EP0386034A1 - Systeme de fabrication de substrats semi-conducteurs - Google Patents

Systeme de fabrication de substrats semi-conducteurs

Info

Publication number
EP0386034A1
EP0386034A1 EP88908954A EP88908954A EP0386034A1 EP 0386034 A1 EP0386034 A1 EP 0386034A1 EP 88908954 A EP88908954 A EP 88908954A EP 88908954 A EP88908954 A EP 88908954A EP 0386034 A1 EP0386034 A1 EP 0386034A1
Authority
EP
European Patent Office
Prior art keywords
coupling
manufacturing system
couplings
negative feedback
media
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP88908954A
Other languages
German (de)
English (en)
Inventor
Horst Kunz-Concewitz
Wolfgang Schmutz
Roland Mann
Herbert Olbrich
Joseph Gentischer
Wolfgang FRÜHAUF
Johann Dorner
Günther BREITSCHWERDT
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Convac GmbH
Original Assignee
Convac GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Convac GmbH filed Critical Convac GmbH
Publication of EP0386034A1 publication Critical patent/EP0386034A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/25—Pc structure of the system
    • G05B2219/25005—Fluid bus for communication in process system with several fluidic control modules
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work

Definitions

  • the invention relates to a production system for substrates, in particular wafers, glass masks, ceramic carriers, with individual process stations for the treatment and / or processing of the individual substrates under clean environment and
  • Trans ⁇ ortvoriquesen for transporting the substrates between the individual process stations are supplied and disposed of with the necessary chemicals, gases, liquids, data, energy via supply and disposal lines.
  • a production system is known from EP 35 844 A2, in which several process stations in a larger process space are accommodated. These individual process stations are each connected to the necessary supply and disposal lines. Another arrangement of the process stations in the event of a change in the process sequence is practically impossible and requires a complex conversion, as a result of which the production process has to be stopped for a long time.
  • the present invention has for its object to improve a manufacturing system of the type mentioned so that changes in the process, in particular the exchange of individual process stations can be done easily, time-saving, without significant interruption of the manufacturing process
  • the invention provides that all supply and disposal lines in a media bus are routed in parallel to process modules arranged in interchangeable process stations, that coupling boxes are arranged in the grid spacing of the process modules on the media bus, and that each of the easily exchangeable process modules corresponds to the coupling boxes a negative feedback is provided and that the connections of the supply and disposal lines are made by merging the coupling box and negative feedback and these connections are interrupted by separating the coupling box and negative feedback.
  • the individual process modules can be connected practically in any order to the media bus, so that process systems can be put together or changed according to the respective requirements or individual process modules can be easily replaced for maintenance or repair. This enables a significant increase in productivity to be achieved while at the same time reducing the proportion of rejects.
  • Couplings and / or plugs and in each case associated in the negative feedback plugs and / or couplings can be provided in the coupling box in a particularly simple design, each of which is connected to the corresponding assigned supply or disposal lines of the media bus or the process module.
  • the coupling boxes and the negative couplings can have mutual guides, by means of which a simultaneous alignment of the individual plugs and couplings is ensured, all plugs and couplings being able to be joined or separated in parallel to the mutual guides are.
  • a quick and easy exchange of the process stations is made possible by the fact that the plugs and / or couplings for liquid or gaseous media have self-closing valves, so that at least the pressure-carrying supply and disposal lines are closed when the coupling box and negative coupling are separated, and that when the coupling box and Negative feedback, the supply and disposal lines of the media bus are continuously connected to the assigned supply and disposal lines of the process module. This saves special solenoid valve controls.
  • both the coupling box and the negative feedback can each have a coupling plate, the connectors and couplings then being provided on or in these coupling plates.
  • the individual coupling boxes can also be equipped differently for the media bus, although the special arrangement of the process modules is then also limited in accordance with the available connections.
  • the mutual guidance of the coupling box and counter coupling or the coupling plates can be carried out particularly easily by means of associated guide bolts and guide bushes, of which at least two, preferably three, can be spaced apart.
  • a simplification of the exchange of process stations with a safe coupling of the supply and disposal lines can be achieved in that the coupling box and the associated negative feedback can be brought together by at least one coupling device, so that the required expenditure of force for connection and disconnection does not have to be applied by hand .
  • the coupling box and / or the negative feedback or components thereof can be provided on the media bus and / or on the process module so as to be displaceable in the coupling direction.
  • the coupling box and negative coupling can advantageously be triggered automatically, preferably via a contact control (switch, sensors).
  • the process module can be displaceably guided in a vertical direction against the media bus, wherein the contact control can be triggered when the end position is reached or shortly before the end position is reached.
  • a secure coupling of the supply and disposal lines can be achieved in that the connection and disconnection of the coupling box and negative coupling or their structural units without mutual movement of Process module and media bus only by mutual, preferably automatic, sensor-controlled displacement of coupling box and / or negative feedback or of units thereof.
  • the coupling device can have a power cylinder, by means of the piston rod of which the coupling box and the negative coupling or the structural units, such as their coupling plates, can be contracted and, if necessary, separated in a controlled manner.
  • the coupling device can have at least one motor-driven threaded rod, by means of which and at least one threaded bore the coupling box and the negative coupling or structural units thereof can be contractible and separable.
  • the coupling device can be arranged in the center of gravity of the forces occurring during the coupling process in the coupling box and the negative feedback.
  • the current-carrying couplings and plugs can be designed to be explosion-proof, and for this purpose the current-carrying parts can be enclosed by a shielding jacket, the shielding being retained when the current-carrying lines are axially connected and disconnected.
  • a shielding jacket an outer jacket on the plug and an inner jacket on the coupling or vice versa can be used for shielding be provided, which form a closed space during the coupling process and in operation, the length of coverage of the outer jacket and inner jacket being greater than the contact length of the plug and coupling.
  • the interior of the outer jacket of the inner jacket can be flooded with a protective gas, for example nitrogen.
  • these can be arranged resiliently in the coupling box or negative feedback.
  • the individual plugs and couplings are expediently used in the coupling box or negative feedback so that they can be exchanged easily in order to obtain a very variable media routing. Subsequent replacement of individual couplings and plugs requires only a slight modification of the holding bushes, so that the standardized arrangement and division is retained.
  • the couplings and the connectors are made of low-contamination material. Any material abrasion during coupling and uncoupling should be avoided completely if possible. At least the surfaces must therefore be designed accordingly.
  • the couplings and plugs for the purest media can be provided in the top of the coupling boxes and counter-couplings and the couplings and plugs for the media, which pose a greater risk of contamination, in the lower region of the coupling boxes and counter-couplings.
  • the electrical leads which are so sensitive to impurities, and in which there is no risk of entry of contaminants into the process modules, "to be disposed in the lower region of the coupling boxes and counter couplings.
  • Figure 1 shows a manufacturing system with process modules and a media module, coupled to a media bus in an oblique view, partially cut;
  • Figure 2 is an oblique view of a media bus with in
  • FIG. 3 bus-side and module-side coupling plates equipped with plugs and couplings;
  • Figure 4 is a media coupling consisting of plug and coupling
  • Figure 5 is a plan view of an explosion-proof version of a clutch.
  • the production system shown schematically in FIG. 1 consists of process modules 1, a media module 2 and a media bus 3 arranged in parallel next to each other.
  • Each module 1, 2 is connected to the media bus 2 via a coupling box 4 and a negative coupling 4 '.
  • the coupling boxes 4 are arranged on the media bus 3 according to the grid width of the process modules 1 and media modules 2.
  • all the necessary supply and disposal lines 5 are arranged, which are connected to couplings 6 or plugs 7 of the coupling boxes 4. Via these supply and disposal lines 5, all the necessary chemicals, gases, liquids, but also energy and data, can be supplied, discharged or exchanged between the individual process modules 1, the media bus 3 and the media module (s) 2.
  • the supply and disposal lines 5 of the media bus 3 itself can a central supply or other interchangeable media modules 2 to ensure a supply and disposal with all required media.
  • control and measuring lines for the control and monitoring of the production processes are also included.
  • the structure of the media bus 3 with its coupling boxes 4 arranged at a grid spacing is shown in more detail in FIG.
  • the supply and disposal lines 5 of the media bus 3 are shielded in an ' elongated channel 8, possibly also in specially divided channels 9 and connected in a manner not shown to the individual couplings 6 of the coupling boxes 4.
  • the couplings 6 themselves, as shown in more detail in FIG. 3, are arranged on or in a coupling plate 10.
  • the coupling plates 10 of the individual coupling boxes 4 are slidably guided on guide rods 11 on the coupling box frame 12, namely perpendicular to the media bus 3, corresponding to the arrow 13 in FIG. 3.
  • the displacement path is limited.
  • the displacement ' is so large, however, that the individual mutually assigned couplings 6 and connectors 7 of the coupling plate 10 and a corresponding coupling plate 10', the associated process module 1 or media module 2 can be brought together and separated.
  • the corresponding plugs 7 are on the coupling plate 10 ' and / or couplings 6 of the supply and disposal lines 5 of the assigned process module 1 or media module 2, so that by connecting the coupling plates 10, 10 ', a connection of these supply lines 5 of the media bus 3 and process module 1 or media module 2 can take place.
  • the process module 1 or media module 2 is pushed up to the desired location of the media bus 3 up to a stop, the coupling plate 10 being moved back on the guide rods 11.
  • a coupling device 14 in the exemplary embodiment 1 a pneumatic cylinder, is arranged, the piston rod of which has a movable hook 14 'which interacts with a hook counterpart 14 "of the other coupling plate 10'.
  • the movable hook becomes a switching contact 14 'coupled with the hook counterpart 14 "and by pulling in the piston rod in the coupling device 14, the two coupling plates 10, 10' are pulled together and thus the couplings 6 and plug 7 are connected to one another, without external forces being exerted on the process module 1 to be connected to produce the connection or media module 2 must be used.
  • guide bolts 15 are provided on the coupling plate 10, which cooperate with guide bushings 15 'of the coupling plate 10'.
  • the coupling process can be controlled and monitored by a contact switch 16.
  • the coupling plate 10 ' is arranged to be somewhat movable on the frame 18 of the process module 1 or media module 2 concerned, via rubber bearings 17.
  • blind openings 19 can be provided in the coupling plates 10, 10 'for further couplings 6 and / or plugs 7.
  • Plugs 7 and couplings 6 can also be interchanged on the coupling plates 10, 10 ', depending on their expediency.
  • FIG 4 the attachment of a plug 6 and a coupling 7 on the coupling plates 10, 10 'is shown on a larger scale in partial section.
  • the coupling 6 is floatingly supported by retaining bushes 20, 21 between round cord sealing rings in the form of O-rings 22, 23 and has a collar 24 for this purpose.
  • the plug 7 is fastened to the bottom 25 of a holding bush 26, which can be easily replaced by a nut 27.
  • the connection of a supply or disposal line 5 is indicated at the connector 7.
  • the coupling and uncoupling of electrical voltages of the supply or disposal lines 5 should take place in a de-energized state. If this is not possible, the coupling 6 shown there can be used for electrical and data lines, as shown in FIG. 5 can be used in which, for example, a data coupling 6 'and an electrical coupling 6 "or corresponding plugs can be arranged.
  • the coupling area of the data coupling 6' and the electrical coupling 6" is hermetically sealed off by an outer jacket 28 and, in the case of the counterpart, by a correspondingly arranged inner jacket .
  • the interior space formed in this way can be flooded with nitrogen, for example, through the bores 29, so as to render any dangerous spark formation harmless.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Quick-Acting Or Multi-Walled Pipe Joints (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

Un système de fabrication de substrats, notamment plaquettes gauffrées, masques en verre, supports céramiques, comprend des stations individuelles de traitement et/ou de façonnage des substrats individuels dans un environnement stérile et des convoyeurs des substrats entre les différentes stations de traitement. Les stations individuelles de traitement sont pourvues de conduits d'alimentation et d'évacuation (5) qui les alimentent en substances chimiques, gaz, liquides, données et énergie nécessaire et évacuent celles qui ne sont pas nécessaires. Afin de permettre de modifier aisément la suite des opérations de traitement avec une interruption minimale de la production, tous les conduits d'alimentation et d'évacuation (5) sont guidés dans un bus de milieux (3) parallèlement à des modules de traitement (1) agencés dans des stations de traitement échangeables. Des boîtes de couplage (4) sont agencées sur le bus de milieux (3), à des écarts réguliers correspondants aux modules de traitement (1). Un contre-couplage (4') correspondant à chaque boîte de couplage est agencé sur chaque module detraitement (1) aisément échangeable, evéntuellement sur chaque module de milieux (2). La connexion avec les conduits d'alimentation et d'évaluation (5) se fait par assemblage de la boîte de couplage (4) et du contre-couplage (4'), ces connexions étant coupées lorsque l'on sépare les boîtes de couplage (4) des contre-couplages (4').
EP88908954A 1987-10-20 1988-10-19 Systeme de fabrication de substrats semi-conducteurs Withdrawn EP0386034A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19873735449 DE3735449A1 (de) 1987-10-20 1987-10-20 Fertigungssystem fuer halbleitersubstrate
DE3735449 1987-10-20

Publications (1)

Publication Number Publication Date
EP0386034A1 true EP0386034A1 (fr) 1990-09-12

Family

ID=6338692

Family Applications (2)

Application Number Title Priority Date Filing Date
EP88908954A Withdrawn EP0386034A1 (fr) 1987-10-20 1988-10-19 Systeme de fabrication de substrats semi-conducteurs
EP19880908948 Withdrawn EP0383792A1 (fr) 1987-10-20 1988-10-19 Systeme de fabrication de substrats semi-conducteurs

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP19880908948 Withdrawn EP0383792A1 (fr) 1987-10-20 1988-10-19 Systeme de fabrication de substrats semi-conducteurs

Country Status (5)

Country Link
US (1) US5083364A (fr)
EP (2) EP0386034A1 (fr)
JP (2) JPH03500711A (fr)
DE (1) DE3735449A1 (fr)
WO (2) WO1989004054A1 (fr)

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DE3735449A1 (de) 1989-05-03
US5083364A (en) 1992-01-28
WO1989004054A1 (fr) 1989-05-05
WO1989004053A1 (fr) 1989-05-05
JPH03500833A (ja) 1991-02-21
EP0383792A1 (fr) 1990-08-29
JPH03500711A (ja) 1991-02-14

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