EP0782500A1 - Foiled ud-prepreg and pwb laminate prepared therefrom - Google Patents

Foiled ud-prepreg and pwb laminate prepared therefrom

Info

Publication number
EP0782500A1
EP0782500A1 EP95932765A EP95932765A EP0782500A1 EP 0782500 A1 EP0782500 A1 EP 0782500A1 EP 95932765 A EP95932765 A EP 95932765A EP 95932765 A EP95932765 A EP 95932765A EP 0782500 A1 EP0782500 A1 EP 0782500A1
Authority
EP
European Patent Office
Prior art keywords
prepreg
laminate
layers
layer
foiled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP95932765A
Other languages
German (de)
English (en)
French (fr)
Inventor
Erik Middelman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMP-Akzo LinLam VOF
Amp Akzo Linlim VOF
Original Assignee
AMP-Akzo LinLam VOF
Amp Akzo Linlim VOF
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP-Akzo LinLam VOF, Amp Akzo Linlim VOF filed Critical AMP-Akzo LinLam VOF
Priority to EP95932765A priority Critical patent/EP0782500A1/en
Publication of EP0782500A1 publication Critical patent/EP0782500A1/en
Ceased legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28Shaping operations therefor
    • B29C70/40Shaping or impregnating by compression not applied
    • B29C70/50Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06Fibrous reinforcements only
    • B29C70/08Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, and with or without non-reinforced layers
    • B29C70/088Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, and with or without non-reinforced layers and with one or more layers of non-plastics material or non-specified material, e.g. supports
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/095Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyurethanes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/40Layered products comprising a layer of synthetic resin comprising polyurethanes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/08Impregnating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024Woven fabric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/12Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/08Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
    • B29K2105/10Cords, strands or rovings, e.g. oriented cords, strands or rovings
    • B29K2105/101Oriented
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/08Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
    • B29K2105/10Cords, strands or rovings, e.g. oriented cords, strands or rovings
    • B29K2105/101Oriented
    • B29K2105/108Oriented arranged in parallel planes and crossing at substantial angles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/24Condition, form or state of moulded material or of the material to be shaped crosslinked or vulcanised
    • B29K2105/243Partially cured
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25Solid
    • B29K2105/253Preform
    • B29K2105/256Sheets, plates, blanks or films
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/021Fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02Synthetic macromolecular fibres
    • B32B2262/0276Polyester fibres
    • B32B2262/0284Polyethylene terephthalate [PET] or polybutylene terephthalate [PBT]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10Inorganic fibres
    • B32B2262/101Glass fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/514Oriented
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • B32B2311/12Copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00Epoxy resins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/0287Unidirectional or parallel fibers

Definitions

  • the present invention pertains to a basic material for making a PWB laminate comprising at least one layer of parallel, unidirectionally oriented (UD) reinforcing fibres impregnated with not yet fully consolidated matrix resin, i.e., a UD prepreg layer.
  • the invention also pertains to laminates for use in printed wire boards (PWBs) prepared from such a UD prepreg layer.
  • a UD prepreg material for making PWBs is known from US 4,814,945.
  • This disclosure relates to a PWB laminate comprising a matrix resin reinforced with parallel aramid fibres.
  • the laminate is built up from layers of unidirectional aramid tape stacked one on top of the other in crosswise fashion.
  • the aramid tape is formed by arranging a single layer of parallel aramid fibres to form fibre strips, coating the fibre strips with resin, and heating them to a semi-cured or "B"-stage.
  • a problem easily incurred when making UD crossply laminates is disorientation of the UD layers. Retaining proper orientation is necessary for obtaining a laminate having sufficient flatness, which is a property of particular importance to a PWB laminate. Particularly if a still flowable matrix resin is used, e.g., B-stage material, there is a substantial risk of disorientation occurring since, on account of the flow which occurs during lamination, the tension, and hence the orientation of the UD layers, cannot be adequately controlled.
  • a still flowable matrix resin e.g., B-stage material
  • UD-reinforced crossply composite laminates on the basis of prepreg.
  • prepreg usually woven glass-fabric prepreg
  • resin systems and lamination technology of proven viability in this field.
  • the customary prepregs are less prone to disorientation problems.
  • UD-crossply laminates are pre-eminently suitable as PWB substrate. Of course, this holds only if these laminates can be manufactured by means of a method that enables retaining proper orientation.
  • a problem associated with the orientation of UD fibres is addressed in DE 3542295. It pertains to photographic shutter materials on the basis of a substrate layer of oriented fibres contained in a matrix resin. It is disclosed that by applying a layer of a heat-shrinkable synthetic foil onto the substrate layer, positional deviations of the parallel fibres during shaping under pressure may be suppressed. The use of a heat-shrinkable foil will cause the UD prepreg to slightly bend in the fibre direction. While this may be desirable in the case of a shutter material, in a PWB laminate it should be avoided entirely.
  • JP-Hei-4-329,132 teaches a hybrid prepreg article for use therein.
  • the hybrid prepreg comprises two different kinds of parallel fibres, essentially thick ones having a diameter of from 30 to 500 ⁇ m and thin ones of 5 to 30 ⁇ m, and a metal layer of 5-100 ⁇ m thickness.
  • any reinforcing fibres be filaments having a diameter below 30 ⁇ m, and preferably of from 3 to 15 ⁇ m, since thicker fibres are prohibitive for suitable drilling of holes and for obtaining a desirable surface flatness. It is particularly with thin prepregs, having thin reinforcing fibers, that handling problems occur.
  • JP-Hei-6-008,240 teaches structural composites, the outermost layer of which has been covered with a metal or metal-compound film. While the core of the composite can be reinforced with parallel, unidirectional yarns, the outer layers are reinforced with glass cloth.
  • the disclosure is directed to shaped, round articles such as golf club shafts or antennas.
  • Japanese Patent Application Laid-Open No. 201699/1985 discloses a heat-bondable electric shielding material which comprises a metal foil, a heat-bondable resin layer formed thereon, and a multiplicity of parallel reinforcing wires fixed to the resin layer.
  • the conductive wires which have a diameter of from 0.03 to 0.5 mm, are spaced apart 10 to 15 cm. It is disclosed that if the metal foil is to be prevented from wrinkling, the shielding material should be wound up together with a cushioning material, e.g. a polyurethane foam sheet.
  • EP 0372 505 It essentially discloses a fibre-reinforced thermoplastic laminate.
  • the fibre reinforcement can be in any form.
  • the thermoplastic laminate is provided with a metal foil when in the molten state. It generally is a high temperature thermoplastic, which is solid at room temperature.
  • the disclosed laminate is not the type of basic material for making PWBs that the invention is aiming at, as it serves as a PWB laminate itself.
  • the laminate manufactured according to EP 372 505 is a laminate having the final properties of a PWB substrate.
  • the invention essentially aims at UD prepregs which can be used to make PWBs, but are not suitable as PWB laminates in themselves.
  • the invention now seeks to provide a UD prepreg layer that allows further handling and processing without incurring problems such as indicated above, and is of a type essentially suitable for making a PWB laminate. Furthermore, the invention seeks to provide a UD prepreg layer in which it is possible to employ a thermally curable resin as the not yet fully consolidated resin without suffering from the additional problems associated therewith. To this end the invention provides a basic material for making a PWB laminate comprising a UD prepreg layer of the type indicated above, wherein the reinforcing fibres have a diameter of below 30 ⁇ m, and a layer of a conductive metal foil, such as copper foil, the layer of conductive metal foil being bonded to the UD prepreg layer.
  • the layer of conductive metal foil makes for a UD prepreg material having sufficient strength perpendicular to the fibres direction to prevent tearing during handling. If the foil is laminated onto the UD prepreg prior to its being cut to size, the problem of handling a thin copper foil is solved too.
  • the invention pertains to a basic material for making a PWB laminate.
  • This basic material comprises a layered structure, the two consecutive layers bonded to each other being a layer of a metal foil, such as copper foil, and a layer of parallel, unidirectionally oriented fibres impregnated with not yet fully consolidated matrix resin.
  • prepreg is well-known in the art and generally indicates a reinforcing material impregnated with resin and (semi)cured. It usually is still in a tacky stage.
  • not yet fully consolidated matrix material indicates that the resin can be further cured still. In the case of a thermoset resin, it generally refers to the matrix resin being in the B stage.
  • the several matrix material (matrix resin) stages are customarily identified in the art as the “A”, "B”, and “C” stages, the A stage indicating unsolidified resin (i.e., in the case of a thermoset resin: the uncured stage), the B stage generally indicating partial solidification (in the case of a thermoset resin: the reaction has proceeded through the formation of longer chains, but not to full network formation), and the C stage indicating a solidified (cured) stage.
  • the terms A stage, B stage and C stage are known to the person of ordinary skill in the art and require no further elucidation here.
  • the foiled prepreg of the invention can be laminated with other prepreg layers or with layers of a consolidated material.
  • other layers comprise a woven fabric reinforcement, but if the advantages of UD reinforcement are to be enjoyed in full, the other layers should have UD parallel fibres as well, i.e., should be UD prepreg layers or consolidated (non-flowing) UD composite layers such as disclosed in WO 92/22191.
  • Woven glass fibres are impregnated with a solution of epoxy resin in MEK.
  • the resulting prepreg is cut to length and stacked between two copper foils.
  • This package is cured under pressure at elevated temperature in a multidaylight press.
  • the laminate coated with copper on both sides manufactured in this manner is then formed into a printed wire board by etching.
  • PWB laminates on the basis of the UD prepreg according to the invention can be manufactured in essentially analogous manner.
  • the preparation of the UD prepreg basic material deviates from the process of impregnating and curing a woven fabric.
  • the UD prepreg can be conveniently prepared by coating a copper foil with matrix resin to form a foiled resin layer, heating the foiled resin layer so as to ensure that the resin is sufficiently flowable for impregnation of filaments to occur, and applying parallel filaments onto the resin to form a foiled UD-reinforced resin layer.
  • the impregnation can also be carried through inversely, viz.
  • the foiled UD-reinforced resin layer is either further heated or subjected to actinic radiation to effect partial curing of the resin (e.g., to the B-stage) or cooled down in order for the resin to solidify (e.g., with a thermoplastic resin that is solid at room temperature).
  • the resulting foiled UD prepreg is easier to handle than both the bare copper foil and the corresponding non-foiled UD prepreg.
  • the foiled prepreg is cut to length and ready to be stacked and laminated with other, non- foiled, UD layers.
  • the non-foiled UD layers will form the inner laminae and be sandwiched between two foiled UD prepregs (with the Cu-foil layers on the outer surfaces).
  • the invention also pertains to a method of making a PWB laminate wherein several layers comprising parallel, unidirectionally oriented reinforcing fibres contained in a resin matrix are stacked and pressed.
  • the layers forming the outer surfaces of the laminate are formed of a foiled UD-prepreg comprising a layer of a conductive metal foil bonded to a UD-prepreg layer, the conductive metal foil being on the outside of the laminate.
  • the layers forming the inner laminae of the PWB laminate are prepreg layers comprising parallel, unidirectionally oriented reinforcing fibres impregnated with not yet fully consolidated matrix resin, i.e., non-foiled UD prepreg.
  • the layers forming the inner laminae of the laminate are formed of non-flowing UD-composite layers or non-flowing UD crossply laminates.
  • non-flowing UD composite is used to indicate a composite material comprising unidirectionally oriented reinforcing fibres enclosed in a matrix material which has been solidified (consolidated) to the extent that it is not brought to flow again during the 96/09158 PCI7EP95/03652
  • the non-flowing UD composite is under such conditions of pressure and temperature as to be in a state below its softening point (i.e., below Tg or apparent Tg), or solidified to a stage in which flow no longer can occur.
  • Tg softening point
  • solidification of the non- flowing UD composite it is preferred for the solidification of the non- flowing UD composite to have reached the C stage, or for such resins to be used as those comprising rigid molecular chains in which, under regular storage and processing conditions, a non-flowing state may already be attained at a stage still called the B stage.
  • a stage material can be employed.
  • these laminae can be prepared in accordance with WO 92/22191. It is also possible to stack and laminate foiled UD prepreg in accordance with the invention using intermediate substrates such as disclosed in WO 92/22192, which may be coated with adhesive or not.
  • UD crossply laminates preferably are balanced and symmetric.
  • the term "balanced” indicates equal properties in perpendicular directions (e.g., an equal number of filaments in the x and y directions)
  • the term "symmetric” indicates mirror image symmetry over the thickness of the laminate, i.e., the laminate is mid-plane symmetric.
  • the plane of symmetry which runs through the centre of the laminate and is parallel to the laminate's outer surfaces, is either the boundary between two UD layers or an imaginary plane running through one UD layer, depending on the number and order of UD layers over the thickness of the laminate.
  • a major advantage of such a balanced and mid-plane symmetric laminate provided with crosswise applied UD-reinforced layers consists in the isomorphism of its properties in the x and y directions (i.e., the two fibre directions perpendicular to each other). More particular preference is given to the laminate being so composed that the UD-reinforced layers are oriented as specified in one of the following models, with 0° and 90° standing for orthogonal orientational directions and the relative thickness of the layers being indicated by repeating the given orientation where necessary: 0°/90°90°/0°
  • the UD-reinforced layers in the laminate according to the invention will each have a thickness in the range of 6 to 800 ⁇ m, preferably of about 12.5 to 400 ⁇ m.
  • the outer layers of the crossply laminate will be formed by a foiled UD prepreg in accordance with the present invention, i.e., a layered structure having a layer of metal foil (say; Cu) and a UD layer (say; 0°) .
  • the inner UD layers have a double thickness as compared with the outer UD layers
  • the inner layers can be built up of a UD prepreg.
  • the UD layers of double thickness do not display the same handling problems as a UD layer of single thickness (which problem is solved in accordance with the invention by applying metal foil).
  • the inner layers are the above-identified non-flowing UD composite layers in accordance with WO 92/22191.
  • the stack of non- foiled UD layers sandwiched between two foiled UD prepregs is such that the UD-reinforced layers are oriented as specified in one of the above models, i.e., Cu0°/90 o 90 o /0°Cu, or Cu0°/90 o 90 o /0 o 0 o /90°90 o /0°Cu.
  • the lamination may be conducted in a multidaylight press, an autoclave, a vacuum press, a double belt press, or in any other suitable apparatus.
  • the PWB laminates made on the basis of the foiled UD-prepreg in acccordance with the present invention are suitable to be used in multilayer PWBs (MLBs), e.g., as disclosed in WO 92/22192.
  • MLBs multilayer PWBs
  • the materials employed in carrying through the present invention are not especially critical. Preferably, use is made of the materials discussed hereinafter.
  • the matrix material is a thermoplastic or a ther osetting polymer, preference being given to thermosetting resins. More preferred is the use of an epoxy resin based matrix material, but other resins are also useful in principle. Examples include cyanate esters, unsaturated polyester (UP) resins, vinyl ester resins, acrylate resins, BT epoxy resin, bismaleimide resin (BMI), polyi ide (PI), phenol resins, triazines, polyurethanes, silicone resin, biscitraconic resin (BCI). Alternatively, combinations of said resins may be employed, and it is also possible to mix the aforementioned resins with certain appropriate thermoplasts, such as PPO, PES, PSU, and PEI among others.
  • thermosetting resins More preferred is the use of an epoxy resin based matrix material, but other resins are also useful in principle. Examples include cyanate esters, unsaturated polyester (UP) resins, vinyl ester resins, acrylate resins, BT epoxy resin, bismaleimide resin (BMI
  • interpenetrating polymer networks may be suitable. It is of advantage to incorporate compounds into the matrix material to render it flame resistant, such as phosphorus or halogen-(particularly bromine-) containing compounds.
  • a particular matrix material which is preferred for its favourable flow and curing properties comprises about 100 parts by weight of Epikote ® 828 EL, about 73 parts by weight of Epikote ® 5050, and about 4 parts by weight of a complex of boron trifluoride and onoethyl amine.
  • the preferred reinforcing material consists of filament yarns
  • non-continuous fibres may also be employed.
  • the reinforcing yarns are preferably selected from the following group of materials: glass, e.g., E-glass, A-glass, C-glass, D-glass, AR-glass, R-glass, Sl-glass, and S2-glass, and various ceramic materials, such as alumina and silicon carbide.
  • polymer based fibres more particularly so-called liquid- crystalline polymers, such as paraphenylene terephthalamide (PPDT), polybenzobisoxazole (PBO), polybenzobisthiazole (PBT), and polybenzoimidazole (PBI), as are fibres based on polyethylene naphthalate (PEN), polyethylene terephthalate (PET), and polyphenylene sulphide (PPS).
  • the fibres (filaments) should have a diameter of below 30 ⁇ m, e.g. 20 ⁇ m. Typical diameters more particularly range from 3 to 15 ⁇ m, and preferably are of from 5 to 13 ⁇ m.
  • the fibre content in the matrix is about 10-90 vol .%, preferably in the range of about 40 to about 70 vol.%.
  • a fibre volume fraction of about 50 vol .% is highly satisfactory.
  • the composite laminates manufactured using the process according to the invention are also suited to be used in a flexible panel or laminate and in rigid-flex laminates.
  • woven fabrics undergo cracking at the junctions of warp and weft fibres, due to the fact that fibres oriented in the bending direction are interwoven with fibres perpendicular to the bending direction, this adverse effect being enhanced by the high fibre concentration at these junctions, which leads to cracking at a relatively low degree of bending.
  • Such cracks cause a high concentration of stress in the conductive traces present on the flexible laminate, and consequently a high risk of cracking, which leads to circuit breakage.
  • the orientation of the outer UD layers preferably parallels the desired bending direction.
  • the present UD crossply laminates are pre-eminently suited to be used as supporting material in devices with various integrated circuits provided thereon (multichip modules). This is notably due to the favourable TCEs, which mostly are the result of the high fibre volume fraction that can be obtained when crossply laminates are used and may be close to the TCEs of electronic components (chips) used in conjunction with PWBs, more particularly MLBs. Such components may be provided on top of an MLB (chip-on-board) or else be embedded in a substrate such as an intermediate substrate according to WO 92/22192 (chip-in-board) .
  • Fig. 1 shows a foiled UD prepreg (1) in accordance with the invention.
  • a foiled UD prepreg (1) in accordance with the invention.
  • copper foil (2) which is applied onto a UD prepreg layer (3) made up of parallel, unidirectionally oriented reinforcing fibres (4) impregnated with not yet fully consolidated matrix resin (5).
  • Fig. 2 shows a non-flowing UD composite (6) in accordance with WO 92/22191.
  • x and y cross-sections are two layers made up of UD fibres (7) impregnated with non-flowing matrix resin (8).
  • Fig. 3 shows a CuO°/90°90°/0°Cu PWB laminate made by stacking and laminating the non-flowing UD composite (6), with two foiled UD prepregs (1).

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
EP95932765A 1994-09-19 1995-09-18 Foiled ud-prepreg and pwb laminate prepared therefrom Ceased EP0782500A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP95932765A EP0782500A1 (en) 1994-09-19 1995-09-18 Foiled ud-prepreg and pwb laminate prepared therefrom

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP94202688 1994-09-19
EP94202688 1994-09-19
EP95932765A EP0782500A1 (en) 1994-09-19 1995-09-18 Foiled ud-prepreg and pwb laminate prepared therefrom
PCT/EP1995/003652 WO1996009158A1 (en) 1994-09-19 1995-09-18 Foiled ud-prepreg and pwb laminate prepared therefrom

Publications (1)

Publication Number Publication Date
EP0782500A1 true EP0782500A1 (en) 1997-07-09

Family

ID=8217206

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95932765A Ceased EP0782500A1 (en) 1994-09-19 1995-09-18 Foiled ud-prepreg and pwb laminate prepared therefrom

Country Status (9)

Country Link
EP (1) EP0782500A1 (zh)
JP (1) JPH10508720A (zh)
KR (1) KR970705465A (zh)
CN (1) CN1158101A (zh)
AU (1) AU694564B2 (zh)
CA (1) CA2200314A1 (zh)
MX (1) MX9702059A (zh)
TW (1) TW371285B (zh)
WO (1) WO1996009158A1 (zh)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0838977A1 (en) * 1996-10-25 1998-04-29 Gividi Italia S.P.A. Laminates for printed circuits using unidirectional glass fabric
WO2000072643A1 (en) * 1999-05-26 2000-11-30 Ppg Industries Ohio, Inc. Fabrication of unidirectional laminate prepregs using tape casting methods and equipment
WO2003009656A1 (en) 2001-07-18 2003-01-30 Matsushita Electric Industrial Co., Ltd. Circuit-formed substrate and method of manufacturing circuit-formed substrate
ITRM20040571A1 (it) * 2004-11-22 2005-02-22 Gen Services Srl Rotore, relativo procedimento di fabbricazione, e macchina ad induzione impiegante il rotore.
US8129623B2 (en) 2006-01-30 2012-03-06 Kyocera Corporation Resin film, adhesive sheet, circuit board, and electronic apparatus
WO2008093757A1 (ja) 2007-01-31 2008-08-07 Kyocera Corporation プリプレグシートの製造方法および製造装置ならびにプリプレグシート
EP1970951A3 (en) 2007-03-13 2009-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
EP2372756A1 (en) 2007-03-13 2011-10-05 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device and manufacturing method thereof
US8500225B2 (en) 2007-03-26 2013-08-06 Lg Electronics Inc. Reinforcing component for refrigerator
EP1976001A3 (en) 2007-03-26 2012-08-22 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
EP1976000A3 (en) * 2007-03-26 2009-05-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US8012561B2 (en) 2007-03-30 2011-09-06 Kyocera Corporation Fiber-reinforced resin and method for manufacturing the same
EP2001047A1 (en) * 2007-06-07 2008-12-10 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device
JP2009045915A (ja) * 2007-07-26 2009-03-05 Kyocera Corp 複合基板、配線基板および実装構造体、並びに複合基板の製造方法
US8284557B2 (en) 2007-10-18 2012-10-09 Kyocera Corporation Circuit board, mounting structure, and method for manufacturing circuit board
JP5293075B2 (ja) * 2007-10-24 2013-09-18 日立化成株式会社 金属箔張り積層板及びプリント配線板
JP2009205669A (ja) 2008-01-31 2009-09-10 Semiconductor Energy Lab Co Ltd 半導体装置
KR101596698B1 (ko) 2008-04-25 2016-02-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치 제조 방법
WO2009139282A1 (en) 2008-05-12 2009-11-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
WO2009142310A1 (en) 2008-05-23 2009-11-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
EP2297778A1 (en) 2008-05-23 2011-03-23 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device
US8053253B2 (en) 2008-06-06 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP5248412B2 (ja) 2008-06-06 2013-07-31 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP5473413B2 (ja) 2008-06-20 2014-04-16 株式会社半導体エネルギー研究所 配線基板の作製方法、アンテナの作製方法及び半導体装置の作製方法
US8563397B2 (en) 2008-07-09 2013-10-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101753574B1 (ko) 2008-07-10 2017-07-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
TWI475282B (zh) 2008-07-10 2015-03-01 Semiconductor Energy Lab 液晶顯示裝置和其製造方法
JP5216716B2 (ja) 2008-08-20 2013-06-19 株式会社半導体エネルギー研究所 発光装置及びその作製方法
CN102160179B (zh) 2008-09-19 2014-05-14 株式会社半导体能源研究所 半导体装置及其制造方法
JP5583951B2 (ja) 2008-11-11 2014-09-03 株式会社半導体エネルギー研究所 半導体装置の作製方法
CN102460722B (zh) 2009-06-05 2015-04-01 株式会社半导体能源研究所 光电转换装置及其制造方法
TWI517268B (zh) 2009-08-07 2016-01-11 半導體能源研究所股份有限公司 端子構造的製造方法和電子裝置的製造方法
JP5719560B2 (ja) 2009-10-21 2015-05-20 株式会社半導体エネルギー研究所 端子構造の作製方法
KR20110114325A (ko) * 2010-04-13 2011-10-19 삼성모바일디스플레이주식회사 표시 장치
JP5594872B2 (ja) * 2010-05-06 2014-09-24 日精株式会社 着色繊維強化複合材
JP5851875B2 (ja) * 2012-02-14 2016-02-03 信越化学工業株式会社 光学半導体装置用パッケージの製造方法及び光学半導体装置の製造方法
NL2016357B1 (en) * 2016-03-03 2017-09-20 Allotropica Tech Inc Pre-preg and composite products
JPWO2019111416A1 (ja) * 2017-12-08 2020-12-10 昭和電工マテリアルズ株式会社 プリプレグ、積層板、及びそれらの製造方法、並びにプリント配線板及び半導体パッケージ
CN109049891B (zh) * 2018-06-13 2020-09-29 咸阳天华电子科技有限公司 一种高弹性覆铜单向纤维片的制备方法
CN109496076B (zh) * 2018-12-19 2020-12-15 咸阳天华电子科技有限公司 一种单向纤维电路板的制造工艺
CN111688287B (zh) * 2020-06-14 2022-06-10 湖南亿润新材料科技有限公司 一种环氧树脂半固化片及其生产工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51111879A (en) * 1975-03-27 1976-10-02 Mitsubishi Gas Chemical Co Manufacture of metal foillclad preepreg
FR2516441A1 (fr) * 1981-11-18 1983-05-20 Spie Batignolles Procede de fabrication de profiles en resine thermoplastique chargee de fibres, installation pour la mise en oeuvre, profiles obtenus et leur utilisation
KR900009265A (ko) * 1988-12-07 1990-07-04 원본미기재 강화 열 가소성 복합체-금속박 적층품의 제조방법
JPH04329132A (ja) * 1991-04-30 1992-11-17 Tonen Corp ハイブリッドプリプレグ
TW244340B (zh) * 1992-07-21 1995-04-01 Akzo Nv

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9609158A1 *

Also Published As

Publication number Publication date
CA2200314A1 (en) 1996-03-28
AU3568495A (en) 1996-04-09
MX9702059A (es) 1997-06-28
CN1158101A (zh) 1997-08-27
AU694564B2 (en) 1998-07-23
KR970705465A (ko) 1997-10-09
TW371285B (en) 1999-10-01
JPH10508720A (ja) 1998-08-25
WO1996009158A1 (en) 1996-03-28

Similar Documents

Publication Publication Date Title
AU694564B2 (en) Foiled UD-prepreg and PWB laminate prepared therefrom
MXPA97002059A (en) Preimpregnado material unidirectionally oriented of thin thread and laminar unit for printed wiring board prepared from mi
EP0587634B1 (en) Method of manufacturing a multilayer printed wire board
EP0050855B1 (en) Laminates
US5662761A (en) Method of manufacturing a UD-reinforced PWB laminate
AU693847B2 (en) A method of making a composite laminate and a PWB substrate so made
EP0751866B1 (en) Method of making a ud crossply pwb laminate having one or more inner layers of metal
US5496613A (en) Printed wire boards and method of making same
EP0700237A1 (en) Thin core printed wire boards
RU2115274C1 (ru) Способ изготовления многослойной платы с печатным монтажом
JP6967736B2 (ja) プリプレグ、金属張積層板、印刷配線基板及び多層印刷配線基板
JPH0229012B2 (ja) Sekisoban
JPH06272135A (ja) 多層プリント配線板用ガラス繊維織布及び多層プリント配線板用プリプレグ
JPS647863B2 (zh)
JPH04279081A (ja) エポキシ樹脂銅張積層板およびその製造方法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19970224

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB IE IT LI LU NL PT SE

17Q First examination report despatched

Effective date: 19980211

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 19991218