US20070082588A1

US20070082588A1 - Methods and apparatus for coupling semiconductor device manufacturing equipment to the facilities of a manufacturing location

Info

Publication number: US20070082588A1
Application number: US11/527,771
Authority: US
Inventors: Nicholas de Vries; Aaron Webb
Original assignee: Individual
Current assignee: Applied Materials Inc
Priority date: 2005-09-27
Filing date: 2006-09-26
Publication date: 2007-04-12
Also published as: WO2007038647A3; CN101273175A; JP2009510786A; KR20080045248A; WO2007038647A2; TW200733178A

Abstract

In a first aspect, an apparatus is provided for coupling a semiconductor device manufacturing tool to facilities. The apparatus includes (1) a docking station adapted to mount to a raised floor and having a thickness approximately equal to the raised floor; (2) a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station, each tool POC location being adapted to be connected to a POC of a semiconductor device manufacturing tool; and (3) a plurality of facilities POC locations disposed on a bottom surface of the docking station. Each facilities POC location is adapted to be connected to a POC of a facility. Numerous other aspects are provided.

Description

The present application claims priority from U.S. Provisional Patent Application Ser. No. 60/720,958, filed Sep. 27, 2005, which is hereby incorporated by reference herein in its entirety.

FIELD OF THE INVENTION

The present invention relates generally to semiconductor device manufacturing, and more particularly to methods and apparatus for coupling semiconductor device manufacturing equipment to the facilities of a manufacturing location.

BACKGROUND OF THE INVENTION

The installation of equipment into a semiconductor device manufacturing location (e.g., building, structure, manufacturing plant and the like) may be time and labor intensive. The time and labor required to install the equipment may be significantly impacted by the time and labor required to attach or couple the equipment to the manufacturing location's facilities. The facilities may include services such as air, water, process gas, vacuum, electricity and the like. The equipment may be connected to the services by coupling the equipment's point(s) of connections (POCs) with the facilities' POCs. Because semiconductor device manufacturing locations may have space constraints, access to the facilities' POCs may be constricted. Thus, there is a need for methods and apparatus for efficiently coupling semiconductor device manufacturing equipment to the facilities of a manufacturing location.

SUMMARY OF THE INVENTION

In a first aspect of the invention, an apparatus is provided for coupling a semiconductor device manufacturing tool to facilities. The apparatus includes (1) a docking station adapted to mount to a raised floor and having a thickness approximately equal to the raised floor; (2) a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station, each tool POC location being adapted to be connected to a POC of a semiconductor device manufacturing tool; and (3) a plurality of facilities POC locations disposed on a bottom surface of the docking station. Each facilities POC location is adapted to be connected to a POC of a facility.
In a second aspect of the invention, a method is provided for pre-facilitating a semiconductor device manufacturing tool. The method includes the step of providing a docking station having (1) a thickness approximately equal to a raised floor; (2) a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station, each tool POC location being adapted to be connected to a POC of a semiconductor device manufacturing tool; and (3) a plurality of facilities POC locations disposed on a bottom surface of the docking station. Each facilities POC location is adapted to be connected to a POC of a facility. The method further includes the steps of (1) mounting the docking station to the raised floor; and (2) connecting the facilities POC locations to POCs of a facility.
In a third aspect of the invention, a method is provided for manufacturing a docking station. The method includes the steps of (1) constructing a frame having a thickness approximately equal to a raised floor; (2) installing a plurality of tool point of connection (POC) locations on a top surface of the frame, each tool POC location being adapted to be connected to a POC of a semiconductor device manufacturing tool; and (3) installing a plurality of facilities POC locations on a bottom surface of the frame. Each facilities POC location is adapted to be connected to a POC of a facility.
In a fourth aspect of the invention, a raised floor system is provided. The raised floor system includes a docking station having (1) a thickness approximately equal to a raised floor, (2) a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station, each tool POC location being adapted to be connected to a POC of a semiconductor device manufacturing tool; and (3) a plurality of facilities POC locations disposed on a bottom surface of the docking station. Each facilities POC location is adapted to be connected to a POC of a facility. The raised floor system also includes a raised floor adapted to support the docking station.
In a fifth aspect of the invention, a semiconductor device manufacturing system is provided. The semiconductor device manufacturing system includes a docking station having (1) a thickness approximately equal to a raised floor; (2) a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station, each tool POC location being adapted to be connected to a POC of a semiconductor device manufacturing tool, and (3) a plurality of facilities POC locations disposed on a bottom surface of the docking station. Each facilities POC location is adapted to be connected to a POC of a facility. The semiconductor device manufacturing system also includes a semiconductor device manufacturing tool including a plurality of tool POCs adapted to be coupled to the plurality of tool point of connection (POC) locations. Numerous other aspects are provided.
Other features and aspects of the present invention will become more fully apparent from the following detailed description, the appended claims and the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric view of a semiconductor device manufacturing system provided in accordance with the present invention.
FIG. 2 is an isometric view of a docking station in accordance with an embodiment of the present invention.
FIG. 3A is a schematic side view of the docking station of FIG. 2 illustrating that the docking station may be coupled to a raised floor in accordance with the present invention.
FIG. 3B is a schematic side view of the docking station of FIG. 2 illustrating that the docking station may have an overall thickness that is approximately the same as a thickness of a raised floor in accordance with the present invention.
FIG. 3C is a schematic side view of the docking station of FIG. 2 illustrating that the docking station may provide multiple AC or other conduit and/or line approaches in accordance with the present invention.
FIG. 4 is a schematic side view of an exemplary system that includes the docking station of FIG. 2 positioned within a raised floor and below a semiconductor device manufacturing tool in accordance with the present invention.
FIG. 5 is a schematic top view of an exemplary embodiment of the docking station of FIG. 2 coupled to a raised floor in accordance with the present invention.

DETAILED DESCRIPTION

The present invention provides a docking station adapted to couple equipment (e.g., semiconductor device processing equipment and the like) to facilities of a manufacturing location (e.g., at point(s) of connections (POCs) for the facilities). The docking station may be employed to pre-facilitize (or “facilitize”) a location at which semiconductor device processing equipment is to be installed (e.g., by pre-plumbing, pre-wiring, etc., any required facilities lines and/or other services at and/or to the docking station before arrival of the semiconductor device processing equipment so that connection of facilities to the semiconductor device processing equipment need only be made at the docking station location when the semiconductor device processing equipment is installed). Time required to install the semiconductor device processing equipment thereby may be greatly reduced.
In an embodiment of the present invention, the docking station may be a sheet of material (e.g., steel, aluminum, plastic and the like) with features that may couple to the facilities' POCs and/or a floor of the manufacturing location. For example, the floor may be a raised metal floor (RMF) or similar floor with space between the floor and an underlying supporting structure (e.g., ground, structural I-beams, etc.). The docking station may be disposed so as to not interfere with the floor's support structure, or the facility lines, etc., that may be disposed between the floor and the underlying supporting structure. In addition, the docking station may be disposed underneath the equipment such that the area utilized (e.g., footprint and the like) by the equipment is not increased due to the employment of the docking station.
The docking station may be integral with or separate from the equipment. A separate docking station may allow the docking station to be coupled to the facilities' POCs prior to delivery and/or installation of the equipment. Thereafter, when the equipment is installed in the semiconductor device manufacturing location, the equipment may be coupled to the facilities' POCs and/or docking station. This may allow the installation and/or startup time of the equipment to be significantly reduced. These and other aspects of the invention are discussed below.
FIG. 1 is an isometric view of a semiconductor device manufacturing system 100 provided in accordance with the present invention. The semiconductor device manufacturing system 100 includes a docking station 102 disposed in a floor 104. Semiconductor device manufacturing equipment 106 may be coupled to facilities via gas lines 108 (e.g., stainless steel tube or the like), vacuum lines 110 (e.g., stainless steel bellows, one inch thick stainless steel tubing, etc.), water lines 112 (e.g., rubber hose, stainless tubing, plastic hose, etc.) and/or other connections such as power lines, signal lines, or the like. The floor 104 may be supported by columns 114 which may rest on the ground and/or some other underlying support structure of a semiconductor device manufacturing location.
With reference to FIG. 1, the gas lines 108, the vacuum lines 110 and the water lines 112 may pass through and/or couple to the docking station 102. Furthermore, other lines may pass through and/or couple to the docking station 102 such as signal lines, power lines, air lines, etc. In the same and/or alternative embodiments, one or more of the gas lines 108, the vacuum lines 110 and/or the water lines 112 may be coupled to the semiconductor device processing equipment 106 via fittings on the docking station 102. Alternatively, one or more of the gas lines 108, the vacuum lines 110 and/or the water lines 112 may pass through the docking station 102 without being coupled to the docking station 102.
In the embodiment of FIG. 1, the docking station 102 may be flush and/or planar with the top surface of the floor 104. For example, the docking station 102 may have a thickness (height) that is about the same or less than a thickness of the floor 104 and/or a floor tile/panel (not separately shown) of the floor 104. Alternatively, the docking station 102 may be angled and/or recessed into the floor 104. In an alternative and/or same embodiment, the docking station 102 may be disposed above the plane encompassing the top surface of the floor 104.
The docking station 102 may include holes and/or cutouts of different sizes and/or shapes. For example, the gas lines 108, the vacuum lines 110 and/or the water lines 112 may pass through holes and/or adapters of various sizes/and or shapes. In a further example, the gas lines 108, the vacuum lines 110, and/or the water lines 112 may be coupled to adapters that couple to the semiconductor processing equipment 106.
FIG. 2 is an isometric view of a docking station in accordance with a second embodiment of the present invention which is designated generally by reference numeral 200. The docking station 200 may include a floor interface 202 (e.g., folded sheet metal, molded thermo-set polymers, etc.) coupled to an electrical conduit pass through 204, a gas panel exhaust port 206, a signal line connector 208 (e.g., RS-232 or the like), clean dry air (CDA) adapters 210 (e.g., compression seal connectors, or the like), vacuum ports 212 (e.g., 304 stainless steel KF flange fittings or the like), process gas line adapters 214 (e.g., compression seal connectors or the like) and/or water line adapters 216 (e.g., quarter inch threaded male to male connectors or the like). Other numbers, types and/or arrangements of pass throughs, connectors, ports and/or adapters may be used.
With reference to FIG. 2, the floor interface 202 may be adapted to orient in various planes. For example, the floor interface 202 may be oriented such that, when coupled to the floor 104, a substantial portion of the docking station 200 may be parallel to the plane formed by the top surface of the floor 104. In the same or alternative embodiments, the orientation and placement of the electrical conduit pass through 204, the gas panel exhaust port 206, the signal line connector 208, the clean dry air (CDA) adapters 210, the vacuum ports 212, the process gas line adapters 214 and/or the water line adapters 216 may vary. For example, the vacuum ports 212 and/or any other connectors/adapters may be oriented at an angle not perpendicular to the plane formed by the floor interface 202.
The docking station 200 of FIG. 2 provides numerous advantages. For example, because the docking station 200 has a reduced profile, the docking station 200 provides a reduced potential for interference between connection locations of the docking station 200 and supporting structure of a raised floor, such as structural beams or other supporting devices located below the raised floor. For example, FIG. 3A is a schematic side view of the docking station 200 illustrating that the docking station 200 may be coupled to a raised floor 302 and allow easy connection of external lines (e.g., gas lines, vacuum lines, water lines, power lines, signal lines, etc.) to the docking station 200 without interfering with support structure of the raised floor 302, such as I-beams 304. The exemplary external line connections shown in FIG. 3A include water lines 306 and gas panel exhaust line 308, although fewer, more and/or other external lines may be connected to the docking station 200. As shown in FIG. 3A, the reduced profile (thickness) of the docking station 200 provides more room for external connections than a conventional connection box which extends significantly below the raised floor 302 and/or provides connections on the sidewalls of the connection box. Further, because the connection locations of the docking station 200 are near the top of the raised floor 302, connections are more conveniently made to the docking station 200 without the need for special wrenches or other special-purpose tightening tools (used when making connections deep within a conventional connection box which extend significantly below a raised floor).
FIG. 3B is a schematic side view of the docking station 200 illustrating that the docking station 200 may have a thickness that is approximately the same as the thickness of the raised floor 302 (and/or a tile/panel of the raised floor 302). Further, an exemplary adapter/connection location 310 is shown within the docking station 200 to illustrate that connections to the docking station 200 may occur at or near the level of the raised floor 302 (e.g., reducing the need for special tightening tools and providing a more convenient connection location).
FIG. 3C is a schematic side view of the docking station 200 illustrating that the docking station 200 may provide multiple AC or other conduit and/or line approaches (e.g., from multiple directions as indicated by arrows 312, 314). Many conventional connection boxes may provide only a single conduit approach. Further, because of the docking station 200's compact profile, the docking station 200 provides convenient connection locations when employed with standard raised floors (e.g., that employ support legs between the raised floor and ground, a cement floor, a waffle table, etc.) or I-beam or otherwise supported raised floors as the reduced profile docking station 200 has a frame that is approximately the same overall thickness/height as a floor tile and/or sits above the I-beams or other supporting structure of the raised floor (FIG. 3A-3C).
FIG. 4 is a schematic side view of an exemplary system 400 that includes the docking station 200 positioned within a raised floor 402 and below a semiconductor device manufacturing tool 404. The raised floor 402 includes tiles or panels 406 which are supported by support members 408 (e.g., pedestals, I-beams, etc.) above a cement floor or other underlying support structure 410. As shown in FIG. 4, the docking station 200 is approximately the same thickness T1 as tiles or panels 406 of the raised floor 402 and provides a plurality of connection locations for the various facilities required by the tool 404. As stated, the docking station 200 may be installed within the floor 402 and connected to any facility services required by the tool 404 before arrival of the tool 404. For example, any gas lines, water lines, power lines, vacuum lines, exhaust lines, etc., required for operation of the tool 404 may be coupled to (or pass through) the docking station 200 before arrival of the tool 404 (as indicated by reference numerals 412 a-g in FIG. 4). Such pre-facilitation of the tool 404 may significantly reduce the start up time of the tool 404. After the docking station 200 is installed in the raised floor 402 and the facilities connections are made to the docking station 200, the tool 404 may be placed (e.g., rolled) over the docking station 200 and mated therewith (such as via one or more lines, conduits, bellows, etc., generally represented by reference numeral 414). The docking station 200 does not interfere with the support members 408, and provides significant space under the floor 402 (as shown).
In some embodiments, the height T2 of the space below the docking station 200 may be approximately equal to the height of the space below the raised floor 402 as depicted in FIG. 4. In other embodiments, the height T2 of the space below the docking station 200 may differ from the height of the space below the raised floor 402 by up to +/−5% in some embodiments, +/−10% in some embodiments or +/−20% in some embodiments. Similarly, in some embodiments, the thickness T1 of the docking station 200 may be approximately equal to the thickness of the raised floor 402 as depicted in FIG. 4. In other embodiments, the thickness T1 of the docking station 200 may differ from the thickness of the raised floor 402 by up to +/−5% in some embodiments, +/−10% in some embodiments or +/−20% in some embodiments.
In at least one embodiment of the invention, the connection and/or pass-through locations of the docking station 200 may be divided and/or logically grouped or arranged. For example, FIG. 5 is a top schematic view of an exemplary embodiment of the docking station 200 coupled to a raised floor 502. As shown in FIG. 5, the connection locations and/or pass-through locations of the docking station 200 are arranged into five groupings 504 a-e. Other numbers of groupings and/or arrangements may be used.
With reference to FIG. 5, for a tool (not shown) which channel A and B requirements, a first grouping 504 a is provided for channel A foreline and communication connections. A second grouping 504 b is provided for channel A power conduits (e.g., a power-conduit pass through). A third grouping 504 c is provided for toxic gas cabinet exhaust 506 and gas line connections 508. A fourth grouping 504 d is provided for channel B forelines, cooling water, clean dry air and vacuum. A fifth grouping 504 e is provided for channel B power conduits. As stated other groupings and/or numbers or types of connections may be used.
Embodiments of the inventive docking station described herein provide for fewer possible connection interferences below a raised floor, provide more room for connections and/or easier access to connections (e.g., such as water or other connections), allow for multiple AC conduit approaches and/or provide about the same or less bends to facility lines (when compared to a conventional connection box).
The foregoing description discloses only exemplary embodiments of the invention. Modifications of the above disclosed apparatus and methods which fall within the scope of the invention will be readily apparent to those of ordinary skill in the art. For instance, the docking station may be made of PVC material and/or oriented at an angle towards the tool. In general, the docking station may be made of any of a variety of structural materials, including, for example, cold-rolled steel, stainless steel, aluminum sheet metal, etc. Overall dimensions of the docking station may vary depending on the type of tool to be facilitized, but a compact structure is preferable in some embodiments. For a full complement of facilities, including gas, water, electrical, vacuum, CDA, and ventilation connections, a docking station may be approximately 6 inches long by 2 inches wide by 3 inches deep, although other dimensions may be used.
In some embodiments, the docking station 200 may have a similar length and width to that of a conventional connection box, but a significantly reduced height/thickness (e.g., about the same thickness as a floor tile of a raised floor to which the docking station 200 is to couple). The docking station 200 may include connection fittings such as KF-50, ½″ VCR, DNet, etc., connections. Any suitable number, size and/or type of connection fittings may be used. Toxic boots or other secondary containment devices may be coupled to and/or used with the docking station 200 (e.g., for removing toxic exhaust and/or other waste from a tool and/or processing chamber).
In at least one embodiment of the invention, an apparatus is provided for coupling a semiconductor device manufacturing tool to facilities. The apparatus includes (1) a docking station adapted to mount to a raised floor and having a thickness approximately equal to the raised floor; (2) a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station, each tool POC location being adapted to be connected to a POC of a semiconductor device manufacturing tool; and (3) a plurality of facilities POC locations disposed on a bottom surface of the docking station. Each facilities POC location is adapted to be connected to a POC of a facility.
In one or more embodiments of the invention, a method is provided for pre-facilitating a semiconductor device manufacturing tool. The method includes the step of providing a docking station having (1) a thickness approximately equal to a raised floor; (2) a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station, each tool POC location being adapted to be connected to a POC of a semiconductor device manufacturing tool; and (3) a plurality of facilities POC locations disposed on a bottom surface of the docking station. Each facilities POC location is adapted to be connected to a POC of a facility. The method further includes the steps of (1) mounting the docking station to the raised floor; and (2) connecting the facilities POC locations to POCs of a facility.
In some embodiments of the invention, a method is provided for manufacturing a docking station. The method includes the steps of (1) constructing a frame having a thickness approximately equal to a raised floor; (2) installing a plurality of tool point of connection (POC) locations on a top surface of the frame, each tool POC location being adapted to be connected to a POC of a semiconductor device manufacturing tool; and (3) installing a plurality of facilities POC locations on a bottom surface of the frame. Each facilities POC location is adapted to be connected to a POC of a facility.
In certain embodiments of the invention, a raised floor system is provided. The raised floor system includes a docking station having (1) a thickness approximately equal to a raised floor, (2) a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station, each tool POC location being adapted to be connected to a POC of a semiconductor device manufacturing tool; and (3) a plurality of facilities POC locations disposed on a bottom surface of the docking station. Each facilities POC location is adapted to be connected to a POC of a facility. The raised floor system also includes a raised floor adapted to support the docking station.
In one or more embodiments of the invention, a semiconductor device manufacturing system is provided. The semiconductor device manufacturing system includes a docking station having (1) a thickness approximately equal to a raised floor; (2) a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station, each tool POC location being adapted to be connected to a POC of a semiconductor device manufacturing tool, and (3) a plurality of facilities POC locations disposed on a bottom surface of the docking station. Each facilities POC location is adapted to be connected to a POC of a facility. The semiconductor device manufacturing system also includes a semiconductor device manufacturing tool including a plurality of tool POCs adapted to be coupled to the plurality of tool point of connection (POC) locations.
Accordingly, while the present invention has been disclosed in connection with exemplary embodiments thereof, it should be understood that other embodiments may fall within the spirit and scope of the invention, as defined by the following claims.

Claims

1. An apparatus for coupling a semiconductor device manufacturing tool to facilities, the apparatus comprising:

a docking station adapted to mount to a raised floor and having a thickness approximately equal to the raised floor;

a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station, wherein each tool POC location is adapted to be connected to a POC of a semiconductor device manufacturing tool; and

a plurality of facilities POC locations disposed on a bottom surface of the docking station, wherein each facilities POC location is adapted to be connected to a POC of a facility.

2. The apparatus of claim 1, wherein the docking station is further adapted to mount to a raised floor in place of a standard raised floor tile.

3. The apparatus of claim 1, wherein the thickness of the docking station is approximately equal to a standard raised floor tile.

4. The apparatus of claim 1, wherein the bottom surface of the docking station is approximately co-planar with a bottom surface of the raised floor.

5. The apparatus of claim 1, wherein a height of a space below the raised floor is approximately the same as a height of a space below the docking station.

6. The apparatus of claim 1, wherein the facilities POC locations are disposed so that attaching the facility POCs does not interfere with support structures of the raised floor.

7. The apparatus of claim 1, wherein the thickness of the docking station is such that attaching the facility POCs does not interfere with support structures of the raised floor.

8. The apparatus of claim 1, wherein the top surface of the docking station is below a top surface of the raised floor.

9. A method of pre-facilitating a semiconductor device manufacturing tool comprising:

providing a docking station having:

a thickness approximately equal to a raised floor,

a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station wherein each tool POC location is adapted to be connected to a POC of a semiconductor device manufacturing tool, and

a plurality of facilities POC locations disposed on a bottom surface of the docking station, wherein each facilities POC location is adapted to be connected to a POC of a facility;

mounting the docking station to the raised floor; and

connecting the facilities POC locations to POCs of a facility.

10. The method of claim 9, wherein providing a docking station includes providing a docking station further adapted to mount to a raised floor in place of a standard raised floor tile.

11. The method of claim 9, wherein providing a docking station includes providing a docking station wherein the thickness of the docking station is approximately equal to a standard raised floor tile.

12. The method of claim 9, wherein providing a docking station includes providing a docking station wherein the bottom surface of the docking station is approximately co-planar with a bottom surface of the raised floor.

13. The method of claim 9, wherein providing a docking station includes providing a docking station wherein a height of a space below the raised floor is approximately the same as a height of a space below the docking station.

14. The method of claim 9, wherein providing a docking station includes providing a docking station wherein the facilities POC locations are disposed so that attaching the facility POCs does not interfere with support structures of the raised floor.

15. The method of claim 9, wherein providing a docking station includes providing a docking station wherein the thickness of the docking station is such that attaching the facility POCs does not interfere with support structures of the raised floor.

16. The method of claim 9, wherein providing a docking station includes providing a docking station wherein the top surface of the docking station is below a top surface of the raised floor.

17. A method of manufacturing a docking station comprising:

constructing a frame having a thickness approximately equal to a raised floor;

installing a plurality of tool point of connection (POC) locations on a top surface of the frame wherein each tool POC location is adapted to be connected to a POC of a semiconductor device manufacturing tool; and

installing a plurality of facilities POC locations on a bottom surface of the frame, wherein each facilities POC location is adapted to be connected to a POC of a facility.

18. The method of claim 17, wherein constructing a frame includes constructing a frame adapted to mount to a raised floor in place of a standard raised floor tile.

19. The method of claim 17, wherein constructing a frame includes constructing a frame wherein the thickness of the frame is approximately equal to a standard raised floor tile.

20. The method of claim 17, wherein constructing a frame includes constructing a frame wherein the bottom surface of the frame is approximately co-planar with a bottom surface of the raised floor.

21. The method of claim 17, wherein constructing a frame includes constructing a frame wherein a height of a space below the raised floor is approximately the same as a height of a space below the frame.

22. The method of claim 17, wherein constructing a frame includes constructing a frame wherein the facilities POC locations are disposed so that attaching the facility POCs does not interfere with support structures of the raised floor.

23. The method of claim 17, wherein constructing a frame includes constructing a frame wherein the thickness of the frame is such that attaching the facility POCs does not interfere with support structures of the raised floor.

24. The method of claim 17, wherein constructing a frame includes constructing a frame wherein the top surface of the frame is below a top surface of the raised floor.

25. A raised floor system comprising:

a docking station having:

a thickness approximately equal to a raised floor,

a plurality of facilities POC locations disposed on a bottom surface of the docking station, wherein each facilities POC location is adapted to be connected to a POC of a facility; and

a raised floor adapted to support the docking station.

26. The system of claim 25, wherein the docking station is further adapted to mount to the raised floor in place of a standard raised floor tile/panel.

27. The system of claim 25, wherein the thickness of the docking station is approximately equal to a standard raised floor tile/panel.

28. The system of claim 25, wherein the bottom surface of the docking station is approximately co-planar with a bottom surface of the raised floor.

29. The system of claim 25, wherein a height of a space below the raised floor is approximately the same as a height of a space below the docking station.

30. The system of claim 25, wherein the facilities POC locations are disposed so that attaching the facility POCs does not interfere with support structures of the raised floor.

31. The system of claim 25, wherein the thickness of the docking station is such that attaching the facility POCs does not interfere with support structures of the raised floor.

32. The system of claim 25, wherein the top surface of the docking station is below a top surface of the raised floor.

33. A semiconductor device manufacturing system comprising:

a docking station having:

a thickness approximately equal to a raised floor,

a semiconductor device manufacturing tool including a plurality of tool POCs adapted to be coupled to the plurality of tool point of connection (POC) locations.

34. The system of claim 33, wherein the docking station is further adapted to mount to the raised floor in place of a standard raised floor tile/panel.

35. The system of claim 33, wherein the thickness of the docking station is approximately equal to a standard raised floor tile/panel.

36. The system of claim 33, wherein the bottom surface of the docking station is approximately co-planar with a bottom surface of the raised floor.

37. The system of claim 33, wherein a height of a space below the raised floor is approximately the same as a height of a space below the docking station.

38. The system of claim 33, wherein the facilities POC locations are disposed so that attaching the facility POCs does not interfere with support structures of the raised floor.

39. The system of claim 33, wherein the thickness of the docking station is such that attaching the facility POCs does not interfere with support structures of the raised floor.

40. The system of claim 33, wherein the top surface of the docking station is below a top surface of the raised floor.