EP0410427B1 - Steckverbinder für Leiterplatten - Google Patents

Steckverbinder für Leiterplatten Download PDF

Info

Publication number
EP0410427B1
EP0410427B1 EP19900114278 EP90114278A EP0410427B1 EP 0410427 B1 EP0410427 B1 EP 0410427B1 EP 19900114278 EP19900114278 EP 19900114278 EP 90114278 A EP90114278 A EP 90114278A EP 0410427 B1 EP0410427 B1 EP 0410427B1
Authority
EP
European Patent Office
Prior art keywords
conductors
printed
potential
circuit boards
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP19900114278
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0410427A1 (de
Inventor
Peter Dipl. Ing. Klimke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wincor Nixdorf International GmbH
Original Assignee
Siemens Nixdorf Informationssysteme AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Nixdorf Informationssysteme AG filed Critical Siemens Nixdorf Informationssysteme AG
Priority to AT90114278T priority Critical patent/ATE95642T1/de
Publication of EP0410427A1 publication Critical patent/EP0410427A1/de
Application granted granted Critical
Publication of EP0410427B1 publication Critical patent/EP0410427B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/777—Coupling parts carrying pins, blades or analogous contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures

Definitions

  • the invention relates to a connector for printed circuit boards, in particular data technology with a multi-layer flexible printed circuit board in the form of a film, which alternately has levels for signal conductors and potential conductors, which stand for each other in a fixed geometric configuration for a specific wave resistance value to be achieved, and in which the Conductor tracks of the individual levels are exposed at the other end of the flexible film.
  • the object of the present invention is to create a connector for printed circuit boards with defined electrical properties, such as impedance, crosstalk and wave resistance.
  • the connector according to the invention is designed in such a way that two superimposed stiffening plates are laminated on one end, the first of which contains plated-through holes into which the pins or soldering tags are soldered, and the second with cutouts for receiving solder the locations where the holes of the first circuit board are provided.
  • An embodiment to achieve a defined characteristic impedance provides that the conductors in the signal planes run parallel and in the longitudinal direction to the flexible conductor film, that the conductors in the potential planes are designed as a lattice work and that the conductor tracks running longitudinally to the film are arranged such that they are under or run above the spaces between the conductors of the signal planes.
  • Another embodiment results from the fact that the conductors for signal and potential transmission are arranged in one plane, alternately next to one another.
  • the connector can also be designed such that the signal conductor level with its individual conductor paths is located between two planar potential conductor levels.
  • the conductors of the signal position and the longitudinal conductors of the potential position in the individual levels can also be congruent with one another. Another possibility is that the grid spacing of the potential conductors is greater than the grid spacing of the signal conductors.
  • a layer protrude laterally and forward over the flexible film 1 and to form it as a metal surface.
  • FIG. 1 shows the structure of a plug according to the invention, the flexible film 1 producing the connection from the printed circuit board 4 to the plug contacts, which are designed as pins 2.
  • the pins 2 are held in the laminated stiffening strips 8 and 9, respectively.
  • the plug part itself is held in a housing designed as a protective collar 3 via a cross member 30.
  • the third stiffening strip 6, which is attached to the other end of the film, is fastened with a notch nail 7 in the printed circuit board 4 and serves there as strain relief. At the solder joint 5, the contacts of the film are exposed and can be soldered to the conductor tracks of the circuit board there.
  • FIG. 2 shows a signal position of the flexible film 1 in the stretched state, the signal conductors 10 being guided to the bores 15 in which the connector pins 7 are located.
  • further conductors 11 are arranged at the rear end of the film between the signal conductors, which bring the potential through vias 16 from the potential level below into the signal plane, so that potential and signal conductors can be attached to the circuit board 4 in a simple manner lying in one plane .
  • Another layer is also designed as a shield plate 12.
  • FIG. 3 A potential position is shown in FIG. 3, where the potential conductors 17 are designed as lattice work, the lattice in the rear being denser than in the front.
  • the holes 15 for the signal conductor connections and the holes 18 for the potential conductor connections can also be seen in the upper part of the film.
  • the signal conductors 10 and the potential conductors 17 are arranged next to one another in one plane.
  • the signal conductors are in one level, the potential conductors in a second level, but offset such that they come to lie in the spaces between the signal conductors 10.
  • the signal conductors are arranged in one plane, while the potential conductors are designed as a metallic surface 20.
  • FIG 8 Another configuration is shown in FIG 8, in which the signal conductors are arranged in a separate plane between two flat potential planes.
  • FIG. 9 shows an arrangement in which signal conductors 10 and potential conductors 17 are located in two planes, but the signal and potential conductors are arranged congruently one above the other
  • FIG. 10 shows an arrangement in which the rasterization of signal and potential conductors are of different sizes, but the potential conductors are also always in a space between two signal conductors.

Landscapes

  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Paper (AREA)
EP19900114278 1989-07-28 1990-07-25 Steckverbinder für Leiterplatten Expired - Lifetime EP0410427B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT90114278T ATE95642T1 (de) 1989-07-28 1990-07-25 Steckverbinder fuer leiterplatten.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3925157A DE3925157A1 (de) 1989-07-28 1989-07-28 Steckverbinder fuer leiterplatten
DE3925157 1989-07-28

Publications (2)

Publication Number Publication Date
EP0410427A1 EP0410427A1 (de) 1991-01-30
EP0410427B1 true EP0410427B1 (de) 1993-10-06

Family

ID=6386123

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19900114278 Expired - Lifetime EP0410427B1 (de) 1989-07-28 1990-07-25 Steckverbinder für Leiterplatten

Country Status (3)

Country Link
EP (1) EP0410427B1 (enrdf_load_stackoverflow)
AT (1) ATE95642T1 (enrdf_load_stackoverflow)
DE (2) DE3925157A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001082416A1 (en) * 2000-04-20 2001-11-01 Vladimir Nikolaevich Davidov Pressure actuated zero insertion force socket
DE202012002352U1 (de) 2011-05-17 2012-04-18 Erni Electronics Gmbh Anordnung aus Steckverbinder und Leiterplatte
WO2014188933A1 (ja) * 2013-05-20 2014-11-27 矢崎総業株式会社 コネクタ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1867468U (de) * 1961-07-18 1963-02-21 Krone Kg Mit einer gedruckten oder geaetzten schaltung sowie mit loetoesen versehene isolierstoff-traegerplatte.
GB1241169A (en) * 1967-09-21 1971-07-28 Elliott Brothers London Ltd Improvements relating to printed circuits
FR2076471A5 (enrdf_load_stackoverflow) * 1970-01-16 1971-10-15 Bull General Electric
DE2142214B1 (de) * 1971-08-23 1973-02-15 Siemens AG, 1000 Berlin u 8000 München Hochfrequenzbauelement in streifenleitungstechnik
US4365856A (en) * 1980-07-09 1982-12-28 Hirose Electric Co., Ltd. Electric connector for coaxial ribbon cable
US4552420A (en) * 1983-12-02 1985-11-12 E. I. Du Pont De Nemours And Company Electrical connector using a flexible circuit having an impedance control arrangement thereon
DE3405804A1 (de) * 1984-02-17 1985-08-22 Siemens AG, 1000 Berlin und 8000 München Folienverdrahtung fuer geraete der elektrotechnik, insbesondere der elektrischen nachrichtentechnik
DE3418958A1 (de) * 1984-05-22 1985-12-05 Nippon Mektron, Ltd., Tokio/Tokyo Vorrichtung und verfahren zum elektrischen und mechanischen verbinden flexibler gedruckter schaltfolien
US4716500A (en) * 1985-10-18 1987-12-29 Tektronix, Inc. Probe cable assembly
DE3544125A1 (de) * 1985-12-13 1987-06-19 Allied Corp Steckverbinder fuer oberflaechenmontage
US4755147A (en) * 1986-05-20 1988-07-05 Control Data Corporation Flex head connector with ground plane
DE8703527U1 (de) * 1987-03-10 1987-05-21 Nonnengässer Elektro-Schalttechnik GmbH, 7410 Reutlingen Steckkontaktleiste für elektrische Leiterplatten

Also Published As

Publication number Publication date
ATE95642T1 (de) 1993-10-15
DE3925157C2 (enrdf_load_stackoverflow) 1993-01-28
DE59002990D1 (de) 1993-11-11
DE3925157A1 (de) 1991-02-07
EP0410427A1 (de) 1991-01-30

Similar Documents

Publication Publication Date Title
DE3639367C2 (enrdf_load_stackoverflow)
DE2233578A1 (de) Mehrschichtige gedruckte schaltungsplatte
DE3535923C2 (enrdf_load_stackoverflow)
DE19605630C2 (de) Keilsonde zum Verbinden einer Testausrüstung mit Anschlüssen einer integrierten Schaltung
DE3812021A1 (de) Flexible schaltung mit anschlussorganen und verfahren zu ihrer herstellung
DE3447556A1 (de) Multilayer-leiterverbindung
DE2843710B2 (de) Mehrlagige flexible gedruckte Schaltung und Verfahren zu ihrer Herstellung
DE69831390T2 (de) Vorrichtung und Verfahren zur Verbindung zwischen zwei elektronischen Anordnungen
DE2453843A1 (de) Steckverbinder-anordnung
AT398676B (de) Leiterplattenanordnung
EP0410427B1 (de) Steckverbinder für Leiterplatten
DE68915259T2 (de) System zur Erhöhung des Übertragungsvermögens von gedruckten Leiterplatten.
DE3031103C2 (de) Verfahren zur Prüfung des Lageversatzes bei Mehrlagenleiterplatten
DE2644296A1 (de) Dreireihiger leitungsstecker mit sogenannten kontaktgabeln zum anschliessen von flachbandkabeln
DE2303537B2 (de) Elektrisch leitende Anschlußschiene und Verfahren zu ihrer Herstellung
DE1930642A1 (de) Leiterplatte zum Aufnehmen und Verbinden elektrischer Bauelemente
DE2627297C2 (de) Mehrschichtige, gedruckte Schaltungsplatte
DE3045236C2 (enrdf_load_stackoverflow)
DE9203996U1 (de) Elektronisches Modul
DE3209699C2 (de) Universal-Leiterplatte
DE3435773A1 (de) Rueckwandverdrahtung fuer einschiebbare elektrische baugruppen
DE8905434U1 (de) Leiterplattensteckverbinder zur Oberflächenmontage
DE1035713B (de) Elektrische Steckanordnung
EP0418508A1 (de) Elektrischer Steckverbinder
DE3234801C2 (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19901128

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH DE FR GB IT LI NL

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: SIEMENS NIXDORF INFORMATIONSSYSTEME AG

17Q First examination report despatched

Effective date: 19921117

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH DE FR GB IT LI NL

REF Corresponds to:

Ref document number: 95642

Country of ref document: AT

Date of ref document: 19931015

Kind code of ref document: T

REF Corresponds to:

Ref document number: 59002990

Country of ref document: DE

Date of ref document: 19931111

RAP4 Party data changed (patent owner data changed or rights of a patent transferred)

Owner name: SIEMENS NIXDORF INFORMATIONSSYSTEME AG

ITF It: translation for a ep patent filed
GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 19931215

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 19950915

Year of fee payment: 6

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 19951017

Year of fee payment: 6

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19960621

Year of fee payment: 7

Ref country code: AT

Payment date: 19960621

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 19960716

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: BE

Payment date: 19960717

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 19960719

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Effective date: 19960731

Ref country code: CH

Effective date: 19960731

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Effective date: 19970402

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19970725

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19970725

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19970731

BERE Be: lapsed

Owner name: SIEMENS NIXDORF INFORMATIONSSYSTEME A.G.

Effective date: 19970731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19980201

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19970725

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19980331

NLV4 Nl: lapsed or anulled due to non-payment of the annual fee

Effective date: 19980201

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.

Effective date: 20050725