EP0473875A1 - Procédé pour la fabrication d'un dispostif avec bobine magnétique HF à construction de type puce - Google Patents

Procédé pour la fabrication d'un dispostif avec bobine magnétique HF à construction de type puce Download PDF

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Publication number
EP0473875A1
EP0473875A1 EP91105864A EP91105864A EP0473875A1 EP 0473875 A1 EP0473875 A1 EP 0473875A1 EP 91105864 A EP91105864 A EP 91105864A EP 91105864 A EP91105864 A EP 91105864A EP 0473875 A1 EP0473875 A1 EP 0473875A1
Authority
EP
European Patent Office
Prior art keywords
magnetic core
base body
bores
plate
coil arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP91105864A
Other languages
German (de)
English (en)
Other versions
EP0473875B1 (fr
Inventor
Michael Ganslmeier
Horst Wünschmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GW- ELEKTRONIK GmbH
GW Elektronik GmbH
Original Assignee
GW- ELEKTRONIK GmbH
GW Elektronik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GW- ELEKTRONIK GmbH, GW Elektronik GmbH filed Critical GW- ELEKTRONIK GmbH
Priority to AT91105864T priority Critical patent/ATE101301T1/de
Priority to KR1019910015422A priority patent/KR920007010A/ko
Priority to JP3250311A priority patent/JPH05267062A/ja
Publication of EP0473875A1 publication Critical patent/EP0473875A1/fr
Application granted granted Critical
Publication of EP0473875B1 publication Critical patent/EP0473875B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F17/0033Printed inductances with the coil helically wound around a magnetic core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core
    • H01F17/06Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H01F17/062Toroidal core with turns of coil around it
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • H01F2027/2814Printed windings with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor

Definitions

  • the invention relates to RF magnet coil arrangements in chip design, comprising an annular magnetic core embedded in plastic material and at least one winding made of at least one turn and guided through the magnetic core, the turns consisting of conductor track parts running parallel to the end face of the magnetic core and parallel to Axle of the magnetic core extending and inserted in the plastic embedded conductor track parts are assembled.
  • the invention further relates to methods for producing such RF magnet coil arrangements.
  • US Pat. No. 4,536,733 describes an RF transmitter with a toroidal core made of ferrite material for energy supply, one winding of which consists of wire wound on the toroidal core and the second winding of which consists of individual, correspondingly shaped sheet metal parts which, together with printed ones Conductor tracks on a circuit board that result in turns of the winding. This embodiment is not applicable to the present invention.
  • JP-AS 1-278707 published in Patents Abstracts of Japan, E-882, Jan. 31, 1990, Vol.14 / No.55, describes an induction coil in chip design and a method for its production. At least two parallel rows of holes are created in a flat body made of magnetic material. Between these rows of holes, conductor tracks are formed on the upper flat side of the body parallel to one another and perpendicular to the edge sides and on the lower flat side of the body also parallel to one another, but at an acute angle to the edge sides, that is to say arranged obliquely over this flat side, in such a way that they run helically around the body and adjoin two holes on the lower flat side. The holes are metallized on their inner surfaces, so that a coil-shaped circuit results.
  • This structure and this manufacturing method differ fundamentally from those of the present invention because the conductor tracks are applied directly to the body made of magnetic material and the body is not annular.
  • US Pat. No. 3,477,051 describes a magnetic coil arrangement in chip design which contains an annular magnetic core embedded in plastic material and at least one winding made of at least one turn and guided through the magnetic core, the turns consisting of conductor track parts and which run parallel to the end face of the magnetic core are composed of conductor track parts running parallel to the axis of the magnetic core and inserted in the embedding plastic.
  • the potting plastic is injection molded around the entire toroid, i.e. both on the two end faces and on the outer surface and the inner surface of the interior of the toroid, produced in one operation. In this operation, channels are simultaneously stamped into the embedding plastic in such a way that these channels run helically around the ring core in accordance with the desired coil.
  • the channels are later filled with metal or their surfaces are metallized, so that a magnetic component results, which has at least one winding consisting of turns.
  • This component is then placed on a carrier body or in recesses of a carrier body which has the shape of the chip with corresponding connection and contacting surfaces with which the ends of the at least one winding are electrically connected.
  • US Pat. No. 3,486,149 describes an improved production of the magnetic coil arrangement just illustrated.
  • this core encased in a plastic body with recesses for the coil turns, but at the same time a housing is also produced, which is also provided with corresponding recesses for conductor tracks to connection areas and with plated-through holes in this process.
  • the housing is preferably rectangular and flat and has pins on one of its narrow side surfaces for use in holes in printed circuits. This does not result in a chip-type component.
  • the magnetic coil arrangements described in the two US patents have, as conductor tracks, at least on the two end faces and in the interior of the core metallized grooves, which already during the production of the plastic covering in one forming operation by means of a suitably designed, complicated process Injection molding tool are generated, each magnetic core must be guided past this tool, or a large number of such tools must be provided if you want to ensure rational production. It is also not provided to fill the interior of the core with plastic during the sheathing, so that a further operation is necessary if, for. B. for reasons of insulation of the interior or all conductor tracks should be covered with plastic.
  • the RF magnet coil arrangement according to the present invention differs from the known embodiments in particular in that the conductor tracks on the end faces are not arranged in channels, but on the faces and in that the electrical connections of the conductor tracks of the two end faces to one another outside and inside the core are present in holes.
  • the resulting advantages of design and manufacture are explained in the context of the description of the invention.
  • the invention is based on the object of specifying an HF magnet coil arrangement of the type described in the introduction, in particular a toroidal core transformer arrangement, which can be produced completely or largely by machine and in very large numbers, the electrical of which Properties in the finished state, both as a function of frequency and for the given number of pieces, are very constant and can be easily installed in SMD circuits.
  • the HF magnet coil arrangement is characterized according to the invention by the features of claim 1.
  • a preferred embodiment is characterized according to the invention by the features of the independent claim 2.
  • the term “ring-shaped magnetic core” encompasses all magnetic cores which have at least one through opening surrounded by magnetic material; the magnetic cores can thus also be rectangular, square or oval and they can also have more than one opening, e.g. Double-hole cores. In these cases, the recess in the base body must of course be adapted to the cross-sectional shape of the magnetic core.
  • RF magnet coil arrangement also includes that other electrical ones Components, for example capacitors or resistors, which are integrated on or on the surfaces of the base body or in its interior, can be present.
  • Components for example capacitors or resistors, which are integrated on or on the surfaces of the base body or in its interior.
  • the invention is only described on the basis of individual arrangements with magnetic cores which have a circular cross section.
  • the basic idea of the invention is to assemble the individual windings of the at least one winding both by surface-mounted conductor track parts and by through-holes located in bores, in order to ensure complete or largely complete mechanical, but also inexpensive series production with a consistently high quality to achieve the electrical properties.
  • An essential aspect of the invention is seen in the fact that a base body is used in which the toroidal core is inserted and that the portions of the individual turns running parallel to the axis of the toroidal core are accommodated in bores of this base body.
  • bores with diameters up to 0.1 mm can still be mastered with metal drills. Laser drilling is recommended for even smaller bore diameters.
  • the base body used which receives the magnetic core, is either laminated on its one side, called the base side, either before it is plated through the bores with the corresponding sections of the turns running perpendicular to the bores, or this lamination is carried out only subsequently.
  • This lamination can be done either by providing the entire surface with an electrically conductive coating and etching off the parts that are not required, or by printing or vapor-coating the corresponding conductor tracks separately.
  • the then still missing parts for completing the coils are achieved by a cover part which is applied to the base body on the side opposite the base part and which contains conductor tracks laminated on similarly to the base part. Depending on the technology used, this cover part can be applied before or after the drilling process.
  • the through-contacting of conductor tracks is known. If this technology is used, the lid can be retrofitted. The other possibility is to apply the cover before drilling and at the same time to drill through with the base body and to make contact with one of the methods specified.
  • a base body in which the metallic connections parallel to the axis of the magnetic core are subsequently realized via bores
  • these conductor webs are formed by layer-by-layer application of electrically conductive material.
  • a base plate is used, on which electrically conductive material, for example silver, is applied, for example vapor-deposited or printed, at locations where these conductor tracks are to be produced.
  • This method can be used to produce metallic columns of the desired order of several millimeters in length and diameters of approximately 0.1 mm, it being possible to carry out the application process in several stages in order to harden or mechanically harden the material already applied stabilize.
  • a similar method of forming columnar traces can be achieved using whisker technology. It is a process that has been known for years, in which, by electrolytic deposition and in particular by condensation from the gas phase, metals can also be formed by germ growth, usually in a hydrocarbon atmosphere, material rods with diameters up to 1 ⁇ m and lengths up to several millimeters.
  • the base body 1 consists of a base body 1, an annular magnetic core 2 inserted therein and a cover 3.
  • the base body 1 is designed, for example, as a thermoplastic body and has a recess the size of the magnetic core 2.
  • the magnetic core 2 is inserted into this recess.
  • the magnetic core 2 has an outer diameter of approximately 4 mm and an inner diameter of approx. 1.5 mm.
  • the base body 1 consists, for example, of thermoplastic material, in which the recess for the magnetic core is already provided during the production, or of a material in which this recess is made subsequently, for example by drilling.
  • the magnetic core 2 inserted into the base body 1 is flush with the surface of the base body 1.
  • the height of the base body 1 is approximately 0.5 mm greater than the height of the magnetic core, so that the base body 1 has a closed, non-perforated bottom surface 4.
  • the cover 3 has a layer thickness of approximately 1 mm.
  • the outer surface of the cover 3 and the bottom surface of the base body 1 have vapor-deposited or printed electrical conductor tracks 5, the ends of which each connect a point above or below the core bore of the magnetic core 2 with a point outside the magnetic core 2.
  • the respectively horizontal conductor track parts of the turns are formed by the already mentioned conductor tracks 5 on the cover 3 or the bottom surface 4 of the base body 1.
  • the respectively vertical sections 8 of the turns of the coils 6 and 7 are realized by bores which run through the base body 1 in the axial direction of the magnetic core 2. In the exemplary embodiment shown, these bores have a bore diameter of 0.3 mm. They are filled with electrically conductive material and each connect an electrical conductor track on the bottom surface 4 with a conductor track on the cover 3.
  • a matrix plate made of thermoplastic material of 16 cm x 16 cm, 20 x 20 400 recesses for 400 ring cores are provided at intervals of 8 mm.
  • This matrix plate is equipped with 400 magnetic cores 2 of the dimensions given above.
  • the matrix plate has a thin copper layer on its bottom surface, as is known from printed circuits; if necessary, it can also be underlaid with a thin polylimide film (Kapton film).
  • the cover part 3 is then glued or welded onto the assembled matrix plate.
  • the cover part 3 also has a continuous conductor layer on its outside. Then the individual holes are drilled through the cover part 3 and the matrix plate in an automatic process, which holes are to form the already mentioned vertical sections 8 of the coils 6 and 7.
  • a laser drilling method or a mechanical drilling method is suitable for this method, for example. With mechanical drilling, bore diameters of up to 0.1 mm can be handled, while even smaller laser beams can be reproduced.
  • the bores are then completely or partially filled with electrically conductive material in such a way that there is a plated-through hole between the electrical conductor tracks of the base surface and the cover 3.
  • Either electrically conductive paste can be used for this purpose, which is injected under pressure in the case of very small bore diameters, or a process of galvanic metallization of plastic surfaces is used. In the case of very small bore diameters, it is advisable to expel the air contained in the bore by using a vacuum. Since the bottom surface 4 of the matrix plate is completely closed except for the holes, this surface can also be used pressurize it and press the plating liquid through the holes from this side or process it on this side with negative pressure in order to suck it through from the other side until the holes are completely or partially closed.
  • Suitable methods are described, for example, in the magazine "productronic 1/2 - 1988, pages 80-82" in connection with the through-contacting of printed circuit boards.
  • the pinch rolling method mentioned there for forced flooding of the holes appears relevant for the present purpose.
  • the electrical conductor tracks are produced on these latter two parts by a customary photo-etching process by placing the unnecessary conductive areas on them be removed from both surfaces.
  • the conductor tracks can also be selectively printed or stamped on.
  • the two surfaces of the cover 3 and the bottom surface 4 that carry the conductor strips are provided with a synthetic resin coating in order to mechanically protect these surfaces, which can be done in an immersion bath.
  • care must be taken to ensure that the contact surfaces 9 (connection pads) for the coils 6 and 7 remain free of plastic coating, which is achieved, for example, by a previous lamination. This lamination is then removed and the entire plate is drawn through a solder bath, as a result of which these connection pads 9 protrude slightly as tin soldering feet, so that the later toroidal transformer is designed as an SMD module.
  • the matrix plate is sawn to separate the toroidal core transformers.
  • a plasma cleaning process is available, as described, for example, in the magazine "productronic 1/2 - 1988, pages 71-72".
  • FIG. 3 differs from the embodiment of FIGS. 1 and 2 in that the cover 3 has been omitted.
  • the bottom part 4, as is clear from the explanation of FIG. 4, is also configured differently; it has a continuous opening for the magnetic core, which is filled with casting resin. Otherwise, the same reference numerals are used for the same parts as in FIGS. 1 and 2.
  • the conductor tracks 5 on the top 10 and the bottom 11 of the base body 1 are located on films 12 made of polyimide.
  • Polyimide films are sold under the trademark "Kapton". These foils are highly heat-resistant, so they can withstand high temperatures, have no melting temperature, they only carbonize at approx. 800 o C, and have a very high electrical resistance. With these properties, they serve as a heat buffer during the hardening of the casting resin and the subsequent cooling.
  • a manufacturing method for a toroidal core transformer according to FIG. 3 is described below with reference to FIG. 4. If the same or corresponding procedural measures are to be applied as for the core transformer according to FIGS. 1 and 2, e.g. The explanation is not repeated for the production of the bores, the conductor tracks on the surfaces of the base body, the metallizations in the bores or the end pads.
  • one or more sheets of castable epoxy resin with the desired dimensions are cast in a vacuum and cured at approx. 120 ° C.
  • the recess 13 is shown in the drawing by dashed lines, because due to the subsequent joint curing of the base body 1 and the filling 15 made of the same casting resin, a transition is practically no longer recognizable.
  • the recess 13 for the magnetic cores 2 e.g. made of ferromagnetic ceramic material
  • the recess 13 for the magnetic cores 2 are positioned exactly according to the number of transducers to be produced as a matrix, for example in the case of a plate with the dimensions 16 cm x 16 cm 400 recesses 13, and drilled through the plate or for example for Double-hole cores milled.
  • two holes for reference holes are drilled at defined points.
  • the plate can also consist of thermoplastic material, for example of polyamide, which has a particularly low epsilon value.
  • the magnetic cores 2 to be inserted into the recesses 13 are checked electrically and for dimensional accuracy and then inserted into the recesses 13 of the plate, which rests on a flat, heated surface, for example a glass plate, after a small amount of casting resin has been filled into the recesses 13 beforehand , which in particular can be carried out fully automatically.
  • the interior of the magnetic cores 2 is then coated with the same resin filled out. Since the thickness of the plate is chosen to be slightly larger, for example by 0.5 mm, than the height of the magnetic cores 2, thin insulating layers 14 are produced from the same casting resin as the filling 15 in the interior of the magnetic cores 2.
  • the casting resin for the interior of the magnetic cores 2 can also be filled with ferrite powder in order to influence the electrical properties of the entire structure in the desired manner.
  • the plate prepared in this way is then dried at 60 ° C. and then cured at 12 ° C. If necessary, the hardened plate is subjected to a grinding process in order to ensure the plane parallelism required for further processing.
  • composite films are applied to each side, which have also been cleaned well and consist of polyimide film of the type described above (25 m thick) and copper coating (17 ⁇ m thick). This is done by rolling the composite films.
  • the plate is then clamped with its reference holes onto a device with which the holes 16 for the plated-through holes are produced, in particular drilled, according to the predetermined pattern, taking into account the number and position of the turns and windings of the individual coils.
  • This predetermined pattern which is to be referred to as the layout, becomes manufactured by computer control and has the taps required for the required number of turns of the desired windings and also contains the masks for the later production of the conductor tracks 5.
  • the plates are then plated through by producing 16 metal coatings on the inner surfaces of the holes.
  • Photoresist is then applied to the copper layers of the upper side 10 and the lower side 11, the pattern for the conductor tracks is generated using the layout, exposed and etched in a manner known per se, so that the conductor tracks 5 are formed.
  • a plate is produced with a large number of RF magnet coil arrangements, which can already be tested electrically in this state.
  • the individual arrangements are then separated by means of a circular saw by cuts along predetermined lines.
  • the individual components can also be soldered to a body specially manufactured for SMD circuits and also provided with a protective cap and are then ready for the final test.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
EP91105864A 1990-09-04 1991-04-12 Procédé pour la fabrication d'un dispostif avec bobine magnétique HF à construction de type puce Expired - Lifetime EP0473875B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AT91105864T ATE101301T1 (de) 1990-09-04 1991-04-12 Verfahren zum herstellen einer hfmagnetspulenanordnung in chip-bauweise.
KR1019910015422A KR920007010A (ko) 1990-09-04 1991-09-04 칩-형(chip-type)hf자기 코일 장치 및 그의 제조방법
JP3250311A JPH05267062A (ja) 1990-09-04 1991-09-04 チツプ型hf磁気コイル装置およびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4027994 1990-09-04
DE4027994A DE4027994A1 (de) 1990-09-04 1990-09-04 Hf-magnetspulenanordnung und verfahren zu ihrer herstellung

Publications (2)

Publication Number Publication Date
EP0473875A1 true EP0473875A1 (fr) 1992-03-11
EP0473875B1 EP0473875B1 (fr) 1994-02-02

Family

ID=6413554

Family Applications (1)

Application Number Title Priority Date Filing Date
EP91105864A Expired - Lifetime EP0473875B1 (fr) 1990-09-04 1991-04-12 Procédé pour la fabrication d'un dispostif avec bobine magnétique HF à construction de type puce

Country Status (6)

Country Link
US (1) US5191699A (fr)
EP (1) EP0473875B1 (fr)
KR (1) KR920007010A (fr)
DE (2) DE4027994A1 (fr)
ES (1) ES2051043T3 (fr)
HK (1) HK80894A (fr)

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EP0809263A1 (fr) * 1996-04-22 1997-11-26 Vacuumschmelze GmbH Composant inductif du type plat
EP0851439A1 (fr) * 1996-12-26 1998-07-01 Citizen Electronics Co., Ltd. Dispositif de circuit modulaire à montage en surface et son procédé de fabrication
EP0856855A2 (fr) * 1997-02-04 1998-08-05 Mitsubishi Denki Kabushiki Kaisha Bobine imprimée avec couche magnétique
WO1998056016A1 (fr) * 1997-06-02 1998-12-10 Vacuumschmelze Gmbh Composant inductif
EP0893699A1 (fr) * 1997-07-25 1999-01-27 Tokin Corporation Capteur magnétique comportant une bobine d'excitation comprenant des sections de conducteur à couche mince formés sur le corps de bobine et avec une bobine de detection enroulée sur celle-ci
US5959846A (en) * 1996-12-26 1999-09-28 Citizen Electronics, Co., Ltd. Modular surface mount circuit device and a manufacturing method thereof

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US5828283A (en) * 1995-12-31 1998-10-27 Daewoo Electronics Co., Ltd. Apparatus for connecting primary conductive lines of flexible transformer
DE19608913A1 (de) * 1996-03-07 1997-09-11 Gw Elektronik Gmbh Hochfrequenzübertrager und Verfahren zu seiner Herstellung
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US6337571B2 (en) * 1998-11-13 2002-01-08 Tektronix, Inc. Ultra-high-frequency current probe in surface-mount form factor
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US20090309687A1 (en) 2008-06-11 2009-12-17 Aleksandar Aleksov Method of manufacturing an inductor for a microelectronic device, method of manufacturing a substrate containing such an inductor, and substrate manufactured thereby,
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US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
EP3095159A4 (fr) 2014-01-17 2017-09-27 Nuvotronics, Inc. Unité d'interface de test à l'échelle d'une tranche: dispositifs et procédés à faible perte et haute isolation pour interconnexions de signaux mixtes à grande vitesse et haute densité, et contacteurs
JP6323213B2 (ja) * 2014-06-26 2018-05-16 株式会社村田製作所 コイルモジュール
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
TWI559341B (zh) * 2014-11-28 2016-11-21 矽品精密工業股份有限公司 電子封裝件
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
CN107112111B (zh) 2015-01-07 2018-10-19 株式会社村田制作所 线圈部件
US11600432B2 (en) 2016-02-24 2023-03-07 Murata Manufacturing Co., Ltd. Substrate-embedded transformer with improved isolation
SK289113B6 (sk) * 2016-09-19 2023-09-13 Logomotion, S.R.O Anténa sjadrom, najmä miniatúrna RFID a/alebo NFC anténa, a spôsob jej výroby
DE102016119164A1 (de) * 2016-10-10 2018-04-12 Phoenix Contact Gmbh & Co. Kg Planarer Übertrager mit integriertem Ringkern
US10395816B2 (en) * 2017-11-03 2019-08-27 Ajoho Enterprise Co., Ltd. Magnetic device fabrication method
EP3483905B1 (fr) * 2017-11-10 2020-07-15 ABB Schweiz AG Bobine d'arrêt
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3477051A (en) * 1967-12-26 1969-11-04 Ibm Die casting of core windings
US3486149A (en) * 1968-01-15 1969-12-23 Ibm Variable ratio die cast pulse transformer
DE3322004A1 (de) * 1983-06-18 1984-12-20 Robert Bosch Gmbh, 7000 Stuttgart Induktives element, insbesondere uebertrager
US4536733A (en) * 1982-09-30 1985-08-20 Sperry Corporation High frequency inverter transformer for power supplies
WO1986000749A1 (fr) * 1984-07-07 1986-01-30 Robert Bosch Gmbh Transformation a haute frequence
DD245296A1 (de) * 1985-12-30 1987-04-29 Inst Prueffeld Elekt Toroidspule mit duennwandigem wickelkoerper
JPH01278707A (ja) * 1988-04-30 1989-11-09 Taiyo Yuden Co Ltd チップ形状インダクタとその製法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3477051A (en) * 1967-12-26 1969-11-04 Ibm Die casting of core windings
US3486149A (en) * 1968-01-15 1969-12-23 Ibm Variable ratio die cast pulse transformer
US4536733A (en) * 1982-09-30 1985-08-20 Sperry Corporation High frequency inverter transformer for power supplies
DE3322004A1 (de) * 1983-06-18 1984-12-20 Robert Bosch Gmbh, 7000 Stuttgart Induktives element, insbesondere uebertrager
WO1986000749A1 (fr) * 1984-07-07 1986-01-30 Robert Bosch Gmbh Transformation a haute frequence
DD245296A1 (de) * 1985-12-30 1987-04-29 Inst Prueffeld Elekt Toroidspule mit duennwandigem wickelkoerper
JPH01278707A (ja) * 1988-04-30 1989-11-09 Taiyo Yuden Co Ltd チップ形状インダクタとその製法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0809263A1 (fr) * 1996-04-22 1997-11-26 Vacuumschmelze GmbH Composant inductif du type plat
EP0851439A1 (fr) * 1996-12-26 1998-07-01 Citizen Electronics Co., Ltd. Dispositif de circuit modulaire à montage en surface et son procédé de fabrication
US5959846A (en) * 1996-12-26 1999-09-28 Citizen Electronics, Co., Ltd. Modular surface mount circuit device and a manufacturing method thereof
EP0856855A2 (fr) * 1997-02-04 1998-08-05 Mitsubishi Denki Kabushiki Kaisha Bobine imprimée avec couche magnétique
EP0856855A3 (fr) * 1997-02-04 1999-06-30 Mitsubishi Denki Kabushiki Kaisha Bobine imprimée avec couche magnétique
WO1998056016A1 (fr) * 1997-06-02 1998-12-10 Vacuumschmelze Gmbh Composant inductif
EP0893699A1 (fr) * 1997-07-25 1999-01-27 Tokin Corporation Capteur magnétique comportant une bobine d'excitation comprenant des sections de conducteur à couche mince formés sur le corps de bobine et avec une bobine de detection enroulée sur celle-ci
US6181130B1 (en) 1997-07-25 2001-01-30 Tokin Corporation Magnetic sensor having excitation coil including thin-film linear conductor sections formed on bobbin with detection coil wound thereon

Also Published As

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HK80894A (en) 1994-08-19
EP0473875B1 (fr) 1994-02-02
KR920007010A (ko) 1992-04-28
DE59100992D1 (de) 1994-03-17
DE4027994A1 (de) 1992-03-05
ES2051043T3 (es) 1994-06-01
US5191699A (en) 1993-03-09

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