EP1001053A1 - Procédé pour la fabrication des fils étamés à chaud - Google Patents

Procédé pour la fabrication des fils étamés à chaud Download PDF

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Publication number
EP1001053A1
EP1001053A1 EP99122362A EP99122362A EP1001053A1 EP 1001053 A1 EP1001053 A1 EP 1001053A1 EP 99122362 A EP99122362 A EP 99122362A EP 99122362 A EP99122362 A EP 99122362A EP 1001053 A1 EP1001053 A1 EP 1001053A1
Authority
EP
European Patent Office
Prior art keywords
wire
tin
layer
hot
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99122362A
Other languages
German (de)
English (en)
Inventor
Manfred Sonnefeld
Jörg Liedermann
Georg Sallmon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Feindrahtwerk Adolf Edelhoff GmbH and Co
Original Assignee
Feindrahtwerk Adolf Edelhoff GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Feindrahtwerk Adolf Edelhoff GmbH and Co filed Critical Feindrahtwerk Adolf Edelhoff GmbH and Co
Publication of EP1001053A1 publication Critical patent/EP1001053A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/024—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0607—Wires

Definitions

  • the invention relates to a method for producing tinned wires Non-ferrous metals, especially copper or copper alloys for electrical engineering Purposes through two-stage finishing, the wires having a diameter of 0.1 to 2 mm and where the non-ferrous metal at least as a jacket on the Wire core is applied.
  • the invention is based on a two-stage finishing process for non-ferrous metal wires, as described in DE-PS 3420514 by the applicant. There the wires are first hot-dip tinned and then galvanized (electrolytically) tinned. This method has proven very successful, the ones treated in this way Wires, however, cannot meet those customer needs that are special high wear resistance of the wire surface and at the same time less Include layer thickness.
  • Hot-dip tinning is the good solderability, hardness and wear resistance of the Layer, which also results in better storage stability and good adhesion the tin layer on the wire material.
  • the advantage of this good liability is by an automatic process on the barrier layer of base material copper and tin layer that also forms the basis for an important one Disadvantages of hot-dip tinning represent. There is a diffusion of tin in the copper layer of the wire and a diffusion of copper into the tin.
  • the galvanic tinning has the advantage that the tin layer grows takes place concentrically on the wire, that is, a very uniform layer thickness can be produced is.
  • this layer is relatively soft and has less wear resistance with high loads. Neither is formed immediately Diffusion layer between wire and tin layer, so the latter is not so has good adhesion to the wire and is therefore more likely to flake off the tin layer when bending the wire.
  • whiskers are needle-shaped crystals that come out of the layer can grow out.
  • lead to the tin bath in the formation of a whisker is avoided in the tin-lead layer that forms.
  • tin-lead alloys with 5% or 40% or 70% Proportion of lead.
  • the invention proposes that characterized in claim 1 Characteristics before.
  • the invention is based on the idea that the outer layer of the wire is a Hot-dip tinning should have because of the surface properties described and good solderability.
  • a nickel layer as an order on the wire, which is preferably a copper or copper alloy wire, there is no diffusion layer as in the case of using tin.
  • Ni3Sn4 nickel and tin diffusion layer Ni3Sn4.
  • Theoretically possible formation of this diffusion layer takes place so slowly that it during the usual use of such wires for a few decades does not matter. Nevertheless, this nickel layer has very good adhesion to the wire.
  • the galvanic application can keep this layer thin, at very uniform thickness of this layer.
  • the minimum permissible layer thickness for the tin is however 0.5 ⁇ m, preferably 1 ⁇ m. So you can get the total tin reduce significantly compared to the usual hot tinning.
  • the wire is nickel-plated in a galvanic manner Bath with a throughput speed of 15-360 m / min., Preferably 17 m / min.
  • the hot-dip tinning takes place in a melt at temperatures between 400 ° C and 260 ° C with a residence time between 2 and 30 sec.
  • aluminum or a can be used as the non-ferrous metal for the wire Aluminum alloy can be used.
  • the wire does not have to be made of solid material exist, but copper sheathed wires with a steel core can be used be on which the layer of copper or copper alloys in a known manner is applied mechanically or electrolytically.
  • the type of training these copper sheathed wires - these are known - are not the subject of Invention and are not described here in detail.
  • the melt can either be pure tin or preferably a tin-lead alloy with a lead content of 5% or 40% or 70% included.
  • the hot-dip tinning it is necessary to carry out the hot-dip tinning provided that the excess tin or tin-lead on the wire after it Pass through the hot-dip tinning bath on a scraper to achieve the desired layer thickness is stripped.
  • the invention is not on use limited by scraper stones. Other methods of achievement the desired layer thickness of the tin when the wire runs out of the hot-dip tinning bath are applicable.
  • non-ferrous wires for electrical engineering Purposes with a diameter of 0.1 to 2 mm.
  • Copper wires or copper sheathed wires can also be made of copper alloys such as B. German silver, bronze and brass can be used.
  • a wire is shown in section, the core material 1 made of copper or a copper alloy.
  • An intermediate layer 2 consists of nickel with a layer thickness of about 2 ⁇ m.
  • Tin layer 3 which is made of tin-lead with a layer thickness of at least 1 ⁇ m.
  • this tin layer 3 is uniform in its layer thickness shown, for the aforementioned reasons, however, this layer can be uneven Have thickness.
  • the bare wire 5 runs from a winder 4 through a degreasing bath 6 from which the wire then passes into a sink 7 and then into a pickle 8. On the latter is followed by the galvanic nickel plating bath 9, in which several Deflection rollers 10 and 11 are arranged. To achieve a corresponding Dwell time of the wire in the nickel plating bath, with a small spatial expansion the latter, the wire is in several turns over the pulleys guided. To overcome the resulting mechanical resistance the rollers 10 are driven by a motor 12. After leaving of the nickel plating bath, the wire passes through a sink 13.
  • the wire 5 passes through a deflecting roller 16 and 17 which is filled with soldering water Flux basin 18
  • the bare wire runs from this over a deflection roller 19 obliquely into a tin bath 20, which has a temperature of about 260 ° C to 400 ° C. having.
  • a further deflection roller 21 via which the The wire is deflected vertically upwards and in the area of a scraper stone 22 leaves the tin bath.
  • the wire then runs in the vertical direction up a cooling section 23, which has a length of about 2.5 - 3.0 m.
  • the cooling section is formed by a tube in which the wire runs and is blown with air in counterflow.
  • the Wire 5 which is now fully tinned, deflected downwards and by one Spool 25 wound up.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Coating With Molten Metal (AREA)
EP99122362A 1998-11-13 1999-11-10 Procédé pour la fabrication des fils étamés à chaud Withdrawn EP1001053A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19852271 1998-11-13
DE19852271A DE19852271A1 (de) 1998-11-13 1998-11-13 Verfahren zur Herstellung verzinnter Drähte

Publications (1)

Publication Number Publication Date
EP1001053A1 true EP1001053A1 (fr) 2000-05-17

Family

ID=7887616

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99122362A Withdrawn EP1001053A1 (fr) 1998-11-13 1999-11-10 Procédé pour la fabrication des fils étamés à chaud

Country Status (2)

Country Link
EP (1) EP1001053A1 (fr)
DE (1) DE19852271A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2843130A1 (fr) * 2002-08-05 2004-02-06 Usinor Procede de revetement de la surface d'un materiau metallique, dispositif pour sa mise en oeuvre et produit ainsi obtenu

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012017520A1 (de) * 2012-09-05 2014-03-06 Feindrahtwerk Adolf Edelhoff Gmbh & Co. Kg Verfahren zur Zinnbeschichtung eines metallischen Substrats,Verfahren zur Härtung einer Zinnschicht, sowie Draht mit einer Zinnbeschichtung
DE102014108347A1 (de) * 2014-06-13 2015-12-17 Leoni Bordnetz-Systeme Gmbh Elektrischer Litzenleiter sowie Verfahren zur Herstellung eines elektrischen Litzenleiters

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3875027A (en) * 1973-06-29 1975-04-01 Bundy Corp Method of electroplating tubing prior to terne alloy coating
US4014660A (en) * 1973-11-12 1977-03-29 Siemens Aktiengesellschaft Hot-tinned wire for electrotechnical purposes and method for its production
JPS5281031A (en) * 1975-12-29 1977-07-07 Dipsol Chem Method of activating nickel plated surface
JPH0551721A (ja) * 1991-08-16 1993-03-02 Sumiden Fine Kondakuta Kk めつき線の製造方法
DE29614464U1 (de) * 1996-08-21 1996-11-28 Feindrahtwerk Adolf Edelhoff GmbH & Co, 58640 Iserlohn Draht mit einer lötbaren metallischen Außenbeschichtung auf einer Aluminiumlegierung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB454415A (en) * 1935-04-02 1936-09-30 Gustav Radtke Coating electrolytically iron and iron alloys with firmly adherent and impermeable films or layers of metal or metals

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3875027A (en) * 1973-06-29 1975-04-01 Bundy Corp Method of electroplating tubing prior to terne alloy coating
US4014660A (en) * 1973-11-12 1977-03-29 Siemens Aktiengesellschaft Hot-tinned wire for electrotechnical purposes and method for its production
JPS5281031A (en) * 1975-12-29 1977-07-07 Dipsol Chem Method of activating nickel plated surface
JPH0551721A (ja) * 1991-08-16 1993-03-02 Sumiden Fine Kondakuta Kk めつき線の製造方法
DE29614464U1 (de) * 1996-08-21 1996-11-28 Feindrahtwerk Adolf Edelhoff GmbH & Co, 58640 Iserlohn Draht mit einer lötbaren metallischen Außenbeschichtung auf einer Aluminiumlegierung

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 7734, Derwent World Patents Index; AN 1977-59871y, XP002129814, "Activation of nickel plated surfaces - using a mineral acid and an aliphatic halide" *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 361 (C - 1080) 8 July 1993 (1993-07-08) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2843130A1 (fr) * 2002-08-05 2004-02-06 Usinor Procede de revetement de la surface d'un materiau metallique, dispositif pour sa mise en oeuvre et produit ainsi obtenu
WO2004015169A2 (fr) * 2002-08-05 2004-02-19 Usinor Procede de revetement de la surface d'un materiau metallique, dispositif pour sa mise en oeuvre et produit ainsi obtenu
WO2004015169A3 (fr) * 2002-08-05 2004-05-13 Usinor Procede de revetement de la surface d'un materiau metallique, dispositif pour sa mise en oeuvre et produit ainsi obtenu

Also Published As

Publication number Publication date
DE19852271A1 (de) 2000-05-18

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