EP0493615A1 - Integrierte halbleiterschaltungsanordnung - Google Patents

Integrierte halbleiterschaltungsanordnung Download PDF

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Publication number
EP0493615A1
EP0493615A1 EP91913084A EP91913084A EP0493615A1 EP 0493615 A1 EP0493615 A1 EP 0493615A1 EP 91913084 A EP91913084 A EP 91913084A EP 91913084 A EP91913084 A EP 91913084A EP 0493615 A1 EP0493615 A1 EP 0493615A1
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EP
European Patent Office
Prior art keywords
wirings
power supply
wiring
semiconductor integrated
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP91913084A
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English (en)
French (fr)
Other versions
EP0493615B1 (de
EP0493615A4 (de
Inventor
Minoru 3-5 Owa 3-Chome Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of EP0493615A1 publication Critical patent/EP0493615A1/de
Publication of EP0493615A4 publication Critical patent/EP0493615A4/xx
Application granted granted Critical
Publication of EP0493615B1 publication Critical patent/EP0493615B1/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L

Definitions

  • the present invention relates to a layout of a semiconductor integrated circuit device in which a plurality of signal wirings are arranged in parallel with power supply wirings like signal wirings for driving a decoder circuit in a memory chip, and more particularly to a semiconductor integrated circuit device using two layers and more of wiring layers.
  • Fig. 4 shows a layout of a conventional memory chip.
  • the present memory chip 1 is a read-only memory (ROM), and is composed of four memory cell blocks 2a to 2d. Between the memory cell blocks 2a and 2b are arranged a row decoder circuit 3a including a decoder and a buffer for driving a word line of the memory cell block 2a and a row decoder circuit 3b of the memory cell block 2b so as to confront each other. Between the memory cell blocks 2c and 2d are also arranged respective row decoder circuits 3c and 3d so as to confront each other.
  • ROM read-only memory
  • peripheral circuits 4a and 4b including predecoder circuits in which signals for driving the row decoders and so forth are arranged for the memory cell blocks 2a to 2d on the opposite side of these circuits.
  • This peripheral circuit 4a is a circuit common to the decoder circuits 3a and 3b, and arranged under the memory cell blocks 2a and 2b.
  • the peripheral circuit 4b is a circuit common to the decoder circuits 3c and 3d, and arranged under the memory cell blocks 2c and 2d.
  • a pad 7 supplied with Vss (0V) is installed on the outer circumferential side of the sense amplifier circuits 6a and 6b.
  • a pad 8 supplied with Vdd (5V) is arranged on the outer circumferential side of the predecoder circuits 4a and 4b.
  • a mother wiring 11 is arranged around the chip 1 from the pad 7, and Vss is applied to respective circuits by branch wirings 12 which are arranged in parallel with respective circuits so as to run towards the center of the chip 1 from the mother wiring 11.
  • Vss is supplied to respective cells 2a to 2d or circuits 3a to 3d through branch wirings 13 branched further from a part 12a of the branch wirings 12.
  • a mother wiring 21 is arranged from a pad 8 through between memory cell blocks 2b and 2c which are the center of the memory chip 1, and Vdd is supplied to respective circuits through branch wirings 22 arranged in parallel with respective circuits from the mother wiring 21 toward the circumference of the chip 1.
  • Vdd is supplied to the decoder circuits 3a to 3d through branch wirings 23 branched further from a part 22a of the branch wiring 22.
  • the supply wirings of two power supplies, Vss and Vdd are arranged in separated positions so that Vss is supplied from the outer circumference to the center of the chip 1 and Vdd is supplied from the center to the outer circumference.
  • a region II where signal wirings which connect the peripheral circuits 4a and 4b and the row decoders 3a to 3d with one another gather together is a region where signal wirings and power supply wirings intersect one another, and is also one of wiring channels having the highest density in the chip 1.
  • Fig. 5 shows a layout of the region II in a conventional device.
  • n lines of signal wirings 31.1 to 31.n from the peripheral circuit 4a to the decoder circuits 3a and 3b are arranged in parallel with one another while being placed between power supply wirings 23a and 23b.
  • These wirings 31.1 to 31.n are connected with respective connecting portions 42.1 to 42.n of n pieces of function cells 41.1 to 41.n of the peripheral circuit 4a.
  • the wirings for signals outputted from these connecting portions 42.1 to 42.n generally intersect with the power supply wiring 12 of the peripheral circuit 4a which is laid out along both ends of the peripheral circuit 4a.
  • these connecting portions 42.1 to 42.n are formed to polycrystalline silicon across an insulating layer in a lower layer of the power supply wiring 12.
  • respective function cells 41.1 to 41.n are arranged in a region having a width wider than the width of the common bus line 30 where respective signal wirings 31.1 to 31.n are arranged collectively.
  • respective signal wirings 31.1 to 31.n connected with connecting portions 42.1 to 42.n arranged in respective function cells 41.1 to 41.n are assembled toward the common bus line 30 using the portion between the row decoder circuits 3a and 3b and the peripheral circuit 4a as an assembling region 50.
  • the signal wirings 31.1 to 31.n thus assembled intersect with the power supply wiring 22a of the row decoders 3a and 3b in a contracted region 51 at an inlet portion to the common bus line 30. Therefore, wiring is made using wirings 32.1 to 32.n in a second layer of highly resistive polycrystalline silicon formed with an insulating layer put therebetween under the power supply wiring 22a in the inlet portion 51 of respective signal wirings 31.1 to 31.n. Further, the wirings 32.1 to 32.n in the second layer and respective signal wirings 31.1 to 31.n are connected with one another through two via holes, a via hole 33 on the peripheral circuit 4a side and a via hole 34 on the common bus line side for every wiring.
  • the quantity of via holes for connecting the wirings in the second layer with signal wirings has to be reduced at the same time, and the resistance of this portion is also increased. Therefore, the access speed is reduced further.
  • polycrystalline silicon wirings used in the portion interfering with power supply wirings are made to be wirings made of aluminum of low resistance.
  • it is required to form such aluminum wirings in an upper layer of power supply wirings while putting an insulating layer therebetween in order to avoid interference with power supply wirings. Since it causes increase of working processes to form the upper part of power supply wirings into a wiring layer as compared with that polycrystalline silicon wirings may be formed at the time of surface working of a semiconductor device, it is difficult to adopt such means.
  • even if such a layout is adopted, it is difficult to solve the problems in points of resistance of via holes and reliability described above.
  • a semiconductor integrated circuit device having at least a signal processing circuit in which a plurality of connecting regions of signal wirings are arranged discretely and a wiring laying region where signal wirings connected with the signal processing circuit are assembled so as to be in parallel among a plurality of power supply wirings according to the present invention is characterized in that the mother power supply wiring from which power supply wirings are branched is arranged along the vicinity of a connecting region of the signal processing circuit.
  • the mother power supply wiring is arranged along the vicinity of the connecting region of the signal processing circuit, it becomes possible to process interference between the mother power supply wiring and signal wirings in the vicinity of that region.
  • the connecting regions of the signal processing circuit are disposed discretely from a space required for logic circuits in the processing circuit. Thus, the spacing among respective signal wirings is secured sufficiently in the vicinity of this region for the signal wirings connected in the connecting region.
  • signal wirings in the second layer required for processing intersection among respective signal wirings and the mother power supply wiring by arranging the mother power supply wiring in the vicinity of this region.
  • signal wirings in the second layer having low resistance may be realized even in a semiconductor device having a high wiring density of a common bus line which corresponds to a wiring laying region of a memory chip and the like.
  • the connecting region of the signal processing circuit is connected with signal wirings using the wiring layer in the second layer in many cases in order to avoid interference with power supply wiring for the signal processing circuit. Therefore, by extending the wiring in the second layer to the portion interfering with the mother power supply wiring, it is possible to reduce the number of connecting points of the signal wirings, and also to aim at reduction of connecting resistance and prevention of deterioration of reliability caused by nonconformity of the connecting points.
  • the mother power supply wiring may be arranged in the vicinity of a plurality of peripheral circuits which are signal processing circuits arranged around the memory cell region so as to process intersection of the signal wirings connecting the decoder circuits arranged among memory cell blocks with peripheral circuits through the common bus line and the mother power supply wiring.
  • power supply wirings branched from the mother power supply wiring are assembled in the common bus line in parallel with these signal wirings, and thus, will never intersect again at an inlet portion of the common bus line and the like.
  • the power supply to the decoder circuits arranged on both sides of the common bus line may be applied through one mother power supply wiring similarly as before. Therefore, it is not required to give consideration to potential variation and interference with other power supply wirings.
  • the above-described mother power supply wiring is to be arranged in parallel with the power supply wiring to the peripheral circuits.
  • the power supply wiring to the peripheral circuits and the mother power supply wiring are in parallel with each other and power consumption in the peripheral circuits is stabilized, it is also possible to form the power supply wirings to the peripheral circuits and the mother power supply wiring into a common wiring.
  • the wiring in the second layer may be made shorter. Hence, further reduction of the wiring resistance may be expected in addition to above-described effects.
  • the common bus line and the mother power supply wiring meet at right angles with each other in many cases from the viewpoint of interference among power supply wirings and the layout of function cells. This is a matter of course in a device having such a layout, but, in a semiconductor device in which the power supply wirings are branched to the common bus line from the mother power supply wiring, the present invention is also applicable even in case the common bus line and the mother power supply wiring do not meet at right angles with each other.
  • Aluminum wirings having low resistance may be used for the wirings in the first layer which is the same as the mother power supply wiring as above-described signal wirings. Further, both aluminum wirings and polycrystalline silicon wirings may be used for the wirings in the second layer formed through an insulating layer in the upper part or the lower part of this first layer.
  • the aluminum wirings are of low resistance, but required to be added to the upper side of the first layer in general.
  • the polycrystalline wirings have an advantage that they may be formed simultaneously with surface working of the semiconductor device inspite of high resistance. Further, since it is possible to secure sufficient width of the wirings of the second layer in the present invention, it is possible to form signal wirings of the second layer having low resistance by using polycrystalline silicon wirings.
  • Fig. 1 shows a layout of a semiconductor integrated circuit device according to the embodiment 1 of the present invention.
  • the semiconductor device in the present embodiment is a memory chip of a read-only memory (ROM) similarly to the conventional device described above, and is composed of four memory cell blocks 2a to 2d.
  • Row decoder circuits 3a and 3b, and 3c and 3d are arranged between memory cell blocks 2a and 2b and between 2c and 2d, respectively, so as to confront each other.
  • peripheral circuits 4a and 4b including predecoder circuits in which signals for driving row decoders are generated are arranged.
  • the arrangement of respective cells and circuits is similar to that of a conventional device described above. Hence, the same numerals are assigned to them and description will be omitted.
  • the wirings of Vss and Vdd are made so that wirings of Vss and Vdd do not intersect each other similarly to a conventional device, and a layout in which wiring channels of Vss and Vdd are separated from each other is adopted.
  • first Vss is supplied to respective circuits through branch wirings 12 so as to run toward the center of a chip 1 through a mother wiring 11 arranged around the chip 1 from a pad 7.
  • Vss is also supplied to the memory cell blocks 2a to 2d and row decoder circuits 3a to 3d through branch wirings 13 branched further from a part 12a of the branch wirings 12.
  • Vdd is supplied to respective circuits with branch wirings 22 from a pad 8 through a mother wiring 21 arranged at the center of the memory chip 1.
  • Vdd is supplied to the decoder circuits 3a to 3d through further branched branch wirings 23 from a part 22a of branch wirings 22.
  • the point to be noticed in the present embodiment is the arrangement of the power supply wiring 22a in a region II where signal wirings for connecting peripheral circuits 4a and 4b which are one of wiring channels having the highest density in the chip 1 with row decoders 3a to 3d are assembled.
  • power supply wirings 22a which have been arranged just under decoder circuits 3a and 3b are arranged just above the peripheral circuit 4a.
  • branch points 35a and 35b of wirings 23a and 23b which branch from the power supply wiring 22a are arranged outside the signal wirings 31.1 to 31.n which are assembled in a common bus line 30 from the peripheral circuit 4a.
  • these two lines of power supply wirings 23a and 23b are assembled in the common bus line 30 so as to form a convex form (nearly inverted Y form) along the outer circumference of the signal wirings 31.1 to 31.n.
  • Fig. 2 shows details of the region II where the signal wirings 31.1 to 31.n are assembled in the common bus line 30.
  • the layout of the present region II is almost similar to that of above-described conventional device, and n lines of signal wirings 31.1 to 31.n for connecting the peripheral circuit 4a and the decoder circuits 3a and 3b with one another are arranged in parallel being put between power supply wirings 23a and 23b in the common bus line 30 between the row decoder circuits 3a and 3b.
  • These wirings 31.1 to 31.n are connected with connecting portions 42.1 to 42.n of respective function cells 41.1 to 41.n of the peripheral circuit 4a.
  • These connecting portions 42.1 to 42.n are formed of polycrystalline silicon in the lower layer of the wiring layer of signal wirings 31.1 to 31.n, and the mother wiring 22a of power supply wirings 23a and 23b of the row decoders 3a and 3b is arranged in parallel with the power supply wiring 12 of the peripheral circuit 4a above the connecting portions 42.1 to 42.n. Further, the power supply wirings 23a and 23b are branched from the mother wiring 22a located outside the cells 41.1 and 41.n at both ends of the function cell 41 at branch points 35a and 35b.
  • the branched power supply wirings 23a and 23b are arranged so as to meet at right angles with the mother wiring 22a along the outside of signal wirings 31.1 and 31.n at both ends which are assembled in the common bus line 30, and are bent thereafter toward the bus line 30 at the lower ends of the memory cell blocks 2a and 2b which are in parallel with the contracted region 51 which is an inlet portion of the common bus line 30. Further, the power supply wirings 23a and 23b are bent again at portions corresponding to both ends of the common bus line 30 so as to meet at right angles with the mother wiring 22a, and are arranged so as to run along the row decoders 3a and 3b.
  • the mother wiring 22a is arranged above the connecting portions 42.1 to 42.n of the peripheral circuit 4a.
  • the interference between the signal wirings 31.1 to 31.n and the mother wiring 22a is processed in the connecting portions 42.1 to 42.n. Accordingly, there is no interference with the mother wiring 22a in the contracted region 51 at the inlet portion of the common bus line 30 as in a conventional semiconductor device, signal wirings in the second layer of polycrystalline silicon which have been concentrated at the narrow inlet portion 51 are omitted, and all the signal wirings 31.1 to 31.n are wired with aluminum wirings having low resistance. As a result, the resistance of the signal wirings 31.1 to 31.n may be reduced.
  • the connecting portions 42.1 to 42.n are of polycrystalline silicon having high resistance, but the width H of each of the connecting portions 42.1 to 42.n is secured so that the resistance value thereof becomes sufficiently small. Further, it is possible to form a plurality of via holes 43 extending over this width H. Thus, a plurality of via holes are formed for one connecting portion.
  • the power supply wiring 12 of Vss to the peripheral circuit 4a and the mother wiring 22a of Vdd to the decoder circuit are arranged closely to each other in parallel.
  • intersections of these two lines of wirings 12 and 22a with the signal wirings 31.1 to 31.n are processed only by the connecting portions 42.1 to 42.n, and the number of connecting points with the wirings in the second layer formed under the power supply wiring is also reduced as compared with a conventional layout.
  • the layout of the power supply wirings has become complicated at first sight in the present embodiment
  • the layout has been simplified in point of reduction of connecting portions and so forth, and improvement of reliability of the device and reduction in access time are aimed at.
  • Fig. 3 shows details of the region II according to the embodiment 2 where the signal wirings 31.1 to 31.n are assembled in the common bus line 30.
  • the layout of signal wirings 31.1 to 31.n, common bus line 30, row decoder circuits 3a and 3b, function cells 41.1 to 41.n, connecting portions 42.1 to 42.n and power supply wirings 23a and 23b is similar to that of above-described embodiment 1. Hence, the same numerals are assigned and description thereof will be omitted.
  • the mother wiring 22a from which power supply wirings 23a and 23b are branched is used also as a power supply wiring to the peripheral circuit 4a.
  • the peripheral circuit 4a consists of a predecoder and the like and does not include a circuit having large power consumption such as a buffer circuit, potential deflection in the power supply wiring is small, and the mother wiring 22a may be used in common as a power supply of a decoder circuit.
  • the power supply wiring 22 and the mother wiring 22a of the decoder circuit it is possible to use the power supply wiring 22 and the mother wiring 22a of the decoder circuit as one power supply wiring by inverting the layout of the power supply wiring 12 of Vss and the power supply wiring 22 of Vdd of the peripheral circuit in the embodiment 1.
  • the connecting portions 42.1 to 42.n formed under the power supply wiring 22a have the length which makes it possible to exchange interference with one line's portion of the wiring, thereby enabling it to reduce the resistance of the signal wirings 31.1 to 31.n. Further, since it is also possible to reduce the quantity of power supply wirings, it is possible to aim at simplification of the layout.
  • the problems related with interference among the common bus line and power supply wirings which have caused problems in points of reliability and obtaining high access speed of the common bus line arranged with a plurality of wirings which increase as the memory capacity and the like increase are solved by arranging the mother power supply wiring branched to the bus line in the vicinity of the processing circuit of the signal wirings arranged in the common bus line.
  • the layout adopted to solve above-described problems may be called not a complicated layout, but rather a simplified layout in such a point that reduction of connecting portions is aimed at as compared with a layout of a conventional semiconductor integrated circuit. It is a matter of course that the manufacturing process will never become more complicated than a conventional semiconductor integrated circuit.
  • polycrystalline silicon is used as signal wirings in the second layer in above-described embodiments, but it is needless to say that aluminum wirings may be used.
  • the layout of power supply wirings is applicable to a memory chip such as a ROM and a RAM. Further, it is a matter of course, the layout may be adopted not only in a memory chip, but also in a semiconductor integrated circuit mounted with memory cells. Moreover, the present invention is applicable to a semiconductor integrated circuit in which a layout obtained by combining wirings of a common bus line system with signal processing circuits is used.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
EP91913084A 1990-07-23 1991-07-19 Integrierte halbleiterschaltungsanordnung Expired - Lifetime EP0493615B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP19423790 1990-07-23
JP194237/90 1990-07-23
PCT/JP1991/000970 WO1992002043A1 (en) 1990-07-23 1991-07-19 Semiconductor integrated circuit device

Publications (3)

Publication Number Publication Date
EP0493615A1 true EP0493615A1 (de) 1992-07-08
EP0493615A4 EP0493615A4 (de) 1994-02-16
EP0493615B1 EP0493615B1 (de) 1998-05-20

Family

ID=16321260

Family Applications (1)

Application Number Title Priority Date Filing Date
EP91913084A Expired - Lifetime EP0493615B1 (de) 1990-07-23 1991-07-19 Integrierte halbleiterschaltungsanordnung

Country Status (6)

Country Link
US (1) US5378925A (de)
EP (1) EP0493615B1 (de)
JP (1) JP3182762B2 (de)
KR (1) KR100247267B1 (de)
DE (1) DE69129445T2 (de)
WO (1) WO1992002043A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6188634B1 (en) 1999-02-16 2001-02-13 Infineon Technologies Ag Semiconductor memory having memory bank decoders disposed symmetrically on a chip

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4027438B2 (ja) 1995-05-25 2007-12-26 三菱電機株式会社 半導体装置
KR0172426B1 (ko) * 1995-12-21 1999-03-30 김광호 반도체 메모리장치
US5808900A (en) * 1996-04-30 1998-09-15 Lsi Logic Corporation Memory having direct strap connection to power supply
JPH1092857A (ja) 1996-09-10 1998-04-10 Mitsubishi Electric Corp 半導体パッケージ
US6344667B1 (en) * 1998-03-02 2002-02-05 Kabushiki Kaisha Toshiba Wiring board with reduced radiation of undesired electromagnetic waves
JP3913927B2 (ja) * 1999-04-19 2007-05-09 富士通株式会社 半導体集積回路装置
KR100715970B1 (ko) * 2001-03-08 2007-05-08 삼성전자주식회사 메모리 모듈
US6598216B2 (en) 2001-08-08 2003-07-22 International Business Machines Corporation Method for enhancing a power bus in I/O regions of an ASIC device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0041844A2 (de) * 1980-06-10 1981-12-16 Fujitsu Limited Integrierte Halbleiterschaltungen

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60182742A (ja) * 1984-02-29 1985-09-18 Fujitsu Ltd 集積回路
JPS61241964A (ja) * 1985-04-19 1986-10-28 Hitachi Ltd 半導体装置
JPS6344742A (ja) * 1986-08-12 1988-02-25 Fujitsu Ltd 半導体装置
JPS63199444A (ja) * 1987-02-16 1988-08-17 Oki Electric Ind Co Ltd 標準セル方式半導体装置
JPS63188949U (de) * 1987-05-27 1988-12-05
JP2606845B2 (ja) * 1987-06-19 1997-05-07 富士通株式会社 半導体集積回路
JPH02268439A (ja) * 1989-04-10 1990-11-02 Hitachi Ltd 半導体集積回路装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0041844A2 (de) * 1980-06-10 1981-12-16 Fujitsu Limited Integrierte Halbleiterschaltungen

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9202043A1 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6188634B1 (en) 1999-02-16 2001-02-13 Infineon Technologies Ag Semiconductor memory having memory bank decoders disposed symmetrically on a chip

Also Published As

Publication number Publication date
KR920702552A (ko) 1992-09-04
JP3182762B2 (ja) 2001-07-03
KR100247267B1 (ko) 2000-03-15
DE69129445T2 (de) 1998-11-26
US5378925A (en) 1995-01-03
DE69129445D1 (de) 1998-06-25
EP0493615B1 (de) 1998-05-20
WO1992002043A1 (en) 1992-02-06
EP0493615A4 (de) 1994-02-16

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