal Corp. Heat transfer apparatus and method
US20140000857A1 (en) * 2012-06-19 2014-01-02 William P. King Refrigerant repelling surfaces
EP2727679A1 (de) 2012-10-30 2014-05-07 Josch Strahlschweisstechnik GmbH Verfahren zur Modifikation der Oberflächen von metallischen Werkstoffen unter Anwendung eines Elektronstrahles
WO2014160565A1 (en) * 2013-03-26 2014-10-02 United Technologies Corporation Turbine engine and turbine engine component with improved cooling pedestals
JP2015010749A (ja) * 2013-06-28 2015-01-19 株式会社日立製作所 伝熱装置
US10371466B2 (en) * 2013-10-15 2019-08-06 Natomics Co., Ltd. Method of preserving heat exchange surface and method of cooling moist air
DE102014002829A1 (de) * 2014-02-27 2015-08-27 Wieland-Werke Ag Metallisches Wärmeaustauscherrohr
JP6219199B2 (ja) * 2014-02-27 2017-10-25 株式会社神戸製鋼所 熱交換用プレートとなる元板材、及びその元板材の製造方法
CN103900245A (zh) * 2014-03-22 2014-07-02 张子春 一种多功能高效节能环保供暖及蒸气两用锅炉
WO2015175147A2 (en) * 2014-04-18 2015-11-19 Kandlikar Satish G Enhanced boiling with selective placement of nucleation sites
JP6470135B2 (ja) * 2014-07-14 2019-02-13 ユナイテッド テクノロジーズ コーポレイションＵｎｉｔｅｄ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 付加製造された表面仕上げ
WO2016014961A1 (en) 2014-07-24 2016-01-28 The University Of Florida Research Foundation, Inc. Cryogenic heat transfer by a nanoporous surface
US10731925B2 (en) 2014-09-17 2020-08-04 The Regents Of The University Of Colorado, A Body Corporate Micropillar-enabled thermal ground plane
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US20180371631A1 (en) * 2015-11-18 2018-12-27 University Of Houston System Exposed segmented nanostructure arrays
CN108369079B (zh) 2015-12-16 2020-06-05 开利公司 用于换热器的传热管
CN116936500A (zh) * 2016-11-08 2023-10-24 开尔文热技术股份有限公司 用于在热接地平面中散布高热通量的方法和设备
CN107148201B (zh) * 2017-07-14 2020-03-31 四川大学 一种利用微细化沸腾高效换热技术的冷却装置
US11566856B2 (en) * 2017-10-13 2023-01-31 Extractcraft, Llc Heat transfer for extract distillation
US10907480B2 (en) * 2018-09-28 2021-02-02 Raytheon Technologies Corporation Ribbed pin fins
CN115997099A (zh) 2020-06-19 2023-04-21 开尔文热技术股份有限公司 折叠式热接地平面
US20230092781A1 (en) * 2021-09-20 2023-03-23 Apple Inc. Porous oxide for improved titanium-polymer bonding

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3842474A (en) * 1972-11-21 1974-10-22 H Schladitz Heat transfer between solids and fluids utilizing polycrystalline metal whiskers
US4246057A (en) * 1977-02-16 1981-01-20 Uop Inc. Heat transfer surface and method for producing such surface
US4129181A (en) * 1977-02-16 1978-12-12 Uop Inc. Heat transfer surface
DE2758526C2 (de) * 1977-12-28 1986-03-06 Wieland-Werke Ag, 7900 Ulm Verfahren und Vorrichtung zur Herstellung eines Rippenrohres
US4288897A (en) * 1978-12-04 1981-09-15 Uop Inc. Method of producing a nucleate boiling surface on a heat transfer member
US4219078A (en) * 1978-12-04 1980-08-26 Uop Inc. Heat transfer surface for nucleate boiling
US4254431A (en) * 1979-06-20 1981-03-03 International Business Machines Corporation Restorable backbond for LSI chips using liquid metal coated dendrites
CA1155107A (en) * 1981-02-11 1983-10-11 Theodore C. Carnavos Heat transfer boiling surface
JPS5956697A (ja) * 1982-05-06 1984-04-02 Agency Of Ind Science & Technol 低過熱度沸騰伝熱面の製造方法
US4577381A (en) * 1983-04-01 1986-03-25 Kabushiki Kaisha Kobe Seiko Sho Boiling heat transfer pipes
JPS6066094A (ja) * 1983-09-22 1985-04-16 Ishikawajima Harima Heavy Ind Co Ltd 伝熱管壁の形成方法
US5468681A (en) * 1989-08-28 1995-11-21 Lsi Logic Corporation Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias
DE19524739A1 (de) * 1994-11-17 1996-05-23 Fraunhofer Ges Forschung Kernmetall-Lothöcker für die Flip-Chip-Technik
DE69525594T2 (de) * 1994-11-17 2002-08-22 Carrier Corp., Syracuse Wärmeaustauschrohr
DE59611449D1 (de) * 1995-09-08 2007-12-20 Fraunhofer Ges Forschung Verfahren und vorrichtung zum testen eines chips
AU3426697A (en) * 1996-02-09 1997-08-28 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College, The High aspect ratio, microstructure-covered, macroscopic surfaces
FR2748156B1 (fr) * 1996-04-26 1998-08-07 Suisse Electronique Microtech Dispositif comprenant deux substrats destines a former un microsysteme ou une partie d'un microsysteme et procede d'assemblage de deux substrats micro-usines
DE19650881C2 (de) * 1996-12-07 1999-04-08 Schwerionenforsch Gmbh Verfahren zur Herstellung von in z-Richtung elektrisch leitfähiger und in x/y-Richtung isolierender Folien aus Kunststoff
DE19750073A1 (de) * 1997-11-12 1999-05-20 Bosch Gmbh Robert Schaltungsträgerplatte
DE19757526C1 (de) * 1997-12-23 1999-04-29 Wieland Werke Ag Verfahren zur Herstellung eines Wärmeaustauschrohres, insbesondere zur Verdampfung von Flüssigkeiten aus Reinstoffen oder Gemischen auf der Rohraußenseite
JP3524424B2 (ja) * 1999-04-01 2004-05-10 キヤノン株式会社 マイクロ構造体アレイ用金型又は金型マスター、及びその作製方法
TW448084B (en) * 1999-10-20 2001-08-01 Lin Ching Bin Manufacture method of microstructure with high aspect ratio

Also Published As

Publication number Publication date
EP1318371A3 (de) 2005-07-13
DE10159860A1 (de) 2003-07-24
ES2300414T3 (es) 2008-06-16
EP1318371A2 (de) 2003-06-11
US20030136547A1 (en) 2003-07-24
PT1318371E (pt) 2008-04-22
DE10159860C2 (de) 2003-12-04
DE50211546D1 (de) 2008-03-06
US6736204B2 (en) 2004-05-18
EP1318371B1 (de) 2008-01-16

Similar Documents

Publication Publication Date Title
ATE384237T1 (de) Verwendung einer fläche zur wärmeübertragung, insbesondere für verdampfungs- und kondensationsprozesse von fluiden
ATE320310T1 (de) Mikrofluidische oberflächen
ATE454369T1 (de) Bruchfeste latexdeckbeschichtungszusammensetzung für faserzementsubstrate
ATE506113T1 (de) Mischkammer
ATE373053T1 (de) Beschichtung zur dauerhaften hydrophilierung von oberflächen und deren verwendung
EP4249694A3 (de) Baupaneel
US20070266576A1 (en) Combination level and square
JP2002249864A5 (de)
BRPI0412018A (pt) substrato revestido por extrusão, uso de um polietileno, e, processo para revestimento por extrusão de um substrato
EP1237148A3 (de) Ultraschallwandler, zugehöriges Herstellungsverfahren und Verwendung in einem Ultraschall-Durchflussmessgerät
ATE481362T1 (de) Verfahren zur herstellung von hydrophob modifizierten polymere
ATE506393T1 (de) Verfahren zur nachvernetzung wasserabsorbierender polymere
DE502005009322D1 (de) Wasserlösliche sulfogruppenhaltige copolymere, varfahren zu deren herstellung und ihre verwendung
DE50011277D1 (de) Verfahren zur Herstellung einer Flächenheizung und Heizelementträgerplatte zur Durchführung des Verfahrens
WO2007120183A3 (en) A micro-bubble plate for patterning biological and non-biological materials
TW200500132A (en) Ultralyophobic membrane
ATE413273T1 (de) Ultraphobes flächengebilde mit einer vielzahl von hydrophilen bereichen
ATE553718T1 (de) Dentalimplantat
EP2022816A3 (de) Haftschicht auf fluorierten Polymeren
DE60200458D1 (de) Blech mit einer Korrosionsschutzbeschichtung
DE50206180D1 (de) Mauersteinförmiges Wärmedämmelement
ATE269167T1 (de) Ultraschallzerstäuber
DE60227373D1 (de) Siloxanharze
BR0001332A (pt) Processo para revestir substratos
ATE346993T1 (de) Verbindungselement zur kraftübertragung