EP0473875A1 - Procédé pour la fabrication d'un dispostif avec bobine magnétique HF à construction de type puce - Google Patents
Procédé pour la fabrication d'un dispostif avec bobine magnétique HF à construction de type puce Download PDFInfo
- Publication number
- EP0473875A1 EP0473875A1 EP91105864A EP91105864A EP0473875A1 EP 0473875 A1 EP0473875 A1 EP 0473875A1 EP 91105864 A EP91105864 A EP 91105864A EP 91105864 A EP91105864 A EP 91105864A EP 0473875 A1 EP0473875 A1 EP 0473875A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- magnetic core
- base body
- bores
- plate
- coil arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 238000010276 construction Methods 0.000 title abstract 2
- 230000005291 magnetic effect Effects 0.000 claims abstract description 82
- 239000004020 conductor Substances 0.000 claims abstract description 69
- 238000000034 method Methods 0.000 claims abstract description 54
- 238000004804 winding Methods 0.000 claims abstract description 32
- 239000004033 plastic Substances 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 238000005266 casting Methods 0.000 claims description 21
- 238000013461 design Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000011159 matrix material Substances 0.000 claims description 13
- 238000005553 drilling Methods 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 6
- 238000001465 metallisation Methods 0.000 claims description 6
- 238000011049 filling Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 5
- 229910000859 α-Fe Inorganic materials 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 2
- 239000012777 electrically insulating material Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims description 2
- 230000004048 modification Effects 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 1
- 238000005019 vapor deposition process Methods 0.000 claims 1
- 238000000576 coating method Methods 0.000 description 5
- 238000003475 lamination Methods 0.000 description 4
- 239000012815 thermoplastic material Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 206010013786 Dry skin Diseases 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- ZINJLDJMHCUBIP-UHFFFAOYSA-N ethametsulfuron-methyl Chemical compound CCOC1=NC(NC)=NC(NC(=O)NS(=O)(=O)C=2C(=CC=CC=2)C(=O)OC)=N1 ZINJLDJMHCUBIP-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000012799 electrically-conductive coating Substances 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000006223 plastic coating Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
- H01F17/062—Toroidal core with turns of coil around it
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2814—Printed windings with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
Definitions
- the invention relates to RF magnet coil arrangements in chip design, comprising an annular magnetic core embedded in plastic material and at least one winding made of at least one turn and guided through the magnetic core, the turns consisting of conductor track parts running parallel to the end face of the magnetic core and parallel to Axle of the magnetic core extending and inserted in the plastic embedded conductor track parts are assembled.
- the invention further relates to methods for producing such RF magnet coil arrangements.
- US Pat. No. 4,536,733 describes an RF transmitter with a toroidal core made of ferrite material for energy supply, one winding of which consists of wire wound on the toroidal core and the second winding of which consists of individual, correspondingly shaped sheet metal parts which, together with printed ones Conductor tracks on a circuit board that result in turns of the winding. This embodiment is not applicable to the present invention.
- JP-AS 1-278707 published in Patents Abstracts of Japan, E-882, Jan. 31, 1990, Vol.14 / No.55, describes an induction coil in chip design and a method for its production. At least two parallel rows of holes are created in a flat body made of magnetic material. Between these rows of holes, conductor tracks are formed on the upper flat side of the body parallel to one another and perpendicular to the edge sides and on the lower flat side of the body also parallel to one another, but at an acute angle to the edge sides, that is to say arranged obliquely over this flat side, in such a way that they run helically around the body and adjoin two holes on the lower flat side. The holes are metallized on their inner surfaces, so that a coil-shaped circuit results.
- This structure and this manufacturing method differ fundamentally from those of the present invention because the conductor tracks are applied directly to the body made of magnetic material and the body is not annular.
- US Pat. No. 3,477,051 describes a magnetic coil arrangement in chip design which contains an annular magnetic core embedded in plastic material and at least one winding made of at least one turn and guided through the magnetic core, the turns consisting of conductor track parts and which run parallel to the end face of the magnetic core are composed of conductor track parts running parallel to the axis of the magnetic core and inserted in the embedding plastic.
- the potting plastic is injection molded around the entire toroid, i.e. both on the two end faces and on the outer surface and the inner surface of the interior of the toroid, produced in one operation. In this operation, channels are simultaneously stamped into the embedding plastic in such a way that these channels run helically around the ring core in accordance with the desired coil.
- the channels are later filled with metal or their surfaces are metallized, so that a magnetic component results, which has at least one winding consisting of turns.
- This component is then placed on a carrier body or in recesses of a carrier body which has the shape of the chip with corresponding connection and contacting surfaces with which the ends of the at least one winding are electrically connected.
- US Pat. No. 3,486,149 describes an improved production of the magnetic coil arrangement just illustrated.
- this core encased in a plastic body with recesses for the coil turns, but at the same time a housing is also produced, which is also provided with corresponding recesses for conductor tracks to connection areas and with plated-through holes in this process.
- the housing is preferably rectangular and flat and has pins on one of its narrow side surfaces for use in holes in printed circuits. This does not result in a chip-type component.
- the magnetic coil arrangements described in the two US patents have, as conductor tracks, at least on the two end faces and in the interior of the core metallized grooves, which already during the production of the plastic covering in one forming operation by means of a suitably designed, complicated process Injection molding tool are generated, each magnetic core must be guided past this tool, or a large number of such tools must be provided if you want to ensure rational production. It is also not provided to fill the interior of the core with plastic during the sheathing, so that a further operation is necessary if, for. B. for reasons of insulation of the interior or all conductor tracks should be covered with plastic.
- the RF magnet coil arrangement according to the present invention differs from the known embodiments in particular in that the conductor tracks on the end faces are not arranged in channels, but on the faces and in that the electrical connections of the conductor tracks of the two end faces to one another outside and inside the core are present in holes.
- the resulting advantages of design and manufacture are explained in the context of the description of the invention.
- the invention is based on the object of specifying an HF magnet coil arrangement of the type described in the introduction, in particular a toroidal core transformer arrangement, which can be produced completely or largely by machine and in very large numbers, the electrical of which Properties in the finished state, both as a function of frequency and for the given number of pieces, are very constant and can be easily installed in SMD circuits.
- the HF magnet coil arrangement is characterized according to the invention by the features of claim 1.
- a preferred embodiment is characterized according to the invention by the features of the independent claim 2.
- the term “ring-shaped magnetic core” encompasses all magnetic cores which have at least one through opening surrounded by magnetic material; the magnetic cores can thus also be rectangular, square or oval and they can also have more than one opening, e.g. Double-hole cores. In these cases, the recess in the base body must of course be adapted to the cross-sectional shape of the magnetic core.
- RF magnet coil arrangement also includes that other electrical ones Components, for example capacitors or resistors, which are integrated on or on the surfaces of the base body or in its interior, can be present.
- Components for example capacitors or resistors, which are integrated on or on the surfaces of the base body or in its interior.
- the invention is only described on the basis of individual arrangements with magnetic cores which have a circular cross section.
- the basic idea of the invention is to assemble the individual windings of the at least one winding both by surface-mounted conductor track parts and by through-holes located in bores, in order to ensure complete or largely complete mechanical, but also inexpensive series production with a consistently high quality to achieve the electrical properties.
- An essential aspect of the invention is seen in the fact that a base body is used in which the toroidal core is inserted and that the portions of the individual turns running parallel to the axis of the toroidal core are accommodated in bores of this base body.
- bores with diameters up to 0.1 mm can still be mastered with metal drills. Laser drilling is recommended for even smaller bore diameters.
- the base body used which receives the magnetic core, is either laminated on its one side, called the base side, either before it is plated through the bores with the corresponding sections of the turns running perpendicular to the bores, or this lamination is carried out only subsequently.
- This lamination can be done either by providing the entire surface with an electrically conductive coating and etching off the parts that are not required, or by printing or vapor-coating the corresponding conductor tracks separately.
- the then still missing parts for completing the coils are achieved by a cover part which is applied to the base body on the side opposite the base part and which contains conductor tracks laminated on similarly to the base part. Depending on the technology used, this cover part can be applied before or after the drilling process.
- the through-contacting of conductor tracks is known. If this technology is used, the lid can be retrofitted. The other possibility is to apply the cover before drilling and at the same time to drill through with the base body and to make contact with one of the methods specified.
- a base body in which the metallic connections parallel to the axis of the magnetic core are subsequently realized via bores
- these conductor webs are formed by layer-by-layer application of electrically conductive material.
- a base plate is used, on which electrically conductive material, for example silver, is applied, for example vapor-deposited or printed, at locations where these conductor tracks are to be produced.
- This method can be used to produce metallic columns of the desired order of several millimeters in length and diameters of approximately 0.1 mm, it being possible to carry out the application process in several stages in order to harden or mechanically harden the material already applied stabilize.
- a similar method of forming columnar traces can be achieved using whisker technology. It is a process that has been known for years, in which, by electrolytic deposition and in particular by condensation from the gas phase, metals can also be formed by germ growth, usually in a hydrocarbon atmosphere, material rods with diameters up to 1 ⁇ m and lengths up to several millimeters.
- the base body 1 consists of a base body 1, an annular magnetic core 2 inserted therein and a cover 3.
- the base body 1 is designed, for example, as a thermoplastic body and has a recess the size of the magnetic core 2.
- the magnetic core 2 is inserted into this recess.
- the magnetic core 2 has an outer diameter of approximately 4 mm and an inner diameter of approx. 1.5 mm.
- the base body 1 consists, for example, of thermoplastic material, in which the recess for the magnetic core is already provided during the production, or of a material in which this recess is made subsequently, for example by drilling.
- the magnetic core 2 inserted into the base body 1 is flush with the surface of the base body 1.
- the height of the base body 1 is approximately 0.5 mm greater than the height of the magnetic core, so that the base body 1 has a closed, non-perforated bottom surface 4.
- the cover 3 has a layer thickness of approximately 1 mm.
- the outer surface of the cover 3 and the bottom surface of the base body 1 have vapor-deposited or printed electrical conductor tracks 5, the ends of which each connect a point above or below the core bore of the magnetic core 2 with a point outside the magnetic core 2.
- the respectively horizontal conductor track parts of the turns are formed by the already mentioned conductor tracks 5 on the cover 3 or the bottom surface 4 of the base body 1.
- the respectively vertical sections 8 of the turns of the coils 6 and 7 are realized by bores which run through the base body 1 in the axial direction of the magnetic core 2. In the exemplary embodiment shown, these bores have a bore diameter of 0.3 mm. They are filled with electrically conductive material and each connect an electrical conductor track on the bottom surface 4 with a conductor track on the cover 3.
- a matrix plate made of thermoplastic material of 16 cm x 16 cm, 20 x 20 400 recesses for 400 ring cores are provided at intervals of 8 mm.
- This matrix plate is equipped with 400 magnetic cores 2 of the dimensions given above.
- the matrix plate has a thin copper layer on its bottom surface, as is known from printed circuits; if necessary, it can also be underlaid with a thin polylimide film (Kapton film).
- the cover part 3 is then glued or welded onto the assembled matrix plate.
- the cover part 3 also has a continuous conductor layer on its outside. Then the individual holes are drilled through the cover part 3 and the matrix plate in an automatic process, which holes are to form the already mentioned vertical sections 8 of the coils 6 and 7.
- a laser drilling method or a mechanical drilling method is suitable for this method, for example. With mechanical drilling, bore diameters of up to 0.1 mm can be handled, while even smaller laser beams can be reproduced.
- the bores are then completely or partially filled with electrically conductive material in such a way that there is a plated-through hole between the electrical conductor tracks of the base surface and the cover 3.
- Either electrically conductive paste can be used for this purpose, which is injected under pressure in the case of very small bore diameters, or a process of galvanic metallization of plastic surfaces is used. In the case of very small bore diameters, it is advisable to expel the air contained in the bore by using a vacuum. Since the bottom surface 4 of the matrix plate is completely closed except for the holes, this surface can also be used pressurize it and press the plating liquid through the holes from this side or process it on this side with negative pressure in order to suck it through from the other side until the holes are completely or partially closed.
- Suitable methods are described, for example, in the magazine "productronic 1/2 - 1988, pages 80-82" in connection with the through-contacting of printed circuit boards.
- the pinch rolling method mentioned there for forced flooding of the holes appears relevant for the present purpose.
- the electrical conductor tracks are produced on these latter two parts by a customary photo-etching process by placing the unnecessary conductive areas on them be removed from both surfaces.
- the conductor tracks can also be selectively printed or stamped on.
- the two surfaces of the cover 3 and the bottom surface 4 that carry the conductor strips are provided with a synthetic resin coating in order to mechanically protect these surfaces, which can be done in an immersion bath.
- care must be taken to ensure that the contact surfaces 9 (connection pads) for the coils 6 and 7 remain free of plastic coating, which is achieved, for example, by a previous lamination. This lamination is then removed and the entire plate is drawn through a solder bath, as a result of which these connection pads 9 protrude slightly as tin soldering feet, so that the later toroidal transformer is designed as an SMD module.
- the matrix plate is sawn to separate the toroidal core transformers.
- a plasma cleaning process is available, as described, for example, in the magazine "productronic 1/2 - 1988, pages 71-72".
- FIG. 3 differs from the embodiment of FIGS. 1 and 2 in that the cover 3 has been omitted.
- the bottom part 4, as is clear from the explanation of FIG. 4, is also configured differently; it has a continuous opening for the magnetic core, which is filled with casting resin. Otherwise, the same reference numerals are used for the same parts as in FIGS. 1 and 2.
- the conductor tracks 5 on the top 10 and the bottom 11 of the base body 1 are located on films 12 made of polyimide.
- Polyimide films are sold under the trademark "Kapton". These foils are highly heat-resistant, so they can withstand high temperatures, have no melting temperature, they only carbonize at approx. 800 o C, and have a very high electrical resistance. With these properties, they serve as a heat buffer during the hardening of the casting resin and the subsequent cooling.
- a manufacturing method for a toroidal core transformer according to FIG. 3 is described below with reference to FIG. 4. If the same or corresponding procedural measures are to be applied as for the core transformer according to FIGS. 1 and 2, e.g. The explanation is not repeated for the production of the bores, the conductor tracks on the surfaces of the base body, the metallizations in the bores or the end pads.
- one or more sheets of castable epoxy resin with the desired dimensions are cast in a vacuum and cured at approx. 120 ° C.
- the recess 13 is shown in the drawing by dashed lines, because due to the subsequent joint curing of the base body 1 and the filling 15 made of the same casting resin, a transition is practically no longer recognizable.
- the recess 13 for the magnetic cores 2 e.g. made of ferromagnetic ceramic material
- the recess 13 for the magnetic cores 2 are positioned exactly according to the number of transducers to be produced as a matrix, for example in the case of a plate with the dimensions 16 cm x 16 cm 400 recesses 13, and drilled through the plate or for example for Double-hole cores milled.
- two holes for reference holes are drilled at defined points.
- the plate can also consist of thermoplastic material, for example of polyamide, which has a particularly low epsilon value.
- the magnetic cores 2 to be inserted into the recesses 13 are checked electrically and for dimensional accuracy and then inserted into the recesses 13 of the plate, which rests on a flat, heated surface, for example a glass plate, after a small amount of casting resin has been filled into the recesses 13 beforehand , which in particular can be carried out fully automatically.
- the interior of the magnetic cores 2 is then coated with the same resin filled out. Since the thickness of the plate is chosen to be slightly larger, for example by 0.5 mm, than the height of the magnetic cores 2, thin insulating layers 14 are produced from the same casting resin as the filling 15 in the interior of the magnetic cores 2.
- the casting resin for the interior of the magnetic cores 2 can also be filled with ferrite powder in order to influence the electrical properties of the entire structure in the desired manner.
- the plate prepared in this way is then dried at 60 ° C. and then cured at 12 ° C. If necessary, the hardened plate is subjected to a grinding process in order to ensure the plane parallelism required for further processing.
- composite films are applied to each side, which have also been cleaned well and consist of polyimide film of the type described above (25 m thick) and copper coating (17 ⁇ m thick). This is done by rolling the composite films.
- the plate is then clamped with its reference holes onto a device with which the holes 16 for the plated-through holes are produced, in particular drilled, according to the predetermined pattern, taking into account the number and position of the turns and windings of the individual coils.
- This predetermined pattern which is to be referred to as the layout, becomes manufactured by computer control and has the taps required for the required number of turns of the desired windings and also contains the masks for the later production of the conductor tracks 5.
- the plates are then plated through by producing 16 metal coatings on the inner surfaces of the holes.
- Photoresist is then applied to the copper layers of the upper side 10 and the lower side 11, the pattern for the conductor tracks is generated using the layout, exposed and etched in a manner known per se, so that the conductor tracks 5 are formed.
- a plate is produced with a large number of RF magnet coil arrangements, which can already be tested electrically in this state.
- the individual arrangements are then separated by means of a circular saw by cuts along predetermined lines.
- the individual components can also be soldered to a body specially manufactured for SMD circuits and also provided with a protective cap and are then ready for the final test.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT91105864T ATE101301T1 (de) | 1990-09-04 | 1991-04-12 | Verfahren zum herstellen einer hfmagnetspulenanordnung in chip-bauweise. |
KR1019910015422A KR920007010A (ko) | 1990-09-04 | 1991-09-04 | 칩-형(chip-type)hf자기 코일 장치 및 그의 제조방법 |
JP3250311A JPH05267062A (ja) | 1990-09-04 | 1991-09-04 | チツプ型hf磁気コイル装置およびその製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4027994 | 1990-09-04 | ||
DE4027994A DE4027994A1 (de) | 1990-09-04 | 1990-09-04 | Hf-magnetspulenanordnung und verfahren zu ihrer herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0473875A1 true EP0473875A1 (fr) | 1992-03-11 |
EP0473875B1 EP0473875B1 (fr) | 1994-02-02 |
Family
ID=6413554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP91105864A Expired - Lifetime EP0473875B1 (fr) | 1990-09-04 | 1991-04-12 | Procédé pour la fabrication d'un dispostif avec bobine magnétique HF à construction de type puce |
Country Status (6)
Country | Link |
---|---|
US (1) | US5191699A (fr) |
EP (1) | EP0473875B1 (fr) |
KR (1) | KR920007010A (fr) |
DE (2) | DE4027994A1 (fr) |
ES (1) | ES2051043T3 (fr) |
HK (1) | HK80894A (fr) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0809263A1 (fr) * | 1996-04-22 | 1997-11-26 | Vacuumschmelze GmbH | Composant inductif du type plat |
EP0851439A1 (fr) * | 1996-12-26 | 1998-07-01 | Citizen Electronics Co., Ltd. | Dispositif de circuit modulaire à montage en surface et son procédé de fabrication |
EP0856855A2 (fr) * | 1997-02-04 | 1998-08-05 | Mitsubishi Denki Kabushiki Kaisha | Bobine imprimée avec couche magnétique |
WO1998056016A1 (fr) * | 1997-06-02 | 1998-12-10 | Vacuumschmelze Gmbh | Composant inductif |
EP0893699A1 (fr) * | 1997-07-25 | 1999-01-27 | Tokin Corporation | Capteur magnétique comportant une bobine d'excitation comprenant des sections de conducteur à couche mince formés sur le corps de bobine et avec une bobine de detection enroulée sur celle-ci |
US5959846A (en) * | 1996-12-26 | 1999-09-28 | Citizen Electronics, Co., Ltd. | Modular surface mount circuit device and a manufacturing method thereof |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0845738A (ja) * | 1994-07-27 | 1996-02-16 | Canon Inc | インダクタンス素子 |
US5828283A (en) * | 1995-12-31 | 1998-10-27 | Daewoo Electronics Co., Ltd. | Apparatus for connecting primary conductive lines of flexible transformer |
DE19608913A1 (de) * | 1996-03-07 | 1997-09-11 | Gw Elektronik Gmbh | Hochfrequenzübertrager und Verfahren zu seiner Herstellung |
US7732732B2 (en) | 1996-11-20 | 2010-06-08 | Ibiden Co., Ltd. | Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
US7462801B1 (en) * | 1996-11-20 | 2008-12-09 | Ibiden Co., Ltd. | Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
JP3058121B2 (ja) * | 1997-05-19 | 2000-07-04 | 日本電気株式会社 | プリント基板 |
JP4216917B2 (ja) * | 1997-11-21 | 2009-01-28 | Tdk株式会社 | チップビーズ素子およびその製造方法 |
US6337571B2 (en) * | 1998-11-13 | 2002-01-08 | Tektronix, Inc. | Ultra-high-frequency current probe in surface-mount form factor |
US6690165B1 (en) | 1999-04-28 | 2004-02-10 | Hironori Takahashi | Magnetic-field sensing coil embedded in ceramic for measuring ambient magnetic field |
KR100443233B1 (ko) * | 2001-06-12 | 2004-08-04 | 학교법인 청석학원 | 전원공급 장치용 플라스틱형 코어 |
US6952153B2 (en) * | 2003-02-04 | 2005-10-04 | Raytheon Company | Electrical transformer |
TWI238513B (en) | 2003-03-04 | 2005-08-21 | Rohm & Haas Elect Mat | Coaxial waveguide microstructures and methods of formation thereof |
US6990729B2 (en) * | 2003-09-05 | 2006-01-31 | Harris Corporation | Method for forming an inductor |
US7372886B2 (en) * | 2004-06-07 | 2008-05-13 | Avago Technologies Fiber Ip Pte Ltd | High thermal conductivity vertical cavity surface emitting laser (VCSEL) |
US8350657B2 (en) * | 2005-06-30 | 2013-01-08 | Derochemont L Pierre | Power management module and method of manufacture |
CN101274734A (zh) | 2006-12-30 | 2008-10-01 | 罗门哈斯电子材料有限公司 | 三维微结构及其形成方法 |
US8203418B2 (en) * | 2007-01-11 | 2012-06-19 | Planarmag, Inc. | Manufacture and use of planar embedded magnetics as discrete components and in integrated connectors |
US9070509B2 (en) | 2007-01-11 | 2015-06-30 | Tyco Electronics Corporation | Method for manufacturing a planar electronic device having a magnetic component |
US7304558B1 (en) * | 2007-01-18 | 2007-12-04 | Harris Corporation | Toroidal inductor design for improved Q |
EP1973189B1 (fr) | 2007-03-20 | 2012-12-05 | Nuvotronics, LLC | Microstructures de chaîne de transmission coaxiales et leurs procédés de formation |
US7755174B2 (en) | 2007-03-20 | 2010-07-13 | Nuvotonics, LLC | Integrated electronic components and methods of formation thereof |
US20090309687A1 (en) | 2008-06-11 | 2009-12-17 | Aleksandar Aleksov | Method of manufacturing an inductor for a microelectronic device, method of manufacturing a substrate containing such an inductor, and substrate manufactured thereby, |
US20090322460A1 (en) * | 2008-06-25 | 2009-12-31 | Lin Hsun-I | High-frequency switching-type direct-current rectifier |
JP2012510725A (ja) * | 2008-12-03 | 2012-05-10 | プラナーマグ インコーポレイテッド | 埋め込まれた磁心を有する一体型平面可変トランス |
US20110123783A1 (en) | 2009-11-23 | 2011-05-26 | David Sherrer | Multilayer build processses and devices thereof |
US9440378B2 (en) * | 2010-05-05 | 2016-09-13 | Tyco Electronics Corporation | Planar electronic device and method for manufacturing |
US8466769B2 (en) | 2010-05-26 | 2013-06-18 | Tyco Electronics Corporation | Planar inductor devices |
US8358193B2 (en) | 2010-05-26 | 2013-01-22 | Tyco Electronics Corporation | Planar inductor devices |
US8325002B2 (en) * | 2010-05-27 | 2012-12-04 | Advanced Semiconductor Engineering, Inc. | Power inductor structure |
TWI435438B (zh) * | 2011-01-28 | 2014-04-21 | Ajoho Entpr Co Ltd | Structure and manufacturing method of inductance element |
US8866300B1 (en) | 2011-06-05 | 2014-10-21 | Nuvotronics, Llc | Devices and methods for solder flow control in three-dimensional microstructures |
US8814601B1 (en) | 2011-06-06 | 2014-08-26 | Nuvotronics, Llc | Batch fabricated microconnectors |
WO2013010108A1 (fr) | 2011-07-13 | 2013-01-17 | Nuvotronics, Llc | Procédés de fabrication de structures électroniques et mécaniques |
DE102012213263A1 (de) * | 2011-09-20 | 2013-03-21 | Robert Bosch Gmbh | Handwerkzeugvorrichtung mit zumindest einer Ladespule |
US8766759B2 (en) * | 2012-10-01 | 2014-07-01 | Zippy Technology Corp. | Transformer |
TWI546000B (zh) * | 2012-10-02 | 2016-08-11 | 健鼎科技股份有限公司 | 電路板封裝結構及其製造方法 |
CN103854838B (zh) * | 2012-12-03 | 2017-02-08 | 上海卓凯电子科技有限公司 | 平面式磁性元件及其制造方法 |
US9325044B2 (en) | 2013-01-26 | 2016-04-26 | Nuvotronics, Inc. | Multi-layer digital elliptic filter and method |
US9306255B1 (en) | 2013-03-15 | 2016-04-05 | Nuvotronics, Inc. | Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other |
US9306254B1 (en) | 2013-03-15 | 2016-04-05 | Nuvotronics, Inc. | Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration |
EP3095159A4 (fr) | 2014-01-17 | 2017-09-27 | Nuvotronics, Inc. | Unité d'interface de test à l'échelle d'une tranche: dispositifs et procédés à faible perte et haute isolation pour interconnexions de signaux mixtes à grande vitesse et haute densité, et contacteurs |
JP6323213B2 (ja) * | 2014-06-26 | 2018-05-16 | 株式会社村田製作所 | コイルモジュール |
US10847469B2 (en) | 2016-04-26 | 2020-11-24 | Cubic Corporation | CTE compensation for wafer-level and chip-scale packages and assemblies |
TWI559341B (zh) * | 2014-11-28 | 2016-11-21 | 矽品精密工業股份有限公司 | 電子封裝件 |
US10511073B2 (en) | 2014-12-03 | 2019-12-17 | Cubic Corporation | Systems and methods for manufacturing stacked circuits and transmission lines |
CN107112111B (zh) | 2015-01-07 | 2018-10-19 | 株式会社村田制作所 | 线圈部件 |
US11600432B2 (en) | 2016-02-24 | 2023-03-07 | Murata Manufacturing Co., Ltd. | Substrate-embedded transformer with improved isolation |
SK289113B6 (sk) * | 2016-09-19 | 2023-09-13 | Logomotion, S.R.O | Anténa sjadrom, najmä miniatúrna RFID a/alebo NFC anténa, a spôsob jej výroby |
DE102016119164A1 (de) * | 2016-10-10 | 2018-04-12 | Phoenix Contact Gmbh & Co. Kg | Planarer Übertrager mit integriertem Ringkern |
US10395816B2 (en) * | 2017-11-03 | 2019-08-27 | Ajoho Enterprise Co., Ltd. | Magnetic device fabrication method |
EP3483905B1 (fr) * | 2017-11-10 | 2020-07-15 | ABB Schweiz AG | Bobine d'arrêt |
US10319654B1 (en) | 2017-12-01 | 2019-06-11 | Cubic Corporation | Integrated chip scale packages |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3477051A (en) * | 1967-12-26 | 1969-11-04 | Ibm | Die casting of core windings |
US3486149A (en) * | 1968-01-15 | 1969-12-23 | Ibm | Variable ratio die cast pulse transformer |
DE3322004A1 (de) * | 1983-06-18 | 1984-12-20 | Robert Bosch Gmbh, 7000 Stuttgart | Induktives element, insbesondere uebertrager |
US4536733A (en) * | 1982-09-30 | 1985-08-20 | Sperry Corporation | High frequency inverter transformer for power supplies |
WO1986000749A1 (fr) * | 1984-07-07 | 1986-01-30 | Robert Bosch Gmbh | Transformation a haute frequence |
DD245296A1 (de) * | 1985-12-30 | 1987-04-29 | Inst Prueffeld Elekt | Toroidspule mit duennwandigem wickelkoerper |
JPH01278707A (ja) * | 1988-04-30 | 1989-11-09 | Taiyo Yuden Co Ltd | チップ形状インダクタとその製法 |
-
1990
- 1990-09-04 DE DE4027994A patent/DE4027994A1/de not_active Withdrawn
-
1991
- 1991-04-12 EP EP91105864A patent/EP0473875B1/fr not_active Expired - Lifetime
- 1991-04-12 ES ES91105864T patent/ES2051043T3/es not_active Expired - Lifetime
- 1991-04-12 DE DE91105864T patent/DE59100992D1/de not_active Expired - Fee Related
- 1991-09-04 US US07/754,587 patent/US5191699A/en not_active Expired - Lifetime
- 1991-09-04 KR KR1019910015422A patent/KR920007010A/ko not_active Application Discontinuation
-
1994
- 1994-08-11 HK HK80894A patent/HK80894A/xx not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3477051A (en) * | 1967-12-26 | 1969-11-04 | Ibm | Die casting of core windings |
US3486149A (en) * | 1968-01-15 | 1969-12-23 | Ibm | Variable ratio die cast pulse transformer |
US4536733A (en) * | 1982-09-30 | 1985-08-20 | Sperry Corporation | High frequency inverter transformer for power supplies |
DE3322004A1 (de) * | 1983-06-18 | 1984-12-20 | Robert Bosch Gmbh, 7000 Stuttgart | Induktives element, insbesondere uebertrager |
WO1986000749A1 (fr) * | 1984-07-07 | 1986-01-30 | Robert Bosch Gmbh | Transformation a haute frequence |
DD245296A1 (de) * | 1985-12-30 | 1987-04-29 | Inst Prueffeld Elekt | Toroidspule mit duennwandigem wickelkoerper |
JPH01278707A (ja) * | 1988-04-30 | 1989-11-09 | Taiyo Yuden Co Ltd | チップ形状インダクタとその製法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0809263A1 (fr) * | 1996-04-22 | 1997-11-26 | Vacuumschmelze GmbH | Composant inductif du type plat |
EP0851439A1 (fr) * | 1996-12-26 | 1998-07-01 | Citizen Electronics Co., Ltd. | Dispositif de circuit modulaire à montage en surface et son procédé de fabrication |
US5959846A (en) * | 1996-12-26 | 1999-09-28 | Citizen Electronics, Co., Ltd. | Modular surface mount circuit device and a manufacturing method thereof |
EP0856855A2 (fr) * | 1997-02-04 | 1998-08-05 | Mitsubishi Denki Kabushiki Kaisha | Bobine imprimée avec couche magnétique |
EP0856855A3 (fr) * | 1997-02-04 | 1999-06-30 | Mitsubishi Denki Kabushiki Kaisha | Bobine imprimée avec couche magnétique |
WO1998056016A1 (fr) * | 1997-06-02 | 1998-12-10 | Vacuumschmelze Gmbh | Composant inductif |
EP0893699A1 (fr) * | 1997-07-25 | 1999-01-27 | Tokin Corporation | Capteur magnétique comportant une bobine d'excitation comprenant des sections de conducteur à couche mince formés sur le corps de bobine et avec une bobine de detection enroulée sur celle-ci |
US6181130B1 (en) | 1997-07-25 | 2001-01-30 | Tokin Corporation | Magnetic sensor having excitation coil including thin-film linear conductor sections formed on bobbin with detection coil wound thereon |
Also Published As
Publication number | Publication date |
---|---|
HK80894A (en) | 1994-08-19 |
EP0473875B1 (fr) | 1994-02-02 |
KR920007010A (ko) | 1992-04-28 |
DE59100992D1 (de) | 1994-03-17 |
DE4027994A1 (de) | 1992-03-05 |
ES2051043T3 (es) | 1994-06-01 |
US5191699A (en) | 1993-03-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0473875B1 (fr) | Procédé pour la fabrication d'un dispostif avec bobine magnétique HF à construction de type puce | |
DE69310781T2 (de) | Verfahren zur Herstellung von Magnetkernen | |
DE4422827C2 (de) | Geschichtete vergossene elektrische Wicklung sowie Transformatoreinheit und Verfahren zu deren Herstellung | |
DE102012216101B4 (de) | Verfahren zum Herstellen einer in einem Substrat integrierten Spule, Verfahren zur Herstellung einer mehrschichtigen Leiterplatte und elektronisches Gerät | |
EP2973671B1 (fr) | Procédé de fabrication d'un composant électronique | |
DE112008000364B4 (de) | Spule und Verfahren zum Bilden der Spule | |
DE3545989C2 (fr) | ||
DE4422216A1 (de) | Mehrlagige metallische Leiterplatte und gegossener Baustein | |
DE3927711C2 (de) | Lamellierte Induktivität | |
DE102018203715A1 (de) | Verfahren zur Herstellung einer Leiterplatte unter Verwendung einer Form für Leiterelemente | |
DE102013226549B4 (de) | Verfahren zur Herstellung einer Leiterplatte | |
WO2020165438A1 (fr) | Bobine et procédé de production de cette bobine | |
DE69815473T2 (de) | Planare wicklungsstruktur und flaches magnetisches bauteil mit reduzierten abmessungen und verbesserten thermischen eigenschaften | |
DE102007045946A1 (de) | Rollflexspule | |
DE102014114205A1 (de) | Planarer Miniaturtransformator | |
WO2010097387A1 (fr) | Support de circuit multicouche et son procédé de fabrication | |
EP0282078B1 (fr) | Procédé de fabrication d'un circuit électrique comportant un noyau métallique et matériau de base utilisé | |
DE19645034C2 (de) | Ebene elektrische Schaltung und Verfahren zur Herstellung derselben | |
DE19860691A1 (de) | Magnetpaste | |
EP2107577B1 (fr) | Composant inductif et procédé de sa fabrication | |
JPH05267062A (ja) | チツプ型hf磁気コイル装置およびその製造方法 | |
EP0024302A2 (fr) | Condensateur électrolytique solide | |
DE19811083C1 (de) | Induktives Bauelement und Verfahren zur Herstellung | |
DE10144464C2 (de) | Elektronisches Bauteil mit Induktionsspule für Hochfrequenzanwendungen und Verfahren zur Herstellung desselben | |
DE102007015819A1 (de) | Verfahren zur Herstellung einer elektronischen Baugruppe sowie elektronische Baugruppe |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FR GB GR IT LI LU NL SE |
|
17P | Request for examination filed |
Effective date: 19920910 |
|
17Q | First examination report despatched |
Effective date: 19921119 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH DE DK ES FR GB GR IT LI LU NL SE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Effective date: 19940202 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 19940202 Ref country code: DK Effective date: 19940202 Ref country code: BE Effective date: 19940202 |
|
REF | Corresponds to: |
Ref document number: 101301 Country of ref document: AT Date of ref document: 19940215 Kind code of ref document: T |
|
REF | Corresponds to: |
Ref document number: 59100992 Country of ref document: DE Date of ref document: 19940317 |
|
ITF | It: translation for a ep patent filed |
Owner name: PROPRIA PROT. PROPRIETA' IND. |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19940430 Ref country code: LI Effective date: 19940430 Ref country code: CH Effective date: 19940430 |
|
GBT | Gb: translation of ep patent filed (gb section 77(6)(a)/1977) |
Effective date: 19940415 |
|
ET | Fr: translation filed | ||
REG | Reference to a national code |
Ref country code: ES Ref legal event code: FG2A Ref document number: 2051043 Country of ref document: ES Kind code of ref document: T3 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
26N | No opposition filed | ||
REG | Reference to a national code |
Ref country code: GB Ref legal event code: IF02 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20030325 Year of fee payment: 13 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: ES Payment date: 20030409 Year of fee payment: 13 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: NL Payment date: 20030417 Year of fee payment: 13 Ref country code: FR Payment date: 20030417 Year of fee payment: 13 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: AT Payment date: 20030423 Year of fee payment: 13 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20030528 Year of fee payment: 13 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20040412 Ref country code: AT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20040412 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: ES Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20040413 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20041101 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20041103 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20040412 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20041231 |
|
NLV4 | Nl: lapsed or anulled due to non-payment of the annual fee |
Effective date: 20041101 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED. Effective date: 20050412 |
|
REG | Reference to a national code |
Ref country code: ES Ref legal event code: FD2A Effective date: 20040413 |