EP1213744A3 - Dispositifs et procédés d'implantation ionique - Google Patents
Dispositifs et procédés d'implantation ionique Download PDFInfo
- Publication number
- EP1213744A3 EP1213744A3 EP01310200A EP01310200A EP1213744A3 EP 1213744 A3 EP1213744 A3 EP 1213744A3 EP 01310200 A EP01310200 A EP 01310200A EP 01310200 A EP01310200 A EP 01310200A EP 1213744 A3 EP1213744 A3 EP 1213744A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- ion
- ion implantation
- methods
- semiconductor substrate
- plural
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
- H01J2237/31706—Ion implantation characterised by the area treated
- H01J2237/3171—Ion implantation characterised by the area treated patterned
- H01J2237/31711—Ion implantation characterised by the area treated patterned using mask
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Analytical Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electron Sources, Ion Sources (AREA)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000372067 | 2000-12-06 | ||
JP2000372067 | 2000-12-06 | ||
JP2001194852 | 2001-06-27 | ||
JP2001194852 | 2001-06-27 | ||
JP2001345158 | 2001-11-09 | ||
JP2001345158 | 2001-11-09 | ||
JP2001363797 | 2001-11-29 | ||
JP2001363797A JP4252237B2 (ja) | 2000-12-06 | 2001-11-29 | イオン注入装置およびイオン注入方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1213744A2 EP1213744A2 (fr) | 2002-06-12 |
EP1213744A3 true EP1213744A3 (fr) | 2005-12-28 |
EP1213744B1 EP1213744B1 (fr) | 2009-02-18 |
Family
ID=27481851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01310200A Expired - Lifetime EP1213744B1 (fr) | 2000-12-06 | 2001-12-05 | Dispositifs et procédés d'implantation ionique |
Country Status (6)
Country | Link |
---|---|
US (1) | US6930316B2 (fr) |
EP (1) | EP1213744B1 (fr) |
JP (1) | JP4252237B2 (fr) |
KR (1) | KR100846110B1 (fr) |
DE (1) | DE60137673D1 (fr) |
TW (1) | TW544712B (fr) |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10210270A1 (de) * | 2002-03-08 | 2003-10-02 | Infineon Technologies Ag | Ionen-Implantierungsvorrichtung |
US6933507B2 (en) * | 2002-07-17 | 2005-08-23 | Kenneth H. Purser | Controlling the characteristics of implanter ion-beams |
US6727175B2 (en) * | 2002-08-02 | 2004-04-27 | Micron Technology, Inc. | Method of controlling metal formation processes using ion implantation, and system for performing same |
US7405147B2 (en) | 2004-01-30 | 2008-07-29 | International Business Machines Corporation | Device and methodology for reducing effective dielectric constant in semiconductor devices |
FR2879625B1 (fr) * | 2004-02-04 | 2007-04-27 | Guernalec Frederic | Dispositif de nitruration par implantation ionique d'une piece en alliage d'aluminium et procede mettant en oeuvre un tel dispositif |
KR20050099154A (ko) * | 2004-04-09 | 2005-10-13 | 삼성전자주식회사 | 이온주입장치 및 그의 이온추출방법 |
DE102004063691B4 (de) | 2004-05-10 | 2019-01-17 | Hynix Semiconductor Inc. | Verfahren zum Implantieren von Ionen in einem Halbleiterbauelement |
US6903350B1 (en) * | 2004-06-10 | 2005-06-07 | Axcelis Technologies, Inc. | Ion beam scanning systems and methods for improved ion implantation uniformity |
JP2005353537A (ja) * | 2004-06-14 | 2005-12-22 | Ulvac Japan Ltd | イオン注入装置 |
JP4868330B2 (ja) * | 2004-10-08 | 2012-02-01 | 独立行政法人科学技術振興機構 | 多価イオン発生源およびこの発生源を用いた荷電粒子ビーム装置 |
US20060258128A1 (en) * | 2005-03-09 | 2006-11-16 | Peter Nunan | Methods and apparatus for enabling multiple process steps on a single substrate |
US7674687B2 (en) * | 2005-07-27 | 2010-03-09 | Silicon Genesis Corporation | Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving process |
JP2007042869A (ja) * | 2005-08-03 | 2007-02-15 | Toyota Motor Corp | ステンシルマスクとその製造方法とその使用方法、及び半導体装置の製造方法 |
EP1752992A1 (fr) | 2005-08-12 | 2007-02-14 | Siemens Aktiengesellschaft | Dispositif d'adaptation d'un paramètre de faisceau à particules d'un faisceau à particules dans un accélérateur de particules et accélérateur de particules comprenant un tél dispositif |
KR100734308B1 (ko) * | 2006-01-26 | 2007-07-02 | 삼성전자주식회사 | 가변 스크린 어퍼쳐를 갖는 이온 주입 시스템 및 이를이용한 이온 주입 방법 |
JP2007208095A (ja) * | 2006-02-03 | 2007-08-16 | Toyota Motor Corp | ステンシルマスク |
JP4625775B2 (ja) * | 2006-02-17 | 2011-02-02 | 株式会社アルバック | イオン注入装置 |
US7863157B2 (en) * | 2006-03-17 | 2011-01-04 | Silicon Genesis Corporation | Method and structure for fabricating solar cells using a layer transfer process |
US7358510B2 (en) | 2006-03-27 | 2008-04-15 | Varian Semiconductor Equipment Associates, Inc. | Ion implanter with variable scan frequency |
EP2002484A4 (fr) | 2006-04-05 | 2016-06-08 | Silicon Genesis Corp | Procede et structure conçus pour fabriquer des cellules photovoltaiques au moyen d'un processus de transfert de couche |
JP4890080B2 (ja) * | 2006-04-18 | 2012-03-07 | トヨタ自動車株式会社 | ステンシルマスク |
KR100755070B1 (ko) | 2006-04-28 | 2007-09-06 | 주식회사 하이닉스반도체 | 번들 빔을 이용한 불균일 이온주입장치 및 방법 |
KR100755069B1 (ko) | 2006-04-28 | 2007-09-06 | 주식회사 하이닉스반도체 | 불균일한 이온주입에너지를 갖도록 하는 이온주입장치 및방법 |
US7696494B2 (en) * | 2006-06-12 | 2010-04-13 | Axcelis Technologies, Inc. | Beam angle adjustment in ion implanters |
WO2007146985A2 (fr) * | 2006-06-13 | 2007-12-21 | Semequip, Inc. | Appareil analyseur magnétique et procédé d'implantation d'ions |
KR20140018392A (ko) * | 2006-06-13 | 2014-02-12 | 세미이큅, 인코포레이티드 | 이온 빔 장치와 자기 스캐닝을 채용한 방법 |
JP4600426B2 (ja) * | 2006-06-26 | 2010-12-15 | 日新イオン機器株式会社 | イオン注入装置およびイオンビームの偏差角補正方法 |
US8153513B2 (en) * | 2006-07-25 | 2012-04-10 | Silicon Genesis Corporation | Method and system for continuous large-area scanning implantation process |
US7619229B2 (en) * | 2006-10-16 | 2009-11-17 | Varian Semiconductor Equipment Associates, Inc. | Technique for matching performance of ion implantation devices using an in-situ mask |
US20080099696A1 (en) * | 2006-10-31 | 2008-05-01 | Applied Materials, Inc. | Shaped apertures in an ion implanter |
US20080128641A1 (en) * | 2006-11-08 | 2008-06-05 | Silicon Genesis Corporation | Apparatus and method for introducing particles using a radio frequency quadrupole linear accelerator for semiconductor materials |
JP5289721B2 (ja) * | 2007-04-10 | 2013-09-11 | 株式会社Sen | イオン注入装置 |
JP5242937B2 (ja) * | 2007-04-10 | 2013-07-24 | 株式会社Sen | イオン注入装置及びイオン注入方法 |
US7820460B2 (en) * | 2007-09-07 | 2010-10-26 | Varian Semiconductor Equipment Associates, Inc. | Patterned assembly for manufacturing a solar cell and a method thereof |
US20090206275A1 (en) * | 2007-10-03 | 2009-08-20 | Silcon Genesis Corporation | Accelerator particle beam apparatus and method for low contaminate processing |
US7994488B2 (en) * | 2008-04-24 | 2011-08-09 | Axcelis Technologies, Inc. | Low contamination, low energy beamline architecture for high current ion implantation |
US8900982B2 (en) * | 2009-04-08 | 2014-12-02 | Varian Semiconductor Equipment Associates, Inc. | Techniques for processing a substrate |
US9076914B2 (en) * | 2009-04-08 | 2015-07-07 | Varian Semiconductor Equipment Associates, Inc. | Techniques for processing a substrate |
US9006688B2 (en) * | 2009-04-08 | 2015-04-14 | Varian Semiconductor Equipment Associates, Inc. | Techniques for processing a substrate using a mask |
US8330128B2 (en) | 2009-04-17 | 2012-12-11 | Varian Semiconductor Equipment Associates, Inc. | Implant mask with moveable hinged mask segments |
US8101927B2 (en) * | 2009-06-08 | 2012-01-24 | Varian Semiconductor Equipment Associates, Inc. | Masking apparatus for an ion implanter |
US20110027463A1 (en) * | 2009-06-16 | 2011-02-03 | Varian Semiconductor Equipment Associates, Inc. | Workpiece handling system |
JP2011086643A (ja) * | 2009-10-13 | 2011-04-28 | Panasonic Corp | 不純物注入方法及びイオン注入装置 |
US8198610B2 (en) * | 2009-10-20 | 2012-06-12 | Advanced Ion Beam Technology, Inc. | Ion implanter with variable aperture and ion implant method thereof |
US8216923B2 (en) | 2010-10-01 | 2012-07-10 | Varian Semiconductor Equipment Associates, Inc. | Integrated shadow mask/carrier for patterned ion implantation |
US8242005B1 (en) | 2011-01-24 | 2012-08-14 | Varian Semiconductor Equipment Associates, Inc. | Using multiple masks to form independent features on a workpiece |
US8461558B2 (en) * | 2011-07-01 | 2013-06-11 | Varian Semiconductor Equipment Associates, Inc. | System and method for ion implantation with dual purpose mask |
US9437392B2 (en) | 2011-11-02 | 2016-09-06 | Varian Semiconductor Equipment Associates, Inc. | High-throughput ion implanter |
JP5892802B2 (ja) * | 2012-02-09 | 2016-03-23 | 住友重機械工業株式会社 | イオン注入方法、搬送容器及びイオン注入装置 |
CN102647849A (zh) * | 2012-05-04 | 2012-08-22 | 哈尔滨工程大学 | 一机两用电子直线加速器及电子直线加速器的一机两用方法 |
JP5963662B2 (ja) * | 2012-12-04 | 2016-08-03 | 住友重機械イオンテクノロジー株式会社 | イオン注入装置 |
KR20150130557A (ko) * | 2013-03-15 | 2015-11-23 | 글렌 레인 패밀리 리미티드 리에빌러티 리미티드 파트너쉽 | 조정 가능한 질량 분해 애퍼쳐 |
JP6045445B2 (ja) * | 2013-06-14 | 2016-12-14 | 住友重機械イオンテクノロジー株式会社 | 高エネルギーイオン注入装置 |
US9269528B2 (en) * | 2013-10-15 | 2016-02-23 | Adavanced Ion Beam Technology, Inc. | Medium current ribbon beam for ion implantation |
US8884244B1 (en) * | 2013-10-22 | 2014-11-11 | Varian Semiconductor Equipment Associates, Inc. | Dual mode ion implanter |
JP6324223B2 (ja) | 2014-06-09 | 2018-05-16 | 住友重機械イオンテクノロジー株式会社 | イオン注入装置及びイオン注入方法 |
TWI686838B (zh) | 2014-12-26 | 2020-03-01 | 美商艾克塞利斯科技公司 | 改善混合式掃描離子束植入機之生產力的系統及方法 |
FR3046799B1 (fr) * | 2016-01-20 | 2018-03-02 | Quertech | Procede de traitement par un faisceau d'ions d'un gaz mono et multicharges pour produire des metaux colores |
JP2017228785A (ja) * | 2017-08-10 | 2017-12-28 | 東芝メモリ株式会社 | 半導体装置の製造方法および半導体製造装置 |
JP6933962B2 (ja) * | 2017-11-22 | 2021-09-08 | 住友重機械イオンテクノロジー株式会社 | イオン注入装置およびイオン注入装置の制御方法 |
CN109872938B (zh) * | 2017-12-05 | 2022-03-29 | 中国电子科技集团公司第四十八研究所 | 一种适用于微纳器件制造的离子注入机 |
US11469108B2 (en) | 2018-08-31 | 2022-10-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | System, semiconductor device and method |
CN110176394A (zh) * | 2019-06-05 | 2019-08-27 | 上海华力集成电路制造有限公司 | 一种离子注入方法及实现其的离子注入机 |
CN112516797B (zh) * | 2020-12-01 | 2022-09-16 | 中国科学院近代物理研究所 | 一种用于同位素分离系统的静电聚焦和加速系统及方法 |
JP6902215B1 (ja) * | 2020-12-14 | 2021-07-14 | 日新イオン機器株式会社 | イオン注入装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3434894A (en) * | 1965-10-06 | 1969-03-25 | Ion Physics Corp | Fabricating solid state devices by ion implantation |
US4242149A (en) * | 1979-07-31 | 1980-12-30 | The United States Of America As Represented By The Secretary Of The Army | Method of making photodetectors using ion implantation and laser annealing |
JPS6122623A (ja) * | 1984-07-11 | 1986-01-31 | Hitachi Ltd | 半導体素子の製造方法 |
US5315118A (en) * | 1993-04-15 | 1994-05-24 | High Voltage Engineering Europa B.V. | Dual ion injector for tandem accelerators |
US6155542A (en) * | 1996-01-05 | 2000-12-05 | Canon Kabushiki Kaisha | Vibration damping apparatus and method |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3566829A (en) * | 1969-03-06 | 1971-03-02 | Bryan H Hill | Ion implantation means including a variable ration ion source |
US3723730A (en) * | 1971-11-30 | 1973-03-27 | Atomic Energy Commission | Multiple ion source array |
US4088895A (en) * | 1977-07-08 | 1978-05-09 | Martin Frederick Wight | Memory device utilizing ion beam readout |
US4151420A (en) * | 1977-12-08 | 1979-04-24 | International Business Machines Corporation | Apparatus for the formation of epitaxial layers doped with conductivity-determining impurities by ion deposition |
US4451738A (en) * | 1980-07-28 | 1984-05-29 | National Research Development Corporation | Microcircuit fabrication |
US4847504A (en) * | 1983-08-15 | 1989-07-11 | Applied Materials, Inc. | Apparatus and methods for ion implantation |
US4578589A (en) * | 1983-08-15 | 1986-03-25 | Applied Materials, Inc. | Apparatus and methods for ion implantation |
JPS61107643A (ja) * | 1984-10-30 | 1986-05-26 | Hitachi Ltd | 蒸発炉付イオン源 |
US5017508A (en) * | 1989-06-29 | 1991-05-21 | Ixys Corporation | Method of annealing fully-fabricated, radiation damaged semiconductor devices |
GB9021629D0 (en) * | 1990-10-04 | 1990-11-21 | Superion Ltd | Apparatus for and method of producing ion beams |
JPH04301345A (ja) * | 1991-03-28 | 1992-10-23 | Nissin Electric Co Ltd | イオンビームの平行走査方法 |
US5196706A (en) * | 1991-07-30 | 1993-03-23 | International Business Machines Corporation | Extractor and deceleration lens for ion beam deposition apparatus |
JP2731886B2 (ja) | 1993-04-27 | 1998-03-25 | ▲巌▼ 大泊 | シングルイオン注入装置及び方法 |
US5378899A (en) * | 1993-10-07 | 1995-01-03 | Kimber; Eugene L. | Ion implantation target charge control system |
JP3420338B2 (ja) * | 1994-06-15 | 2003-06-23 | 株式会社アルバック | イオン注入装置 |
US5907158A (en) * | 1997-05-14 | 1999-05-25 | Ebara Corporation | Broad range ion implanter |
JPH11135593A (ja) * | 1997-10-28 | 1999-05-21 | Toshiba Corp | 半導体製造装置 |
JP4204662B2 (ja) * | 1998-04-02 | 2009-01-07 | 株式会社アルバック | イオン注入装置およびイオン注入方法 |
US6335534B1 (en) * | 1998-04-17 | 2002-01-01 | Kabushiki Kaisha Toshiba | Ion implantation apparatus, ion generating apparatus and semiconductor manufacturing method with ion implantation processes |
US6207963B1 (en) * | 1998-12-23 | 2001-03-27 | Axcelis Technologies, Inc. | Ion beam implantation using conical magnetic scanning |
JP2000274482A (ja) * | 1999-01-18 | 2000-10-03 | Canon Inc | 能動的除振装置、露光装置及び方法並びにデバイス製造方法 |
US6534775B1 (en) * | 2000-09-01 | 2003-03-18 | Axcelis Technologies, Inc. | Electrostatic trap for particles entrained in an ion beam |
US6521897B1 (en) * | 2000-11-17 | 2003-02-18 | The Regents Of The University Of California | Ion beam collimating grid to reduce added defects |
-
2001
- 2001-11-29 JP JP2001363797A patent/JP4252237B2/ja not_active Expired - Fee Related
- 2001-12-03 US US10/011,869 patent/US6930316B2/en not_active Expired - Lifetime
- 2001-12-05 EP EP01310200A patent/EP1213744B1/fr not_active Expired - Lifetime
- 2001-12-05 TW TW090130058A patent/TW544712B/zh not_active IP Right Cessation
- 2001-12-05 KR KR1020010076403A patent/KR100846110B1/ko active IP Right Grant
- 2001-12-05 DE DE60137673T patent/DE60137673D1/de not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3434894A (en) * | 1965-10-06 | 1969-03-25 | Ion Physics Corp | Fabricating solid state devices by ion implantation |
US4242149A (en) * | 1979-07-31 | 1980-12-30 | The United States Of America As Represented By The Secretary Of The Army | Method of making photodetectors using ion implantation and laser annealing |
JPS6122623A (ja) * | 1984-07-11 | 1986-01-31 | Hitachi Ltd | 半導体素子の製造方法 |
US5315118A (en) * | 1993-04-15 | 1994-05-24 | High Voltage Engineering Europa B.V. | Dual ion injector for tandem accelerators |
US6155542A (en) * | 1996-01-05 | 2000-12-05 | Canon Kabushiki Kaisha | Vibration damping apparatus and method |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 010, no. 170 (E - 412) 17 June 1986 (1986-06-17) * |
TERRIS B D ET AL: "Patterning magnetic films by ion beam irradiation", JOURNAL OF APPLIED PHYSICS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, vol. 87, no. 9, 1 May 2000 (2000-05-01), pages 7004 - 7006, XP012050711, ISSN: 0021-8979 * |
Also Published As
Publication number | Publication date |
---|---|
KR100846110B1 (ko) | 2008-07-14 |
TW544712B (en) | 2003-08-01 |
US6930316B2 (en) | 2005-08-16 |
EP1213744B1 (fr) | 2009-02-18 |
KR20020045537A (ko) | 2002-06-19 |
US20020066872A1 (en) | 2002-06-06 |
JP4252237B2 (ja) | 2009-04-08 |
JP2003208869A (ja) | 2003-07-25 |
DE60137673D1 (de) | 2009-04-02 |
EP1213744A2 (fr) | 2002-06-12 |
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