EP0836756B1 - Steckverbinder mit integriertem leiterplattenzusammenbau - Google Patents

Steckverbinder mit integriertem leiterplattenzusammenbau Download PDF

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Publication number
EP0836756B1
EP0836756B1 EP96922643A EP96922643A EP0836756B1 EP 0836756 B1 EP0836756 B1 EP 0836756B1 EP 96922643 A EP96922643 A EP 96922643A EP 96922643 A EP96922643 A EP 96922643A EP 0836756 B1 EP0836756 B1 EP 0836756B1
Authority
EP
European Patent Office
Prior art keywords
substrate
terminal
high speed
electrical connector
connector according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP96922643A
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English (en)
French (fr)
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EP0836756A1 (de
EP0836756A4 (de
Inventor
Bernardus L. Paagman
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FCI SA
Original Assignee
FCI SA
Framatome Connectors International SAS
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Publication date
Application filed by FCI SA, Framatome Connectors International SAS filed Critical FCI SA
Priority to EP96922643A priority Critical patent/EP0836756B1/de
Publication of EP0836756A1 publication Critical patent/EP0836756A1/de
Publication of EP0836756A4 publication Critical patent/EP0836756A4/de
Application granted granted Critical
Publication of EP0836756B1 publication Critical patent/EP0836756B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal

Definitions

  • the present invention relates to connectors and specifically to high speed, shielded connectors having one or more integrated PCB assemblies.
  • Right angle connectors are now widely used and available in many different configurations.
  • the usual method of manufacture comprises stitching terminals into a suitable housing followed by row-by-row tail bending of the terminal tails.
  • the method of bending the tails of each of the terminals is complex, especially since the bending is different for each row.
  • the bending for each row must be done in such a way that each of the board contact terminals extends substantially the same distance from the connector body.
  • each of said board contact terminals, in the assembled state of the connector must be precisely positioned in such a way that the pattern of board contact terminals corresponds closely to the pattern of holes in the PCB into which they will be inserted.
  • An additional difficulty is related to the EMI shielding of the tails for high-frequency applications.
  • a controlled-impedance tail section is preferred with additional ground shielding options.
  • Such a socket comprises an insulating substrate having a first surface and circuit traces disposed on the first surface and extending from a first area of the substrate to a second area of the substrate, the circuit trace includes at least a first location for mounting an electrical terminal on the substrate, a first electrical terminal having a mounting section for mounting the terminal at the first location on the circuit trace and a contact section for mounting the connector onto the surface of a board, the electrical terminal being in electrical connection with the circuit trace, the said mounting section being the force application structure receiving during the assembly the force applied to the terminal.
  • U.S. Patent No. 4,571,014 shows a different approach for the manufacturing of right angle connectors using one or more PCB assemblies.
  • Each of the PCB assemblies comprises one insulated substrate, one spacer, and one cover plate, all of which are attached to one another.
  • the insulating substrate is provided with a predetermined pattern of conducting tracks, while ground tracks are provided between the conducting tacks.
  • the conducting tracks are connected at one end to a female contact terminal and at the other end to a male contact terminal.
  • Each of the cover plates is a conductive shield member.
  • the insulating substrates are rather thick to allow plated blind holes to be made for the construction of female-type contacts for mating contact with male-type pins of a mating connector or the like.
  • the female contacts are connected to conducting tracks on the surface of the insulating substrate through a thin metal tail extending from the plated blind hole through the material of the insulating substrate to the corresponding track.
  • a thin metal tail extending from the plated blind hole through the material of the insulating substrate to the corresponding track.
  • the object of the present invention is to provide a connector which overcomes the disadvantages described above.
  • ground tracks may be provided between the conducting tracks on a first surface and a ground layer may be provided on a second surface opposite the first surface.
  • the cover plates are made of insulating material and may be provided with cover plate conducting tracks and cover plate ground tracks in a predetermined pattern on a first cover plate surface facing the insulating substrate.
  • the cover plate conducting tracks may have one end for connection to one first contact terminal and another end for connection to one second contact terminal.
  • the cover plates may have the second cover plate surface opposite said first cover plate surface covered by a cover plate ground layer.
  • each of the first contact terminals may be connected to one second contact terminal through one conducting track on the insulating substrate and through a conducting track on the cover plate. Thereby, the electrical resistance between a first contact terminal and a respective second contact terminal is reduced.
  • the pattern of conducting tracks on the insulating substrate and the pattern of conducting tracks on the cover plate may be in mirror relation to each other.
  • the ground tracks on the insulating substrate and the cover plate ground tracks on the cover plate, respectively, can be connected to the ground layer on the second surface of the insulating substrate and to the cover plate ground layer, respectively, through plated through-holes.
  • This can be easily achieved, by starting the production of a connector according to the invention with an insulating substrate having metal layers at both sides.
  • One side of the substrate is, then, patterned to be provided with suitable conducting tracks and ground tracks in a predetermined pattern, in accordance with known PCB manufacturing techniques.
  • the ground tracks may then be electrically connected to the metal layer at the opposite side by plated through-holes, which can be made by well known manufacturing techniques.
  • the recesses in the spacer or cover plate can be designed for entirely accommodating one first contact terminal in such a way that, in the assembled state, none of the first contact terminals extends outside the connector.
  • Such a configuration, used in conjunction with a shielding ground layer, provides improved shielding as it is possible to enclose each of the contact terminals to a greater extent.
  • the second contact terminals may comprise press-fit pins, surface mount terminals and solder contact pins for connecting the connector to a printed circuit board or the like.
  • the connector may also comprise an insulating connector body accommodating each of said one or more integrated PCB assemblies and provided with a metallized shielding layer on its outer surface. Thereby, the electromagnetic interference caused by such a connector to the environment is further reduced.
  • the connector body desirably includes structure for receiving and securing PCB modules in alignment.
  • each spacer and its adjacent cover plate are substituted by another cover plate, provided with suitable recesses for accommodating first contact terminals and/or second contact terminals.
  • the PCB modules include planar insulating substrates having conductive traces on which terminals are secured and insulating covers disposed over the terminal carrying side of the substrate, the covers having recesses for accommodating the terminals.
  • the covers and associated recesses can comprise a means of applying a force to the contact terminals, such as an insertion force necessary to press fit the connector into a circuit board, in a manner that minimizes or eliminates the imposition of stresses on the connection of the terminals to the circuit traces.
  • the terminals include structure, engaged by the cover, for imparting force to the terminals.
  • the connector may be provided with suitable filter elements by arranging at least one electrical component within the connector, for instance selected from the group of components comprising resistors, capacitors and inductors.
  • Figure 1 shows an integrated PCB assembly 1 having an insulating body 13.
  • the insulating body 13 may comprise two or more layers as explained below and may be provided with shielding ground layers 9 at either main outer surface. However, depending on the application one of the shielding ground layers, or both, may be omitted.
  • the body 13 is provided with a first series of openings or recesses 2 in a first side surface for accommodating suitable contact terminals 4. At a second side surface, the body 13 is provided with similar openings or recesses 3 for accommodating suitable board contact terminals 7. Each of said openings or recesses 2 and 3 includes a conductive surface therein. The recess 2 and 3 may be entirely or partly metallized.
  • Each of the contact terminals 4 is shown to have a female type contact portion 14, a tail connect portion 6 and a body connect portion 5.
  • Each of the body connect portions 5 is designed to be received by one of the recesses 2 and to be electrically connected to the metal layer within the hole 2, e.g. by soldering or a press-fit connection.
  • each of the female-type contact portions 14 may be substituted by male-type contact portions or hermaphrodite-type contact portions, as is known to any person skilled in the art.
  • Each of the board contact terminals 7 is shown to have a board contact portion 15 and a body connect portion 8.
  • Each of the body connect portions 8 is to be received by one recess 3 and to be connected e.g. by soldering or by a press-fit connection thereto.
  • Each of the board contact portions 15 is designed to be received by an appropriate hole in a printed circuit board and to be connected thereto,. e.g. by soldering.
  • a press-fit connection as shown, can also be provided instead.
  • the board contact portion 15 may be designed to be suitable for surface mount or through mount connection to a printed circuit board. It is observed that the phrase "printed circuit board" is not used in a limiting sense, but is meant to include any kind of substrate to which connectors and right angle connectors may be connected, as is known by a person skilled in the art.
  • Each of the recesses 2 are electrically connected to a corresponding recesses 3 by suitable conducting means within the body 13.
  • suitable conducting means may be conductive traces 11 as will be explained below by reference to Figures 2a and 3a.
  • ground tracks 10 may be provided in-between. Instead of providing a ground track 10 between each two adjacent conducting means 11 other configurations are possible. Ground tracks 10 may, e.g., be present between adjacent groups of two conducting means 11 thus having a twinax-type configuration.
  • Figures 2a through 2c show subsequent manufacturing steps of producing a right angle connector according to the invention in which standard methods of producing printed circuit boards are used.
  • Figure 2a shows an insulating substrate 16, formed for example of conventional flat PCB material provided with several parallel conducting tracks 11.
  • Conducting ground tracks 10 may be provided between adjacent conducting tracks 11.
  • the outer most conducting ground track 10 is provided with a ground contact terminal 7' to be connected to ground through the printed circuit board to which the connector is to be connected.
  • Each of the conducting tracks 11 is connected to board contact terminals 7, the board contact portions 15 of which extending beyond the insulating substrate 16.
  • the board contact portions 15 are shown as press-fit terminals they might be replaced by suitable solder tail terminals or surface mount terminals as mentioned above.
  • the body contact portions 5 and 8 of terminals 4 and 7, respectively are fixed onto suitable solder pads formed at the ends of traces 11. This can be achieved by conventional surface mount soldering techniques.
  • An insulating spacer 17 is provided having a first series of openings 24 for accommodating the contact terminals 4 and a second series of openings 25 for accommodating at least part of the board contact terminals 7.
  • the recess 2 and 3 in the insulating body 13 are formed at the interface of adjacent layers or laminations. That is, the recesses 2, for example, are bounded by the insulating layer 16, the edges of openings 24 or 25 and the cover 18. This allows the contacts to be secured on layer 16 by conventional surface mounting or other bonding techniques.
  • An insulating cover plate 18, optionally provided with a fully metallized ground layer 9, is provided.
  • each of the insulating cover plates 18 may be provided with suitable conducting tracks 11 one end of which is electrically connected to a contact terminal 4 and the other end of which is electrically connected to a board contact terminal 7. These conducting tracks may be provided in a mirrored relation to the conducting tracks 11 on the insulating substrate 16. Cover plate 18 may also be provided with ground tracks 10 between those conducting tracks 11 (not shown). These ground tracks 10 are preferably connected to the ground layer 9 by means of plated through-holes 26. The manufacturing of plated through-holes is known to persons skilled in the art and need no further explanation. Of course, substrate 16 may be provided with similar plated through-holes 26 in order to connect ground tracks 10 to ground layer 9 at the outer surface of substrate 16.
  • Figure 2b shows one integrated PCB assembly manufactured from the components shown in Figure 2a, i.e. an insulating substrate 16 to which an insulating spacer 17 is attached and an insulating cover plate 18 attached to the insulating spacer 17.
  • the first series of openings 24 in the insulating spacer 17 form recesses 2, in which the female-type contact terminals 4 are disposed to receive contact terminals of a mating connector (not shown).
  • the female-type contact terminals 4 shown in Figure 2a may be replaced by male-type or hermaphrodite-type contact terminals.
  • a cover plate could be provided in which suitable recesses are made for accommodating the contact terminals 4 and the board contact terminals 7. Such recesses would serve the same purpose as openings 24, 25 in spacer 17 shown in Figure 2a. Alternatively, but less desirably from a cost standpoint, such recesses could be provided in substrate 16.
  • Figure 2c shows several integrated PCB assemblies as shown in Figure 2b parallel to each other and to be inserted into a connector body 19.
  • the connector body 19 may be made of any insulating material and may be provided with a metallized outer surface to enhance the shielding effectiveness.
  • the connector body 19 may be provided with suitable guiding ridges 23 and one or more guiding extensions 22 for properly connecting the assembled connector to a mating connector (not shown).
  • each of the integrated PCB assemblies have at least one ground layer 9 on one of their main outer surfaces to shield the parallel integrated PCB assemblies from each other. Both outer surfaces of each of the outer integrated PCB assemblies in the configuration shown in figure 2c are preferably provided with ground layers 9 to enhance the shielding effectiveness.
  • the connector body 19 is provided with suitable lead-in holes 20 in corresponding relationship with each of the contact terminals 4.
  • Each of the lead-in holes 20 is suitable for receiving a mating male-type contact terminal of a mating connector (not shown).
  • the lead-in holes 20 are arranged in columns and rows as is designated by arrows c and r.
  • FIG 3a several contact terminals 4 are shown adjoined on a carrier as one stamped part.
  • the additional joining metal between adjacent contact terminals 4 is stamped away as a final step during manufacturing.
  • the function of the carrier is to form a one stitch process.
  • board contact terminals 7 are shown to be adjoined on a carrier as one stamped part.
  • the additional joining metal between adjacent board contact terminals is stamped away as final step during manufacturing.
  • cover plate 18 may be provided with a plurality of suitable conducting tracks one side of which is to be connected electrically to one contact terminal 4 and the other side of which is to be connected to one board contact terminal 7 in order to reduce the electrical resistance.
  • Either or both of the insulating substrates 16 or the insulating cover plates 18 may be provided with a suitable ground layer 9.
  • the insulating substrate, the insulating spacer and the insulating cover plate are adhered to each other by widely known means like glue, conductive adhesives in track areas and/or use of pressure in order to produce one integrated PCB assembly as shown in Figure 3b.
  • spacer 17 could be omitted whereas, then, cover plate 18 could be provided with suitable recesses for accommodating those parts of contact terminals 4 and board contact terminals 7 not extending from substrate 16. Alternatively but less desirably, such recesses could be provided in substrate 16.
  • FIG. 3b Several parallel integrated PCB assemblies as shown in Figure 3b are introduced in the rear side of a connector body 19 which is provided with suitable openings in the rear side to accommodate the extending contact terminals 4 (Figure 3c).
  • shielding means may be provided within the connector body 19.
  • the embodiment according to Figures 2a through 2c may be preferred because it is easier to provide for shielding between adjacent contact terminals 4.
  • the present invention is not limited to the embodiments shown in the figures. Especially, the invention is not limited to providing integrated PCB assemblies having one insulating substrate 16, one spacer 17 and one cover plate 18. Other numbers of substrates, spacers and cover plates are possible and are considered within the scope of the present invention. Moreover, the substrate 16, spacer 17 and cover plate 18 may have any desired dimension. Since separate substrates, spacers, cover plates, etc. may be used to manufacture connectors in accordance with the invention, filter elements, like resistors, capacitors and inductors, can be easily incorporated within the connector by using well known PCB manufacturing techniques. For example, they may be manufactured by well known thin film techniques.
  • any of the insulating substrates 16 may, e.g., be provided with suitable connecting pins to be received by suitable holes in the insulating cover plates 18 to provide easier alignment of parallel integrated PCB assemblies and to prevent shifting of integrated PCB assemblies when inserting several parallel integrated PCB assemblies into the rear side of the connector body 19.
  • the connector according to the invention can be manufactured by using standard and inexpensive PCB manufacturing methods without the stamping/moulding/bending processes which are now widely used and which are relatively expensive. Moreover, impedance matching can be easily obtained since the manufacturing tolerances can be easily controlled.
  • the connector according to the present invention can also be designed for miniature coaxial or twinax applications.
  • the connector according to the invention is provided with a set of contact terminals 4 at one side and a set of board contact terminals 7 at another side it is to be understood that the principles of the invention also apply to connectors in which the board contact terminals 7 are substituted by contact terminals suitable for connection to a mating connector or the like.
  • the set of contact terminals 4 may be constructed as board contact terminals to be suited for connection to a printed circuit board or the like.
  • FIGS 4-14c illustrate a second embodiment of an integral terminal PCB module.
  • This embodiment eliminates the separate spacer element 17 of the previous embodiment and incorporates certain of its functions into a single cover/ spacer member.
  • the cover and an associated PCB terminal assembly form a terminal module, several of which can be held together in side-by-side relationship in a housing to form an electrical connector.
  • the PCB assembly 30 comprises an insulating substrate 31 of a material commonly commercially used for making PCBs.
  • the substrate 31 can be a resin impregnated fiber assembly such as is sold under the designation FR4, having a thickness 0.4 mm, for example.
  • FR4 resin impregnated fiber assembly
  • the traces 32 include contact pads at each end adapted to have metal terminals secured to them, as by conventional surface mounting techniques using solder.
  • a plurality of ground or shielding traces 33 may also be applied to the substrate 31.
  • the shielding traces 33 may be disposed between each of the circuit traces 32 or between groups of such traces.
  • a terminal, such as a contact terminal 34 is mounted at the first end of each trace 32 and a connector mounting side terminal 35 is mounted on the second end of each circuit trace 32.
  • An additional shielding or ground layer 36 may be applied to the remainder of the substrate 31.
  • a ground terminal 37 is fixed onto the ground layer 36, in alignment with the terminals 35.
  • a locating hole 39 may be appropriately placed in the substrate 31.
  • the locating hole 39 preferably comprises a plated through hole for establishing electrical connection with a grounding layer 38 ( Figure 5) that may extend substantially over the entire back surface of the substrate 31.
  • a grounding layer 38 Figure 5
  • small vias forming plated through-holes may be disposed in each of the ground tracks 33 so that the ground tracks 33, the shield layer 36 and the back shield layer 38 form a shielding structure for the signal traces 33 and associated terminals.
  • contact terminals 34 are formed as a one-piece stamping and can comprise a dual beam contact having a base section 40 having an opposed pair of upstanding portions 41.
  • a spring section 42 is cantilevered from each of the upstanding portions 41 to define an insertion axis for a mating terminal, such as a pin from a pin header. Such a pin would be engaged by the contact portions 43 disposed at the end of each cantilevered arm 42.
  • the contact terminals also include a mounting section, such as the planar member 44, that is adapted to be secured onto the end of the circuit trace 32, typically by solder 46. The latter can be accomplished by conventional surface mounting or other bonding techniques.
  • the cantilevered arms 42 and contact portions 43 define a contact mating or pin insertion axis that is generally parallel to the plane of substrate 31, but is offset from the surface carrying the conductive traces 32.
  • connector mounting terminal 35 includes a press-fit section 48 and a board mounting section 49.
  • the board mounting section 49 includes a generally planar base 50 with an upturned top tang 52 disposed along a top edge. A pair of opposed side tangs 53 are also upturned from the base 50.
  • the mounting portion 49 is retained on the circuit trace 32 by solder fillets 54, again formed by conventional surface mounting solder techniques.
  • the top tang 52 is spaced closely adjacent to or rests on the top surfaces of the side tangs 53 as shown in Figure 7.
  • Figures 8, 8a, 8b, 8c and 8d illustrate an insulative cover/spacer member 56, preferably molded from an appropriate polymeric insulating material.
  • the cover includes a plurality of contact recesses 57 formed along one edge.
  • Each of the recesses 38 includes a contact preload rib 58.
  • a large central recess 59 may also be formed in the cover.
  • a second plurality of terminal recesses 60 is formed along a second edge of the cover.
  • a locating boss 62 is integrally formed with the cover and is sized and shaped to be received, with limited clearance, in the locating opening 39 in the substrate 31.
  • the cover further includes an upper rim 63 extending from the rear of the cover to a location near the recesses 57.
  • a bottom rim or support member 64 is formed on a portion of the bottom surface of the cover.
  • the cover 56 further includes an upper locating and mounting rib 65, preferably in the form of a dove tail rib as shown.
  • a similar but shorter mounting and locating rib 66 is disposed on the bottom edge of the cover.
  • the surfaces 67a and 67b form board rest surfaces against which a substrate 31 is placed.
  • the surfaces 67a and 67b may carry an adhesive or alternately a double adhesive coated film (not shown) may be applied to extend from surface 67a to surface 67b.
  • a terminal module 69 ( Figure 9) is formed by associating a PCB terminal assembly 30 with a cover 56.
  • Figure 9 is substantially an x-ray view through the cover 56 for ease in showing the location of the elements on substrate 31, with respect to the cover.
  • the PCB assembly 30 is located in the vertical direction by the upper and lower rim or mounting members 63, 64 and is located in a longitudinal manner by the locating boss 62.
  • the contact terminals 34 are located in the contact recesses 57 and the connector mounting terminals 35 are located in the recesses 60.
  • the previously mentioned adhesive or adhesive coated films on surface 67a and 67b maintain the PCB assembly and cover 56 together.
  • Figure 9a is a sectional view taken along line AA of Figure 9 and shows the contact terminals 34 located in the contact recesses 57.
  • the terminals 34 are positioned so that the contact portions 43 bear against the preload ribs 58 to impart a desired preload on the cantilevered spring arms 42.
  • Figure 9b is a sectional view taken along line BB.
  • the substrate 31 is essentially located in a vertical position by the rims 63 and 64.
  • the overall thickness of the module 69 generally approximates the desired contact pitch of the finished connector. For example, if a 2.0 mm contact pitch is desired, and assuming a substrate thickness of 0.4 mm, the thickness of cover 56 would be approximately 1.6 mm. Thus, if the modules 69 are stacked in side by side relationship, the desired pitch is achieved.
  • each connector mounting 35 has its mounting portion received within a corresponding recess 60.
  • the board mounting terminal is of a type that is likely to have a relatively high axial force applied to it, such as a press-fit terminal, the surface 68 ( Figure 8d) of the recess 60 is advantageously located so that it bears against the upturned tang 52 of the terminal.
  • the views in Figures 9c and Figure 11 are taken substantially along section line CC of Figure 9.
  • Figure 9d is a fragmentary cross sectional view taken along line DD of Figure 9 showing a positioning of grounding terminal 37 in a similar fashion to terminal 35 in Figures 9c and Figure 11.
  • Figure 9e is a view of the back end of the module 69 showing in phantom views the locating boss 62 and the mounting portion of a terminal 35.
  • Figures 10 and 10a illustrate enlarged views of the connector contacts 34 located in recesses 57 of the cover 56.
  • Figure 10a is a cross sectional view taken along line GG of Figure 10 and shows the positioning of the preload rib 58 with respect to the contact portions 43.
  • Figure 11 illustrates the interaction of the cover 56 with the board connection terminal 35 when a downward force F is applied to the top edge of the module 69. That force is transmitted by the cover to the pressing surface 68 formed by the top surface of the recess 60. As a result, a vertical insertion force that is used to push the press-fit 48 into the hole T is applied directly to the upper tang 52 and the side tangs 53. In this manner, shear stress occuring at the solder connection between the base 50 of the terminal and the circuit trace 32 is minimized. In this manner, loosening or detachment of the terminal 35 is avoided.
  • the surface 68 is designed so that it will engage tang 52 before the rim 63 beings applying a vertical force to the upper edge of the substrate 31.
  • One way to accomplish this is to provide an initial, small clearance between the rim 63 and the adjacent edge of substrate 31.
  • the cover is designed so that a significant proportion of the insertion force is applied directly to terminal 35 so that stress at the terminal/conductive track interface is minimized.
  • the structure disclosed is designed to withstand required press-fit pin insertion forces of 35-50 Newtons per pin.
  • Figure 12 is a cross sectional view taken along line HH of Figure 12a and shows a connector housing 70 having a top wall 72, a bottom wall 76 and a front wall 78.
  • the top wall 72 includes a plurality of locating slots, for example the dove tail slots 73.
  • One or more guiding ridges 74 may be formed on a top surface of the top 72.
  • the bottom 76 also includes a locating slot, for example the dove tail slots 77.
  • the front wall 78 includes a plurality of openings 79.
  • Figure 13a is a front elevational view of a lead-in face plate 80 having a plurality of tapered lead-in sections 84 arranged in the form of a grid. Each of the lead-in portions 84 extends to a pin insertion port 85. A plurality of sleeves or hollow bosses 86 extend from the rear surface of the face plate 80 and are shaped in size to be positioned in the openings 79 in the front wall 78 of housing 70.
  • Figure 14 is a sectional view showing the assembly of contact module 69, housing 70 and face plate 80 to form a completed right angle connector.
  • a plurality of pins 90 and 90a are shown being received in the mating contact terminals 34.
  • the pins designated as 90a in both Figures 14 and 14c are shown in a somewhat misaligned, as can occur when pins are bent.
  • a plurality of contact modules 69 are assembled in the housing 70 by aligning the dove tail ribs 65 and 66 of each module with the dove tail slots 73 and 77 respectively of the housing and pushing the modules in the direction of front wall 78.
  • the mounting contacts 33 and ground contact 37 are positioned to be inserted into the holes of a circuit board on to which the connector is to be mounted. This would conventionally be accomplished by applying a downward force, usually to the top of the housing 70 extending over the region of the board contacts 35.
  • Additional shielding can be provided by metallizing appropriate surfaces of the housing 70.

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  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Claims (10)

  1. Elektrischer Hochgeschwindigkeitsverbinder zur Befestigung auf einer Platte, mit:
    einem isolierenden Substrat (31) mit einer ersten Oberfläche und mindestens einer Leiterbahn (32), die auf der ersten Oberfläche angeordnet ist und von einem ersten Bereich des Substrats (31) zu einem zweiten Bereich des Substrats verläuft, wobei die Leiterbahn (32) mindestens eine erste Stelle zur Befestigung eines elektrischen Anschlusses auf dem Substrat (31) aufweist,
    einem ersten elektrischen Anschluss (35), der einen Befestigungsabschnitt (49) zur Befestigung des Anschlusses (35) an der ersten Stelle auf der Leiterbahn (32) und einen Kontaktbereich (48) zur Befestigung des Verbinders auf der Oberfläche der Platte aufweist, wobei der elektrische Anschluss mit der Leiterbahn (32) in elektrischer Verbindung steht,
    wobei der Befestigungsbereich (49), der sich von der Oberfläche des Substrats weg erstreckt, eine Krafteinwirkungsstruktur ist, die angepasst ist, um eine auf den Anschluss ausgeübte Kraft aufzunehmen,
    dadurch gekennzeichnet, dass
    der Befestigungsabschnitt (49) eine im wesentlichen ebene Basis (50) parallel zur Ebene des Substrats (31) mit einem nach oben gebogenen, oberen Lappen (52) aufweist, der entlang einer Oberkante angeordnet ist und sich von der Oberfläche der ebenen Basis (50) weg erstreckt.
  2. Elektrischer Hochgeschwindigkeitsverbinder nach Anspruch 1, dadurch gekennzeichnet, dass die ebene Basis (50) des Befestigungsabschnitts (49) weiter ein Paar von gegenüberliegenden seitlichen Lappen (53) aufweist, die von der Basis (50) nach oben gebogen sind und sich von der Oberfläche der ebenen Basis (50) weg erstrecken.
  3. Elektrischer Hochgeschwindigkeitsverbinder nach Anspruch 1, dadurch gekennzeichnet, dass der Befestigungsabschnitt (49) auf der Leiterbahn (32) durch Lötverbindung gehalten wird.
  4. Elektrischer Hochgeschwindigkeitsverbinder nach Anspruch 1, dadurch gekennzeichnet, dass der Anschluss (35) ein Presspassungsanschluss ist.
  5. Elektrischer Hochgeschwindigkeitsverbinder nach Anspruch 1, dadurch gekennzeichnet, dass er weiter eine isolierende Abdekkung (56) zum Abdecken der ersten Oberfläche des Substrats (31) aufweist, wobei die Abdeckung (56) und das Substrat (31) einen Modul (69) bilden, so dass ein beträchtlicher Anteil der Kraft auf den Anschluss (35) ausgeübt wird.
  6. Elektrischer Hochgeschwindigkeitsverbinder nach den Ansprüchen 1 bis 5, dadurch gekennzeichnet, dass die Abdeckung (56) Eingriffmittel aufweist, um mit der Krafteinwirkungsstruktur in Eingriff zu gelangen, um die Kraft darauf anzuwenden.
  7. Elektrischer Hochgeschwindigkeitsverbinder nach Anspruch 6, dadurch gekennzeichnet, dass das Eingriffmittel eine Druckfläche (68) aufweist, die angepasst ist, um gegen den oberen Lappen (52) anzuliegen.
  8. Elektrischer Hochgeschwindigkeitsverbinder nach Anspruch 6, dadurch gekennzeichnet, dass die Abdeckung weiter eine Vertiefung (60) zur Aufnahme des Anschlusses (35) aufweist, wobei die Druckfläche (68) von der Bodenfläche der Vertiefung (60) gebildet wird.
  9. Elektrischer Hochgeschwindigkeitsverbinder nach Anspruch 6, dadurch gekennzeichnet, dass die Abdeckung weiter einen oberen Rand (63) aufweist, der eine senkrechte Kraft auf die Oberkante des Substrats (31) ausübt.
  10. Elektrischer Hochgeschwindigkeitsverbinder nach den Ansprüchen 6 bis 9, dadurch gekennzeichnet, dass ein kleiner Spielraum ursprünglich zwischen dem Rand (63) und der Oberkante des Substrats (31) vorgesehen ist, so dass die Druckfläche (68) in den oberen Lappen (52) eingreift, ehe der obere Rand (63) die senkrechte Kraft anlegt.
EP96922643A 1995-07-03 1996-07-02 Steckverbinder mit integriertem leiterplattenzusammenbau Expired - Lifetime EP0836756B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP96922643A EP0836756B1 (de) 1995-07-03 1996-07-02 Steckverbinder mit integriertem leiterplattenzusammenbau

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP95201811A EP0752739B1 (de) 1995-07-03 1995-07-03 Verbinder mit integrierter Flachbaugruppe
EP95201811 1995-07-03
EP96922643A EP0836756B1 (de) 1995-07-03 1996-07-02 Steckverbinder mit integriertem leiterplattenzusammenbau
PCT/US1996/011214 WO1997002627A1 (en) 1995-07-03 1996-07-02 Connector, preferably a right angle connector, with integrated pcb assembly

Publications (3)

Publication Number Publication Date
EP0836756A1 EP0836756A1 (de) 1998-04-22
EP0836756A4 EP0836756A4 (de) 1999-08-25
EP0836756B1 true EP0836756B1 (de) 2004-12-08

Family

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EP95201811A Expired - Lifetime EP0752739B1 (de) 1995-07-03 1995-07-03 Verbinder mit integrierter Flachbaugruppe
EP96922643A Expired - Lifetime EP0836756B1 (de) 1995-07-03 1996-07-02 Steckverbinder mit integriertem leiterplattenzusammenbau

Family Applications Before (1)

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EP95201811A Expired - Lifetime EP0752739B1 (de) 1995-07-03 1995-07-03 Verbinder mit integrierter Flachbaugruppe

Country Status (8)

Country Link
EP (2) EP0752739B1 (de)
JP (2) JP3784836B2 (de)
KR (1) KR100394531B1 (de)
CN (1) CN1244959A (de)
DE (2) DE69519226T2 (de)
IN (1) IN190516B (de)
TW (1) TW369740B (de)
WO (1) WO1997002627A1 (de)

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Also Published As

Publication number Publication date
TW369740B (en) 1999-09-11
EP0836756A1 (de) 1998-04-22
KR100394531B1 (ko) 2003-09-19
DE69634005D1 (de) 2005-01-13
EP0836756A4 (de) 1999-08-25
EP0752739B1 (de) 2000-10-25
WO1997002627A1 (en) 1997-01-23
DE69519226T2 (de) 2001-08-23
JP3784836B2 (ja) 2006-06-14
JP2006108115A (ja) 2006-04-20
IN190516B (de) 2003-08-02
CN1244959A (zh) 2000-02-16
DE69634005T2 (de) 2005-11-03
DE69519226D1 (de) 2000-11-30
JP4486028B2 (ja) 2010-06-23
JP2001525974A (ja) 2001-12-11
EP0752739A1 (de) 1997-01-08

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