EP1210739A2 - Composants et leur production - Google Patents

Composants et leur production

Info

Publication number
EP1210739A2
EP1210739A2 EP00974302A EP00974302A EP1210739A2 EP 1210739 A2 EP1210739 A2 EP 1210739A2 EP 00974302 A EP00974302 A EP 00974302A EP 00974302 A EP00974302 A EP 00974302A EP 1210739 A2 EP1210739 A2 EP 1210739A2
Authority
EP
European Patent Office
Prior art keywords
glass
adhesive
glass substrate
components
blasting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00974302A
Other languages
German (de)
English (en)
Inventor
Christoph Hamann
Alois Ambrugger
Wolfgang Rogler
Wolfgang Roth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1210739A2 publication Critical patent/EP1210739A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • the container consists of a seal housing, a transparent substrate that covers this housing, and a Sealant that binds the substrate to the housing.
  • Housing and substrate can be made of glass.
  • the figure shows - not to scale - a schematic cross section through a component 10 according to the invention.
  • An organic light-emitting diode (OLED) 12 is arranged on a glass substrate 11.
  • the OLED 12 is covered by a glass cap 13 which is bonded to the glass substrate 11 at the edge 14.
  • the OLED 12 has the following components: a transparent electrode 15, for example made of ITO, an organic hole transport material 16, for example made of a conductive polymer, an organic electroluminescent material 17, for example a light-emitting polymer, and a metal electrode 18, for example made of calcium 19 and silver 20 is composed.
  • the organic electroluminescent material 17, i.e. the emitter (chromophore) also serves as an electron transport material.
  • the two functions can also be separate, in which case the electron transport material is arranged between the metal electrode and the emitter.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

L'invention concerne des composants qui comportent les constituants suivants: un substrat en verre (11); une diode électroluminescente (12) organique placée sur le substrat en verre (11) et un capot en verre (13) disposé au-dessus de la diode électroluminescente (12) organique, qui est collé au substrat en verre, au niveau du bord (14). Le capot en verre est obtenu à partir d'une plaque de verre, par enlèvement tridimensionnel de matière, par traitement par faisceau.
EP00974302A 1999-09-09 2000-09-07 Composants et leur production Withdrawn EP1210739A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19943148 1999-09-09
DE19943148 1999-09-09
PCT/DE2000/003108 WO2001018886A2 (fr) 1999-09-09 2000-09-07 Composants et leur production

Publications (1)

Publication Number Publication Date
EP1210739A2 true EP1210739A2 (fr) 2002-06-05

Family

ID=7921382

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00974302A Withdrawn EP1210739A2 (fr) 1999-09-09 2000-09-07 Composants et leur production

Country Status (5)

Country Link
US (1) US6798133B1 (fr)
EP (1) EP1210739A2 (fr)
JP (1) JP2003509814A (fr)
TW (1) TW494590B (fr)
WO (1) WO2001018886A2 (fr)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10044841B4 (de) * 2000-09-11 2006-11-30 Osram Opto Semiconductors Gmbh Plasmaverkapselung für elektronische und mikroelektronische Bauelemente wie OLEDs sowie Verfahren zu dessen Herstellung
DE10045204A1 (de) * 2000-09-13 2002-04-04 Siemens Ag Träger für eine OLED und Verfahren zur Herstellung eines Trägers für eine OLED
US6724150B2 (en) * 2001-02-01 2004-04-20 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
ATE377257T1 (de) 2001-03-22 2007-11-15 Lumimove Inc Beleuchtetes anzeigesystem und prozess
DE10130992B4 (de) * 2001-06-27 2006-02-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer hermetisch dichten Verbindung zwischen einem Substrat und einer Dioden-Schutzkappe
JP2003086355A (ja) * 2001-09-05 2003-03-20 Kiko Kenji Kagi Kofun Yugenkoshi 有機ｅｌ素子の封止構造並びに封止方法及び封止装置
DE10219951A1 (de) 2002-05-03 2003-11-13 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter
DE10236855B4 (de) * 2002-08-07 2006-03-16 Samsung SDI Co., Ltd., Suwon Gehäuseeinheit zur Verkapselung von Bauelementen und Verfahren zu deren Herstellung
GB0219223D0 (en) * 2002-08-17 2002-09-25 Cambridge Display Tech Ltd Organic optoelectronic device encapsulation package
US7224116B2 (en) 2002-09-11 2007-05-29 Osram Opto Semiconductors Gmbh Encapsulation of active electronic devices
US7193364B2 (en) 2002-09-12 2007-03-20 Osram Opto Semiconductors (Malaysia) Sdn. Bhd Encapsulation for organic devices
DE10314161A1 (de) * 2003-03-28 2004-10-28 Siemens Ag Feldeffektelektroden für organische optoelektronische Bauelemente
US7365442B2 (en) 2003-03-31 2008-04-29 Osram Opto Semiconductors Gmbh Encapsulation of thin-film electronic devices
JP2005302605A (ja) * 2004-04-14 2005-10-27 Canon Inc 半導体装置
FR2871651A1 (fr) * 2004-06-09 2005-12-16 Thomson Licensing Sa Capot en verre et boitier d'encapsulation de composants electroniques dote d'un tel capot
US7220040B2 (en) * 2004-11-12 2007-05-22 Harris Corporation LED light engine for backlighting a liquid crystal display
JP2007035536A (ja) * 2005-07-29 2007-02-08 Rohm Co Ltd フラットパネルディスプレイ
US7982214B2 (en) * 2006-12-12 2011-07-19 Koninklijke Philips Electronics N.V. Voltage-operated layered arrangement
TW201002126A (en) * 2007-12-21 2010-01-01 Du Pont Encapsulation assembly for electronic devices
US8404095B2 (en) * 2009-06-02 2013-03-26 The United States Of America, As Represented By The Secretary Of The Navy Preparing electrodes for electroplating
DE102011003969B4 (de) * 2011-02-11 2023-03-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Bauelements
KR101574686B1 (ko) * 2011-06-08 2015-12-07 엘지디스플레이 주식회사 유기 발광장치와 이의 제조방법
JP6182909B2 (ja) * 2013-03-05 2017-08-23 株式会社リコー 有機ｅｌ発光装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1366678A (en) * 1971-11-05 1974-09-11 Gen Electric Co Ltd Electroluminescent devices and their manufacture
EP0781075B1 (fr) * 1994-09-08 2001-12-05 Idemitsu Kosan Company Limited Procede d'enrobage d'un element electroluminescent organique et d'un autre element electroluminescent organique
JPH09148066A (ja) 1995-11-24 1997-06-06 Pioneer Electron Corp 有機ｅｌ素子
JPH11121167A (ja) 1997-10-16 1999-04-30 Tdk Corp 有機ｅｌ素子
JP3278611B2 (ja) * 1998-05-18 2002-04-30 日本電気株式会社 有機ｅｌ素子の封止方法
JP2000003783A (ja) * 1998-06-12 2000-01-07 Tdk Corp 有機ｅｌ表示装置
US6383664B2 (en) * 1999-05-11 2002-05-07 The Dow Chemical Company Electroluminescent or photocell device having protective packaging
US7008658B2 (en) 2002-05-29 2006-03-07 The Boc Group, Inc. Apparatus and method for providing treatment to a continuous supply of food product by impingement

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0118886A2 *

Also Published As

Publication number Publication date
JP2003509814A (ja) 2003-03-11
WO2001018886A2 (fr) 2001-03-15
US6798133B1 (en) 2004-09-28
TW494590B (en) 2002-07-11
WO2001018886A3 (fr) 2001-07-26

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