KR900009265A - 강화 열 가소성 복합체-금속박 적층품의 제조방법 - Google Patents

강화 열 가소성 복합체-금속박 적층품의 제조방법 Download PDF

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Publication number
KR900009265A
KR900009265A KR1019890017614A KR890017614A KR900009265A KR 900009265 A KR900009265 A KR 900009265A KR 1019890017614 A KR1019890017614 A KR 1019890017614A KR 890017614 A KR890017614 A KR 890017614A KR 900009265 A KR900009265 A KR 900009265A
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South Korea
Prior art keywords
fiber
metal foil
die
poly
reinforced
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KR1019890017614A
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English (en)
Inventor
에드워드 오코너 제심즈
로코 보너자 베네딕트
토마스 웹스터 제임즈
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원본미기재
휘립프스 피트로오리암 캄파니
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Publication of KR900009265A publication Critical patent/KR900009265A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B32B37/203—One or more of the layers being plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/08—Reinforcements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2398/00—Unspecified macromolecular compounds
    • B32B2398/20—Thermoplastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

내용 없음

Description

강화 열 가소성 복하체-금속박 적층품의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 방법을 수행하기 위한 장치 시스템의 개략도이다, 제2도는 제1도에서 보여주는 가열된 포오밍다이 및 냉각 다이의 확대 측면도이다, 제3도는 제2도의 가열된 포오밍 다이 및 냉각다이의 상면도이다.

Claims (13)

  1. 열가소성 물질이 다이를 통과하는 동안 용융 상태에 도달하여서 다이에 부착된 금속 박을 가지는 섬유-강화 열가소성 복합체로 구성된 적층물을 형성할 정도의 온돌르 가지는 가열성 포오밍 다이(forming die)를 통해, 열가소성 물질로 함침시킨 섬유-강화 물질 및 최소한 한개의 인접하여 위치한 금속박을 끌어당기는 것으로 구성되는, 섬유-강화 물질 및 최소한 한개의 인접하여 위치한 금속박을 끌어당기는 것으로 구성되는, 섬유-강화 열가소성 복합체-금속박 적층품의 제조 방법.
  2. 제1항에 있어서, 상기 가열판 포오밍 다잉의 입구 단면이 그들의 출구 단면 보다 큰 방법.
  3. 제2항에 있어서, 상기 열가소성 물질이 폴리(아릴렌 설파이드), 폴리설폰, 폴리이미드, 폴리에테르이미드, 폴리에테르케톤 또는 폴리에테르에테르 케톤인 방법.
  4. 제3항에 있어서, 상기 폴리(아릴렌 설파이드)가 폴리(페닐렌 설파이드)인 방법.
  5. 제1항 내지 제4항중 어느 한 항에 있어서, 상기 섬유 강화 물질이 유리 섬유, 탄소섬유 또는 아라미드 섬유로 형성되는 방법.
  6. 제1항 내지 제4항중 어느 한 항에 있어서, 상기 금속박이 구리, 알루미늄 또는 은박인 방법.
  7. 제6항에 있어서, 상기 금속박이 구리박인 방법.
  8. 제1항 내지 제4항중 어느 한 항에 있어서, 상기 열가소성 물질이 폴리(아릴렌 설파이드)이고 강화 물질이 유리 섬유인 방법.
  9. 제1항 내지 제4항중 어느 한 항에 있어서, 상기 적층물을 상기 가열된 포오밍 다이에서 배출시킨 후에 냉각 다이를 통해 끌어당기는 것을 포함하는 방법.
  10. 제9항에 있어서, 상기 냉각 다이가, 상기 적충물이 약 80℃내지 약 l00℃로 냉각되는 온도를 가지는 방법.
  11. 제1항 내지 제4항 중 어느 한 항에 있어서. 상기 가열된 포오밍 다이의 온도가, 상기 열가소성 물질의 온도가 약 350℃ 내지 약 400℃의 고온~약 230℃내지 약 280℃외 저온 범위가 될 정도인 방법.
  12. 제10항에 있어서, 상기 적층물을 상기 냉각다이로 통과시킨후에 결정된 길이의 다수의 제품으로 절단하는 방법.
  13. 제1항 내지 제4항중 어느 한 항에 있어서, 열가소성 물질로 함침된 섬유-강화 물질의 한개 이상의 연속 테이프 또는 시이트 및 금속박의 한개 이상의 연속 테이프 또는 시이트를 가열된 포오밍 다이를 통해 끌어당기는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890017614A 1988-12-07 1989-11-30 강화 열 가소성 복합체-금속박 적층품의 제조방법 KR900009265A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28101288A 1988-12-07 1988-12-07
US07/281,012 1988-12-07

Publications (1)

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KR900009265A true KR900009265A (ko) 1990-07-04

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EP (1) EP0372505A3 (ko)
JP (1) JPH02188240A (ko)
KR (1) KR900009265A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100647008B1 (ko) * 2006-06-21 2006-11-23 주식회사 한국화이바 하이브리드 직물 및 그를 적용하여 내화염특성이 강화된복합재료

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TW371285B (en) * 1994-09-19 1999-10-01 Amp Akzo Linlam Vof Foiled UD-prepreg and PWB laminate prepared therefrom
JPH08309926A (ja) * 1995-05-17 1996-11-26 Nitto Boseki Co Ltd 積層板材及びそれから作製した織機の綜絖枠
AU6015099A (en) * 1998-09-03 2000-03-27 Linlan Induction Ab Sandwich construction
DE102005042167A1 (de) * 2005-09-06 2007-03-08 Rehau Ag + Co. Verfahren zur Herstellung eines Polymer-Metall-Koextrudats und Polymer-Metall-Koextrudat, sowie Herstellvorrichtung
DE112016005215T5 (de) * 2015-11-13 2018-08-02 Aleris Rolled Products Germany Gmbh Verfahren zur Herstellung eines Faser-Metall-Laminat-Materials
CN109496076B (zh) * 2018-12-19 2020-12-15 咸阳天华电子科技有限公司 一种单向纤维电路板的制造工艺
EP3753969A1 (en) * 2019-06-19 2020-12-23 Rhodia Operations Method for production of thermoplastic composites and their uses
US11559956B2 (en) * 2019-10-31 2023-01-24 The Boeing Company Method and apparatus for rapid continuous consolidation of thermoplastic components
US20240342975A1 (en) * 2023-04-14 2024-10-17 Spirit Aerosystems, Inc. Apparatus and method for roll forming thermoplastic composites

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US3993726A (en) * 1974-01-16 1976-11-23 Hercules Incorporated Methods of making continuous length reinforced plastic articles
US4395459A (en) * 1978-07-11 1983-07-26 Herschdorfer C George Reinforced laminates produced from crosslinkable thermoplastic olefin polymer material
US4389453A (en) * 1982-06-07 1983-06-21 Toray Industries, Inc. Reinforced polyphenylene sulfide molded board, printed circuit board including this molded board and process for preparation thereof
US4820366A (en) * 1987-03-06 1989-04-11 Phillips Petroleum Company Apparatus and method for pultruding reinforced plastic articles
EP0312150B1 (en) * 1987-10-14 1992-12-02 Structural Laminates Company Laminate of metal sheets and continuous filaments-reinforced thermoplastic synthetic material, as well as a process for the manufacture of such a laminate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100647008B1 (ko) * 2006-06-21 2006-11-23 주식회사 한국화이바 하이브리드 직물 및 그를 적용하여 내화염특성이 강화된복합재료

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EP0372505A2 (en) 1990-06-13
JPH02188240A (ja) 1990-07-24
EP0372505A3 (en) 1991-08-28

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