EP0798079A3 - Machine et procédé de polissage de plaquettes semi-conductrices - Google Patents

Machine et procédé de polissage de plaquettes semi-conductrices Download PDF

Info

Publication number
EP0798079A3
EP0798079A3 EP97104697A EP97104697A EP0798079A3 EP 0798079 A3 EP0798079 A3 EP 0798079A3 EP 97104697 A EP97104697 A EP 97104697A EP 97104697 A EP97104697 A EP 97104697A EP 0798079 A3 EP0798079 A3 EP 0798079A3
Authority
EP
European Patent Office
Prior art keywords
polishing
polishing slurry
semiconductor wafers
turn table
silicon wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97104697A
Other languages
German (de)
English (en)
Other versions
EP0798079B1 (fr
EP0798079A2 (fr
Inventor
Teruaki C-304 Aza Ohhira 150-5 Fukami
Kiyoshi Aza Uenohara 186 Suzuki
Toshio Azaue Uenohara 2 Azito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of EP0798079A2 publication Critical patent/EP0798079A2/fr
Publication of EP0798079A3 publication Critical patent/EP0798079A3/fr
Application granted granted Critical
Publication of EP0798079B1 publication Critical patent/EP0798079B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
EP97104697A 1996-03-25 1997-03-19 Machine et procédé de polissage de plaquettes semi-conductrices Expired - Lifetime EP0798079B1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP6799796 1996-03-25
JP6799796 1996-03-25
JP67997/96 1996-03-25
JP05450497A JP3384530B2 (ja) 1996-03-25 1997-03-10 半導体ウェーハの研磨装置および研磨方法
JP54504/97 1997-03-10
JP5450497 1997-03-10

Publications (3)

Publication Number Publication Date
EP0798079A2 EP0798079A2 (fr) 1997-10-01
EP0798079A3 true EP0798079A3 (fr) 1998-03-25
EP0798079B1 EP0798079B1 (fr) 2000-10-18

Family

ID=26395260

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97104697A Expired - Lifetime EP0798079B1 (fr) 1996-03-25 1997-03-19 Machine et procédé de polissage de plaquettes semi-conductrices

Country Status (4)

Country Link
EP (1) EP0798079B1 (fr)
JP (1) JP3384530B2 (fr)
DE (1) DE69703312T2 (fr)
MY (1) MY132494A (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001121407A (ja) 1999-10-21 2001-05-08 Nec Corp 研磨装置
JP4657412B2 (ja) * 1999-12-10 2011-03-23 エルエスアイ コーポレーション 半導体ウェハを研磨する装置及び方法
JP4510362B2 (ja) * 2001-11-30 2010-07-21 俊郎 土肥 Ｃｍｐ装置およびｃｍｐ方法
JP2004075859A (ja) * 2002-08-19 2004-03-11 Chubu Kiresuto Kk 研磨スラリーの清浄化法
EP1610365B1 (fr) * 2003-03-18 2012-08-08 Nomura Micro Science Co., Ltd. Materiau de purification d'une suspension de purification de semi-conducteurs, module de purification d'une suspension de purification de semi-conducteurs et procede de fabrication d'une suspension de purification de semi-conducteurs
JP4551167B2 (ja) * 2004-09-14 2010-09-22 日本化学工業株式会社 半導体ウェーハの研磨装置及びこれを用いた研磨方法
JP2006346753A (ja) * 2005-06-13 2006-12-28 Nomura Micro Sci Co Ltd 金属汚染された研磨スラリーの除染方法
TWI417430B (zh) * 2006-08-25 2013-12-01 Applied Materials Inc 基板研磨液之使用點處理方法與系統
JP2010167551A (ja) 2008-12-26 2010-08-05 Nomura Micro Sci Co Ltd 使用済みスラリーの再生方法
US9259668B2 (en) * 2012-02-17 2016-02-16 Jsr Corporation Cleaning method of immersion liquid, immersion liquid cleaning composition, and substrate
CN104552002A (zh) * 2014-12-29 2015-04-29 苏州用朴合金工具有限公司 基于硬质合金杆的cbn砂轮加工的冷却液循环利用系统
JP6454599B2 (ja) 2015-05-14 2019-01-16 株式会社ディスコ 研磨装置
JP6844970B2 (ja) * 2016-08-18 2021-03-17 株式会社ディスコ 研磨装置
JP7000102B2 (ja) * 2017-09-29 2022-01-19 株式会社フジミインコーポレーテッド 研磨処理方法および研磨用組成物
JP6946166B2 (ja) * 2017-12-20 2021-10-06 パナソニックＩｐマネジメント株式会社 研磨装置および研磨方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189987A (ja) * 1983-04-11 1984-10-27 Nec Corp シリコンウエ−ハ−研摩排水の循環利用方法
US5087372A (en) * 1989-03-24 1992-02-11 Asahi Kasei Kogyo Kabushiki Kaisha Method for removing heavy metal ions from contaminated water and a porous membrane usable therefor
JPH04293587A (ja) * 1991-03-25 1992-10-19 Asahi Chem Ind Co Ltd Ｇａ−Ａｓ研磨排水の処理方法
EP0639534A2 (fr) * 1993-08-16 1995-02-22 Ebara Corporation Système de traitement de déchets dans un appareil de polissage

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189987A (ja) * 1983-04-11 1984-10-27 Nec Corp シリコンウエ−ハ−研摩排水の循環利用方法
US5087372A (en) * 1989-03-24 1992-02-11 Asahi Kasei Kogyo Kabushiki Kaisha Method for removing heavy metal ions from contaminated water and a porous membrane usable therefor
JPH04293587A (ja) * 1991-03-25 1992-10-19 Asahi Chem Ind Co Ltd Ｇａ−Ａｓ研磨排水の処理方法
EP0639534A2 (fr) * 1993-08-16 1995-02-22 Ebara Corporation Système de traitement de déchets dans un appareil de polissage

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 009, no. 045 (C - 268) 26 February 1985 (1985-02-26) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 102 (C - 1031) 2 March 1993 (1993-03-02) *

Also Published As

Publication number Publication date
EP0798079B1 (fr) 2000-10-18
DE69703312D1 (de) 2000-11-23
MY132494A (en) 2007-10-31
JP3384530B2 (ja) 2003-03-10
EP0798079A2 (fr) 1997-10-01
JPH09314466A (ja) 1997-12-09
DE69703312T2 (de) 2001-02-22

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