Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
  • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
  • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
  • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/484—Connecting portions
  • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
  • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
  • H01L2224/732—Location after the connecting process
  • H01L2224/73201—Location after the connecting process on the same surface
  • H01L2224/73203—Bump and layer connectors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01068—Erbium [Er]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01078—Platinum [Pt]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01079—Gold [Au]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/151—Die mounting substrate
  • H01L2924/1515—Shape
  • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Definitions

• the invention relates to a housing assembly for an electronic component and a method for packaging electronic components.
• semiconductor chips are provided with a housing to protect them from mechanical damage and environmental influences using different methods.
• the housing also performs functions that are decisive for further processing and assembly.
• the chips are encapsulated against environmental influences with a housing made of an injection molding compound or a housing made of ceramic or a housing made of a plastic adhesive, also called a "globetop" coating.
• the housing assembly for an electronic component has at least the following components:
• an electronic component to be packaged eg semiconductor chip
• an external contact carrier e.g., a housing frame which surrounds the semiconductor chip
• a housing frame which surrounds the semiconductor chip
• an underside cover part and / or an upper side cover part the interspaces of the components being filled in a heated state by means of a capillary-reflecting epoxy resin via a filler opening and the interspaces being dimensioned as capillary gaps or capillary bores.
• a housing assembly according to the invention has the advantage that no moldings are required when manufacturing the housing assembly, especially since the housing assembly already represents the outer shape of the housing.
• support elements are required which keep the housing components at a distance from one another during the filling process of the capillary-acting epoxy resin.
• a support element can be a plate-shaped chip carrier which at the same time has the external contacts plated, embossed or printed.
• the chip location i.e.
• the position of the active side of a chip, which has the electronic components, can be freely selected in this housing assembly.
• the active side can face upwards, as in the case of a fingertip module, and be freely accessible or covered by a top cover part, as in the case of machine-equipped housing variants.
• the housing assembly includes a fingertip module. Since the top of the fingertip module with the active semiconductor chip area must be accessible, the filling opening for the capillary-acting epoxy resin is provided in the underside cover part. During manufacture, the housing assembly for filling the capillary-acting epoxy resin is therefore positioned with the underside cover part pointing upwards.
• the underside cover part of a housing assembly for the fingertip module can include an integral edge cover.
• the gap between the underside cover part of the housing assembly of a fingertip module and the semiconductor chip, and between the integral edge cover and the semiconductor chip is adapted to the capillary action of the epoxy resin.
• This capillary action means that the uniform distribution of the capillary epoxy in the gap is stopped when the gap exceeds a critical size.
• This property of a capillary-acting epoxy resin has the advantage that no additional measures are required in order to seal capillary-acting gaps or capillary-acting bores which open towards the outside of the housing assembly against leakage of the epoxy resin.
• the fingertip module has bond connections between contact connection areas of the external contact carrier and contact areas on the semiconductor chip. After the chip has been fixed in place, these bond connections can be fixed on the top of the semiconductor chip with the aid of the capillary-acting epoxy resin. th contact surfaces are attached to connect them to the contact pads of the external contact carrier. For this purpose, the contact areas on the semiconductor chip are arranged in an edge region of the semiconductor chip which, after the bond connections have been introduced, can be sealed by a thermoplastic casting compound, including the bond connections.
• the external contact carrier of the fingertip module is a flexible multilayer conductor strip which has flat conductors which are arranged between the contact connection areas and external contact surfaces on a flexible substrate and are partially covered by an insulation layer.
• This embodiment has the advantage that the external contact carrier can be adapted to the spatial requirements of the place of use of the fingertip module.
• the external contact carrier is designed as a flexible multilayer conductor strip in a machine assembly system as a continuous conveyor belt on which the housing assembly according to the invention is to be arranged and fastened.
• the flexible multilayer conductor strip has corresponding openings which allow access to the active semiconductor area of the fingertip module.
• the housing assembly includes a chip card module.
• the semiconductor chip is arranged in flip-chip technology on the external contact carrier, the external contact carrier simultaneously forming the underside cover part of the chip card module and carrying both the external contact areas and the contact connection areas.
• the contact connection areas are arranged in a pattern which corresponds to the pattern of the contact areas on the semiconductor chip, so that the contact bumps of the semiconductor chip can be connected to the contact connection areas of the external contact carrier by means of flip-chip technology.
• the sealing of outwardly leading gaps and bores can be dispensed with as long as they have dimensions according to the invention which are adapted to the capillary action of the epoxy resin.
• the epoxy resin extends only as far as the capillary action of the epoxy resin is active, so that the epoxy resin spreads out at edges where the capillary gap or the capillary bores enlarge.
• larger voids of the packaging assembly can be filled with the epoxy resin if appropriate filling openings are provided for the voids, which are not closed by capillary action of the epoxy resin, and on the other hand control openings are provided which have a capillary action and thus indicate when the intended void is completely filled with the epoxy resin. For this purpose, such control openings are to be arranged at the uppermost point of the cavities.
• the components of the housing assembly are attached to a flexible chip carrier in order to assemble them.
• a flexible chip carrier can simultaneously make the external contact Form carrier so that the external contact carrier of the housing assembly can be designed for machine assembly.
• the housing assembly is fastened to the chip carrier with heating, a thermoplastic plastic, which is used as a hot melt adhesive, being melted.
• a thermoplastic plastic which is used as a hot melt adhesive, being melted.
• This thermoelastic plastic glues the housing assembly to the chip carrier when it cools, which advantageously enables mass production.
• the housing assembly is attached to the chip carrier by means of a two-component adhesive.
• adjustment elements are provided which position the components of the housing assembly exactly with respect to one another.
• the housing assembly is fixed on the chip carrier by means of an adhesive film.
• This method is particularly suitable for packaging fingertip modules, especially since after filling the fingertip module and establishing the bond connections for the fingertip module, the fingertip module can be separated from the adhesive film on the chip carrier, especially since the chip carrier only has adhesive film serves to assemble the housing assembly and does not become part of the packaged electronic component when the method is carried out in this way.
• FIG. 1 shows a schematic cross section through a housing assembly for a fingertip module according to a first embodiment of the invention.
• FIG. 2 shows an exploded perspective view of the housing assembly of FIG. 1.
• Figure 3 shows a schematic cross section through a
• Housing assembly for a card chip module according to a second embodiment of the invention.
• Figure 4 shows a schematic cross section through a housing assembly for a machine-equipped housing according to a third embodiment of the invention.
• FIG. 1 shows a schematic cross section through a housing assembly for a fingertip module 10 according to a first embodiment of the invention.
• the housing assembly of FIG. 1 for an electronic component 1 essentially consists of a semiconductor chip 2 to be packaged, an external contact carrier 3 and a housing frame 4, which in this embodiment is integrally connected to an underside cover part 5.
• the housing frame 4 and the underside cover part 5 are adapted to the dimensions of the semiconductor chip 2 to be installed such that gap cross sections remain between the housing frame 4 and the semiconductor chip 2 and between the underside cover part 5 and the semiconductor chip 2, the dimensions of which correspond to the capillary action of a capillary to be filled.
• lar-acting epoxy resin 12 are matched.
• Such dimensioned gaps are called capillary gaps 8 in the following.
• a filling opening 7 for the capillary-acting epoxy resin is provided in the underside cover part 5.
• a so-called "underfiller" is used as the capillary-acting epoxy resin.
• the housing assembly is first arranged with the underside cover part 5 upwards on a carrier which has an adhesive film and shows corresponding openings in the area of the bond connections 14 to be introduced later.
• a top cover 6 is dimensioned to have an opening 22 which defines the active area of the fingertip module 10 releases.
• the top cover 6 is limited in such a way that contact areas 16 located in the edge region of the semiconductor chip 2 are exposed for a bond connection 14.
• a bond wire 23 of the bond connection 14 connects in each case one contact area 16 on the
• the external contact carrier 3 is multilayer and has a flexible substrate 19 which is connected to an edge cover 13 for the semiconductor chip 2.
• the flexible substrate 19 carries the contact pads 15, the flat conductors 21 and the outer contact surfaces 18 and an insulating layer 20 which protects the flat conductors 21.
• FIG. 2 shows an exploded perspective view of the housing assembly of FIG. 1.
• the external contact carrier 3 forms a unit with the top cover part 6 and has the opening 22 in the region of the top cover part 6, which forms the active surface of the semiconductor chip 2 Fingertip module 10 releases.
• a second opening 26 in the external contact carrier 3 and the top cover part 6 enables access to the contact surfaces 16 of the semiconductor chip 2 and the contact connection surfaces 15 of the external contact carrier 3, as long as the second opening 26 is not covered or sealed by an epoxy resin.
• the semiconductor chip 2 can be fitted into the edge cover 13 except for lateral capillary gaps.
• the underside cover part 5 is integrally connected to the edge cover 13 and has a filling opening 7 in its center for the capillary-acting epoxy resin.
• corner bores 27 in the edge cover 13 correspond to corresponding corner bores 28 in the top cover part 6 and serve to fasten the fingertip module 10 in or on corresponding electronic devices.
• Two further bores in the edge cover 13 correspond to corresponding bores 31 in the external contact carrier 3. These bores 29 and 31 are also provided for the positioning and fastening of the finished fingertip module 10.
• FIG. 3 shows a schematic cross section through a housing assembly for a chip card module 25 according to a second embodiment of the invention.
• This housing assembly consists of a housing frame 4, which is attached to a chip card 32 as an external contact carrier 3.
• the 34 between the housing frame 4 and the semiconductor chip 2 can be dimensioned as a capillary-active gap or can be designed as a filling opening without any capillary action and thus have a larger distance between the housing frame 4 and the semiconductor chip 2 than a capillary gap.
• the gap 35 located in the chip card base must be dimensioned such that it is adapted to the capillary action of the epoxy resin, so that the capillary-effective epoxy resin 12 can be filled between the housing frame 4 and the semiconductor chip 2 without it emerging from the gap 35 in the chip card bottom.
• the semiconductor chip 2 is arranged in a flip-chip arrangement on the chip card 32, which is simultaneously designed as an external contact carrier 3 in the region of the semiconductor chip.
• External contact carrier 3 has a pattern of contact pads within the housing frame 4, which with a pattern of contact areas 16 on the semiconductor chip 2 corresponds.
• the electrical connection between the contact surfaces 16 and the contact connection surfaces on the external contact carrier 3 is established, for example, by means of solder bumps 36, the semiconductor chip 2 on the chip card 32 being electrically contacted before the housing frame 4 is positioned and then the capillary-acting epoxy resin 12 being filled ,
• the gap 35 serves as an insulation gap between a multiplicity of the contact connection areas on the external contact carrier 3.
• the chip card 32 can also have a cutout in the area of the housing assembly, so that a separate housing frame 4 is not required.
• the schematic structure of a housing assembly shown in FIG. 3 can be constructed in such a way that the entire assembly with external contact surfaces on the underside of the external contact carrier 3 is inserted into a chip card of appropriate thickness. This embodiment is indicated in FIG. 3 by dashed outline 39.
• FIG. 4 shows a schematic cross section through a housing assembly for a machine-equipped housing according to a third embodiment of the invention.
• This machine-equipped housing is arranged as a housing assembly on an external contact carrier 3, which at the same time represents a chip carrier 37 for a large number of machine-equipped housings.
• the chip carrier 37 can be realized in the form of a flexible band or in the form of a circuit board which carries the external contact surfaces and the contact connection surfaces.
• the semiconductor chips 2 are applied using flip-chip technology on the chip carrier 37, which has different and several external contact carrier areas for several semiconductor chips 2, so that contact surfaces 16 of the semiconductor chips 2 are connected to contact connection surfaces of the external contact carrier 3.
• the housing frame 4 and a top cover part 6 are put on.
• the capillary gap 8 in the chip carrier 37 serves to isolate the contact pads from one another and has dimensions which are adapted to the capillary action of the epoxy resin 12. The same applies to the distance between the semiconductor chip 2 and the external contact carrier 3.
• the space between the housing frame 4 and the semiconductor chip 2 can be dimensioned as desired, since the top cover part 6 has control holes 17 which are adapted to the capillary action of the epoxy resin 12.
• the control holes 17 automatically fill with epoxy resin due to the capillary action and thus indicate the complete filling of the cavities 38.
• the filler opening 7 must accordingly be larger than a capillary opening and allow a filler channel to the cavity 38 without the flow of epoxy resin to the cavity 38 being stopped by capillary action. This can be achieved, for example, by an elongated hole-like filling opening 7, which is arranged transversely above the semiconductor chip 2, or by an opening 7 in the top cover part 6 arranged outside the center in the region of the cavity 38. From such an opening, thinly viscous, heated, capillary-acting epoxy resin flows into the opening and spreads out in the capillary gaps 8 and correspondingly dimensioned control bores 17, so that the filling process is ended after a few seconds.
• a connecting gap 33 between the housing frame 4 and the external contact carrier 3 can also be designed as a capillary gap, so that when the epoxy resin is filled in, a mechanical connection between the chip carrier 37 and the housing frame 4 is also produced without it can spread epoxy resin on the chip carrier through the connecting gap 33.
• This housing assembly therefore has the advantage that no molded parts other than the components of the housing assembly are required for sealing or packaging a semiconductor chip.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
• Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
• Packaging Frangible Articles (AREA)

Applications Claiming Priority (3)

Publications (1)

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ID=7637175

Family Applications (1)

Country Status (13)

Families Citing this family (17)

Family Cites Families (16)

• 2000
  • 2000-03-31 DE DE10016135A patent/DE10016135A1/de not_active Withdrawn
• 2001
  • 2001-03-28 CN CNB018074596A patent/CN1199252C/zh not_active Expired - Fee Related
  • 2001-03-28 IL IL15195801A patent/IL151958A0/xx unknown
  • 2001-03-28 EP EP01927614A patent/EP1269532A1/de not_active Withdrawn
  • 2001-03-28 MX MXPA02009501A patent/MXPA02009501A/es unknown
  • 2001-03-28 KR KR1020027012715A patent/KR20020086704A/ko not_active Application Discontinuation
  • 2001-03-28 WO PCT/DE2001/001165 patent/WO2001075962A1/de not_active Application Discontinuation
  • 2001-03-28 JP JP2001573540A patent/JP2003529933A/ja active Pending
  • 2001-03-28 DE DE10191266T patent/DE10191266D2/de not_active Expired - Fee Related
  • 2001-03-28 CA CA002404032A patent/CA2404032A1/en not_active Abandoned
  • 2001-03-28 AU AU2001254609A patent/AU2001254609A1/en not_active Abandoned
  • 2001-03-28 BR BR0109645-1A patent/BR0109645A/pt not_active IP Right Cessation
  • 2001-03-30 TW TW090107663A patent/TW503535B/zh not_active IP Right Cessation
• 2002
  • 2002-09-30 US US10/260,469 patent/US6713677B2/en not_active Expired - Fee Related

Non-Patent Citations (2)

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