Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J61/00—Gas-discharge or vapour-discharge lamps
  • H01J61/02—Details
  • H01J61/30—Vessels; Containers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
  • H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
  • H01J29/028—Mounting or supporting arrangements for flat panel cathode ray tubes, e.g. spacers particularly relating to electrodes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
  • H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
  • H01J29/08—Electrodes intimately associated with a screen on or from which an image or pattern is formed, picked-up, converted or stored, e.g. backing-plates for storage tubes or collecting secondary electrons
  • H01J29/085—Anode plates, e.g. for screens of flat panel displays
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
  • H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
  • H01J29/10—Screens on or from which an image or pattern is formed, picked up, converted or stored
  • H01J29/18—Luminescent screens
  • H01J29/30—Luminescent screens with luminescent material discontinuously arranged, e.g. in dots, in lines
  • H01J29/32—Luminescent screens with luminescent material discontinuously arranged, e.g. in dots, in lines with adjacent dots or lines of different luminescent material, e.g. for colour television
  • H01J29/327—Black matrix materials
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
  • H01J29/46—Arrangements of electrodes and associated parts for generating or controlling the ray or beam, e.g. electron-optical arrangement
  • H01J29/467—Control electrodes for flat display tubes, e.g. of the type covered by group H01J31/123
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
  • H01J29/86—Vessels; Containers; Vacuum locks
  • H01J29/864—Spacers between faceplate and backplate of flat panel cathode ray tubes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J31/00—Cathode ray tubes; Electron beam tubes
  • H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
  • H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
  • H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
  • H01J31/123—Flat display tubes
  • H01J31/125—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection
  • H01J31/127—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection using large area or array sources, i.e. essentially a source for each pixel group
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
  • H01J9/02—Manufacture of electrodes or electrode systems
  • H01J9/18—Assembling together the component parts of electrode systems
  • H01J9/185—Assembling together the component parts of electrode systems of flat panel display devices, e.g. by using spacers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
  • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
  • H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
  • H01J9/242—Spacers between faceplate and backplate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J2329/00—Electron emission display panels, e.g. field emission display panels
  • H01J2329/02—Electrodes other than control electrodes
  • H01J2329/08—Anode electrodes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J2329/00—Electron emission display panels, e.g. field emission display panels
  • H01J2329/18—Luminescent screens
  • H01J2329/32—Means associated with discontinuous arrangements of the luminescent material
  • H01J2329/323—Black matrix
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J2329/00—Electron emission display panels, e.g. field emission display panels
  • H01J2329/86—Vessels
  • H01J2329/8625—Spacing members
  • H01J2329/864—Spacing members characterised by the material
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J2329/00—Electron emission display panels, e.g. field emission display panels
  • H01J2329/86—Vessels
  • H01J2329/8625—Spacing members
  • H01J2329/8645—Spacing members with coatings on the lateral surfaces thereof
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J2329/00—Electron emission display panels, e.g. field emission display panels
  • H01J2329/86—Vessels
  • H01J2329/8625—Spacing members
  • H01J2329/865—Connection of the spacing members to the substrates or electrodes
  • H01J2329/8655—Conductive or resistive layers

Definitions

• This invention relates to flat panel devices such as flat cathode ray tube (CRT) displays. This invention also relates to techniques used in fabricating flat panel devices.
• CRT flat cathode ray tube
• flat CRT display also known as a "flat panel display”
• flat panel display In addition to flat CRT displays, other flat panel displays, such as plasma displays, have also been developed.
• a faceplate, a backplate, and connecting walls around the periphery of the faceplate and backplate form an enclosure.
• the enclosure In some flat panel displays, the enclosure is held at vacuum pressure, e.g., in flat CRT displays, approximately 1 x 10" 7 torr.
• the interior surface of the faceplate is coated with light emissive elements such as phosphor or phosphor patterns which define the active region of the display.
• the light emissive elements are caused to emit light, e.g., cathodic elements located adjacent the backplate are excited to release electrons which are accelerated toward the phosphor on the faceplate, causing the phosphor to emit light which is seen by a viewer at the exterior surface of the faceplate (the "viewing surface”) .
• the electron-emissive elements are selectively excited to cause certain of the elements to emit electrons that move towards phosphors on the faceplate. These phosphors, upon being struck by the impinging electrons, emit light that is visible at the exterior surface of the faceplate.
• the electrons emitted from each of the sets of electron-emissive elements are intended to strike only certain target phosphors. However, some of the emitted electrons invariably strike portions of the faceplate outside the target phosphors.
• a matrix of dark non-reflective regions that emit substantially no light when struck by electrons from the electron-emissive elements are suitably dispersed among the phosphor regions. In a color display, this black matrix also improves color purity.
• the phosphor regions extend further away from the faceplate than the black matrix.
• the faceplate and backplate are particularly susceptible to this type of mechanical failure due to their high aspect ratio.
• “aspect ratio” is defined as either the width, i.e., distance between the interior surfaces of opposing connecting walls, or the height, i.e., distance between the interior surface of the faceplate and the interior surface of the backplate, divided by the thickness.
• the faceplate or backplate of a flat panel display may also fail due to external forces resulting from impacts sustained by the flat panel display.
• Spacers have been used to internally support the faceplate and/or backplate. Previous spacers have been walls or posts located between pixels (phosphor regions that define the smallest individual picture element of the display) in the active region of the display.
• polyimide spacers have been found inadequate because of: 1) insufficient strength; 2) inability to match the coefficient of thermal expansion with the materials typically used for the faceplate (e.g., glass) , backplate (e.g. , glass, ceramic, glass-ceramic or metal) and addressing grid (e.g., glass-ceramic or ceramic) , resulting in registration problems; and 3) outgassing that may occur when polyimide is used in a vacuum pressure environment.
• the presence of the spacers may adversely affect the flow of electrons toward the faceplate in the vicinity of the spacer.
• stray electrons may electrostatically charge the surface of the spacer, changing the voltage distribution near the spacer from the desired distribution and resulting in distortion of the electron flow, thereby causing distortions in the image produced by the display.
• a flat panel device includes a spacer for providing internal support of the device.
• the spacer prevents the device from collapsing as a result of stresses arising from the differential pressure between the internal vacuum pressure (i.e., any pressure less than atmospheric pressure) and the external atmospheric pressure.
• the spacer also internally supports the device against stresses arising from external impact forces.
• surfaces of the spacer within the enclosure are treated to prevent or minimize charge buildup on the spacer surfaces. Consequently, the presence of the spacer does not adversely affect the flow of electrons near the spacer, so that the image produced by the device is not distorted.
• a coating is formed on spacer surfaces, the coating being a material having a secondary emission ratio ⁇ less than 4 and a sheet resistance between 10 9 and 10 14 ohms/ ⁇ . in an additional embodiment, the coating has a secondary emission ratio ⁇ less than 2.
• the coating is selected from a group of materials including chromium oxide, copper oxide, carbon, titanium oxide and vanadium oxide. In one particular embodiment, the coating is chromium oxide.
• a first coating is formed on spacer surfaces. A second coating is formed over the first coating. The first coating is a material having a sheet resistance between 10 9 and 10 14 ohms/ ⁇ . The second coating is a material having a secondary emission ratio ⁇ less than 4. In an additional embodiment the second coating has a secondary emission ratio ⁇ less than 2.
• spacer surfaces are first surface-doped to produce a sheet resistance between 10 9 and 10 14 ohms/ ⁇ , then a coating is formed over the doped spacer surfaces, the coating being a material having a secondary emission ratio ⁇ less than 4. In an additional embodiment the coating has a secondary emission ratio ⁇ less than 2.
• the coating is selected from a group of materials including chromium oxide, copper oxide, carbon, titanium oxide and vanadium oxide. In one particular embodiment, the coating is chromium oxide.
• spacer surfaces are surface-doped to produce a sheet resistance between 10 9 and 10 14 ohms/ ⁇ .
• the total thickness of the coating or coatings is between 0.05 and 20 ⁇ m.
• the coating having a secondary emission ratio ⁇ less than 4 is preferably formed with a thickness between 0.01 and 0.05 ⁇ m.
• the coating or coatings are formed such that the sheet resistance varies no more than ⁇ 2% throughout the coating.
• the dopant can be, for instance, titanium, iron, manganese or chromium.
• the spacer can be made of, for instance, ceramic and can be a spacer wall, a spacer structure, or some combination of a spacer wall, spacer walls, and spacer structure.
• the flat panel device also contains a mechanism to emit light.
• the flat panel device can include a field emitter cathode or a thermionic cathode.
• the faceplate and backplate of the flat panel device can both be straight or both be curved.
• the flat panel device can include an addressing grid.
• one or more electrodes are formed on the treated spacer surfaces. For instance, an electrode can be formed near an interface of the spacer and backplate, the voltage of the electrode being controlled to achieve a desired voltage distribution in the vicinity of the interface, thereby deflecting the flow of electrons as desired to correct for distortions resulting from imperfections in the surface treatment or misalignment of the spacer.
• this electrode can be formed with a serpentine path with respect to an interior surface of the backplate in order to achieve a desired voltage distribution.
• a voltage divider establishes the voltage of each electrode.
• the voltage divider is a resistive coating formed on the spacer surfaces. The sheet resistance of the coating must be closely controlled (preferably ⁇ 2%) to achieve accurate voltages on the electrodes.
• the voltage divider can be a resistive strip that is positioned outside the enclosure across the electrically conductive traces that extend from each of the electrodes. The voltage control of the voltage divider can be fine-tuned by "trimming," i.e., selectively removing material from the voltage divider to vary local resistance to establish the desired voltages on the electrodes.
• a strip of electrically conductive material (“edge metallization”) is formed between an edge surface of the spacer and the backplate, and in intimate contact with the entire length of the spacer. If a resistive coating is formed on the spacer surfaces, the edge metallization is electrically connected to the resistive coating. In that case, the edge metallization and the resistive coating are formed such that an interface between the edge metallization and the resistive coating is at a constant distance from an interior surface of the backplate. In like manner, edge metallization is formed between an edge surface of the spacer and the faceplate to establish good electrical connection between the faceplate and spacer.
• a flat panel device is assembled by mounting a spacer between a backplate and faceplate, treating surfaces of the spacer to prevent or minimize charge buildup on the spacer surfaces, coating an edge surface of the spacer with edge metallization such that the edge metallization forms an electrical connection between the spacer and backplate, and sealing the backplate and faceplate together to encase the spacer in an enclosure.
• the surfaces can be treated by forming a resistive coating or coatings, by surface doping, by surface doping and forming a resistive coating or coatings, or by firing to reduce the surface.
• the resistive coating or coatings can be formed by chemical vapor deposition, sputtering, or evaporation.
• the present invention furnishes a light- emitting structure suitable for use in optical devices such as flat-panel CRT displays.
• the light-emitting structure of the invention contains a main section, a pattern of ridges situated along the main section, and a plurality of light-emissive regions situated along the main section in spaces between the ridges.
• the light- emissive regions produce light upon being struck by electrons.
• the ridges in contrast, are substantially non-emissive of light when hit by electrons.
• the ridges extend further away from the main section than the light- emissive regions.
• Each ridge includes a dark region that encompasses substantially the entire width of that ridge and at least part of its height.
• the pattern of ridges thereby forms a raised black matrix that improves the contrast of the light-emitting structure.
• the raised black matrix also enhances the color purity when the light-emissive regions selectively produce light of two or more colors.
• the main section constitutes the first of a pair of plates having internal surfaces that face, and are spaced apart, from each other.
• the light- emissive regions and the raised ridges are situated along the internal surface of the first plate.
• the first plate is transparent at least in portions extending along the light-emissive regions.
• An array of laterally separated sets of electron-emissive elements are situated along the internal surface of the second plate.
• the electron- emissive elements emit electrons that cause the light- emissive regions to emit light.
• the optical device contains supporting structure that supports the two plates and keeps them spaced apart from each other.
• the support structure preferably includes a group of laterally separated internal supports situated between the ridges and the second plate so as to cross the ridges.
• the internal supports extend towards areas between the electron-emissive elements. As a result, the internal supports are largely not visible at the exterior surface of the faceplate—i.e., the viewing surface.
• the light-emissive regions are typically quite fragile. Because the ridges extend further away from the first plate than the light-emissive regions, the ridges prevent the internal supports from directly exerting force on the light-emissive regions. The combination of internal supports and raised ridges thereby provides a mechanism for maintaining a desired spacing between the two plates along the full active area of the optical device without subjecting the fragile light-emissive regions to potentially damaging mechanical forces produced by the internal supports. This increases device reliability.
• the light-emitting structure of the invention can be fabricated according to various techniques. In one group of techniques according to the invention, the pattern of ridges is formed along the main section by a process that involves selectively removing portions of a layer of ridge material provided along the main section. In another group of techniques according to the invention, portions of a body are selectively removed to a specified depth such that the remainder of the body comprises the main section and the pattern of ridges.
• Figure 1 is a perspective cutaway view of a flat panel display including a thermionic cathode according to an embodiment of the invention.
• Figures 2A and 2B are simplified cross-sectional views of a flat panel display according to an embodiment of the invention illustrating the use of spacer walls.
• Figure 2A is a cross-sectional view taken along plane 2B- 2B of Figure 2B.
• Figure 2B is a cross-sectional view taken along plane 2A-2A of Figure 2A.
• Figure 3 is a perspective cutaway view of a flat panel display including a field emission cathode according to another embodiment of the invention.
• Figure 4A is a detailed perspective sectional view of a portion of the flat panel display of Figure 3.
• Figures 4B and 4C are plan views of internal parts of the display of Figure 4A as seen respectively from the positions of, and in the directions of, arrows C and D.
• Figure 4D is a cross-sectional side view of the full flat-panel CRT display of Figure 4A.
• Figure 4E is a magnified cross-sectional structural view of part of the CRT display of Figure 4A centering around the black matrix.
• Figure 5 is a detailed view of a portion of Figure 2B illustrating means for aligning spacer walls according to an embodiment of the invention.
• Figure 6 is a simplified cross-sectional view, viewed in the same direction as Figure 2A, illustrating a flat panel display including spacer walls and a spacer structure according to another embodiment of the invention.
• Figure 7A is a simplified cross-sectional view, viewed in the same direction as Figure 2A, of a portion of a flat panel display according to an embodiment of the invention including a field emission cathode and spacer walls.
• Figure 7B is a simplified cross-sectional view, viewed in the same direction as Figure 2A, of a portion of a flat panel display according to another embodiment of the invention including a field emission cathode, spacer walls and an addressing grid.
• Figure 7C is a simplified cross-sectional view, viewed in the same direction as Figure 2A, of a portion of a flat panel display according to another embodiment of the invention including a field emission cathode, a spacer structure and an addressing grid.
• Figure 8 is a simplified cross-sectional view, viewed in the same direction as Figure 2A, illustrating the use of spacers according to the invention in a flat panel display having a curved faceplate and backplate.
• Figures 9A and 9B are simplified cross-sectional views of a flat panel display according to an embodiment of the invention illustrating a coating formed on surfaces of spacer walls.
• Figure 9A is a cross-sectional view taken along plane 9B-9B of Figure 9B
• Figure 9B is a cross-sectional view taken along plane 9A-9A of Figure 9A.
• Figure 10 is a graph of voltage versus distance from a field emitter in a direction perpendicular to a baseplate on which the field emitter is situated.
• Figure 11 is a graph of secondary emission ratio versus voltage illustrating the characteristics of two materials.
• Figures 12A through 12D are cross-sectional views illustrating the interface between a spacer wall, metallization and focusing ridges of the backplate according to various embodiments of the invention.
• Figures 13A, 13B, 13C, 13D, 13E, 13F, 13G, and 13H are cross-sectional views representing steps in manufacturing a light-emitting black-matrix structure for the display of Figure 4A.
• Figures 14A, 14B, 14, 14D, 14E, 14F, 14G, 14H, 141, and 14J are cross-sectional views representing steps in manufacturing another light-emitting black-matrix structure for the display of Figure 4A.
• Figures 15A, 15B, 15C, 15D, 15E, 15F, 15G, 15H, 151, and 15J are cross-sectional views representing steps in manufacturing a further light-emitting black-matrix structure for the display of Figure 4A.
• Figures 16A, 16B, 16C, 16D, 16E, 16F, 16G, 16H, 161, and 16J are cross-sectional views representing steps in manufacturing yet another light-emitting black-matrix structure for the display of Figure 4A.
• CTR cathode ray tube
• the invention is also applicable to other flat panel displays such as plasma displays or vacuum fluorescent displays.
• the invention is not limited to use with displays, but can be used with other flat panel devices used for other purposes such as optical signal processing, optical addressing for use in controlling other devices such as, for instance, phased array radar devices, or scanning of an image to be reproduced on another medium such as in copiers or printers.
• the invention is applicable to flat panel devices having non- rectangular screen shapes, e.g., circular, and irregular screen shapes such as might be used in a vehicle dashboard or an aircraft control panel.
• a flat panel display is a display in which the faceplate and backplate are substantially parallel, and the thickness of the display is small compared to the thickness of a conventional deflected-beam CRT display, the thickness of the display being measured in a direction substantially perpendicular to the faceplate and backplate.
• the thickness of a flat panel display is less than 2 inches (5.08 cm).
• the thickness of a flat panel display is substantially less than 2 inches, e.g., 0.25 - 1.0 inches (0.64 - 2.54 cm).
• FIG. 1 is a perspective cutaway view of flat panel display 100 according to an embodiment of the invention.
• Flat panel display 100 includes faceplate 102, backplate 103 and layer 105 having peripheral region 105a outside seals 101a, 101b on which electronics 110 are disposed.
• Faceplate 102, backplate 103, layer 105 and seals 101a, 101b form an enclosure that is held at vacuum pressure (herein, vacuum pressure is defined as any pressure less than atmospheric pressure) of approximately 1 x 10" 7 torr.
• vacuum pressure is defined as any pressure less than atmospheric pressure
• cathode 109 which is formed on or near backplate 103, is heated to emit electrons toward the phosphor-coated interior surface of faceplate 102 (i.e., anode) .
• Addressing grid 106 is positioned between cathode 109 and faceplate 102.
• Electronics 110 includes driving circuitry for controlling the voltage of electrodes in holes 111 of addressing grid 106 so that the flow of electrons to faceplate 102 is regulated.
• Spacers 108 support faceplate 102 against addressing grid 106.
• Figure 2A is a simplified cross-sectional view, taken along plane 2B-2B of Figure 2B, of flat panel display 200 according to the invention.
• Figure 2B is a simplified cross-sectional view, taken along plane 2A-2A of Figure 2A, of flat panel display 200.
• Faceplate 202, backplate 203, top wall 204a, bottom wall 204c, and side walls 204b, 204d form enclosure 201 that is held at vacuum pressure.
• the side (interior surface) of faceplate 202 facing into enclosure 201 is coated with phosphor or phosphor patterns.
• Layer 205 is disposed between faceplate 202 and backplate 203.
• Addressing grid 206 is formed within enclosure 201 on the portion of layer 205 corresponding to the active region (i.e., projected area of the phosphor coated region of faceplate 202 on a plane parallel to faceplate 202) of faceplate 202.
• Spacer walls 207 are formed within enclosure 201 on the portion of layer 205 corresponding to the active region (i.e., projected area of the phosphor coated region of faceplate 202 on a plane parallel to faceplate 202) of faceplate 202.
• spacer walls and 208 are disposed between backplate 203 and addressing grid 206, and faceplate 202 and addressing grid 206, respectively.
• spacer is used to describe generally any structure used as an internal support within a flat panel display.
• specific embodiments of spacers according to the invention are described as a “spacer wall” or “spacer walls,” or as a “spacer structure.”
• Spacer subsumes “spacer wall,” “spacer walls,” and “spacer structure,” as well as any other structure performing the above-described function of a spacer.
• a thermionic cathode is located between addressing grid 206 and backplate 203.
• the thermionic cathode includes cathode wires 209, and directional electrodes 210 formed on cathode spacer walls 207. Though not shown, electrodes could also be formed on backplate 203. Though two directional electrodes 210 are shown formed on each side of each cathode spacer wall 207, it is to be understood that other numbers of directional electrodes 210 could be used. Further, though one cathode wire 209 is shown between each cathode spacer wall 207, it is to be understood that there can be more than one cathode wire 209 between each cathode spacer wall 207.
• each cathode wire 209 is attached to a spring (not shown) by, for instance, welding.
• the springs are, in turn, attached to backplate 203, addressing grid 206 or cathode spacer walls 207.
• the springs maintain cathode wires 209 parallel to backplate 203, addressing grid 206 and cathode spacer walls 207 as cathode wires 209 heat and expand during operation of display 200, then cool and contract when display 200 is turned off.
• Each cathode wire 209 is heated to release electrons.
• a voltage is applied to each directional electrode 210 to help shape the electron distribution and electron paths as the electrons move toward addressing grid 206.
• Voltages applied to electrodes (not shown) formed on the surface of holes 211 formed in addressing grid 206 govern whether the electrons pass through addressing grid 206 to strike the phosphor coated on faceplate 202.
• Addressing grid 206 may also contain electrodes that direct the electrons to strike a particular phosphor region or regions, and electrodes that focus the electron distribution.
• cathode spacer walls 207 and/or anode spacer walls 208 can be treated to prevent electrostatic charging of spacer walls 207 and/or 208 that can undesirably affect the flow of electrons toward phosphor-coated faceplate 202 and thereby degrade the quality of the image produced by flat panel display 200.
• thermionic cathode in which a wire is heated to emit electrons
• other types of thermionic cathode can be used.
• a thermionic cathode can include dots (the dots can be of any shape) of material formed on backplate 203 which are heated to emit electrons.
• Faceplate 202 is made of, for example, glass.
• Backplate 203 is made of, for example, glass, ceramic, glass-ceramic, silicon or metal.
• Addressing grid 206 is made of, for example, ceramic or glass-ceramic.
• Walls 204a, 204b, 204c, 204d are made of, for example, glass, ceramic, glass-ceramic or metal.
• the thickness of faceplate 202 is approximately 0.080 inches (2.03 mm)
• the thickness of addressing grid 206 is approximately 0.020 inches (0.51 mm)
• the thickness of backplate 203 is approximately 0.080 inches (2.03 mm).
• Phosphor or phosphor patterns are coated on the interior surface of faceplate 202.
• the region of faceplate 202 in which phosphor is coated is called the active region.
• active region has been used elsewhere in this description to denote, in addition to the above-described region of faceplate 202, the projected area of that region of faceplate 202 in any plane parallel to faceplate 202.
• Phosphor need not cover the entire active region.
• the phosphor can be segmented into regions. Phosphor regions can be defined by surrounding them with a black border, called a "black matrix,” to improve contrast.
• anode spacer walls 208 In order to avoid a "prison cell effect" on the external viewing surface of faceplate 202, anode spacer walls 208 must be located over the black matrix within the active region of faceplate 202 so that anode spacer walls 208 are not seen at the viewing surface of flat panel display 200.
• the black matrix is raised above the phosphor coating on the interior surface of faceplate 202 by photolithographic patterning and etching away of the black matrix material in the areas to be coated with phosphor.
• Anode spacer walls 208 contact a part of the black matrix. Since the black matrix is raised above the remainder of faceplate 202, even if anode spacer walls 208 slide from their original position on the black matrix, anode spacer walls 208 are held above the phosphor coating by another part of the black matrix so that the phosphor coating is not damaged by contact with anode spacer walls 208, as is evident from the more detailed description of the black matrix below.
• the surface of the black matrix is approximately level with the phosphor coating on faceplate 202. Again, anode spacer walls 208 contact the black matrix.
• Distance 222 between the phosphor-coated interior surface of faceplate 202 and the facing surface of addressing grid 206 depends upon voltage breakdown requirements. In one embodiment, distance 222 is approximately 0.100 inches (2.54 mm). Distance 223 between the interior surface of backplate 203 and the facing surface of addressing grid 206 depends upon the uniformity of the electron flow from the cathode. In one embodiment, distance 223 is approximately 0.250 inches (6.35 mm) .
• Spacing 225 of cathode spacer walls 207 is determined according to mechanical and electrical constraints. Mechanically, there must be an adequate number of cathode spacer walls 207, positioned properly with respect to addressing grid 206, to properly support backplate 203 against the pressure differential between the vacuum pressure in enclosure 201 and the atmospheric pressure surrounding the exterior of flat panel display 200. Spacing 225 depends upon distance 223 between the interior surface of backplate 203 and the facing surface of addressing grid 206, the material of which cathode spacer walls 207 are made, and the thickness and material of backplate 203.
• cathode spacer walls 207 must be located so that directional electrodes 210 are an appropriate distance from each cathode wire 209 to achieve the desired distribution and path-shape of electrons emitted from cathode wires 209, and to ensure that the electrons are accelerated adequately toward addressing grid 206.
• either electrical or mechanical constraints may dictate the maximum allowable spacing 225.
• cathode spacer walls 207 must be located so that they do not cover holes 211 formed in addressing grid 206, or adversely intercept or deflect electrons. However, as noted above and described in greater detail below, cathode spacer walls 207 can be treated to minimize or eliminate undesired interception or deflection of electrons.
• Spacing 224 of anode spacer walls 208 is also determined according to mechanical and electrical considerations. Mechanically, there must be an adequate number of anode spacer walls 208, positioned properly with respect to addressing grid 206, to properly support faceplate 202 against the pressure differential between the vacuum pressure in enclosure 201 and the atmospheric pressure surrounding the exterior of flat panel display 200. Similarly to spacing 225, spacing 224 depends upon distance 222 between the interior surface of faceplate 202 and the facing surface of addressing grid 206, the 5 material of which anode spacer walls 208 are made, and the thickness of faceplate 202.
• anode spacer walls 208 must be located so that they do not cover holes 211 formed in addressing grid 206, cover phosphor on faceplate 202, or adversely
• anode spacer walls 208 can be treated to minimize or eliminate undesired deflection or interception of electrons.
• glass-ceramic anode spacer walls 208 having a thickness of 4 mils (0.102 mm), and distance 222 of 0.1 inches (2.54 mm), spacing 224 is approximately 1 inch (2.54 cm).
• glass backplate 203 having a thickness of 0.080 inches (2.03 mm)
• spacing 225 is also approximately 1 inch (2.54 cm), taking into consideration only mechanical constraints on spacing 225.
• the maximum spacing 225 of cathode spacer walls 207 may vary
• cathode spacer walls 207 can be shaped and because backplate 203 can be made of a material other than glass. Further, as noted above, electrical considerations may dictate a different spacing 225.
• Anode spacer walls 208 can be located such that each
• anode spacer wall 208 is opposite addressing grid 206 from one of cathode spacer walls 207.
• Anode spacer walls 208 need not be formed opposite each cathode spacer wall 207 if the backplate 203 is sufficiently thick. Further cathode spacer walls 207 need not be formed opposite each
• cathode spacer walls e.g., cathode spacer walls 207
• cathode spacer walls 207 have extended all the way from backplate 203 to addressing grid 206.
• spacer walls 207 and 208 follow a straight line path between rows of holes 211 in addressing grid 206 from top wall 204a to bottom wall 204c. In additional embodiments of the invention, spacer walls can follow other than a straight line path through rows of holes 211 in addressing grid 206. In the above description, spacer walls 207 and 208 extend from close to top wall 204a to close to bottom wall 204c. Generally, spacer walls 207 and 208 can be formed in any manner to provide support so long as they do not adversely affect the electron flow to faceplate 202.
• spacer walls 207 and 208 could be formed that extend from one side wall 204b to the other side wall 204d, or spacer walls 207 and 208 could extend diagonally across flat panel display 200. Which of these configurations is chosen will depend on the characteristics of the cathode.
• Spacer walls 207 and 208 must have a sufficiently small thickness so that spacer walls 207 and 208 do not overlap and block holes 211 in addressing grid 206.
• holes 211 are approximately 5 mils (0.127 mm) in diameter and have a center-to-center distance, measured between holes 211 in the same row or column, of 12.5 mils (0.318 mm).
• Spacer walls 207 and 208 have a thickness of approximately 4 mils (0.102 mm) .
• spacer walls and spacer structures in embodiments of the invention described above and below are made of a thin material which is readily workable in an untreated state and becomes stiff and strong after a prescribed treatment. The material must also be compatible with use in a vacuum environment.
• the spacer walls and spacer structures are made of a material having a coefficient of thermal expansion that closely matches the coefficients of thermal expansion of the faceplate, backplate and addressing grid (if present) .
• Matching the coefficients of thermal expansion means that the spacer walls, addressing grid, faceplate and backplate expand and contract approximately the same amount during heating and cooling that occurs when the flat panel display is assembled or operated. Consequently, proper alignment is maintained among the spacer walls, addressing grid, faceplate and backplate.
• spacer walls and spacer structures can be made of the same material used to form the addressing grid (if present) .
• spacer walls 207 and 208 are made of a ceramic or glass-ceramic material.
• spacer walls 207 and 208 are formed from ceramic tape.
• ceramic or glass-ceramic tapes and slurries are the materials used for the spacer walls or spacer structures.
• the requirements of the material for spacers according to the invention are that (a) it be producible in thin layers, (b) the layers be flexible in the unfired state, (c) holes can be put in a layer or several layers together in the unfired state, (d) the holes can be filled with conductors where desired, (e) conductive traces can be put accurately on the surfaces of the unfired layers, (f) the layers can be laminated, in that they are bonded together at least on a final firing, (g) the fired structure have a coefficient of thermal expansion that can be substantially matched to that of a face plate and a back plate which are made of materials such as float glass, (h) the fired, laminated structure be rigid and strong, (i) the fired structure be vacuum compatible, (j) the fired structure not contain materials which will poison
• ceramic is often used, in the context of ceramic tape or ceramic layer or ceramic sheet.
• the term is intended to refer to any of a known family of glass- ceramic tapes, devitrifying glass tapes, ceramic glass tapes, ceramic tapes or other tapes which have plastic binders and ceramic or glass particles and which are flexible and workable in the unfired state, curable to a hard and rigid layer on firing, as well as other materials equivalent thereto, which are initially flexible and may be processed to a final hard and rigid state.
• Ceramic tape is formed from a mixture of ceramic particles, amorphous glass particles, binders and plasticizers. Initially, the mixture is a slurry which can be molded instead of formed into ceramic tape. Ceramic tape can be formed from the slurry and, in an unfired state, is a deformable material which can easily be cut and formed as desired. Ceramic tape may be made in thin sheets, e.g., approximately 0.3 to 10 mils. Examples of ceramic tape that can be used with the invention are the tapes available from Coors Electronic Package Co. of Chattanooga, Tennessee as Catalog Nos. CC-92771/777 and CC-LT20, or tapes that are the substantial equivalent of the Coors ceramic tape.
• Green Tape is available in very thin sheets (e.g. about 3 mils to 10 mils) has a relatively low firing temperature, about 900°C to 1000°C, and includes plasticizers in the unfired state which provide excellent workability.
• the Green Tape product is a mixture of ceramic particles and amorphous glass, also in particulate form, with binders and plasticizers. See U.S. Patent Nos. 4,820,661, 4,867,935, and 4,948,759.
• Unfired ceramic tape can readily be formed in the ways to be described below to yield spacer walls and spacer structures according to the invention.
• the ceramic tape is fired. The firing occurs in two stages: a first stage in which the tape is heated to a temperature of approximately 350°C to burn out the binders and plasticizers from the tape, and a second stage in which the tape is heated to a temperature (between 800°C and 2000°C, depending on the composition of the ceramic) at which the ceramic particles sinter together to form a strong, dense structure.
• Spacer walls 207 and 208 of Figures 2A and 2B are formed and assembled into flat panel display 200 as follows.
• Strips having a length and width chosen according to the particular requirements of flat panel display 200, as explained in more detail above, are cut from a sheet of unfired ceramic tape.
• An advantage of using an unfired ceramic or glass-ceramic is that the strips can be easily fabricated by slitting or die- cutting.
• the strips are then fired, as described above.
• the fired strips (spacer walls 207 and 208) are placed at appropriate pre-determined locations with respect to addressing grid 206, faceplate 202 and backplate 203, and attached to addressing grid 206 by, for instance, gluing * or glass fritting.
• spacer walls 207 and 208 are held in place so that they are properly aligned with respect to faceplate 202, backplate 203 and addressing grid 206.
• the strips for spacer walls 207 and 208 can also be fabricated by first making and firing sheets of ceramic or 5 glass-ceramic. The fired sheets can then be coated (as explained in more detail below) and cut into strips that form spacer walls 207 and 208. Alternatively, the fired sheets can be cut into strips and then coated.
• Figure 3 is a perspective cutaway view of flat panel
• Flat panel display 300 includes faceplate 302, backplate 303 and side walls 304 which together form sealed enclosure 301 that is held at vacuum pressure, e.g., approximately 1 x 10 "7 torr or less. Spacer walls
• Field emitter cathode 305 is formed on a surface of backplate 303 within enclosure 301. As explained in more detail below, row and column electrodes (not shown) control the emission of electrons from a cathodic emission
• Integrated circuit chips 310 include driving circuitry for controlling the voltage of the row and column electrodes
• Electrically conductive traces are used to electrically connect circuitry on chips 310 to the row and column electrodes.
• Figure 4A illustrates part of a flat-panel color CRT
• the CRT display in Figure 4A contains transparent electrically insulating flat faceplate 302 and electrically insulating flat backplate 303.
• a group of laterally separated electrically insulating spacer walls 308 are situated between plates 302 and 303. Spacer walls 308 extend parallel to one another at a uniform spacing. Walls 308 extend perpendicular to plates 302 and 303. Each wall 308 consists of ceramic typically having a thickness of 80 - 90 ⁇ m. The center-to-center spacing of walls 308 is typically 8 - 25 mm. As discussed further below, walls 308 constitute internal supports for maintaining the spacing between plates 302 and 303 at a substantially uniform value across the entire active area of the display. Patterned area field-emission cathode structure 305 is situated between backplate 303 and spacer walls 308.
• FIG 4B depicts the layout of field-emission cathode structure 305 as viewed in the direction, and from the positions, represented by arrows C in Figure 4A.
• Cathode structure 305 consists of a large group of electron- emissive elements 309, a patterned metallic emitter electrode (sometimes referred to as base electrode) divided into a group of substantially identical straight lines 310, a metallic gate electrode divided into a group of substantially identical straight lines 311, and an electrically insulating layer 312.
• Emitter-electrode lines 310 are situated on the interior surface of backplate 303 and extend parallel to one another at a uniform spacing.
• the center-to-center spacing of emitter lines 310 is typically 315 - 320 ⁇ m.
• Lines 310 are typically formed of molybdenum or chromium having a thickness of 0.5 ⁇ m. Each line 310 typically has a width of 100 ⁇ m.
• Insulating layer 312 lies on lines 310 and on laterally adjoining portions of backplate 303. Insulating layer 312 typically consists of silicon dioxide having a thickness of 1 ⁇ m.
• Gate-electrode lines 311 are situated on insulating layer 312 and extend parallel to one another at a uniform spacing.
• gate lines 311 The center-to-center spacing of gate lines 311 is typically 105 - 110 ⁇ m. Gate lines 311 also extend perpendicular to emitter lines 310. Gate lines 311 are typically formed with a titanium-molybdenum composite having a thickness of 0.02 - 0.5 ⁇ m. Each line 311 typically has a width of 30 ⁇ m.
• a light-emitting structure which contains a black matrix is situated between faceplate 302 and spacer walls 308.
• the light-emitting structure consists of a group of light-emissive regions 313, a pattern of substantially identical dark ridges 314 that reflect substantially no light, and light-reflective layer 315.
• Figure 4C depicts the layout of the light-emitting structure as viewed in the direction, and from the positions, represented by arrows D in Figure 4A.
• light-emissive regions 313 consist of phosphors configured in straight equal-width stripes extending parallel to one another at a uniform spacing in the same direction as gate lines 311.
• Each phosphor stripe 313 typically has a width of 80 ⁇ m.
• the thickness (or height) of phosphor stripes 313 is 1 - 30 ⁇ m, typically 25 ⁇ m.
• the average height of dark ridges 314 exceeds the thickness (or height) of phosphor stripes 313 by at least 2 ⁇ m. In the typical case described above, ridges 314 extend 25 ⁇ m above stripes 313. Accordingly, ridges 314 extend further away from faceplate 302 than stripes 313. Each ridge 314 contains a dark (essentially black) , non-reflective region that occupies the entire width of that ridge 314 and at least part of its height.
• Figure 4A depicts an example in which these dark non-reflective regions encompass the full height of ridges 314.
• the later drawings illustrate examples in which the dark non- reflective regions occupy only parts of the ridge height. The choice of materials for dark ridges 314 is wide.
• spacer walls 308 are shown as contacting gate lines 311 in Figure 4A.
• walls 308 may contact focusing ridges that extend above lines 311 as described in Spindt et al, U.S. patent application Ser. No. , "Field Emitter with
• end 208a of anode spacer wall 208 is inserted into notch 504 and end 208b ( Figure 2B) is inserted into a similar notch formed in bottom wall 204c so that anode spacer wall 208 is held in place.
• Width 504a of notch 504 is made slightly larger than the thickness of anode spacer wall 208 so that anode spacer wall 208 is held in place in the direction parallel to top wall 204a in the plane of Figure 5.
• the thickness of anode spacer wall 208 is 4 mils (0.102 mm), and width 504a is approximately 4.5 mils (0.0114 mm).
• Cathode spacer walls 607 and anode spacer structure 608 can be made of the same material as addressing grid 606. Using the same material, having the same coefficient of thermal expansion, for cathode spacer walls 607, anode spacer structure 608 and addressing grid 606 means that when cathode spacer walls 607, anode spacer structure 608 and addressing grid 606 are heated during assembly or operation of flat panel display 600, cathode spacer walls 607, anode spacer structure 608 and addressing grid 606 will each expand and contract the same amount so that registry of holes 611 and 614 is maintained and cathode spacer walls 607 do not overlap holes 611.
• the FEC structure includes row electrodes 710 formed on electrically insulative backplate 703.
• Insulator 712 (made of an electrically insulative material) is formed on backplate 703 to cover row electrodes 710.
• Holes 712a are formed through insulator 712 to row electrodes 710.
• Emitters 709 are formed on row electrodes 710 within holes 712a.
• Emitters 709 are cone-shaped and tip 709a of emitter 709 extends just above the level of insulator 712. It is to be understood that other types of emitters could be used.
• Column electrodes 711 are formed on insulator 712 around holes 712a such that column electrodes 711 extend partially over holes 712a to a predetermined distance from emitter tips 709a.
• Anode spacer walls 708 extend from the column electrodes 711 to faceplate 702 to support faceplate 702 against the force arising from the differential pressure between the vacuum pressure within flat panel display 700 and the ambient atmospheric pressure outside of flat panel display 700.
• Anode spacer walls 708 are formed in the same manner as anode spacer walls 208 used with a thermionic cathode, as described above with respect to Figures 2A and 2B. Any of the embodiments of anode spacer walls used above with thermionic cathodes can be used with flat panel display 700.
• an anode spacer structure such as anode spacer structure 608 described above ( Figure 6) can be used with flat panel display 700.
• Flat panel display 750 includes faceplate 752 and backplate 753 which, together with side walls (not shown) , form a sealed enclosure that is held at vacuum pressure.
• An insulating layer 762 is formed on an interior surface of backplate 753.
• Emitters 759 are formed on backplate 753 in holes 762a formed in insulating layer 762.
• Addressing grid 756 is disposed on insulating layer 762. Holes 756a are formed through addressing grid 756 such that holes 756a are coaxial with holes 762a of insulating layer 762.
• Electrical conductors 756b are formed in addressing grid 756 and extend to holes 756a. Emitters 759 release electrons 764 which are accelerated through holes 762a and 756a by application of appropriate voltages to electrical conductors 756b to hit phosphor regions 763 formed on an interior surface of faceplate 752.
• Anode spacer walls 758 support faceplate 752 against the force arising from the differential pressure between the internal vacuum pressure and the external atmospheric pressure. Anode spacer walls 758 are located so that anode spacer walls 758 do not interfere with the flow of electrons 764. Anode spacer walls 758 are formed as described above. Any of the embodiments of anode spacer walls described above can be used.
• a matrix of dark ridges 911 is situated within enclosure 901 on faceplate 902, as described in more detail above with respect to Figures 4A - 4E.
• Phosphor 913 is formed to partially fill each trough between ridges 911.
• Anode 914 which is a thin electrically conductive material such as aluminum, is formed on phosphor 913.
• Spacer walls 908 support faceplate 902 against backplate 903. The surfaces of each spacer wall 908 intermediate the opposing ends are coated with resistive coating 904 or are surface doped, as described in more detail below. Resistive coating 904 prevents or minimizes charge build-up on spacer wall 908 that can distort the flow of electrons 915.
• the desired equipotential lines in the plane of Figure 9A, near focusing ribs 912, follow a serpentine path, rising above focusing ribs 912 and falling above the cavity in which emitters 909 are located.
• the presence of spacer wall 909 imposes an equipotential line at this location, i.e., the bottom of spacer wall 909, that is straight.
• one of electrodes 917 can be located near the bottom of spacer wall 909 and formed in a serpentine path in order to create a potential field having equipotential lines with the desired serpentine shape.
• each spacer wall 908 It is necessary that the voltage change near each spacer wall 908 also change linearly between field emitters 909 and anode 914, so that the flow of electrons is not distorted (and the display image thereby degraded) .
• the adjacent spacer wall 908 can interfere with the flow of electrons 915 from field emitters 909. Stray electrons 915 emitted from field emitters 909a will strike spacer wall 908, typically resulting in the accumulation of charge on spacer wall 908.
• ⁇ V voltage deviation (in volts)
• p s sheet resistance of the surface of the spacer wall (in ohms/ ⁇ )
• x distance from nearest electrode
• equation (1) assumes that the current density j strikes spacer wall 908 uniformly and that the sheet resistance p s of spacer wall 908 is uniform. More exactly, equation (1) would account for the dependence of current density j on the position on spacer wall 908, and the dependence of secondary emission ratio ⁇ on the exact voltage at the position on spacer wall 908.
• the maximum voltage deviation ⁇ V occurs at the midpoint between two electrodes 917 (i.e., the quantity [x • (x-d)/2] is maximized), and is proportional to the distance between the electrodes squared. For this reason, providing additional electrodes 917 minimizes the voltage deviation near spacer wall 908 and, thus, the distortion of the flow of electrons 915 toward faceplate 902.
• the addition of n electrodes of w to a spacer wall 908 of height h reduces the power consumption of flat panel display 900 according to the ratio given below: P NE d - nw
• each electrode being 4 mils wide
• a spacer wall 908 having a height h of 100 mils reduces the I 2 R power loss for a given ⁇ - V mx by a factor of approximately 30.
• Figure 11 is a graph of secondary emission ratio ⁇ versus voltage illustrating the characteristics of two materials: material 1101 and material 1102.
• the secondary emission ratio ⁇ is greater than 1 (and frequently much greater) for an energy range between 100 volts to 10,000 volts, resulting in a positively charged surface.
• anode 914 is typically maintained at a positive voltage of 1500 - 10,000 volts relative to emitters 909.
• spacer walls 908 are preferably made of an electrically insulative (i.e., high resistivity) material.
• spacer walls 908 are typically positively charged (and frequently highly positively charged) , resulting in distortion of the flow of electrons 917 from emitters 909.
• material 1102 has a secondary emission ratio ⁇ that, for the voltage range in flat panel display 900, remains near 1. Since the voltage deviation ⁇ V varies as the quantity l- ⁇ 5, when the surfaces of spacer walls 908 are made of material 1102, little charge (positive or negative) accumulates on the surfaces of spacer walls 908. Consequently, the presence of spacer walls 908 has little impact on the voltage drop between field emitters 909 and anode 914, and, therefore, the distortion of the flow of electrons 915 due to the presence of spacer walls 908 is minimized.
• the material used for coating 904 has the above sheet resistance p 5 and a secondary emission ratio ⁇ less than 2.
• the coating 904 according to this embodiment is, for instance, chromium oxide, copper oxide, carbon. titanium oxide, vanadium oxide or a mixture of these materials.
• coating 904 is chromium oxide.
• Coating 904 has a thickness between 0.05 and 20 ⁇ m.
• coating 904 includes a first coating formed on spacer wall 908 of a material having a sheet resistance p s between 10 9 and 10 14 ohms/ ⁇ without regard to the magnitude of the secondary emission ratio ⁇ S.
• the first coating is then covered by a second coating having a secondary emission ratio ⁇ less than 4 in one embodiment, and less than 2 in another embodiment.
• the material for the first coating is, for instance, titanium-chromium-oxide, silicon carbide or silicon nitride.
• the material for the second coating is, for instance, chromium oxide, copper oxide, carbon, titanium oxide, vanadium oxide or a mixture of those materials.
• the total thickness of coating 904 is between 0.05 and 20 ⁇ m.
• spacer walls 908 are surface doped to produce a sheet resistance p, between 10 9 and 10 14 ohms/ ⁇ , then covered with coating 904 having a secondary emission ratio ⁇ of less than 4 in one embodiment and less than 2 in another embodiment.
• the dopant can be, for instance, titanium, iron, manganese or chromium.
• Coating 904 is, for instance, chromium oxide, copper oxide, carbon, titanium oxide or vanadium oxide, a mixture of those materials.
• coating 904 is chromium oxide.
• Coating 904 has a thickness between 0.05 and 20 ⁇ m.
• spacer walls 908 are surface-doped to a concentration to produce a sheet resistance between 10 9 and 10 14 ohms/ ⁇ .
• the dopant can be, for instance, titanium, iron, manganese or chromium.
• spacer surfaces are to take advantage of a material contained in the initial ceramic layers which can be made to become slightly conductive in a later firing.
• treatment of spacer walls to minimize or eliminate charging of the surfaces of the spacer walls is described.
• embodiments of the invention including a spacer structure, e.g., spacer structure 608 ( Figure 6) , the surfaces of holes in the spacer structure through which electrons flow are treated, as described above, to minimize or eliminate charging of those surfaces.
• Figures 12A through 12D are cross-sectional views illustrating the interface between a spacer wall, resistive coating, edge metallization and focusing ribs according to various embodiments of the invention.
• the coating in each embodiment can be one of the coatings described above with respect to Figures 9A, 9B and 9C.
• a sharply defined edge metallization/resistive coating interface is formed that is straight and at a constant height above the cathode so that a straight equipotential is defined at the base of the spacer wall along the length of the spacer wall parallel to the backplate.
• Edge metallization according to the embodiments of the invention described below can be formed on the edge surfaces of the spacer walls by the techniques described above for formation of resistive coating 904.
• resistive coating 1204 is formed on side surfaces 1208a of spacer wall 1208. Coating 1204 is formed on side surfaces 1208a so that coating 1204 does not extend beyond the end of side surfaces 1208a.
• Edge metallization 1206 is formed on end surface 1208b of spacer wall 1208 so that edge metallization 1206 does not extend beyond coating 1204.
• resistive coating 1214 is formed on side surfaces 1218a and end surface 1218b of spacer wall 1218 to entirely cover spacer wall 1218.
• Edge metallization 1206 is formed adjacent the portion of coating 1218 formed on end surface 1218b of spacer wall 1218 so that edge metallization 1206 does not extend beyond the edge of coating 1204.
• resistive coating 1214 is formed on side surfaces 1218a and end surface 1218b of spacer wall 1218 to entirely cover spacer wall 1218.
• Edge metallization 1216 is formed adjacent the portion of coating 1214 formed on end surface 1218b of spacer wall 1218 such that metallization 1216 overlaps coating 1214 and extends around the corner of coating 1214 to a well- defined height.
• resistive coating 1204 is formed on side surfaces 1208a of spacer wall 1208, as in Figure 12A, so that coating 1204 does not extend beyond the end of side surfaces 1208a.
• Edge metallization 1216 is formed adjacent the portion of coating 1204 formed on end surface 1208b of spacer wall 1208 such that metallization 1216 overlaps coating 1204 and extends around the corner of coating 1204 to a well-defined height.
• electrodes 915 are formed at intervals on the surfaces of spacer walls 908 that are exposed within enclosure 901.
• the voltages at these electrodes 915 are set by a voltage divider.
• the voltage divider can either be coating 904 or a resistive strip, outside the active region of display 900, connected to electrically conductive traces extending from each of electrodes 915.
• the voltage divider can be "trimmed" by removing material from the voltage divider at selected locations to increase the resistance at those locations as necessary. The trimming can be done by, for instance, using a laser to ablate material from the voltage divider.
• Figures 13A through 13H (collectively " Figure 13") , Figures 14A through 14J (collectively “ Figure 14") , Figures 15A through 15J (collectively " Figure 15") , and Figures 16A through 16J (collectively " Figure 16") illustrate four basic process sequences for manufacturing the light-emitting structure in the CRT display of Figure 4A. To facilitate describing these processes, the orientation of the various regions in Figures 13, 14, 15, and 16 is upside down from that in Figure 4A. In the following process description, directional terms such as “upper” and “lower” apply to the directional orientation utilized in Figures 13 through 16.
• the intended interior surface of faceplate 302 i.e., the upper faceplate surface here—is roughened as indicated in
• the roughening step is typically done with a chemical etchant such as a hydrofluoric acid solution, or with a halogen-based plasma etchant.
• a chemical etchant such as a hydrofluoric acid solution, or with a halogen-based plasma etchant.
• Slurry 321 of solder glass capable of forming dark non-reflective frit is screen deposited on the upper surface of faceplate 302 as shown in Figure 13B.
• Slurry 321 is converted to hardened solder glass layer 322 by firing (i.e., heating) the structure at 400 - 450 C C for 1 - 120 minutes.
• Portions of solder glass layer 322 at locations between sites intended for dark ridges 314 are removed by chemical or plasma etching through a suitable photoresist mask (not shown) or by ablation using a suitably programmed laser.
• Figure 13D illustrates the resulting structure in which ridges 314 are the remainder of solder glass layer 322.
• Phosphor stripes 313r, 313g, and 313b are formed on the upper surface of faceplate 302 in the spaces between dark ridges 314 as depicted in Figure 13E.
• a slurry of a polymer, a photosynthesizer, and phosphor particles that emit light of one of the three colors of red, green, and blue is deposited on the upper surface of faceplate 302.
• the portions of the slurry at the intended sites for the phosphor particles of that color are hardened by exposing those slurry portions to actinic radiation using a suitable photoresist mask (not shown) .
• the remainder of the slurry is poured off, and the structure is rinsed. This procedure is then repeated with phosphor particles that produce light of each of the two remaining colors.
• the structure is dried to complete the fabrication of phosphor stripes 313.
• Layer 323 of lacquer is sprayed on phosphors 313 and ridges 314.
• the upper surface of lacquer layer 323 is smooth as illustrated in Figure 13F.
• Aluminum is evaporatively deposited on lacquer layer 323 to form light-reflective layer 315. See Figure 13G.
• the structure is then heated at approximately 450°C for 60 minutes in a partial oxygen atmosphere to burn out lacquer 323.
• Figure 14H depicts the final structure while. Because lacquer layer 323 had a smooth upper surface, light-reflective aluminum layer 315 ends up with a smooth lower surface. Moving to Figure 14, the starting point again is faceplate 302 whose upper surface is roughened. See Figure 15A.
• Layer 325 of a dark non-reflective metal is deposited on the upper surface of faceplate 302 as shown in Figure 14B.
• Metal layer 325 typically consists of black chrome or niobium having a thickness of 50 - 200 nm.
• Thick photoresist layer 326 is formed on metal layer 325 as shown in Figure 14C.
• Photoresist layer 326 can, for example, consist of a positive photoresist such as Morton EL2026. The photoresist thickness is 25 - 75 ⁇ m, typically 50 ⁇ m.
• Photoresist 326 is selectively exposed to actintic radiation and then developed to form channels 327 of approximately the desired width for ridges 314. That is, the channel width is 10 - 50 ⁇ m, typically 25 ⁇ m. See Figure 14D in which items 326a are the remainder of photoresist 326.
• Channels 327 are selectively filled, or nearly filled, with metal to form metal ridges 314d as depicted in Figure 14E.
• the selective filling is done according to an electrochemical deposition (electroplating) process.
• Metal ridges 314d may consist of dark or opaque metal. Typically, the ridge metal is chrome or a nickel-iron alloy.
• Photoresist mask 326a is subsequently removed to produce the structure shown in Figure 14F. Using metal ridges 314d as a mask, the exposed portions of dark metal layer 325 are removed.
• Figure 14G illustrates the resulting structure in which dark ridges 314e are the remainder of metal layer 325. Each dark ridge 314e and overlying ridge portion 314d constitute one of dark ridges 314.
• Phosphor stripes 313 and light-reflective layer 315 are now created in the manner discussed above in connection with the process of Figure 13.
• Figure 14H depicts the formation of stripes 313.
• the deposition of layer 315 over lacquer layer 323 is illustrated in Figure 141.
• Figure 14J illustrates the final light-emitting structure after lacquer 323 is burned out.
• the starting point for the process sequence of Figure 15 is transparent electrically insulating flat body (or plate) 329 typically consisting of glass of largely uniform composition. See Figure 15A.
• Patterned layer 330 of a material capable of acting as a sandblast mask is formed on the upper surface of transparent body 329 as shown in Figure 15B.
• Mask layer 330 can be formed by depositing a blanket layer of the sandblast masking material on body 329 and then removing selected portions of the blanket layer by a masked etch to expose surface portions of body 329.
• a selective removal operation is performed to remove portions of transparent body 329 to a specified depth at the areas exposed through mask 330.
• Figure 15C illustrates the resulting structure in which the remainder of body 329 consists of faceplate 302 and an overlying pattern of ridges 314f.
• the removal operation is done by sandblasting.
• Mask 330 may be eroded away during the sandblasting. If any of mask 330 is present at the end of the sandblasting, the remainder of mask 330 is removed as indicated in Figure 15D.
• Layer 331 of dark material is screen deposited on the upper surface of the structure. See Figure 15E.
• the dark material may consist of dark glass or dark metal.
• Photoresist mask 332 is typically formed on dark layer 331 directly above ridges 314f as shown in Figure 15F. To avoid misalignment, photoresist mask 332 is typically created by using the photomask reticle employed in creating sandblast mask 330 for negative photoresist or a reverse-image mask for positive photoresist.
• Dark ridge portions 314g are respectively created above ridges 314f by removing the exposed portions of dark layer 331.
• Figure 15G depicts the consequent structure after removal of photoresist 332.
• Each ridge portion 314g and underlying ridge 314f constitute one of dark ridges
• the light-emitting structure is finished in the way described above for the process of Figure 14.
• phosphor stripes 313 are formed in the spaces between ridges 314 as shown in Figure 15H.
• Figure 151 shows the deposition of light-reflective layer 315 over lacquer 323. The final structure is shown in Figure 15J after burning out lacquer 323.
• FIG. 16H shows the resulting structure in which each dark ridge portion 314i and underlying ridge 314h constitute one of dark ridges 314.
• the light-emitting structure is completed in the manner described above for the process of Figure 14.
• the formation of phosphor stripes 313 is illustrated in Figure 161.
• Figure 16J illustrates the placement of light-reflective layer 315 over stripes 313 and ridges 314.
• spacer walls 308 and outer walls 304 are appropriately placed between the cathode structure and the light-emitting black-matrix structure while the components of the display are in a chamber pumped down to a pressure below 10 "7 torr.
• the display is then sealed at 300-600°C typically 450°C.
• Dark ridges 314 soften, as described above, at a temperature in the range of 300-700°C depending on whether they consist of metal, solder glass, or glass.
• the ridge- softening temperature is typically chosen to be approximately equal to or slightly less than the display- sealing temperature.
• spacer walls 308 penetrate slightly into ridges 314 during the sealing process. This compensates for differences in height among walls 308.
• ridge-softening temperature exceeds the display-sealing temperature
• dark ridges 314 can be pre- softened just before the CRT display is sealed. In that case, spacer walls 308 again penetrate slightly into ridges 314 during sealing to compensate for spacer-wall height differences.
• the dark portions of ridges 314 in each of the process sequences of Figures 15 and 16 could be moved from the tops of ridges 314 to their bottoms by providing a layer of dark material on top of transparent body 329 at the beginning of the process sequence and then deleting the steps involved in forming upper ridge portions 314g or 314i. Additional parallel dark non-reflective ridges could be formed on faceplate 302 so as to extend perpendicular to ridges 314.
• Phosphor stripes 313 could be created from thin phosphor films instead of phosphor particles.
• Light- emissive regions 313 could be implemented with elements other than phosphors (in particle or film form) .
• a transparent anode that directly adjoins faceplate 302 could be used in place of, or in conjunction with light-reflective layer 315. Such an anode would typically consist of a layer of a transparent electrically conductive material such as indium-tin oxide. Faceplate 302 and, when present, the adjoining transparent anode then constitute a main section of the light-emitting black-matrix structure.

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
• Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
• Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
• Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)

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• 1994
  • 1994-02-01 WO PCT/US1994/000602 patent/WO1994018694A1/en active IP Right Grant
  • 1994-02-01 JP JP51805294A patent/JP3595336B2/ja not_active Expired - Fee Related
  • 1994-02-01 DE DE69430568T patent/DE69430568T3/de not_active Expired - Lifetime
  • 1994-02-01 EP EP94908603A patent/EP0683920B2/de not_active Expired - Lifetime
  • 1994-02-01 AU AU61634/94A patent/AU6163494A/en not_active Abandoned

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