EP0880785A1 - Verfahren zur imprägnierung von elektrisch leitenden substraten - Google Patents
Verfahren zur imprägnierung von elektrisch leitenden substratenInfo
- Publication number
- EP0880785A1 EP0880785A1 EP96934760A EP96934760A EP0880785A1 EP 0880785 A1 EP0880785 A1 EP 0880785A1 EP 96934760 A EP96934760 A EP 96934760A EP 96934760 A EP96934760 A EP 96934760A EP 0880785 A1 EP0880785 A1 EP 0880785A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- impregnation
- resin
- resin system
- temperature
- comonomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000008569 process Effects 0.000 title claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 124
- 239000011347 resin Substances 0.000 claims abstract description 124
- 238000005470 impregnation Methods 0.000 claims abstract description 51
- 238000004804 winding Methods 0.000 claims abstract description 45
- 239000004033 plastic Substances 0.000 claims abstract description 6
- 229920003023 plastic Polymers 0.000 claims abstract description 6
- 239000000654 additive Substances 0.000 claims abstract description 4
- 229920000642 polymer Polymers 0.000 claims abstract description 3
- 238000010438 heat treatment Methods 0.000 claims description 29
- -1 diallyl phthalates Chemical class 0.000 claims description 18
- 239000000155 melt Substances 0.000 claims description 18
- 239000004848 polyfunctional curative Substances 0.000 claims description 14
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 14
- 230000005855 radiation Effects 0.000 claims description 13
- 229920006305 unsaturated polyester Polymers 0.000 claims description 11
- 229920001567 vinyl ester resin Polymers 0.000 claims description 9
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 8
- HNPDNOZNULJJDL-UHFFFAOYSA-N ethyl n-ethenylcarbamate Chemical class CCOC(=O)NC=C HNPDNOZNULJJDL-UHFFFAOYSA-N 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 229920003055 poly(ester-imide) Polymers 0.000 claims description 7
- 229920000728 polyester Polymers 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 6
- 230000006698 induction Effects 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 6
- VTLKLYJOUVMHIY-UHFFFAOYSA-N 3-ethenylpenta-1,3-diene;urea Chemical compound NC(N)=O.CC=C(C=C)C=C VTLKLYJOUVMHIY-UHFFFAOYSA-N 0.000 claims description 4
- YCZVNBQAIZENBU-UHFFFAOYSA-N NC(=O)N.C(=C)C=CC=C Chemical compound NC(=O)N.C(=C)C=CC=C YCZVNBQAIZENBU-UHFFFAOYSA-N 0.000 claims description 4
- 239000005062 Polybutadiene Substances 0.000 claims description 4
- 238000005266 casting Methods 0.000 claims description 4
- 238000007598 dipping method Methods 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 4
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 claims description 4
- 150000001451 organic peroxides Chemical class 0.000 claims description 4
- 229920002857 polybutadiene Polymers 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims description 3
- 150000003949 imides Chemical class 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 101100495769 Caenorhabditis elegans che-1 gene Proteins 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 229920000965 Duroplast Polymers 0.000 abstract 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 14
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 12
- 239000002904 solvent Substances 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 229920003192 poly(bis maleimide) Polymers 0.000 description 8
- 150000003254 radicals Chemical class 0.000 description 8
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 7
- 239000001530 fumaric acid Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 150000001991 dicarboxylic acids Chemical class 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 238000002411 thermogravimetry Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 150000002978 peroxides Chemical class 0.000 description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000011248 coating agent Chemical class 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000000499 gel Substances 0.000 description 3
- 125000005462 imide group Chemical group 0.000 description 3
- 239000004922 lacquer Substances 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920005862 polyol Polymers 0.000 description 3
- 150000003077 polyols Chemical class 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 3
- 239000004641 Diallyl-phthalate Substances 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 2
- 150000001723 carbon free-radicals Chemical class 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- MFEWNFVBWPABCX-UHFFFAOYSA-N 1,1,2,2-tetraphenylethane-1,2-diol Chemical compound C=1C=CC=CC=1C(C(O)(C=1C=CC=CC=1)C=1C=CC=CC=1)(O)C1=CC=CC=C1 MFEWNFVBWPABCX-UHFFFAOYSA-N 0.000 description 1
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
- PUKLCKVOVCZYKF-UHFFFAOYSA-N 1-[2-(2,5-dioxopyrrol-1-yl)ethyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCN1C(=O)C=CC1=O PUKLCKVOVCZYKF-UHFFFAOYSA-N 0.000 description 1
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
- JHSWSKVODYPNDV-UHFFFAOYSA-N 2,2-bis(prop-2-enoxymethyl)propane-1,3-diol Chemical compound C=CCOCC(CO)(CO)COCC=C JHSWSKVODYPNDV-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- LZDXRPVSAKWYDH-UHFFFAOYSA-N 2-ethyl-2-(prop-2-enoxymethyl)propane-1,3-diol Chemical compound CCC(CO)(CO)COCC=C LZDXRPVSAKWYDH-UHFFFAOYSA-N 0.000 description 1
- IGDCJKDZZUALAO-UHFFFAOYSA-N 2-prop-2-enoxypropane-1,3-diol Chemical compound OCC(CO)OCC=C IGDCJKDZZUALAO-UHFFFAOYSA-N 0.000 description 1
- BQJITCRVRYNXIN-UHFFFAOYSA-N 3-[4-(2,5-dioxopyrrol-3-yl)butyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(CCCCC=2C(NC(=O)C=2)=O)=C1 BQJITCRVRYNXIN-UHFFFAOYSA-N 0.000 description 1
- SLJJEYCPTRKHFI-UHFFFAOYSA-N 3-[6-(2,5-dioxopyrrol-3-yl)hexyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(CCCCCCC=2C(NC(=O)C=2)=O)=C1 SLJJEYCPTRKHFI-UHFFFAOYSA-N 0.000 description 1
- FYRWKWGEFZTOQI-UHFFFAOYSA-N 3-prop-2-enoxy-2,2-bis(prop-2-enoxymethyl)propan-1-ol Chemical compound C=CCOCC(CO)(COCC=C)COCC=C FYRWKWGEFZTOQI-UHFFFAOYSA-N 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- 239000004831 Hot glue Chemical class 0.000 description 1
- 229930194542 Keto Natural products 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- YBVKMVCZNISULF-UHFFFAOYSA-N Polyester A3 Natural products CC1CC(OC(=O)c2ccccc2)C(OC(=O)C)C3(COC(=O)C)C(OC(=O)C)C(OC(=O)c4ccccc4)C5C(O)C13OC5(C)C YBVKMVCZNISULF-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000004887 air purification Methods 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920006038 crystalline resin Polymers 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 125000001142 dicarboxylic acid group Chemical group 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004992 fission Effects 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000002531 isophthalic acids Chemical class 0.000 description 1
- 125000000468 ketone group Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 150000002976 peresters Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 150000003443 succinic acid derivatives Chemical class 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- VSJBBIJIXZVVLQ-UHFFFAOYSA-N tert-butyl 3,5,5-trimethylhexaneperoxoate Chemical compound CC(C)(C)CC(C)CC(=O)OOC(C)(C)C VSJBBIJIXZVVLQ-UHFFFAOYSA-N 0.000 description 1
- BWSZXUOMATYHHI-UHFFFAOYSA-N tert-butyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(C)(C)C BWSZXUOMATYHHI-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
Definitions
- the process according to the invention for impregnating substrates comprises impregnating the substrate with a plastic, partially, crystalline or crystalline resin system A) which is highly viscous at room temperature, which is low-viscosity and liquid at the application temperature and which can be hardened by free radicals to form thermosets is.
- the windings of electrical machines are usually impregnated by impregnation.
- the purpose of this impregnation is to mechanically consolidate the
- thermosets This impregnation is usually carried out using lacquers or resins which harden to form thermosets. Because on the one hand The requirements for the long-term thermal stability of these thermosets are very high, and on the other hand, the above-mentioned properties, in particular the electrical insulation, must also exist, there are a number of paints and resins that are tailored to the specific areas of application.
- the unsaturated polyester resins have conquered a large space because they have considerable advantages over other thermosetting resin systems. It is thus possible to meet the required properties to a large extent by tailoring the unsaturated polyester resins to molecular dimensions, such as, for example, the selection of specific monomer units or the setting of specific molecular weights. Furthermore, the reactivity of the unsaturated polyester resins can be influenced in such a way that short and therefore inexpensive manufacturing processes for windings of electrical machines are possible.
- the unsaturated polyester resins, in particular the unsaturated polyester imide resins have outstanding properties, particularly with regard to the requirement for long-term thermal resistance.
- the unsaturated polyester resins are composed on the one hand of base resins consisting, for example, of alpha, beta-unsaturated dicarboxylic acids, further modifying mono-, di- and / or polycarboxylic acids, di- and / or polyols and in the case of Polyesterimde from building blocks containing hydroxyl and carboxyl groups, and also from comonomers which react with the alpha, beta-unsaturated dicarboxylic acid units of the base resin and can lead to thermosets.
- base resins consisting, for example, of alpha, beta-unsaturated dicarboxylic acids, further modifying mono-, di- and / or polycarboxylic acids, di- and / or polyols and in the case of Polyesterimde from building blocks containing hydroxyl and carboxyl groups, and also from comonomers which react with the alpha, beta-unsaturated dicarboxylic acid units of the base resin and can lead to thermosets.
- the preferred comonomer is styrene, which, because of its good dissolving properties, is also used to adjust the processing viscosity.
- the comonomers mentioned are completely copolymerized during curing under suitable conditions.
- Such a solvent-free system is referred to as an impregnating resin.
- the impregnating lacquers the vapor pressures of the comonomers at the application temperature lead to evaporation losses, which, however, are generally lower than with solvent-containing systems (50%, based on the amount of solvent used, evaporation loss with solvent-containing impregnating lacquers, 10 to 30% evaporation loss with impregnating resins).
- comonomers usually used are not suitable for solving these tasks, since the comonomers must be in the liquid state for reasons of the processability of the resins.
- Such comonomers such as vinyl or allyl compounds, have liquids at room temperature and in particular Processing and curing temperatures to considerable vapor pressures, which lead to considerable evaporation losses in the comonomers.
- Suitable comonomers are thus solid or highly viscous at room temperature, as are the resins themselves, which are present in a highly viscous, plastic, partially crystalline or crystalline state at room temperature.
- the objects must be impregnated at temperatures at which the resins or the mixtures of resins and comonomers are present in the low-viscosity and / or in the molten state.
- molten resin systems in electrical insulation technology is state of the art. Such molten resin systems are used as solvent-free wire enamels, extrudable cable compounds, hot-melt adhesives or coating compounds.
- the use of radically curing systems is the exception, since the processability of such highly reactive systems is very limited due to the unacceptably short pot life (time in which the resin is in the processable state).
- a further object of the present invention was therefore to achieve a stabilization of the resin systems used at elevated application temperatures, without excessively long curing times and excessive curing temperatures, at which decomposition phenomena in the resins and damage to the materials to be impregnated can occur.
- JP-A-53 05 97 91 describes polyesterimide resins with at least trihydric carboxylic acids and polyester polyols as monomer units, which are prepared with amines and other proportions of at least trihydric carboxylic acids.
- Such polyesterimide resins are used in molten form as an insulating coating for electrically conductive substrates. The coatings have good electrical and mechanical properties. No toxic vapors are released during the coating process.
- DE-A-26 48 351 and DE-A-26 48 352 comprise injection-moldable resin compositions which consist of 10 to 50% by weight of unsaturated polyester resin, 0.2 to 2% by weight of organic peroxide and also inert Filler exist.
- the unsaturated polyesters are composed of the building blocks polyol, ethylenically unsaturated dicarboxylic acid and saturated dicarboxylic acid.
- Resin compositions of this type are used for electrical or electronic components, such as insulators, housings for low and medium voltage switches, cable insulations and plugs.
- DE-A-16 40 428 describes the use of annular bodies made of unsaturated polyester resins, which are coated with waxes to improve the blocking resistance. These annular bodies are used for the impregnation of windings in such a way that they are placed on a winding head of the winding. When heated, the unsaturated polyester resin melts, penetrates into the winding and is cured there.
- a resin system A) is used as the impregnating resin, comprising: AI) a radical-curable thermosetting resin, A2) at least one suitable hardener and, if appropriate, accelerator, A3) optionally further comonomers and / or further polymers with ethylenically unsaturated radical-polymerizable groups, the vapor pressure of A3) being impregnated and Curing temperature is low, and A4) optionally other conventional additives,
- the resin system A) is highly viscous, plastic, partially crystalline or crystalline at room temperature and wherein the resin system A) is converted into the low-viscosity liquid state during the impregnation process by increasing the temperature to the impregnation temperature, so that impregnation according to the known processes of Dip soaking, flooding, dip rolling, trickling or pouring, if necessary with the support of the impregnation by applying a vacuum.
- the resin component AI is preferably selected from the group of unsaturated polyesters, unsaturated polyesterimides, bismaleimides, oligomeric diallyl phthalates, comonomer-free vinyl esters, comonomer-free vinyl ethers, comonomer-free vinyl urethanes and / or polybutadiene resins on their own or in combinations with one another.
- the resin component AI) is particularly preferably selected from the group of unsaturated polyesters, unsaturated polyester imides and bismaleimides in combination with the resin component A3) selected from the group of oligomeric diallyl phthalates, divinylethylene urea, divinyl propylene urea, N-vinyl carbazole, N-vinyl pyrrolidone, comonomer-free vinyl esters, comonomer-free vinyl ethers, comonomer-free vinyl urethanes, vinyl- and / or allyl group-containing polyesters or mixtures thereof.
- Hardeners A2) which are preferably used are radical-forming peroxides, in particular organic peroxides, and / or compounds which form radicals by cleaving a carbon-carbon bond.
- the resin systems A) are particularly preferably delivered in the activated state as one-component resins, in special cases the activation can also take place immediately before the impregnation using suitable mixing metering devices.
- the substrates to be impregnated are preferably preheated to a temperature equal to or greater than the impregnation temperature before the impregnation.
- the substrates to be impregnated are preheated, for example, by means of electrical heat, induction heating, microwave radiation or infrared radiation.
- the substrates are preferably impregnated by dipping, flooding, dipping rolling, trickling or pouring, the impregnation being carried out in a vacuum in which the components AI) to A4) still have a negligibly low vapor pressure.
- the substrate can remain immersed until the resin system A) has gelated in the substrate.
- the resin systems After impregnation with the resin systems, the resin systems are cured at a temperature which is above the temperature of the resin melt and which is generated, for example, by means of heat, induction heating, microwave radiation, infrared radiation or a conventional heating furnace passage, where appropriate surface drying is supported by the action of high-energy radiation, such as UV or electron radiation.
- high-energy radiation such as UV or electron radiation.
- unsaturated polyester resins which may contain building blocks containing imide groups, bismaleimide resins, oligomeric diallyl phthalates, comonomer-free vinyl esters, comonomer-free vinyl ethers, comonomer-free vinyl urethanes and / or polybutadiene resins.
- Unsaturated polyester resins are known. Unsaturated polyester resins containing imide groups are described, for example, in DE-A-15 70 273, DE-A-17 20 323 and DE-A-24 60 768.
- building blocks of the unsaturated polyester resins are, for example: polyols containing polymerizable double bonds, such as glycerol monoallyl ether, trimethylolpropane monoallyl ether and pentaerythritol mono- and diallyl ether, and polymerizable double bonds containing polycarboxylic acids or their anhydrides, such as fumaric acid, such as fumaric acid, such as fumaric acid, such as fumaric acid, such as fumaric acid, such as fumaric acid and preferably maleic acid or maleic anhydride and monocarboxylic acids containing polymerizable double bonds, such as, for example, acrylic and / or methacrylic acid.
- polyols containing polymerizable double bonds such as glycerol monoallyl ether, trimethylolpropane monoallyl ether and pentaerythritol mono- and diallyl ether
- polycarboxylic acids or their anhydrides such as fumaric
- a part of the unsaturated dicarboxylic acid can be replaced by saturated dicarboxylic acids such as adipic acid, perhydrogenated isophthalic acid, phthalic acid, phthalic anhydride and / or dimerized fatty acids to modify the properties of the unsaturated polyester resins .
- saturated dicarboxylic acids such as adipic acid, perhydrogenated isophthalic acid, phthalic acid, phthalic anhydride and / or dimerized fatty acids to modify the properties of the unsaturated polyester resins .
- Suitable components A3) copolymerizable with the unsaturated polyesters or imide group-containing polyesters AI) are, for example: diallyl phthalate prepolymers, divinylethylene urea, divinyl propylene urea, N-vinyl carbazole, N-vinyl pyrrolidone, comonomer-free vinyl esters, comonomer-free vinyl ethers, co-monomer-free vinyl urethanes and polyesters that
- Contain vinyl or allyl groups and which differ from AI) such as, for example, polyester composed of saturated and / or unsaturated polycarboxylic acids with pentaerythritol mono-, di- and / or triallyl ether and optionally modifying glycols
- the copolymerizable components A3) have such low vapor pressures at the impregnation and curing temperatures that no significant immissions can take place.
- Any low molecular weight bismaleimides can be used as bismaleimide component AI).
- Bismaleinimides of the formula I are advantageously used
- radical R1 denotes an aliphatic, cycloaliphatic, araliphatic or aromatic radical and the radicals mentioned optionally further functional groups, such as ether, ester, amide, carbamate, keto, sulfone or hydroxyl groups can have.
- Rl is preferably a straight-chain alkylene radical having 2 to 20, in particular 2 to 10, carbon atoms or a 4,4'-diphenylmethane, 2,4-tolylene, 1,3- or 1,4-phenylene radical.
- Suitable bismaleimides are, for example, ethylene bismaleimide, butylene bismaleimide, hexamethylene bismaleimide, 4,4'-diphenylmethane bismaleimide, 2,4, -tolylene bismaleimide and 1,3-phenylene bismaleimide or mixtures thereof.
- Suitable components A3) copolymerizable with the bismaleimides AI) are, for example: oligomeric diallyl phthalates, divinyl ethylene urea, divinyl propylene urea, N-vinyl carbazole, comonomer-free vinyl esters, comonomer-free vinyl ethers, comonomer-free vinyl urethanes and polyesters which contain vinyl or allyl groups and which differ from AI), such as, for example, composed of saturated and / or unsaturated polycarboxylic acids with pentaerythritol mono-, di- and / or triallyl ether and optionally modifying glycols as monomer units.
- the copoly At the impregnating and curing temperatures, merisable components A3) have such low vapor pressures that no significant immissions can take place.
- component AI can be used alone or in a mixture with other components listed under AI): oligomeric diallyl phthalates, comonomer-free vinyl esters, comonomer-free vinyl ethers, comonomer-free vinyl urethanes and / or polybutadiene resins.
- hardener A2 Depending on the resin system A, known peroxides with suitable decomposition temperatures or compounds which decompose thermally with the formation of carbon radicals can be used as hardener A2). If necessary, additional compounds are present that accelerate the decay of the radical formers. It is essential to the invention that the hardener A2) only produce a significant free-radical stream above the impregnation temperatures, which causes the resin system A) to harden.
- peroxides A2) which only undergo significant decomposition into radicals above the impregnation temperature are commercially available organic peroxides, such as tert-butyl perbenzoate, tert-butyl perisononanoate or tert-butyl peroctoate, or peroxides in combination with accelerators , such as benzoyl peroxide in combination with tertiary amines or peresters with cobalt salts of organic acids.
- hardeners A2) which decompose to form carbon radicals include benzopinacol, substituted succinic acid derivatives and preferably silyl ether-substituted ethylene glycols, as described, for example, in DE-A-26 32 294.
- Such silyl ethers according to DE-A-26 32 294 sometimes decompose into radicals and only at higher temperatures are in some cases largely stable in the resin system A) to be polymerized, even at temperatures above 80 degrees C.
- the resin systems A) can contain, as part of component A4), stabilizers known per se for compounds which can be polymerized by free radicals, such as, for example, quinones, hydroquinones, sterically hindered phenols and / or sterically hindered amines and nitroverts bonds.
- stabilizers known per se for compounds which can be polymerized by free radicals such as, for example, quinones, hydroquinones, sterically hindered phenols and / or sterically hindered amines and nitroverts bonds.
- processing aids for coating resins which are customary per se such as, for example, surface-active and surface-active substances for improving the flow and penetration, additives which influence viscosity, such as pyrogenic silica or bentonite, may be present as further constituents of component A4) which may be present. as well as mineral or organic fillers
- the substrates for example the windings of electrical machines, are impregnated with the resin systems A) according to the invention, consisting of components AI), A2) and optionally A3) and A4), in the melt of A) at temperatures which are below the curing temperature.
- the processing times of the resin systems A) are such that impregnation is possible using the methods of the prior art.
- Such impregnation processes are, for example: - Soaking the substrate to be impregnated, which may be preheated, by immersing it in the melt of the resin system A), dwelling the substrate to be impregnated in the melt until the resin melt has reached all points to be impregnated, if necessary, until for gelling the resin that has penetrated into the substrate, dipping and dripping the impregnated substrate and then curing the absorbed resin system A), the heating of the object with current heat in the immersed state not having to be interrupted, so that heat conduction occurs Heat losses in the winding can be compensated for or the dwell time until any gelation under resin can be shortened by increasing the winding temperature during immersion,
- Resin system A) is flooded in such a way that there is sufficient impregnation of the substrate, then draining the melt of resin system A) / if necessary until the resin which has penetrated into the substrate gels, allowing the substrate to drip off and then curing the debris Substrate-absorbed melt of the resin system A), the heating of the object with current heat in the immersed state does not have to be interrupted, so that heat losses occurring in the winding due to heat conduction can be compensated for or by increasing the winding temperature during immersion the dwell time until possible gels under resin can be shortened,
- the optionally preheated substrate being rolled in such a way through the activated melt of the resin system A) that, in the case of windings of electrical machines as the substrate, only the winding and the part carrying the winding of the substrate are covered by the melt of the resin system A) until the winding has been adequately impregnated and then the melt absorbed by the substrate (from the winding) is cured, preferably with rotation, the object being heated with electricity during the rolling does not have to be interrupted, so that heat losses occurring in the winding due to heat conduction can be compensated for or the dwell time until any gelation under resin can be shortened by increasing the winding temperature during rolling.
- the impregnation processes mentioned above can preferably be carried out in a vacuum or alternately between vacuum and overpressure.
- the substrates can be preheated, for example, by means of electrical heat (heating by electrical resistance), induction heating, microwave or infrared heating and by passage through a conventional heating furnace.
- the curing of the resin system A) adhering to the substrate after impregnation can take place, for example, as in the preheating of the substrates by means of current heating, induction heating, microwave or infrared heating, and by passage through a conventional heating oven, the curing being counter to the substrate surface ⁇ can also be supported by additional radiation, for example IR, UV or electron radiation.
- An unsaturated polyesterimide AI) according to Example 2 of DE-C-24 60 768 from maleic anhydride, neopentyl glycol, trishydroxy isocyanurate and the reaction product of tetrahydrophthalic anhydride and monoethanolamine is with 10 wt .-%, based on the resin system A), diallyl phthalate oligomer A3 ) (Type Ftalidap 27, manufacturer Alusuisse) mixed in the melt. 2% by weight, based on the resin system A), of benzopanolsilyl ether (type initiator BK, manufacturer Bayer AG) are mixed in as hardener A2).
- the resin system A) has an almost firm consistency at room temperature and a viscosity of 1300 mPas at 80 degrees C.
- the pot life of the resin system A) is 210 minutes at 80 degrees C, the gelling time at 140 degrees C 27 minutes.
- the stator of an electric motor which was preheated to 120 degrees C in the heating furnace, is slowly immersed in the molten resin system A) heated to 80 degrees C. The stator remains in the melted resin system A) until no more bubbles rise.
- the stator is then slowly replaced, about 2 minutes are allowed to drip off and then the resin system A) is cured by heating in the oven at 160 ° C. for 30 minutes. After hardening, the winding of the stator is sufficiently solidified. After sawing up the winding, the stator shows sufficient impregnation.
- the mass loss determined thermogravimetrically when heating in the TGA apparatus to 160 degrees C in 10 minutes and maintaining the temperature at 160 degrees C for 30 minutes is 3.4% by weight, based on the resin system A) .
- the unsaturated polyester ester imide AI) according to Example 1 is mixed with a polyester A3), which was prepared from 2 moles of pentaerythritol triallyl ether, 4 moles of adipic acid and 3 moles of pentaerythritol diallyl ether by melt condensation, in a ratio of 2: 1 and with 2% by weight to the resin system A), mixed according to Example 1.
- the mixture has a plastic consistency at room temperature and a viscosity of 570 mPas at 100 degrees Celsius.
- the pot life of resin system A) with 1% by weight, based on resin system A), of tert-butyl perbenzoate as additional hardener component A2) is 210 minutes at 100 degrees C, the gelling time at 160 degrees C 10 minutes.
- the stator of an electric motor which in the Was preheated to 120 degrees C, slowly immersed.
- the stator remains in the molten resin system A) until no more bubbles rise. Thereafter, the stator is slowly immersed, about 2 minutes are allowed to drip off and then the resin system A) is cured by heating in the oven to 160 ° C. for 30 minutes.
- the winding of the stator After hardening, the winding of the stator is sufficiently solidified. After sawing up the winding, the stator shows sufficient impregnation.
- the mass loss determined thermogravimetrically when heating in the TGA apparatus to 160 degrees C in 10 minutes and maintaining the temperature at 160 degrees for 30 minutes is 2.3% by weight, based on the resin system A).
- a monomer-free vinyl ester Al) (type Palatal A430-01, monomer-free, manufacturer BASF AG), which is solid at room temperature and has a viscosity of 500 mPas at 100 degrees C, is melted in the storage container of a conventional trickling system. After mixing 1% by weight, based on the entire resin system A), of tert-butyl perbenzoate as hardener A2) with a conventional mixing metering head, the resin system A) thus prepared is instilled onto an anchor, the winding of which is passed through Electricity heat had been heated to 140 degrees C. The resin system A) is cured at 140 degrees C for 15 minutes. After hardening, the winding is sufficiently solidified.
- thermo-gravimetrically determined mass loss when heating up in the TGA apparatus to 140 degrees C in 10 minutes and shaving The temperature at 140 ° C. for 15 minutes is 1.4% by weight, based on the resin system A).
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Chemically Coating (AREA)
- Electrodes Of Semiconductors (AREA)
- Polymerisation Methods In General (AREA)
- Reinforced Plastic Materials (AREA)
- Insulating Of Coils (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1995142564 DE19542564A1 (de) | 1995-11-15 | 1995-11-15 | Verfahren zur Imprägnierung von elektrisch leitenden Substraten |
DE19542564 | 1995-11-15 | ||
PCT/EP1996/004552 WO1997018567A1 (de) | 1995-11-15 | 1996-10-19 | Verfahren zur imprägnierung von elektrisch leitenden substraten |
Publications (1)
Publication Number | Publication Date |
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EP0880785A1 true EP0880785A1 (de) | 1998-12-02 |
Family
ID=7777522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP96934760A Withdrawn EP0880785A1 (de) | 1995-11-15 | 1996-10-19 | Verfahren zur imprägnierung von elektrisch leitenden substraten |
Country Status (10)
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19648133A1 (de) * | 1996-11-21 | 1998-05-28 | Beck & Co Ag Dr | Verfahren zur Tränkung von Bauteilen |
DE19648134A1 (de) * | 1996-11-21 | 1998-05-28 | Beck & Co Ag Dr | Verfahren zur Tränkung von Bauteilen |
DE19711410A1 (de) | 1997-03-19 | 1998-09-24 | Beck & Co Ag Dr | Tränk-, Verguß- und Überzugsmassen für elektrotechnische und/oder elektronische Bauteile sowie für Trägermaterialien für flächige Isolierstoffe |
JP3917520B2 (ja) | 2001-01-09 | 2007-05-23 | ブラック アンド デッカー インク | 熱伝導性プラスチックでコーティングされた電機子を有する電気モータ |
US6946758B2 (en) | 2001-01-09 | 2005-09-20 | Black & Decker Inc. | Dynamoelectric machine having encapsulated coil structure with one or more of phase change additives, insert molded features and insulated pinion |
US7096566B2 (en) | 2001-01-09 | 2006-08-29 | Black & Decker Inc. | Method for making an encapsulated coil structure |
US7814641B2 (en) | 2001-01-09 | 2010-10-19 | Black & Decker Inc. | Method of forming a power tool |
FR2910012B1 (fr) * | 2006-12-15 | 2009-03-06 | Cray Valley S A Sa | Resines polyesters insatures fonctionnalises par imides cycloaliphatiques insaturees, pour revetements et compositions de moulage |
DE102009045200B4 (de) * | 2009-09-30 | 2021-02-11 | Inter-Consult Gmbh | Verfahren und Vorrichtung zum Bearbeiten von Bauteilen elektrischer Maschinen |
JP5500358B2 (ja) * | 2010-04-22 | 2014-05-21 | 日立化成株式会社 | 電気絶縁用樹脂組成物及びこの組成物を用いた電気機器 |
DE202010017440U1 (de) * | 2010-11-12 | 2011-11-10 | Gottlob Thumm Maschinenbau Gmbh | Imprägnieranlage mit einer Reinigungsvorrichtung |
DE102010060515B4 (de) * | 2010-11-12 | 2016-01-21 | Gottlob Thumm Maschinenbau Gmbh | Imprägnieranlage mit einer Reinigungvorrichtung |
DE102011078592B4 (de) * | 2011-07-04 | 2013-07-25 | Siemens Aktiengesellschaft | Supraleitende Spulenanordnung und Verfahren zu deren Herstellung |
DE102011052518A1 (de) * | 2011-08-09 | 2013-02-14 | Elantas Gmbh | Lösemittelfreie Drahtlackzusammensetzung |
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JPS59221360A (ja) * | 1983-05-31 | 1984-12-12 | Mitsubishi Electric Corp | 不飽和ポリエステルワニス組成物 |
US4554470A (en) * | 1984-06-08 | 1985-11-19 | Westinghouse Electric Corp. | Polybutadiene VPI resin |
JPH03105902A (ja) * | 1989-09-20 | 1991-05-02 | Hitachi Ltd | 超電導コイル |
JP2964530B2 (ja) * | 1990-03-20 | 1999-10-18 | 日本曹達株式会社 | 硬化性樹脂組成物 |
DE4140738A1 (de) * | 1991-12-11 | 1993-06-17 | Herberts Gmbh | Haertbare masse, verfahren zu deren herstellung und deren verwendung zur fixierung von wickelguetern |
DE4331086A1 (de) * | 1993-09-11 | 1995-03-16 | Herberts Gmbh | Verfahren zur Fixierung von Wickelgütern mit radikalisch polymerisierbaren Massen |
-
1995
- 1995-11-15 DE DE1995142564 patent/DE19542564A1/de not_active Withdrawn
-
1996
- 1996-10-19 JP JP9518528A patent/JP2000500289A/ja active Pending
- 1996-10-19 CA CA 2237765 patent/CA2237765A1/en not_active Abandoned
- 1996-10-19 WO PCT/EP1996/004552 patent/WO1997018567A1/de not_active Application Discontinuation
- 1996-10-19 EP EP96934760A patent/EP0880785A1/de not_active Withdrawn
- 1996-10-19 BR BR9611459A patent/BR9611459A/pt not_active Application Discontinuation
- 1996-10-19 PL PL32665496A patent/PL326654A1/xx unknown
- 1996-10-23 TW TW85113011A patent/TW319719B/zh active
- 1996-11-13 YU YU60196A patent/YU60196A/sh unknown
- 1996-11-14 HR HRP960540 patent/HRP960540A2/hr not_active Application Discontinuation
Non-Patent Citations (1)
Title |
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See references of WO9718567A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO1997018567A1 (de) | 1997-05-22 |
HRP960540A2 (en) | 1997-12-31 |
JP2000500289A (ja) | 2000-01-11 |
BR9611459A (pt) | 1999-02-17 |
DE19542564A1 (de) | 1997-05-22 |
YU60196A (sh) | 1998-08-14 |
CA2237765A1 (en) | 1997-05-22 |
TW319719B (enrdf_load_stackoverflow) | 1997-11-11 |
PL326654A1 (en) | 1998-10-12 |
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