EP1177573A2 - Systeme permettant de traiter des plaquettes de silicium - Google Patents

Systeme permettant de traiter des plaquettes de silicium

Info

Publication number
EP1177573A2
EP1177573A2 EP00940170A EP00940170A EP1177573A2 EP 1177573 A2 EP1177573 A2 EP 1177573A2 EP 00940170 A EP00940170 A EP 00940170A EP 00940170 A EP00940170 A EP 00940170A EP 1177573 A2 EP1177573 A2 EP 1177573A2
Authority
EP
European Patent Office
Prior art keywords
manufacturing
wafers
units
measuring units
plant according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00940170A
Other languages
German (de)
English (en)
Inventor
Michael Goetzke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of EP1177573A2 publication Critical patent/EP1177573A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory

Definitions

  • the invention relates to a system for processing wafers according to the preamble of claim 1.
  • Such systems comprise a large number of manufacturing units with which different manufacturing steps for processing the wafers are carried out. These manufacturing steps involve various processing steps in etching processes, wet chemical processes, diffusion processes and various cleaning processes such as CMP processes (Chemical Mechanical Polishing).
  • One or more manufacturing units are provided for each of the corresponding manufacturing steps.
  • measuring units are provided in which the quality of the processing of the wafers can be checked.
  • the entire manufacturing process is subject to strict cleanliness requirements, so that the manufacturing units and measuring units are arranged in a clean room or in a system of clean rooms.
  • the wafers are fed into the individual production units and measuring units in cassettes in predetermined lot sizes via a transport system.
  • the removal after processing the wafers in the production and measuring units is also carried out via the transport system, the wafers in turn being stored in the cassettes.
  • the transport system has a conveyor system which is designed, for example, in the form of roller conveyors.
  • a predetermined number of cassettes are fed via the transport system to a manufacturing unit or a measuring unit for processing.
  • the manufacturing unit or measuring unit each has a loading and unloading station, via which a cassette with wafers can be inserted in each case. After all the wafers of a cassette have been processed in the production unit or measuring unit, the cassette with the wafers is re-dispensed via the loading and unloading station and transported away via the conveyor system.
  • Measuring units are provided in the area of manufacturing and measuring units, storage systems such as stockers, which are part of the transport system. Cassettes with wafers can be temporarily stored in a stocker under clean room conditions and, if necessary, fed to the individual production and measuring units.
  • the conveyor system consists of line-guided systems such as roller conveyors, which can only be branched to a certain extent.
  • the manufacturing units and measuring units are usually not arranged according to their functionality. This leads to a certain inefficiency in the transport of the individual wafers.
  • a further disadvantage is that in a manufacturing or measuring unit until the processing of all wafers a cartridge must be awaited before the entire lot will be passed in the cassette on the loading and unloading of the transport system ⁇ for transport. If, for example, the wafers of a cassette are loaded in a production unit works and then checks the processing quality in a measuring unit, the processing of all wafers of a cassette must first be awaited before the checking can then take place in the measuring unit. Only then can further measures be taken depending on the measurement results. The throughput times of the cassettes with the wafers through the system is therefore undesirably high.
  • a processing system for processing wafers is known from US Pat. No. 5,803,932.
  • This processing system includes a loading / unloading section, a processing section and an interface section.
  • a transport device and at least two waiting sections are provided.
  • the transport device is located between the loading / unloading section and the interface section.
  • a plurality of process units forming the processing section are arranged on both sides of the transport device.
  • the wafers are transported on the transport device either in the direction of the loading / unloading section or in the direction of the interface section.
  • the wafers are first transported in the first cassettes via an Interbay conveyor system and then reach an interface equipment.
  • the wafers are removed from the first cassettes and transferred to second cassettes in a predetermined arrangement.
  • the second cassettes are successively fed to different processing units via an intrabay conveyor system leads in which different processing of the wafer takes place.
  • DE 195 14 037 AI relates to a transport device for the transport of substrates.
  • the transport device is designed as a turntable which is driven at a constant clock frequency.
  • the substrate can be fed to a process station provided outside the turntable by means of a rotatably mounted substrate gripper.
  • JP 08268512 A relates to a storage unit for storing substrates.
  • the storage unit comprises a sorting unit, by means of which the substrates are sorted automatically and stored or removed in cassettes in the storage unit.
  • the invention has for its object to keep the throughput time of the wafer during processing as short as possible for a system of the type mentioned.
  • the system for processing wafers has one or more production cells in which a number of production and / or measurement units are combined.
  • Each production cell has a loading and unloading station for the delivery and delivery of cassettes with wafers.
  • the wafers can be individually fed in parallel to the manufacturing units and / or measuring units within the manufacturing cell.
  • the main advantage of such a manufacturing cell is that the wafers of a cassette no longer have to be processed serially in the individual manufacturing units and measuring units. Rather, the wafers can be fed individually to the manufacturing and measuring units as required, so that parallel processing of the wafers is made possible within a manufacturing cell. It is particularly advantageous that after processing a wafer, it can be fed immediately to the assigned measuring unit for checking the processing quality.
  • the manufacturing cell advantageously also has a suitable manufacturing unit, in which the wafer can optionally be reworked in the measuring unit immediately after checking.
  • the individual wafers can be fed to the manufacturing and measuring units within a manufacturing cell without intermediate storage. On the one hand, this leads to a further reduction in the throughput times of the wafers through the system. On the other hand, the saving of storage systems leads to considerable cost savings.
  • Figure 1 Schematic representation of a system for processing wafers with several manufacturing cells.
  • Figure 2 Schematic representation of a manufacturing cell according to Figure 1
  • Figure 3 Schematic representation of two linked manufacturing cells.
  • Figure 1 shows an embodiment of a system for processing wafers.
  • the system comprises a large number of production units 1, 1 'for carrying out the production steps required for processing the wafers. These manufacturing steps include machining processes in etching processes, wet chemical processes, diffusion processes and cleaning processes. One or more production units 1, 1 'can be provided for each of these processing operations.
  • the system comprises a large number of measuring units 2, 2 ', in which the results of the individual production steps are checked.
  • the manufacturing units 1, 1 'and measuring units 2, 2' are arranged in a clean room 3. Alternatively, the system can be distributed over a system of clean rooms 3.
  • a small number of production units 1 'and measuring units 2' are arranged in an isolated manner in the clean room 3.
  • the majority of manufacturing 1 and measuring units 2 are arranged in manufacturing cells 4.
  • all manufacturing 1 and measuring units 2 are integrated in manufacturing cells 4, so that no isolated manufacturing 1 'and measuring units 2' remain in the clean room 3.
  • the isolated manufacturing units 1 'and measuring units 2' and the individual manufacturing cells 4 are connected to one another via a transport system.
  • the transport system has a conveyor system 5 and a storage system.
  • the conveyor system 5 can be formed, for example, by a system of roller conveyors.
  • Stocker 6 are preferably used as storage systems.
  • Wafers arranged in cassettes are transported via the conveyor system 5 in predetermined batch sizes.
  • the insulated manufacturing units 1 'and measuring units 2' and the manufacturing cells 4 each have a loading and unloading station 7 for the supply and removal of the cassettes.
  • the storage systems are provided at suitable locations, in which the cassettes are temporarily stored.
  • the storage systems also have a loading and unloading station 7 for loading and unloading with cassettes.
  • a cassette with wafers is fed to the isolated production units 1 'and measuring units 2' via the loading and unloading station 7. After the same manufacturing step has been carried out for all wafers in manufacturing unit 1 'or after the same measuring process has been carried out for all wafers of this cassette in measuring unit 2', the corresponding cassette with the wafers is fed back to the transport system via loading and unloading station 7 .
  • cassettes with wafers in predetermined lot sizes are fed to the manufacturing cells 4.
  • An exemplary embodiment of the manufacturing cell 4 according to the invention is shown in detail in FIG.
  • the manufacturing cell 4 comprises a predetermined number of manufacturing and measuring units 2 that are functionally assigned to one another.
  • the manufacturing cell 4 can be spatially separated from the other units of the system by wall elements 8.
  • the loading and unloading station 7 is arranged on one of these wall elements 8, via which cassettes with wafers are received by the transport system or cassettes with wafers are delivered to the transport system.
  • the loading and unloading station 7 has a plurality of ports 9 for the supply and a plurality of ports 10 for the removal of the cassettes.
  • the supply and removal of cassettes can be done manually or by means of handling devices, not shown.
  • the individual manufacturing and measuring units 2 are not supplied with complete cassettes with wafers but with individual wafers within a manufacturing cell 4.
  • the individual wafers can be identified on the basis of markings so that tracking of the wafers is ensured within the production cell 4 during the processing operations.
  • marks are applied to the wafers that can be identified with detection systems. These marks are preferably affixed to the outer edge regions of the wafers, which after processing are separated as a waste from the usable area inside the wafers.
  • the brands can be barcodes which are identified by means of barcode readers.
  • the loading and unloading station 7 and the manufacturing 1 and measuring units 2 of a manufacturing cell 4 are connected to one another via a sub-transport system.
  • the wafers stored in a cassette and fed via the loading and unloading station 7 are separated on the sub-transport system.
  • the separated wafers are preferably fed to different manufacturing and measuring units 2 of the manufacturing cell 4 in parallel. According to the order of processing the individual wafers successively supplied to different manufacturing and measuring units 2. After the wafers have gone through all the processing processes in the production cell 4, they are stored again in cassettes and output to the transport system via the loading and unloading station 7.
  • the sub-transport system shown in Figure 2 consists essentially of a conveyor system 11 which has branches to the individual manufacturing 1 and measuring units 2.
  • Handling devices 12 which feed the individual wafers to the production units 1, are provided on these branches. In principle, such handling devices 12 can also be provided for the supply to the measuring units 2.
  • the wafers are separated immediately after receipt of a cassette at the loading and unloading station 7.
  • the separation can be carried out by the operating personnel or automatically by means of handling devices (not shown).
  • the wafers are fed individually into specific branches of the conveyor system 11, as a result of which the wafers are fed to the corresponding manufacturing unit 1 or measuring unit 2.
  • manufacturing 1 and measuring units 2 are combined for a lithography process.
  • three different manufacturing units 1 are preferably provided.
  • a manufacturing unit 1 is used to apply photoresist to the wafers.
  • Another manufacturing unit 1 is used to expose photoresist on the wafers.
  • the third manufacturing unit 1 is used to develop photoresist on the wafers.
  • the three different manufacturing units 1 are each operated by a handling device 12. According to the capacity requirement for the manufacturing unit 1, three such arrangements are provided in the manufacturing cell 4.
  • the measuring units 2 for checking the manufacturing steps carried out in the aforementioned manufacturing units 1 can be formed, for example, by control systems which check whether the multilayer structures which have wafers inside are correctly arranged one above the other.
  • Optical control devices for detecting faults on the wafers can be provided as further measuring units 2.
  • the second manufacturing cell 4' has a Arranged unloading station with ports 10 for the removal of the wafers.
  • the transfer station 13 can be formed by a gripper or the like, which converts wafers from the roller conveyor 11 of one manufacturing cell 4 to the roller conveyor 11 of the other manufacturing cell 4.
  • the production capacity of the manufacturing process in question can be increased in a simple manner.
  • the entire system can thus be flexibly adapted to the respectively required production capacities by means of a suitable linking of production cells 4, 4 '.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)

Abstract

La présente invention concerne un système permettant de traiter des plaquettes de silicium, dans au moins une salle blanche (3), avec un agencement d'unités de production (1) et d'unités de mesure (2) qui sont reliées par un système de transport pour transporter des cassettes avec des plaquettes de silicium. Plusieurs unités de production (1) et/ou de mesure (2), montées de façon fonctionnelle, sont réunies pour former une cellule de production (4). Cette cellule de production présente une station de charge et de décharge (7) destinée à recevoir et à livrer des cassettes avec des plaquettes de silicium. A l'intérieur de la cellule de production (4), des plaquettes de silicium individuelles peuvent être amenées aux unités de production (1) et de mesure (2) pour être traitées.
EP00940170A 1999-05-07 2000-05-05 Systeme permettant de traiter des plaquettes de silicium Withdrawn EP1177573A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19921245 1999-05-07
DE19921245A DE19921245C2 (de) 1999-05-07 1999-05-07 Anlage zur Bearbeitung von Wafern
PCT/DE2000/001451 WO2000068973A2 (fr) 1999-05-07 2000-05-05 Systeme permettant de traiter des plaquettes de silicium

Publications (1)

Publication Number Publication Date
EP1177573A2 true EP1177573A2 (fr) 2002-02-06

Family

ID=7907411

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00940170A Withdrawn EP1177573A2 (fr) 1999-05-07 2000-05-05 Systeme permettant de traiter des plaquettes de silicium

Country Status (5)

Country Link
US (1) US6809510B2 (fr)
EP (1) EP1177573A2 (fr)
DE (1) DE19921245C2 (fr)
TW (1) TW497116B (fr)
WO (1) WO2000068973A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10163477B4 (de) * 2001-12-21 2004-01-08 Siemens Ag Transportmodul
JP4170864B2 (ja) * 2003-02-03 2008-10-22 大日本スクリーン製造株式会社 基板処理装置および基板処理装置における基板搬送方法および基板処理方法
DE10326338A1 (de) * 2003-06-05 2004-12-30 Infineon Technologies Ag Halbleiter-Bauelement-Test-Verfahren, sowie Test-System zum Testen von Halbleiter-Bauelementen
DE10328709A1 (de) * 2003-06-24 2005-01-27 Infineon Technologies Ag Halbleiter-Bauelement-Test-Verfahren, sowie Test-System zum Testen von Halbleiter-Bauelementen
JP4670808B2 (ja) * 2006-12-22 2011-04-13 ムラテックオートメーション株式会社 コンテナの搬送システム及び測定用コンテナ
US8108989B2 (en) 2007-06-28 2012-02-07 Crown Equipment Corporation Manufacturing cell and elements of the cell
CN110745530A (zh) * 2018-07-24 2020-02-04 深圳市矽电半导体设备有限公司 一种物料传输自动线及其自动进出料方法
US20210020635A1 (en) * 2019-07-17 2021-01-21 Nanya Technology Corporation Semiconductor structure and method of formation

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5164905A (en) * 1987-08-12 1992-11-17 Hitachi, Ltd. Production system with order of processing determination
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
US5024570A (en) * 1988-09-14 1991-06-18 Fujitsu Limited Continuous semiconductor substrate processing system
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
US5495417A (en) * 1990-08-14 1996-02-27 Kabushiki Kaisha Toshiba System for automatically producing different semiconductor products in different quantities through a plurality of processes along a production line
JPH0616206A (ja) * 1992-07-03 1994-01-25 Shinko Electric Co Ltd クリーンルーム内搬送システム
JPH07297258A (ja) * 1994-04-26 1995-11-10 Tokyo Electron Ltd 板状体の搬送装置
JP3185595B2 (ja) * 1995-04-03 2001-07-11 株式会社ダイフク 基板仕分け装置を備えた荷保管設備
DE19514037C2 (de) * 1995-04-13 1997-09-04 Leybold Ag Transportvorrichtung
US5777876A (en) * 1995-12-29 1998-07-07 Bull Hn Information Systems Inc. Database manufacturing process management system

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
None *
See also references of WO0068973A3 *

Also Published As

Publication number Publication date
WO2000068973A3 (fr) 2001-03-15
TW497116B (en) 2002-08-01
DE19921245A1 (de) 2000-11-16
DE19921245C2 (de) 2003-04-30
US20020064954A1 (en) 2002-05-30
US6809510B2 (en) 2004-10-26
WO2000068973A2 (fr) 2000-11-16

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