EP1001561B1 - Infrared communication device - Google Patents
Infrared communication device Download PDFInfo
- Publication number
- EP1001561B1 EP1001561B1 EP99122394A EP99122394A EP1001561B1 EP 1001561 B1 EP1001561 B1 EP 1001561B1 EP 99122394 A EP99122394 A EP 99122394A EP 99122394 A EP99122394 A EP 99122394A EP 1001561 B1 EP1001561 B1 EP 1001561B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- communication device
- lens
- infrared communication
- infrared
- infrared led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/11—Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
- H04B10/114—Indoor or close-range type systems
Definitions
- the present invention relates to an infrared communication device according to the generic clause of claim 1 which is capable of the bi-directional communication of data between electric instruments such as a personal computer, printer, PDA, facsimile equipment, pager, and portable telephone.
- a device according to the generic clause of claim 1 is already known from document FR 24 94 912A .
- FIG. 7 is a perspective view of the infrared communication device
- Fig. 8 shows a radiation pattern of infrared LED elements
- Fig. 9 shows a radiation pattern of a semi-spherical lens.
- an infrared communication device 1 has a substrate 2 made of glass epoxy resin having thermally stable and insulative properties. On the substrate, an electrode pattern (not shown) is formed. There is mounted four infrared LED elements 3 (Fig. 9) as light emitting elements and a photodiode (not shown) as a light receiving element on the electrode pattern on the substrate by die bonding and wire bonding. The infrared LED elements and the photodiode are electrically connected to the electrode pattern by die bond paste such as silver paste as a conductive adhesive. Furthermore, other electronic parts such as an IC chip are mounted on the substrate.
- the infrared LED elements and others are covered by a light transmissive resin 7 such as an epoxy resin in which a visible rays cuting material is included.
- the infrared LED elements are covered by resin 7a and the photodiode is covered by resin 7b.
- the resin 7 allows the infrared LED and the photodiode to emit and receive the light, and also protects the elements.
- the substrate, infrared LED and photodiode are mounted in a shield case 8 made of metal such as stainless steel, aluminum, copper or iron. Since the shield case 8 covers the infrared LED, photodiode and circuit, outside noises are blocked. Ends 9 of the shield case 8 are connected to a ground (not shown) .
- the infrared LED element 3 has a narrow directivity, so that the infrared rays are transmitted a long distance.
- the angle of four infrared LED elements 3 are positioned so as to widely spread in the X direction (Fig. 7) as shown by reference B in Fig. 8. As a result, the radiating width in the direction Z perpendicular to the X direction is narrow as shown by reference C in Fig. 9.
- An object of the present invention is to provide an infrared communication device in which infrared LED elements can be easily mounted in the device, and having a sufficient radiation pattern.
- An infrared communication device 10 of the first embodiment of the present invention is provided with four infrared LED elements 11 as a light emitting element device, a photodiode 12 as a light receiving element, an IC chip 13 and other electronic parts are mounted on the electrode pattern of the substrate 2 by die bonding of silver paste, and wire-bond mounted by bonding wires 14 of gold.
- the four infrared LED elements 11 are arranged on the straight in the X direction and enclosed by a reflective cup 15.
- the photodiode 12 is disposed on the X line.
- the infrared LED elements 11, photodiode 12, IC chip 13 and others are covered by a light transmissive resin 16 such as an epoxy resin.
- a semi-cylindrical lens 16a and a semi-spherical lens 16b are formed integrally with the resin 16, so that the infrared rays are radiated and received.
- the semi-cylindrical lens 16a is formed such that the axis thereof coincides with the arrangement line of the infrared LED elements 11 and the photodiode 12.
- the radiation pattern D of the infrared rays emitted from the infrared LED elements 11 is marrow in the Z direction.
- the radiation pattern E is wide as shown in Fig. 4.
- the directivity of the single infrared LED element is narrow, a wide directivity and high light power can be obtained by arranging a plurality of elements.
- the infrared communication device 10A is different from the first embodiment in the shape of the lens 16c.
- the lens 16c has an elongated semi-spherical shape extended in the X direction.
- the radiation pattern is further expanded by the elongated semi-spherical shape lens 16c as shown by the reference F in Fig. 6.
- each of the surfaces may be formed into a semi-spherical shape, thereby further expanding the radiation pattern E.
- the infrared communication device can be largely miniaturized. Furthermore, since the number of lens is small, the device can be easily manufactured at a low cost.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Led Device Packages (AREA)
- Optical Communication System (AREA)
- Light Receiving Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33503298 | 1998-11-11 | ||
JP33503298A JP4172558B2 (ja) | 1998-11-11 | 1998-11-11 | 赤外線通信デバイス |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1001561A2 EP1001561A2 (en) | 2000-05-17 |
EP1001561A3 EP1001561A3 (en) | 2003-12-03 |
EP1001561B1 true EP1001561B1 (en) | 2005-08-03 |
Family
ID=18283984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99122394A Expired - Lifetime EP1001561B1 (en) | 1998-11-11 | 1999-11-10 | Infrared communication device |
Country Status (5)
Country | Link |
---|---|
US (1) | US20030081288A1 (ja) |
EP (1) | EP1001561B1 (ja) |
JP (1) | JP4172558B2 (ja) |
DE (1) | DE69926468T2 (ja) |
TW (1) | TW437189B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6577877B1 (en) * | 2000-02-23 | 2003-06-10 | Motorola, Inc. | Wireless infrared peripheral interface for a communication device |
JP2002025326A (ja) * | 2000-07-13 | 2002-01-25 | Seiko Epson Corp | 光源装置、照明装置、液晶装置及び電子機器 |
GB2369736A (en) * | 2000-12-01 | 2002-06-05 | Martin Lawrence | Using cylindrical lenses to facilitate optical communications with moving devices |
JP4902046B2 (ja) * | 2000-12-15 | 2012-03-21 | ローム株式会社 | 赤外線データ通信モジュールおよびその製造方法 |
US20040218766A1 (en) * | 2003-05-02 | 2004-11-04 | Angell Daniel Keith | 360 Degree infrared transmitter module |
JP5698210B2 (ja) * | 2012-12-19 | 2015-04-08 | 本田技研工業株式会社 | 燃料電池車両 |
JP6307692B2 (ja) * | 2015-11-04 | 2018-04-11 | 株式会社オーディオテクニカ | 受光器 |
WO2018063247A1 (en) * | 2016-09-29 | 2018-04-05 | Intel Corporation | Optical free air transmit and receive interconnect |
US10523338B2 (en) * | 2016-09-29 | 2019-12-31 | Intel Corporation | Lens for free air optical interconnect |
JP7049769B2 (ja) * | 2017-02-22 | 2022-04-07 | 株式会社本田電子技研 | 自動ドア開閉制御用センサ |
CA3130380A1 (en) | 2020-09-10 | 2022-03-10 | Saco Technologies Inc. | Light shaping assembly having light sources mounted on a pcb via supporting pins bent for orienting light toward a projector lens |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2494912A1 (fr) * | 1980-11-21 | 1982-05-28 | Radiotechnique Compelec | Dispositif photocoupleur de detection |
JPS6029725A (ja) * | 1983-07-28 | 1985-02-15 | Hoya Corp | 音響光学変調装置 |
JPS63176A (ja) * | 1986-06-19 | 1988-01-05 | Honda Motor Co Ltd | 複合型光センサ |
US5130531A (en) * | 1989-06-09 | 1992-07-14 | Omron Corporation | Reflective photosensor and semiconductor light emitting apparatus each using micro Fresnel lens |
US5122893A (en) * | 1990-12-20 | 1992-06-16 | Compaq Computer Corporation | Bi-directional optical transceiver |
JP3025109B2 (ja) * | 1992-03-11 | 2000-03-27 | シャープ株式会社 | 光源および光源装置 |
US5506445A (en) * | 1994-06-24 | 1996-04-09 | Hewlett-Packard Company | Optical transceiver module |
JP3461653B2 (ja) * | 1995-10-19 | 2003-10-27 | 富士ゼロックス株式会社 | 光ファイバ伝送と自由空間伝送に共用可能な光送受信器および光通信ネットワーク |
CA2166334C (en) * | 1995-12-29 | 2001-12-25 | Albert John Kerklaan | Combination diffused and directed infrared transceiver |
DE19653793C2 (de) * | 1996-12-21 | 1999-11-18 | Vishay Semiconductor Gmbh | Transceiver Bauelement zur optischen Datenübertragung |
JP3786227B2 (ja) * | 1997-02-19 | 2006-06-14 | シチズン電子株式会社 | 赤外線データ通信モジュール及びその製造方法 |
DE19727633C2 (de) * | 1997-06-28 | 2001-12-20 | Vishay Semiconductor Gmbh | Bauteil zur gerichteten, bidirektionalen, optischen Datenübertragung |
-
1998
- 1998-11-11 JP JP33503298A patent/JP4172558B2/ja not_active Expired - Fee Related
-
1999
- 1999-11-10 US US09/437,489 patent/US20030081288A1/en not_active Abandoned
- 1999-11-10 DE DE69926468T patent/DE69926468T2/de not_active Expired - Lifetime
- 1999-11-10 TW TW088119644A patent/TW437189B/zh not_active IP Right Cessation
- 1999-11-10 EP EP99122394A patent/EP1001561B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP4172558B2 (ja) | 2008-10-29 |
EP1001561A2 (en) | 2000-05-17 |
DE69926468D1 (de) | 2005-09-08 |
DE69926468T2 (de) | 2006-04-06 |
EP1001561A3 (en) | 2003-12-03 |
US20030081288A1 (en) | 2003-05-01 |
JP2000150924A (ja) | 2000-05-30 |
TW437189B (en) | 2001-05-28 |
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