EP1224067B1 - Dispositif et procede pour sectionner des materiaux - Google Patents
Dispositif et procede pour sectionner des materiaux Download PDFInfo
- Publication number
- EP1224067B1 EP1224067B1 EP01984580A EP01984580A EP1224067B1 EP 1224067 B1 EP1224067 B1 EP 1224067B1 EP 01984580 A EP01984580 A EP 01984580A EP 01984580 A EP01984580 A EP 01984580A EP 1224067 B1 EP1224067 B1 EP 1224067B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- lubricant
- coolant
- cutting
- cutting disk
- supplied
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Definitions
- the invention relates to an apparatus and a method for Separation of materials, especially single crystals.
- FIG. 1 is a schematic View of inner hole cutting seen in a top view in the direction of the central longitudinal axis M of a single crystal 1.
- How 1 is the single crystal 1, which is essentially cylindrical with a central longitudinal axis M. is attached to a bracket, not shown and along with it in one direction perpendicular to the central longitudinal axis M via a feed device, not shown traversable.
- a cutting disc 2 is provided, which is a concentric There is inner hole core sheet 2a, the edge 3 surrounding the inner hole is set with diamond grains is and thus forms a cutting edge.
- the width of the core sheet between its outer edge and its inner edge is larger than the diameter of the single crystal, which is why in the figure schematically shows only the inner edge.
- the cutting disc 2 is about its central axis R over a Drive rotatable in the direction A shown in Fig. 1.
- the Cutting disc and the single crystal are arranged to each other, that the axis of rotation R of the cutting disc 2 and the Center longitudinal axis M of the single crystal 1 parallel at a distance to each other.
- the single crystal 1 is the feed device perpendicular to its central longitudinal axis M movable towards the cutting disc 2 that the cutting disc when rotating the single crystal 1 completely in a plane perpendicular to its central longitudinal axis M cuts through, and away from the cutting disc 2 in one position movable in which a separated wafer can be removed can.
- a coolant-lubricant supply device 4 for supplying cooling lubricant to the Cutting edge provided in direction of rotation A according to the position P2 the exit of the cutting disc from the single crystal 1, hereinafter referred to as the outlet side.
- a second Supply device for cooling lubricants provided in direction of rotation A according to the position P2 the exit of the cutting disc from the single crystal 1, hereinafter referred to as the outlet side. Operational is before the cutting disc 2 enters the single crystal 1 via the feed device 4 the cooling lubricant applied to the cutting edge or the cutting disc 2, which then by the rotation of the cutting disc 2 in the The resulting separation gap is transported.
- the second feed device 5 again applied cooling lubricant, so that the cleaning and removal of worn away Material is guaranteed by the separation gap.
- the Cooling lubricants are added to the surface tension reduce and thus the wetting of the cutting disc improve.
- the known device also has a device for interval flushing of the core sheet and Clamping system.
- the object is achieved by a device according to claim 1 or a method according to claim 9th
- the device according to the invention and the invention Methods have the particular advantage that during less cooling lubricant is required during the separation process than in the known device. This makes a qualitative high quality cut.
- the inventive Device in a known manner, the holder and the feed device for the single crystal 1 and the cutting disc 2 with the core sheet 2a and the diamond-trimmed edge 3 the inner hole of the cutting disc.
- the device according to the invention has a device a first supply device 10 for supplying cooling lubricant on the edge 3 of the inner hole and on the Cutting disc 2, which in the direction of rotation of the cutting disc 2 seen on the outlet side at position P2 after Passage. Through the single crystal 1 is provided.
- the first Feeding device 10 for cooling lubricants is for example designed as a nozzle.
- a second feed device 11 for cleaning agent on the outlet side in the area of the inner hole It is also on the outlet side a device 12 for supplying a gaseous Medium, especially compressed air, on the cutting disc 2 and in particular the edge 3 is provided.
- FIGS. 3 to 6 The operation of the device according to the invention and the device according to the invention The method can be seen from FIGS. 3 to 6.
- the cutting disc is before the cutting or cutting process 2 and the single crystal 1 separated from each other. Then it will be the single crystal 1 moves relative to the cutting disc 2 and this occurs rotating in the material of the single crystal 1 Separate.
- Fig. 3 As shown in Fig. 3, during the Separation process via the feed device 10 coolant-lubricant with a low volume flow, i.e. at slow speed v and low pressure p the edge 3, which the Forming cutting edge, fed via the feed device 10.
- a cooling lubricant with a Additive that uses the surface tension ⁇ of the coolant-lubricant increases and thus the wetting of the core sheet 2a worsened. This results in poor wetting of the core sheet 2a of the cutting disc 2, and form it droplets 20 of the cooling lubricant on the surface of the core sheet 2a.
- compressed air via the compressed air source 12 blown onto the edge 3, making the bad Wetting is balanced. The compressed air continues to carry to form and distribute droplets 20 at. As shown in Fig.
- the method according to the invention is thus a two-stage process Process in which the cooling of the Separating tool, swirling the coolant, trapping of the removed material into the coolant lubricant droplets and distributing and storing the coolant lubricant droplets with the removed material below Centrifugal force acts.
- a second stage after the single crystal is moved away from the cutting disc is the cleaning and the removal of worn material over high air pressure and sufficient cooling lubricant supply performed.
- the one used in the second stage Detergent can be identical to the coolant-lubricant but it can also be another substance, e.g. water his. Thus, coolants and lubricants have different properties.
- cooling and Lubrication requires much less cooling lubricant than for cleaning and removing the removed material.
- On high quality cut can only be done with such a Apply a small amount of coolant and lubricant.
- the amount of coolant-lubricant set to the minimum required amount to cool and guarantee lubrication.
- the separation gap is free and the contact between the core sheet and the wafer section becomes avoided.
- cleaning is a much higher one Volume flow optimal.
- a container 30 is provided in the working position at a constant distance is located above the feed device 10 and the one Line 31 is connected to this. Located in the container coolant, which the feed device 10th via the line only under the influence of gravitation or is supplied to the hydrostatic pressure. Air bubbles in the Line are led upwards. This ensures that even with small amounts of coolant to be supplied ensures constant and bubble-free feeding is.
- the invention is suitable for cutting a wide variety of materials, e.g. for optical glasses, plastics and others.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Claims (13)
- Dispositif pour sectionner des matériaux, en particulier des monocristaux, avec :un disque de sectionnement (2) avec un trou concentrique dont le bord (3) forme un bord de coupe, le disque de sectionnement (2) pouvant tourner autour de son axe central pour sectionner le matériau (1),un dispositif de positionnement pour le positionnement du matériau (1) à sectionner par rapport au disque de sectionnement de telle manière que le disque de sectionnement traverse le matériau en tournant sur lui-même pendant le sectionnement et découpe une partie (1a) du matériau (1),un premier dispositif (10) pour amener un agent de refroidissement et de lubrification sur le disque de sectionnement (2),un deuxième dispositif (11) pour amener un agent de nettoyage sur le disque de sectionnement (2),
- Dispositif selon la revendication 1, caractérisé en ce que la commande est constituée de sorte que l'agent de refroidissement et de lubrification est amené à un faible débit et l'agent de nettoyage est amené à un débit plus élevé.
- Dispositif selon la revendication 1 ou 2 avec un troisième dispositif (12) destiné à amener un fluide gazeux sur le disque de sectionnement, caractérisé en ce que le troisième dispositif (12) destiné à amener un fluide gazeux présente une buse conçue de telle manière que le fluide soit appliqué sur le bord (3).
- Dispositif selon la revendication 3, caractérisé en ce que le premier dispositif (10) destiné à amener l'agent de refroidissement et de lubrification et le troisième dispositif (12) destiné à amener un fluide gazeux sont disposés de telle manière que l'agent de refroidissement et de lubrification et le fluide gazeux soient amenés sur le côté de sortie en arrière du point où le disque de sectionnement (2) traverse le matériau (1).
- Dispositif selon l'une des revendications 1 à 4, caractérisé en ce que le deuxième dispositif (11) destiné à amener un agent de nettoyage, en particulier un agent de refroidissement et de lubrification, est prévu sur le côté de sortie.
- Dispositif selon l'une des revendications 1 à 5, caractérisé en ce que le premier dispositif (10) destiné à amener l'agent de refroidissement et de lubrification présente une buse conçue de telle manière que l'agent de refroidissement et de lubrification soit appliqué sur le bord (3).
- Dispositif selon l'une des revendications 1 à 6, caractérisé en ce qu'il comprend une commande qui actionne le premier dispositif (10) pendant l'opération de sectionnement de telle manière qu'une faible quantité d'agent de refroidissement et de lubrification seulement soit amenée.
- Dispositif selon l'une des revendications 1 à 7, caractérisé en ce qu'il est prévu, au-dessus du premier dispositif (10) dans la position de travail, un réservoir (30) d'agent de refroidissement et de lubrification, qui communique par une conduite (31) avec le premier dispositif (10), l'alimentation étant réalisée par gravité.
- Procédé pour le sectionnement de matériaux, notamment pour la découpe par trou intérieur de monocristaux, dans lequel une partie (1a) du matériau est séparée du matériau (1) au moyen d'un disque de sectionnement (2) pénétrant en rotation dans le matériau pendant l'opération de sectionnement,
caractérisé en ce que le refroidissement et le nettoyage sont réalisés séparément dans le temps, par le fait qu'un agent de refroidissement et de lubrification est amené pendant l'opération de sectionnement et un agent de nettoyage après l'opération de sectionnement, après que la pièce (1a) a été détachée du matériau, l'agent de refroidissement et de lubrification étant amené à un débit réduit et l'agent de nettoyage à un débit plus élevé. - Procédé selon la revendication 9, caractérisé en ce que l'agent de refroidissement et de lubrification est amené, vu dans le sens de la rotation, uniquement sur le côté de sortie en arrière du point où le disque de sectionnement (2) traverse le matériau (1).
- Procédé selon la revendication 9 ou 10, caractérisé en ce qu'un fluide gazeux, en particulier de l'air comprimé, est amené sur le bord du disque de sectionnement (2).
- Procédé selon l'une des revendications 9 à 11, caractérisé en ce que le fluide gazeux est amené, vu dans le sens de la rotation du disque de sectionnement, après le point de sortie du disque de sectionnement hors du matériau.
- Procédé selon l'une des revendications 9 à 12, caractérisé en ce que l'agent de refroidissement et de lubrification contient un additif qui accroít la tension superficielle.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10055286A DE10055286A1 (de) | 2000-11-08 | 2000-11-08 | Vorrichtung und Verfahren zum Trennen von Werkstoffen |
DE10055286 | 2000-11-08 | ||
PCT/EP2001/012032 WO2002038349A1 (fr) | 2000-11-08 | 2001-10-17 | Dispositif et procede pour sectionner des materiaux |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1224067A1 EP1224067A1 (fr) | 2002-07-24 |
EP1224067B1 true EP1224067B1 (fr) | 2004-07-28 |
Family
ID=7662530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01984580A Expired - Lifetime EP1224067B1 (fr) | 2000-11-08 | 2001-10-17 | Dispositif et procede pour sectionner des materiaux |
Country Status (11)
Country | Link |
---|---|
US (1) | US20030005919A1 (fr) |
EP (1) | EP1224067B1 (fr) |
JP (2) | JP4302979B2 (fr) |
CN (2) | CN101066616A (fr) |
AT (1) | ATE271962T1 (fr) |
CZ (1) | CZ301194B6 (fr) |
DE (2) | DE10055286A1 (fr) |
RU (1) | RU2271927C2 (fr) |
SK (1) | SK286415B6 (fr) |
TW (1) | TW590842B (fr) |
WO (1) | WO2002038349A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2996336B1 (fr) * | 2010-09-30 | 2017-09-13 | Samsung Electronics Co., Ltd | Dispositif d'interpolation d'images au moyen d'un filtre d'interpolation de lissage |
KR20120037576A (ko) * | 2010-10-12 | 2012-04-20 | 주식회사 엘지실트론 | 단결정 잉곳 절단장치 및 단결정 잉곳 절단방법 |
DE102011008400B4 (de) * | 2011-01-12 | 2014-07-10 | Siltronic Ag | Verfahren zur Kühlung eines Werkstückes aus Halbleitermaterial beim Drahtsägen |
JP6722917B2 (ja) * | 2016-04-26 | 2020-07-15 | 三星ダイヤモンド工業株式会社 | スクライブヘッドユニット |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1301500A (fr) * | 1960-08-19 | 1962-08-17 | Hydrol Chemical Company Ltd | Machine à meuler |
FR2557000B1 (fr) * | 1983-12-23 | 1987-08-07 | Essilor Int | Poste de meulage pour machine a meuler, notamment pour le biseautage ou le rainurage d'une lentille ophtalmique |
DE3640645A1 (de) * | 1986-11-28 | 1988-06-09 | Wacker Chemitronic | Verfahren zum zersaegen von kristallstaeben oder -bloecken vermittels innenlochsaege in duenne scheiben |
JP2979870B2 (ja) * | 1992-11-27 | 1999-11-15 | 信越半導体株式会社 | 半導体インゴットのコーン状端部切除方法 |
DE4309134C2 (de) * | 1993-03-22 | 1999-03-04 | Wilfried Wahl | Verfahren zur Schmierung und Kühlung von Schneiden und/oder Werkstücken bei zerspanenden Arbeitsprozessen |
JPH06328433A (ja) * | 1993-05-20 | 1994-11-29 | Tokyo Seimitsu Co Ltd | スライシングマシン |
JPH07304028A (ja) * | 1994-05-13 | 1995-11-21 | Nippon Steel Corp | スライシングマシン |
SG70097A1 (en) * | 1997-08-15 | 2000-01-25 | Disio Corp | Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface |
DE10027086B4 (de) * | 1999-06-01 | 2009-04-16 | Hitachi Metals, Ltd. | Magnetelement-Schneidverfahren und Magnetelement-Schneidvorrichtung |
-
2000
- 2000-11-08 DE DE10055286A patent/DE10055286A1/de not_active Withdrawn
-
2001
- 2001-10-17 EP EP01984580A patent/EP1224067B1/fr not_active Expired - Lifetime
- 2001-10-17 US US10/181,099 patent/US20030005919A1/en not_active Abandoned
- 2001-10-17 WO PCT/EP2001/012032 patent/WO2002038349A1/fr active IP Right Grant
- 2001-10-17 AT AT01984580T patent/ATE271962T1/de not_active IP Right Cessation
- 2001-10-17 SK SK978-2002A patent/SK286415B6/sk not_active IP Right Cessation
- 2001-10-17 RU RU2002118120/03A patent/RU2271927C2/ru not_active IP Right Cessation
- 2001-10-17 CN CNA2007101065817A patent/CN101066616A/zh active Pending
- 2001-10-17 CZ CZ20022365A patent/CZ301194B6/cs not_active IP Right Cessation
- 2001-10-17 CN CNB018034896A patent/CN100396460C/zh not_active Expired - Fee Related
- 2001-10-17 DE DE50102989T patent/DE50102989D1/de not_active Expired - Fee Related
- 2001-10-17 JP JP2002540914A patent/JP4302979B2/ja not_active Expired - Fee Related
- 2001-11-02 TW TW090127230A patent/TW590842B/zh not_active IP Right Cessation
-
2007
- 2007-10-03 JP JP2007260189A patent/JP2008135712A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP1224067A1 (fr) | 2002-07-24 |
CZ20022365A3 (cs) | 2002-10-16 |
TW590842B (en) | 2004-06-11 |
SK9782002A3 (en) | 2002-12-03 |
DE50102989D1 (de) | 2004-09-02 |
US20030005919A1 (en) | 2003-01-09 |
JP2004512989A (ja) | 2004-04-30 |
WO2002038349A1 (fr) | 2002-05-16 |
CN101066616A (zh) | 2007-11-07 |
RU2271927C2 (ru) | 2006-03-20 |
JP4302979B2 (ja) | 2009-07-29 |
RU2002118120A (ru) | 2004-01-20 |
CN1394161A (zh) | 2003-01-29 |
JP2008135712A (ja) | 2008-06-12 |
DE10055286A1 (de) | 2002-05-23 |
CZ301194B6 (cs) | 2009-12-02 |
SK286415B6 (sk) | 2008-09-05 |
ATE271962T1 (de) | 2004-08-15 |
CN100396460C (zh) | 2008-06-25 |
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