EP0473875B1 - Procédé pour la fabrication d'un dispostif avec bobine magnétique HF à construction de type puce - Google Patents

Procédé pour la fabrication d'un dispostif avec bobine magnétique HF à construction de type puce Download PDF

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Publication number
EP0473875B1
EP0473875B1 EP91105864A EP91105864A EP0473875B1 EP 0473875 B1 EP0473875 B1 EP 0473875B1 EP 91105864 A EP91105864 A EP 91105864A EP 91105864 A EP91105864 A EP 91105864A EP 0473875 B1 EP0473875 B1 EP 0473875B1
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EP
European Patent Office
Prior art keywords
accordance
conducting members
recesses
magnetic core
magnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP91105864A
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German (de)
English (en)
Other versions
EP0473875A1 (fr
Inventor
Michael Ganslmeier
Horst Wünschmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GW- ELEKTRONIK GmbH
GW Elektronik GmbH
Original Assignee
GW- ELEKTRONIK GmbH
GW Elektronik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GW- ELEKTRONIK GmbH, GW Elektronik GmbH filed Critical GW- ELEKTRONIK GmbH
Priority to AT91105864T priority Critical patent/ATE101301T1/de
Priority to KR1019910015422A priority patent/KR920007010A/ko
Priority to JP3250311A priority patent/JPH05267062A/ja
Publication of EP0473875A1 publication Critical patent/EP0473875A1/fr
Application granted granted Critical
Publication of EP0473875B1 publication Critical patent/EP0473875B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F17/0033Printed inductances with the coil helically wound around a magnetic core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core
    • H01F17/06Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H01F17/062Toroidal core with turns of coil around it
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • H01F2027/2814Printed windings with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor

Definitions

  • the present invention relates to a method for producing an RF magnetic coil arrangement in chip design according to the preamble of claim 1.
  • US Pat. No. 4,536,733 describes an HF transformer with a toroidal core made of ferrite material for energy supply, one winding of which consists of wire wound on the toroidal core and the second winding of which consists of individual, correspondingly shaped sheet metal parts which together with printed conductor tracks on a circuit board, which result in turns of the winding.
  • JP-AS 1-278707 published in Patents Abstracts of Japan, E-882, Jan. 31, 1990, Vol.14 / No.55, describes an induction coil in chip design and a method for its production. At least two parallel rows of holes are created in a flat body made of magnetic material. Between these rows of holes, conductor tracks are formed on the upper flat side of the body parallel to one another and perpendicular to the edge sides and on the lower flat side of the body also parallel to one another, but at an acute angle to the edge sides, that is to say arranged obliquely over this flat side, in such a way that they run helically around the body and adjoin two holes on the lower flat side. The holes are metallized on their inner surfaces, so that a coil-shaped circuit results.
  • US Pat. No. 3,477,051 describes a magnetic coil arrangement in chip design, which contains an annular magnetic core embedded in plastic material and at least one winding made of at least one turn and guided through the magnetic core, the turns consisting of conductor track parts and which run parallel to the end face of the magnetic core are composed of conductor track parts running parallel to the axis of the magnetic core and inserted in the embedding plastic.
  • the embedding plastic is produced in an injection molding process around the entire ring core, ie both on the two end faces as well as on the outer surface and the inner surface of the interior of the ring core, in one operation. In this process, channels are simultaneously embossed in the embedding plastic in such a way that these channels run helically around the toroid according to the desired coil.
  • the channels are later filled with metal or their surfaces are metallized, so that a magnetic component results which has at least one winding consisting of turns.
  • This component is then placed on a carrier body or in recesses of a carrier body which has the shape of the chip with corresponding connection and contacting surfaces with which the ends of the at least one winding are electrically connected.
  • US Pat. No. 3,486,149 describes an improved production of the magnetic coil arrangement just illustrated.
  • this core encased in a plastic body with depressions for the coil turns, but at the same time a housing is also produced, which is also provided with corresponding depressions for conductor tracks to connecting surfaces and with plated-through holes in this working step.
  • the housing is preferably rectangular and flat and has pins on one of its narrow side faces for use in holes in printed circuits.
  • the invention is based on the object of specifying a method for producing an HF magnet coil arrangement, with which constant electrical values can be achieved even in the case of large quantities.
  • RF magnet coil arrangement also includes the fact that other electrical components, e.g. Capacitors or resistors, which are integrated on or on the surfaces of the base body or in its interior, can be present.
  • Capacitors or resistors which are integrated on or on the surfaces of the base body or in its interior.
  • the invention is only described on the basis of individual arrangements with magnetic cores which have a circular cross section.
  • the basic idea of the invention is to assemble the individual windings of the at least one winding both by surface-mounted conductor track parts and by through-holes located in bores in order to achieve a completely or largely complete mechanical, but also inexpensive series production with a consistently high quality to achieve the electrical properties.
  • An essential aspect of the invention is seen in the fact that a base body is used in which the toroidal core is inserted and that the sections of the individual turns running parallel to the axis of the toroidal core are accommodated in bores of this base body.
  • holes with diameters of up to 0.1 mm can still be mastered with metal drills. Laser drilling is recommended for even smaller bore diameters. These holes are then plated through, depending on the material and Offer dimensions different processes.
  • the through-contacting of conductor tracks is known. If this technology is used, the lid can be retrofitted. The other possibility is to apply the cover before drilling and at the same time to drill through the base body and to make contact with one of the methods specified.
  • a base body in which the metallic connections parallel to the axis of the magnetic core are subsequently realized via bores
  • these conductor webs are formed by layer-by-layer application of electrically conductive material.
  • a base plate is used, on which electrically conductive material, for example silver, is applied, for example vapor-deposited or printed, at locations where these conductor tracks are to be produced.
  • This method can be used to produce metallic columns of the desired order of magnitude of several millimeters in length and diameters of approximately 0.1 mm, it being possible to carry out the application process in several stages in order to harden or mechanically harden the material already applied stabilize.
  • a modification of this method provides that instead of a plate made of casting resin, a plate made of thermoplastic is used and the spaces in the openings between the magnetic cores and the plate are filled with hardenable casting resin.
  • the base body 1 consists of a base body 1, an annular magnetic core 2 inserted therein and a cover 3.
  • the base body 1 is designed, for example, as a thermoplastic body and has a recess the size of the magnetic core 2.
  • the magnetic core 2 is inserted into this recess.
  • the magnetic core 2 has an outer diameter of approximately 4 mm and an inner diameter of approximately 1.5 mm.
  • the base body 1 consists, for example, of thermoplastic material, in which the recess for the magnetic core is already provided in the production, or of a material in which this recess is subsequently, e.g. is produced by drilling.
  • the magnetic core 2 inserted into the base body 1 is flush with the surface of the base body 1.
  • the height of the base body 1 is approximately 0.5 mm greater than the height of the magnetic core, so that the base body 1 has a closed, non-perforated bottom surface 4.
  • the cover 3 has a layer thickness of approximately 1 mm.
  • the outer surface of the cover 3 and the bottom surface of the base body 1 have vapor-deposited or printed electrical conductor tracks 5, the ends of which each connect a point above or below the core bore of the magnetic core 2 with a point outside the magnetic core 2.
  • Fig. 2 shows very clearly the conductor routing in a toroidal core transformer with two coils 6 and 7.
  • the respectively horizontal conductor parts of the turns are formed by the already mentioned conductor paths 5 on the cover 3 or the bottom surface 4 of the base body 1.
  • the vertical sections 8 of each Windings of the coils 6 and 7 are realized through bores which run through the base body 1 in the axial direction of the magnetic core 2. In the exemplary embodiment shown, these bores have a bore diameter of 0.3 mm. They are filled with electrically conductive material and each connect an electrical conductor track on the bottom surface 4 with a conductor track on the cover 3.
  • a production method for a toroidal core transformer is described below, in which the recess in the base body is not continuous, according to FIGS. 1 and 2.
  • a matrix plate made of thermoplastic plastic of 16 cm x 16 cm, 20 x 20 400 recesses for 400 ring cores are provided at intervals of 8 mm.
  • This matrix plate is equipped with 400 magnetic cores 2 of the dimensions given above.
  • the matrix plate has on its bottom surface a thin copper layer, as is known from printed circuits; if necessary, it can also be underlaid with a thin polylimide film (Kapton film).
  • the cover part 3 is glued or welded onto the assembled matrix plate.
  • the cover part 3 also has a continuous conductor layer on its outside.
  • the individual holes are drilled through the cover part 3 and the matrix plate in an automatic process, which holes are to form the already mentioned vertical sections 8 of the coils 6 and 7.
  • a laser drilling method or a mechanical drilling method is suitable for this method, for example. Mechanical drilling can handle bore diameters of up to 0.1 mm, while laser drilling can reproduce even smaller ones.
  • the holes are then completely or partially filled with electrically conductive material so that a Through-contacting between the electrical conductor tracks of the bottom surface 4 and the cover 3 results.
  • Either electrically conductive paste can be used for this purpose, which is injected under very small bore diameters under pressure, or a process of galvanic metallization of plastic surfaces is used. In the case of very small bore diameters, it is advisable to expel the air contained in the bore by using a vacuum. Since the bottom surface 4 of the matrix plate is completely closed except for the bores, this surface can also be pressurized and the plating liquid can be pushed through the bores from this side or processed with negative pressure on this side in order to suck it through from the other side until the bores are completely or are partially closed.
  • Suitable processes are described, for example, in the magazine "productronic 1/2 - 1988, pages 80-82" in connection with the through-contacting of printed circuit boards.
  • the squeeze-rolling process mentioned there for forced flooding of the holes appears relevant for the present purpose.
  • the electrical conductor tracks are produced on these latter two parts by a customary photo-etching process by placing the unnecessary conductive areas on them be removed from both surfaces.
  • the conductor tracks can also be selectively printed or stamped on.
  • the two surfaces of the cover 3 and the bottom surface 4 carrying the conductor tracks are provided with a synthetic resin coating in order to mechanically protect these surfaces, which can be done in an immersion bath. It is however, make sure that the contact surfaces 9 (connection pads) for the coils 6 and 7 remain free of plastic coating, which is achieved for example by a previous lamination. This lamination is then removed and the entire plate is drawn through a soldering bath, as a result of which these connecting pads 9 protrude slightly as tin soldering feet, so that the later toroidal transformer is designed as an SMD module.
  • the matrix plate is sawn to separate the toroidal core transformers.
  • a plasma cleaning process is available, as described, for example, in the magazine "productronic 1/2 - 1988, pages 71-72".
  • FIG. 3 differs from the embodiment of FIGS. 1 and 2 in that the cover 3 has been omitted.
  • the bottom part 4 is also configured differently; it has a continuous opening for the magnetic core, which is filled with casting resin. Otherwise, the same reference numerals are used for the same parts as in FIGS. 1 and 2.
  • the conductor tracks 5 on the top 10 and the bottom 11 of the base body 1 are located on foils 12 made of polyimide.
  • Polyimide films are sold under the trademark "Kapton". These foils are highly heat-resistant, so they can withstand high temperatures, have no melting temperature, they only carbonize at approx. 800 ° C, and have a very high electrical resistance. With these properties, they serve as a heat buffer during the hardening of the casting resin and the subsequent cooling.
  • a manufacturing method for a toroidal core transformer according to FIG. 3 is described below with reference to FIG. 4. If the same or corresponding procedural measures as for core transformers according to FIGS. 1 and 2 are to be used, e.g. The explanation is not repeated for the production of the bores, the conductor tracks on the surfaces of the base body, the metallizations in the bores or the end pads.
  • one or more sheets of castable epoxy resin with the desired dimensions are cast in a vacuum and cured at approx. 120 ° C.
  • the recesses 13 is shown in the drawing by dashed lines, because due to the subsequent joint curing of the base body 1 and the filling 15 made of the same cast resin, a transition is practically no longer recognizable.
  • the recesses 13 for the magnetic cores 2 (for example made of ferromagnetic ceramic material) are positioned exactly in accordance with the number of transmitters to be manufactured.
  • Such a matrix has, for example, a plate with the dimensions 16 cm ⁇ 16 cm and contains 400 recesses 13. Then holes are drilled or milled through the plate. In addition, two holes for reference holes are drilled at defined locations.
  • the plate can also be made of thermoplastic material consist, for example, of polyamide, which has a particularly low epsilon value.
  • the magnetic cores 2 to be inserted into the recesses 13 are checked electrically and for dimensional accuracy and then inserted into the recesses 13 of the plate, which are placed on a flat, heated surface, e.g. a glass plate, after a small amount of casting resin has been filled into the recesses 13 beforehand, which can in particular be carried out fully automatically.
  • the interior of the magnetic cores 2 is then filled with the same casting resin. Since the thickness of the plate is slightly, e.g. 0.5 mm, larger than the height of the magnetic cores 2, thin insulating layers 14 are formed from the same casting resin as the filling 15 in the interior of the magnetic cores 2.
  • the casting resin for the interior of the magnetic cores 2 can also be filled with ferrite powder, in order to influence the electrical properties of the entire structure in the desired manner.
  • the plate prepared in this way is then dried at 60 ° C. and then cured at 120 ° C. If necessary, the hardened plate is subjected to a grinding process to ensure the plane parallelism required for further processing.
  • composite films are applied to each side, which have also been cleaned well and which consist of polyimide film of the type described above (25 ⁇ m thick) and copper coating (17 ⁇ m thick). This is done by rolling the composite films.
  • the plate is then clamped with its reference holes onto a device with which the holes 16 for the plated-through holes are produced, in particular drilled, in accordance with the predetermined pattern, taking into account the number and position of the turns and windings of the individual coils.
  • This predetermined pattern which is to be referred to as a layout, is produced in a computer-controlled manner and has the taps required for the required number of turns of the desired windings and also contains the masks for the later production of the conductor tracks 5.
  • the plates are then plated through by galvanically producing 16 metal coatings on the inner surfaces of the holes.
  • Photoresist is then applied to the copper layers of the upper side 10 and the lower side 11, the pattern for the conductor tracks is generated using the layout, exposed and etched in a manner known per se, so that the conductor tracks 5 are formed.
  • a plate is created with a large number of RF magnet coil arrangements, which can already be tested electrically in this state.
  • the individual arrangements are then separated by means of a circular saw by cuts along predetermined lines.
  • the individual components can also be soldered to a body specially manufactured for SMD circuits and also provided with a protective cap and are then ready for the final test.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Claims (14)

  1. Procédé pour la fabrication d'un dispositif à bobine magnétique HF du type puce comportant un noyau magnétique annulaire (2) encastré dans un corps en matériau isolant et au moins une bobine (6, 7) entourant l'anneau du noyau magnétique, laquelle est composée de barrettes conductrices individuelles parallèles à l'axe du noyau magnétique et de barrettes conductrices individuelles perpendiculaires à l'axe du noyau magnétique, caractérisé en ce que l'on forme un corps de base (1) avec un grand nombre d'évidements (13) pour la réception d'un nombre correspondant de noyaux magnétiques (2), que l'on insère les noyaux magnétiques dans les évidements, que l'on applique sur la partie supérieure et/ou sur la partie inférieure du corps de base (1) des couches avec les barrettes conductrices nécessaires perpendiculaires à l'axe du noyau magnétique, lesquelles comportent aussi les raccordements pour la(les) bobine(s) (6, 7), que l'on pratique les perçages nécessaires pour les barrettes conductrices parallèles à l'axe des noyaux magnétiques, que l'on remplit les perçages de matériau conducteur, et que les puces sont ensuite individualisées par sciage ou par un autre procédé de séparation.
  2. Procédé selon la revendication 1, caractérisé en ce que les évidements (13) pratiqués dans le corps de base (1) pour le logement des noyaux magnétiques (2) ne traversent pas entièrement le corps de base, de sorte qu'il existe une surface fermée sur laquelle est appliquée la couche avec les barrettes conductrices.
  3. Procédé selon l'une des revendications 1 ou 2, caractérisé en ce que l'on dispose sur le côté du corps de base (1) comportant les évidements (13) pour les noyaux magnétiques, un élément de couvercle (3) et/ou un élément de fond (4), qui comprend la couche avec les barrettes conductrices.
  4. Procédé selon l'une des revendications 2 ou 3, caractérisé en ce que l'on utilise pour la constitution de la couche avec les barrettes conductrices, une feuille de cuivre de laquelle les surfaces non nécessaires sont éliminées par gravure.
  5. Procédé selon l'une des revendications 2 ou 3, caractérisé en ce que, pour la constitution de la couche avec les barrettes conductrices, les barrettes conductrices sont imprimées ou déposées sous vide.
  6. Procédé selon l'une des revendications 1 à 5, caractérisé en ce que le remplissage des perçages avec du matériau conducteur est effectué selon l'une des alternatives ci-après :
    a) injection d'étain de brasure
    b) injection de pâte conductrice
    c) un procédé de galvanisation par lequel du matériau conducteur est déposé.
  7. Procédé selon l'une des revendications 4 à 6, caractérisé en ce que la couche avec des barrettes conductrices est composée d'une feuille en polyimide sur laquelle la couche de cuivre est appliquée.
  8. Procédé selon la revendication 3, caractérisé en ce que l'on applique la couche sur le côté extérieur respectivement de l'élément de couvercle (3) et/ou de l'élément de fond (4), et en ce que la liaison électrique des barrettes conductrices parallèles à l'axe du noyau magnétique (2) est obtenue par une jonction de brasage dans un procédé de métallisation.
  9. Procédé selon la revendication 10, caractérisé en ce que le matériau de brasure utilisé présente un point de fusion d'au moins 300° C.
  10. Procédé selon l'une des revendications 1 à 9, caractérisé en ce que l'on utilise une matière thermoplastique ou de la résine de coulée durcissable pour le corps de base (1).
  11. Procédé selon la revendication 10, caractérisé en ce que l'on utilise en tant que résine de coulée une résine époxy, qui durcit de préférence à 120° C.
  12. Procédé selon l'une des revendications 1 à 11, caractérisé en ce que l'on pratique des évidements (13) dans le corps de base (1) qui évident également l'espace à l'intérieur du noyau magnétique (2), que l'on utilise des noyaux magnétiques dont les dimensions axiales sont plus faibles que la hauteur utile des évidements (13), que l'on remplit le volume des évidements de matériau isolant afin d'obtenir une surface fermée pour la réception de la couche avec les barrettes conductrices.
  13. Procédé selon la revendication 12, caractérisé en ce que le matériau de remplissage des évidements (13) contient un composant magnétiquement actif.
  14. Procédé selon l'une quelconque des revendications 1 à 13, caractérisé en ce qu'au moins deux ouvertures de référence sont pratiquées dans le corps de base (1), à l'aide desquelles la pièce à traiter peut être exactement bridée sur un support pour les différentes phases de traitement.
EP91105864A 1990-09-04 1991-04-12 Procédé pour la fabrication d'un dispostif avec bobine magnétique HF à construction de type puce Expired - Lifetime EP0473875B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AT91105864T ATE101301T1 (de) 1990-09-04 1991-04-12 Verfahren zum herstellen einer hfmagnetspulenanordnung in chip-bauweise.
KR1019910015422A KR920007010A (ko) 1990-09-04 1991-09-04 칩-형(chip-type)hf자기 코일 장치 및 그의 제조방법
JP3250311A JPH05267062A (ja) 1990-09-04 1991-09-04 チツプ型hf磁気コイル装置およびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4027994 1990-09-04
DE4027994A DE4027994A1 (de) 1990-09-04 1990-09-04 Hf-magnetspulenanordnung und verfahren zu ihrer herstellung

Publications (2)

Publication Number Publication Date
EP0473875A1 EP0473875A1 (fr) 1992-03-11
EP0473875B1 true EP0473875B1 (fr) 1994-02-02

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EP91105864A Expired - Lifetime EP0473875B1 (fr) 1990-09-04 1991-04-12 Procédé pour la fabrication d'un dispostif avec bobine magnétique HF à construction de type puce

Country Status (6)

Country Link
US (1) US5191699A (fr)
EP (1) EP0473875B1 (fr)
KR (1) KR920007010A (fr)
DE (2) DE4027994A1 (fr)
ES (1) ES2051043T3 (fr)
HK (1) HK80894A (fr)

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US5191699A (en) 1993-03-09
HK80894A (en) 1994-08-19
EP0473875A1 (fr) 1992-03-11
DE4027994A1 (de) 1992-03-05
DE59100992D1 (de) 1994-03-17
ES2051043T3 (es) 1994-06-01

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