EP1014425B1 - Mechanism and method for supporting substrate to be coated with film - Google Patents

Mechanism and method for supporting substrate to be coated with film Download PDF

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Publication number
EP1014425B1
EP1014425B1 EP99125447A EP99125447A EP1014425B1 EP 1014425 B1 EP1014425 B1 EP 1014425B1 EP 99125447 A EP99125447 A EP 99125447A EP 99125447 A EP99125447 A EP 99125447A EP 1014425 B1 EP1014425 B1 EP 1014425B1
Authority
EP
European Patent Office
Prior art keywords
substrate
support members
stage
film
film forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP99125447A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1014425A1 (en
Inventor
Masao Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
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Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of EP1014425A1 publication Critical patent/EP1014425A1/en
Application granted granted Critical
Publication of EP1014425B1 publication Critical patent/EP1014425B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips

Definitions

  • the present invention relates to a mechanism and method for supporting a substrate to be coated with a film, for use in liquid crystal display devices and semiconductor devices such as transistors.
  • a CVD (Chemical Vapor Deposition) apparatus for forming a thin film on a surface of a supported wafer.
  • a susceptor is used as a wafer support mechanism.
  • a wafer is placed on a top of the bearing surface of the susceptor which is horizontally held.
  • the susceptor is angularly displaced so that the bearing surface is vertical.
  • Wafer chuck pins are fixed to the bearing surface.
  • the wafer chuck pins support the wafer on the bearing surface and prevent the wafer from falling due to the angular displacement of the susceptor. After the film has been formed, the susceptor is angularly displaced again so that the bearing surface is horizontal. In this state, the wafer is lifted up and transported away.
  • Patent Abstracts of Japan of document JP-A-58-40837 disclose a clamping device in which a semiconductor wafer is supported by a mount plate for processing. Claws are arranged under the stage that protrude therefrom and are slanted when the mount plate is raised so as to securely hold the wafer during processing thereof.
  • An object of the present invention is to provide a mechanism and a method for supporting a substrate to be coated with a thin film, which mechanism and method enable transporting the substrate coated with a thin film out of a film forming apparatus without damaging the thin film as well as the substrate.
  • this object is accomplished by a mechanism as defined in claim 1, and by a method as defined in claim 9.
  • the support members which support an end surface of a substrate to be coated with a film, are movable during film formation, peeling-off of the thin film which has been formed on the substrate, as well as cracks and chips in the substrate coated with the thin film can be almost completely prevented by moving the support members before transporting the substrate out of the film forming apparatus after formation of the film.
  • the support members are moved in parallel, peeling-off of the thin film formed on the substrate, as well as cracks and chips in the substrate can be almost completely prevented by moving the support members before transporting the substrate out of the film forming apparatus after formation of the film.
  • the support members since the direction of movement of the support members is a direction towards or away from the shaft member, the support members can be prevented from rubbing against the end surface of the substrate on which a film has been formed when the support members are moved. Accordingly, dust caused by rubbing can be prevented from being contained in the thin film, with the result that the quality of the thin film is improved.
  • the plurality of support members can be moved in one operation by a single moving means, which makes the structure of the support mechanism simple.
  • the plurality of support members can be moved independently by the moving means respectively provided for the plurality of support members, so that, for example, the respective support members can move in different manners.
  • the movement of the support members can be achieved by an actuator having a simple structure.
  • the support members are formed in a columnar shape, the areas of the surfaces of the support members which come into contact with the end surface of the substrate to be coated with a film can be decreased. Accordingly, the thin film which has been formed on the substrate tends not to adhere to the support members and peeling-off of the thin film from the substrate, as well as cracks and chips in the substrate can be almost completely prevented.
  • the support members are moved in a direction parallel to one side of the stage, peeling-off of the thin film formed on the substrate, as well as cracks and chips in the substrate can be almost completely prevented.
  • the support members can be prevented from rubbing against the end surface of the substrate on which a film has been formed, when the support members are moved. Accordingly, dusts caused by rubbing can be prevented from being contained in the thin film, thereby enabling the quality of the thin film to be improved.
  • the thin film when the thin film is formed on a glass substrate or a semiconductor wafer, peeling-off of the thin film which has been formed on the glass substrate or the semiconductor wafer, as well as cracks and chips in the glass substrate or the semiconductor wafer can be almost completely prevented.
  • Fig. 1 is a view showing a film forming apparatus 10.
  • the film forming apparatus 10 comprises a load lock chamber 11 which can be sealed, a transport chamber 12, and a film forming chamber 13.
  • the load lock chamber 11 is a passage through which a substrate M to be coated with a film is transported into the film forming apparatus.
  • the transport chamber 12 is connected to the load lock chamber 11 and has a vacuum robot 14 for transporting the substrate M in a vacuum.
  • the film forming chamber 13 is connected to the transport chamber 12 and has a support mechanism 20 for supporting the substrate M.
  • a gate valve 15 is provided between the load lock chamber 11 and the transport chamber 12, and a gate valve 16 is provided between the transport chamber 12 and the film forming chamber 13.
  • Exhaust pipes 17 and 18 are respectively provided in the transport chamber 12 and film forming chamber 13.
  • a substrate M is fed into the interior of the load lock chamber 11 from one end thereof.
  • the load lock chamber 11, the transport chamber 12, and the film forming chamber 13 are then sealed.
  • the gate valves 15 and 16 are then closed and gas inside is exhausted via the exhaust pipes 17 and 18. A vacuum is thus created inside the transport chamber 12 and the film forming chamber 13.
  • the gate valve 15 opens.
  • the vacuum robot 14 in the transport chamber 12 extends an arm 14a and receives the substrate M to transport the substrate M to the gate valve 16.
  • the gate valve 15 is closed.
  • the vacuum robot 14 again extends an arm and transfers the substrate M onto the support mechanism 20 inside the film forming chamber 13.
  • the gate valve 16 is closed.
  • the substrate M is fed back in reverse along the transporting path and is taken out from the load lock chamber 11.
  • Fig. 2 is a perspective view showing the support mechanism 20 of the film forming apparatus 10 and Fig. 3 is a side view of the same.
  • the support mechanism 20 has a stage 21, a shaft member 22, support pins 23, 24 and the like.
  • the stage 21 is constituted with a rectangular plate-shaped member and has a flat substrate bearing surface 21a on which the substrate M is placed. Directions parallel to two adjacent sides of the stage 21 are taken as direction X and direction Y.
  • the shaft member 22 is disposed at a predetermined distance from the stage 21 facing an end surface 21b of the stage 21 and extends in the direction X.
  • the stage 21 and the shaft member 22 are linked by link members 25 and 26.
  • the shaft member 22 is rotatable in directions Q about a longitudinal axis thereof. After the substrate M on which film formation has been completed has been transported out by the vacuum robot 14 and while the receipt of the next substrate M by the vacuum robot 14 is being awaited, the shaft member 22 supports the stage 21 in a horizontal state. A position where the stage 21 is being supported in a horizontal state to receive the substrate is hereafter called a substrate receiving position. When film formation is performed, the shaft member 22 rotates to angularly displace the stage 21 up to a film forming position where the substrate bearing surface 21a becomes parallel with a vertical or substantially vertical direction.
  • the support pins 23, 24 are provided at an end portion of the substrate bearing surface 21a so as to protrude upright from the substrate bearing surface 21a.
  • the support pins 23, 24 can support the end surface of the substrate M from beneath even when the stage 21 is lifted up to the film forming position by rotation of the shaft member 22.
  • the support pins 23, 24 are each formed in a columnar shape and have a small area of contact with the end surface of the substrate M. Accordingly, the thin film which has been formed on the substrate M tends not to adhere to the support pins 23, 24, and peeling-off of the thin film from the substrate M and cracks or chips in the substrate M can be prevented.
  • the support pins 23, 24 are also both connected to an actuator 27 and can move in the direction Y, namely in a direction in which the pins 23, 24 they either move towards or away from the shaft member 22. After film formation, the support pins 23, 24, contacting with an end surface of the substrate M can be separated therefrom without damaging the substrate M or the thin film which has been formed thereon.
  • the movement of the support pins 23, 24 may be a movement where they move towards the shaft member 22 in the direction Y, a reciprocating motion where after this towards movement they move away from the shaft member 22, or a cyclic oscillating movement.
  • support pins 23, 24 are moved by the actuator 27, but dedicated actuators may be individually provided for the respective support pin 23, 24 so as to move the support pins independently of each other.
  • the substrate M is transported into the film forming chamber 13 and is placed on the stage 21.
  • the stage 21 is angularly displaced from the substrate receiving position at which the substrate M is placed on the stage 21, to the film forming position at which the substrate bearing surface 21a of the stage 21 becomes vertical or substantially vertical.
  • the end surface of the substrate M is thus supported from beneath by the support pins 23, 24.
  • the stage 21 is angularly displaced from the film forming position back to the substrate receiving position. Once the stage 21 has returned to the substrate receiving position from the film forming position, the actuator 27 is driven so as to move the support pins 23, 24. Finally, the substrate M is lifted up and transported out from the film forming chamber 13.
  • the mechanism and method for supporting a substrate to be coated with a film of the invention may be applied to a film forming apparatus for forming a desired film on a glass substrate or a semiconductor wafer.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
EP99125447A 1998-12-22 1999-12-20 Mechanism and method for supporting substrate to be coated with film Expired - Lifetime EP1014425B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36531098 1998-12-22
JP36531098A JP3695971B2 (ja) 1998-12-22 1998-12-22 成膜装置および成膜方法

Publications (2)

Publication Number Publication Date
EP1014425A1 EP1014425A1 (en) 2000-06-28
EP1014425B1 true EP1014425B1 (en) 2008-02-13

Family

ID=18483950

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99125447A Expired - Lifetime EP1014425B1 (en) 1998-12-22 1999-12-20 Mechanism and method for supporting substrate to be coated with film

Country Status (6)

Country Link
US (1) US20030172874A1 (ja)
EP (1) EP1014425B1 (ja)
JP (1) JP3695971B2 (ja)
KR (1) KR100355484B1 (ja)
DE (1) DE69938120T2 (ja)
TW (1) TW457615B (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100819369B1 (ko) * 2001-12-31 2008-04-04 엘지.필립스 엘시디 주식회사 노광용 척
JP4364196B2 (ja) 2005-01-05 2009-11-11 三星モバイルディスプレイ株式會社 トレイ用整列システム
CN102177270B (zh) * 2008-11-14 2013-09-04 株式会社爱发科 有机薄膜蒸镀装置、有机el元件制造装置、及有机薄膜蒸镀方法
KR101470883B1 (ko) * 2008-12-29 2014-12-10 주식회사 케이씨텍 원자층 증착장치
WO2011024853A1 (ja) * 2009-08-26 2011-03-03 キヤノンアネルバ株式会社 成膜装置
US8898928B2 (en) * 2012-10-11 2014-12-02 Lam Research Corporation Delamination drying apparatus and method
CN104516131B (zh) * 2014-12-24 2018-02-13 合肥京东方光电科技有限公司 一种贴膜治具
CN105172302A (zh) * 2015-08-24 2015-12-23 苏州英多智能科技股份有限公司 翻转式真空贴合治具
US10573549B2 (en) 2016-12-01 2020-02-25 Lam Research Corporation Pad raising mechanism in wafer positioning pedestal for semiconductor processing
US9892956B1 (en) * 2016-10-12 2018-02-13 Lam Research Corporation Wafer positioning pedestal for semiconductor processing
US9960068B1 (en) 2016-12-02 2018-05-01 Lam Research Corporation Moment cancelling pad raising mechanism in wafer positioning pedestal for semiconductor processing
IT201700119768A1 (it) * 2017-10-23 2019-04-23 Incitec Production S R L Dispositivo per l'accoppiamento di porzioni di materiale
CN109850238A (zh) * 2019-01-31 2019-06-07 武汉精毅通电子技术有限公司 显示面板贴膜装置
CN110203698B (zh) * 2019-05-24 2021-11-09 上海提牛机电设备有限公司 一种方形件的搬运翻转装置
CN112117204B (zh) * 2020-09-10 2022-10-14 安徽龙芯微科技有限公司 一种封装结构的制作方法
KR102340103B1 (ko) 2021-09-01 2021-12-17 (주)한테크 초박형 유리기판 이송장치 및 이송방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840837A (ja) * 1981-09-02 1983-03-09 Tokyo Ohka Kogyo Co Ltd クランプ装置
JPH08107076A (ja) * 1994-10-06 1996-04-23 Sony Corp バッチ式減圧ｃｖｄ装置
JP3288554B2 (ja) * 1995-05-29 2002-06-04 株式会社日立製作所 イオン注入装置及びイオン注入方法
JP3720515B2 (ja) * 1997-03-13 2005-11-30 キヤノン株式会社 基板処理装置及びその方法並びに基板の製造方法

Also Published As

Publication number Publication date
DE69938120D1 (de) 2008-03-27
DE69938120T2 (de) 2009-02-05
JP3695971B2 (ja) 2005-09-14
KR100355484B1 (ko) 2002-10-11
US20030172874A1 (en) 2003-09-18
JP2000188315A (ja) 2000-07-04
TW457615B (en) 2001-10-01
KR20000048313A (ko) 2000-07-25
EP1014425A1 (en) 2000-06-28

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