EP0860513A3 - Appareillage et procédé pour la production des couches minces - Google Patents

Appareillage et procédé pour la production des couches minces Download PDF

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Publication number
EP0860513A3
EP0860513A3 EP98102793A EP98102793A EP0860513A3 EP 0860513 A3 EP0860513 A3 EP 0860513A3 EP 98102793 A EP98102793 A EP 98102793A EP 98102793 A EP98102793 A EP 98102793A EP 0860513 A3 EP0860513 A3 EP 0860513A3
Authority
EP
European Patent Office
Prior art keywords
target
substrate
thin film
supplying
reactive gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98102793A
Other languages
German (de)
English (en)
Other versions
EP0860513A2 (fr
Inventor
Kazuho Sone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of EP0860513A2 publication Critical patent/EP0860513A2/fr
Publication of EP0860513A3 publication Critical patent/EP0860513A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0057—Reactive sputtering using reactive gases other than O2, H2O, N2, NH3 or CH4
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0063—Reactive sputtering characterised by means for introducing or removing gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0068—Reactive sputtering characterised by means for confinement of gases or sputtered material, e.g. screens, baffles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
EP98102793A 1997-02-19 1998-02-18 Appareillage et procédé pour la production des couches minces Withdrawn EP0860513A3 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP3512597 1997-02-19
JP35125/97 1997-02-19
JP3512597 1997-02-19
JP9583197 1997-04-14
JP9583197 1997-04-14
JP95831/97 1997-04-14

Publications (2)

Publication Number Publication Date
EP0860513A2 EP0860513A2 (fr) 1998-08-26
EP0860513A3 true EP0860513A3 (fr) 2000-01-12

Family

ID=26374048

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98102793A Withdrawn EP0860513A3 (fr) 1997-02-19 1998-02-18 Appareillage et procédé pour la production des couches minces

Country Status (3)

Country Link
US (1) US6451184B1 (fr)
EP (1) EP0860513A3 (fr)
KR (1) KR100278190B1 (fr)

Families Citing this family (37)

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Publication number Priority date Publication date Assignee Title
US6627056B2 (en) * 2000-02-16 2003-09-30 Applied Materials, Inc. Method and apparatus for ionized plasma deposition
DE60142320D1 (de) * 2000-03-13 2010-07-22 Canon Kk Verfahren zur Herstellung eines Dünnfilms
GB0108782D0 (en) * 2001-04-07 2001-05-30 Trikon Holdings Ltd Methods and apparatus for forming precursors
KR100390576B1 (ko) * 2001-07-31 2003-07-07 한국과학기술원 박막제조장치
DE10392235T5 (de) 2002-02-14 2005-07-07 Trikon Technologies Limited, Newport Vorrichtung zur Plasmabearbeitung
DE10216671A1 (de) * 2002-04-15 2003-12-18 Applied Films Gmbh & Co Kg Beschichtungsanlage
JP4280603B2 (ja) * 2003-11-04 2009-06-17 キヤノン株式会社 処理方法
ATE508348T1 (de) * 2004-03-01 2011-05-15 Applied Materials Gmbh & Co Kg Verfahren zum aufbringen eines filters auf einer folie
US7695590B2 (en) 2004-03-26 2010-04-13 Applied Materials, Inc. Chemical vapor deposition plasma reactor having plural ion shower grids
US7767561B2 (en) 2004-07-20 2010-08-03 Applied Materials, Inc. Plasma immersion ion implantation reactor having an ion shower grid
US8058156B2 (en) 2004-07-20 2011-11-15 Applied Materials, Inc. Plasma immersion ion implantation reactor having multiple ion shower grids
JP4923450B2 (ja) * 2005-07-01 2012-04-25 富士ゼロックス株式会社 バッチ処理支援装置および方法、プログラム
US20070084720A1 (en) * 2005-07-13 2007-04-19 Akihiro Hosokawa Magnetron sputtering system for large-area substrates having removable anodes
US20070012559A1 (en) * 2005-07-13 2007-01-18 Applied Materials, Inc. Method of improving magnetron sputtering of large-area substrates using a removable anode
US20070012558A1 (en) * 2005-07-13 2007-01-18 Applied Materials, Inc. Magnetron sputtering system for large-area substrates
US20070012663A1 (en) * 2005-07-13 2007-01-18 Akihiro Hosokawa Magnetron sputtering system for large-area substrates having removable anodes
US20070051616A1 (en) * 2005-09-07 2007-03-08 Le Hienminh H Multizone magnetron assembly
US20070056850A1 (en) * 2005-09-13 2007-03-15 Applied Materials, Inc. Large-area magnetron sputtering chamber with individually controlled sputtering zones
US20070056843A1 (en) * 2005-09-13 2007-03-15 Applied Materials, Inc. Method of processing a substrate using a large-area magnetron sputtering chamber with individually controlled sputtering zones
US7588668B2 (en) 2005-09-13 2009-09-15 Applied Materials, Inc. Thermally conductive dielectric bonding of sputtering targets using diamond powder filler or thermally conductive ceramic fillers
US7445976B2 (en) * 2006-05-26 2008-11-04 Freescale Semiconductor, Inc. Method of forming a semiconductor device having an interlayer and structure therefor
JP5217051B2 (ja) * 2006-11-27 2013-06-19 オムロン株式会社 薄膜製造方法
KR100748395B1 (ko) 2006-11-27 2007-08-13 한국산업안전공단 표준공기 조제시스템
TWI402370B (zh) * 2010-06-11 2013-07-21 Ind Tech Res Inst 濺鍍含高蒸氣壓材料之鍍膜的方法與裝置
CN102312204A (zh) * 2010-07-02 2012-01-11 财团法人工业技术研究院 溅镀含高蒸气压材料的镀膜的方法与装置
US8802545B2 (en) * 2011-03-14 2014-08-12 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US9105705B2 (en) * 2011-03-14 2015-08-11 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US9159964B2 (en) 2012-09-25 2015-10-13 Front Edge Technology, Inc. Solid state battery having mismatched battery cells
US8753724B2 (en) * 2012-09-26 2014-06-17 Front Edge Technology Inc. Plasma deposition on a partially formed battery through a mesh screen
CN206127394U (zh) * 2012-12-27 2017-04-26 菲力尔系统公司 沉积系统
US20150020974A1 (en) * 2013-07-19 2015-01-22 Psk Inc. Baffle and apparatus for treating surface of baffle, and substrate treating apparatus
WO2015064194A1 (fr) * 2013-10-30 2015-05-07 東京エレクトロン株式会社 Dispositif de dépôt et procédé de dépôt
KR102213751B1 (ko) * 2014-03-28 2021-02-09 삼성디스플레이 주식회사 스퍼터링 장치 및 그 구동 방법
US20160362782A1 (en) * 2015-06-15 2016-12-15 Taiwan Semiconductor Manufacturing Co., Ltd. Gas dispenser and deposition apparatus using the same
JP6105115B1 (ja) * 2016-03-14 2017-03-29 株式会社東芝 処理装置及びコリメータ
JP6595658B1 (ja) * 2018-05-09 2019-10-23 キヤノントッキ株式会社 電子部品の製造方法
KR102597417B1 (ko) * 2018-12-26 2023-11-03 가부시키가이샤 알박 스퍼터링 장치 및 스퍼터링 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110673A (ja) * 1981-12-23 1983-07-01 Hitachi Ltd 反応性スパツタリング装置
EP0106623A2 (fr) * 1982-10-05 1984-04-25 Fujitsu Limited Appareil de pulvérisation
EP0401035A2 (fr) * 1989-06-02 1990-12-05 Kabushiki Kaisha Toshiba Appareillage et procédé de production de films
US5415753A (en) * 1993-07-22 1995-05-16 Materials Research Corporation Stationary aperture plate for reactive sputter deposition

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DE3331707A1 (de) * 1983-09-02 1985-03-21 Leybold-Heraeus GmbH, 5000 Köln Verfahren und vorrichtung zum reaktiven aufstaeuben von verbindungen von metallen und halbleitern
US4654112A (en) * 1984-09-26 1987-03-31 Texas Instruments Incorporated Oxide etch
JPS6256570A (ja) 1985-09-06 1987-03-12 Tdk Corp 反応性スパツタリング方法
US4664935A (en) * 1985-09-24 1987-05-12 Machine Technology, Inc. Thin film deposition apparatus and method
JPS62274067A (ja) 1986-05-22 1987-11-28 Nec Corp 薄膜形成方法
US4824544A (en) * 1987-10-29 1989-04-25 International Business Machines Corporation Large area cathode lift-off sputter deposition device
US4931158A (en) * 1988-03-22 1990-06-05 The Regents Of The Univ. Of Calif. Deposition of films onto large area substrates using modified reactive magnetron sputtering
US5635036A (en) * 1990-01-26 1997-06-03 Varian Associates, Inc. Collimated deposition apparatus and method
US5660693A (en) * 1991-01-18 1997-08-26 Applied Vision Limited Ion vapour deposition apparatus and method
JP3149887B2 (ja) 1991-11-08 2001-03-26 新日本製鐵株式会社 スパッタ成膜方法及びスパッタ成膜装置
US5223108A (en) * 1991-12-30 1993-06-29 Materials Research Corporation Extended lifetime collimator
JPH0641733A (ja) 1992-07-28 1994-02-15 Matsushita Electric Ind Co Ltd 反応性スパッタリング装置
US5380414A (en) * 1993-06-11 1995-01-10 Applied Materials, Inc. Shield and collimator pasting deposition chamber with a wafer support periodically used as an acceptor
US5382339A (en) * 1993-09-17 1995-01-17 Applied Materials, Inc. Shield and collimator pasting deposition chamber with a side pocket for pasting the bottom of the collimator
JPH07335553A (ja) 1994-06-08 1995-12-22 Tel Varian Ltd 処理装置および処理方法
JPH0860355A (ja) * 1994-08-23 1996-03-05 Tel Varian Ltd 処理装置
JP3790903B2 (ja) 1995-08-03 2006-06-28 オリンパス株式会社 スパッタリング用ターゲット装置及びスパッタリング方法
JP3742443B2 (ja) 1995-08-04 2006-02-01 オリンパス株式会社 薄膜の製造方法
US5705042A (en) * 1996-01-29 1998-01-06 Micron Technology, Inc. Electrically isolated collimator and method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110673A (ja) * 1981-12-23 1983-07-01 Hitachi Ltd 反応性スパツタリング装置
EP0106623A2 (fr) * 1982-10-05 1984-04-25 Fujitsu Limited Appareil de pulvérisation
EP0401035A2 (fr) * 1989-06-02 1990-12-05 Kabushiki Kaisha Toshiba Appareillage et procédé de production de films
US5415753A (en) * 1993-07-22 1995-05-16 Materials Research Corporation Stationary aperture plate for reactive sputter deposition

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 007, no. 213 (C - 187) 20 September 1983 (1983-09-20) *

Also Published As

Publication number Publication date
US6451184B1 (en) 2002-09-17
KR19980071462A (ko) 1998-10-26
KR100278190B1 (ko) 2001-01-15
EP0860513A2 (fr) 1998-08-26

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