EP0340275B1 - Procede et appareil de traitement en phase vapeur - Google Patents
Procede et appareil de traitement en phase vapeur Download PDFInfo
- Publication number
- EP0340275B1 EP0340275B1 EP88909752A EP88909752A EP0340275B1 EP 0340275 B1 EP0340275 B1 EP 0340275B1 EP 88909752 A EP88909752 A EP 88909752A EP 88909752 A EP88909752 A EP 88909752A EP 0340275 B1 EP0340275 B1 EP 0340275B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- chamber
- treatment
- vapour
- treatment chamber
- atmosphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 claims abstract description 32
- 230000008018 melting Effects 0.000 claims abstract description 7
- 238000002844 melting Methods 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 98
- 238000009835 boiling Methods 0.000 claims description 30
- 238000010438 heat treatment Methods 0.000 claims description 22
- 239000011261 inert gas Substances 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 5
- 238000000354 decomposition reaction Methods 0.000 claims description 4
- 238000009834 vaporization Methods 0.000 claims description 3
- 238000004064 recycling Methods 0.000 claims description 2
- 230000003134 recirculating effect Effects 0.000 claims 2
- 230000000063 preceeding effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 20
- 239000012071 phase Substances 0.000 description 11
- 239000006071 cream Substances 0.000 description 9
- 229920006395 saturated elastomer Polymers 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000000443 aerosol Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000010702 perfluoropolyether Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- ALSTYHKOOCGGFT-KTKRTIGZSA-N (9Z)-octadecen-1-ol Chemical compound CCCCCCCC\C=C/CCCCCCCCO ALSTYHKOOCGGFT-KTKRTIGZSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241001225885 Prosopis caldenia Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000010000 carbonizing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- QKENRHXGDUPTEM-UHFFFAOYSA-N perfluorophenanthrene Chemical compound FC1(F)C(F)(F)C(F)(F)C(F)(F)C2(F)C3(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C3(F)C(F)(F)C(F)(F)C21F QKENRHXGDUPTEM-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/04—Apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Claims (24)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US119567 | 1987-11-12 | ||
US07/119,567 US4838476A (en) | 1987-11-12 | 1987-11-12 | Vapour phase treatment process and apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0340275A1 EP0340275A1 (fr) | 1989-11-08 |
EP0340275B1 true EP0340275B1 (fr) | 1992-07-29 |
Family
ID=22385103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP88909752A Expired - Lifetime EP0340275B1 (fr) | 1987-11-12 | 1988-11-11 | Procede et appareil de traitement en phase vapeur |
Country Status (8)
Country | Link |
---|---|
US (1) | US4838476A (fr) |
EP (1) | EP0340275B1 (fr) |
JP (1) | JPH02502200A (fr) |
KR (1) | KR890701272A (fr) |
AU (1) | AU2786289A (fr) |
DE (1) | DE3873321T2 (fr) |
RU (1) | RU2014975C1 (fr) |
WO (1) | WO1989004234A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202009014590U1 (de) | 2009-10-29 | 2010-02-04 | Asscon Systemtechnik-Elektronik Gmbh | Dampfphasen-Lötanlage |
Families Citing this family (96)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU625442B2 (en) * | 1988-11-28 | 1992-07-09 | Furukawa Aluminum Co., Ltd. | Gaseous phase brazing method of al or al alloy |
US5288333A (en) * | 1989-05-06 | 1994-02-22 | Dainippon Screen Mfg. Co., Ltd. | Wafer cleaning method and apparatus therefore |
US5158100A (en) * | 1989-05-06 | 1992-10-27 | Dainippon Screen Mfg. Co., Ltd. | Wafer cleaning method and apparatus therefor |
NL8901598A (nl) * | 1989-06-23 | 1991-01-16 | Soltec Bv | Met een beschermgas werkende soldeermachine, voorzien van automatisch werkende sluisdeuren. |
DE8913226U1 (fr) * | 1989-11-08 | 1989-12-21 | Leicht, Helmut Walter, 8900 Augsburg, De | |
US5054210A (en) * | 1990-02-23 | 1991-10-08 | S&K Products International, Inc. | Isopropyl alcohol vapor dryer system |
US5593507A (en) * | 1990-08-22 | 1997-01-14 | Kabushiki Kaisha Toshiba | Cleaning method and cleaning apparatus |
US5188282A (en) * | 1991-01-28 | 1993-02-23 | Hughes Aircraft Company | Vapor phase flash fusing of printed wiring boards |
US5118357A (en) * | 1991-03-20 | 1992-06-02 | Finishing Equipment, Inc. | Treatment fluid application and recovery apparatus and method |
GB9121003D0 (en) * | 1991-10-03 | 1991-11-13 | Boc Group Plc | Soldering |
JP2709365B2 (ja) * | 1992-03-16 | 1998-02-04 | 日立テクノエンジニアリング株式会社 | ベーパーリフローはんだ付け装置 |
US5313965A (en) * | 1992-06-01 | 1994-05-24 | Hughes Aircraft Company | Continuous operation supercritical fluid treatment process and system |
US5415193A (en) * | 1992-11-13 | 1995-05-16 | Taricco; Todd | Pressure controlled cleaning system |
JP3074366B2 (ja) * | 1993-02-22 | 2000-08-07 | 東京エレクトロン株式会社 | 処理装置 |
DE4329178B4 (de) * | 1993-08-30 | 2006-11-09 | EMO Oberflächentechnik GmbH | Dampfphasenreinigung |
US5539995A (en) * | 1994-03-16 | 1996-07-30 | Verteq, Inc. | Continuous flow vapor dryer system |
ATE172231T1 (de) * | 1994-03-18 | 1998-10-15 | Ald Vacuum Techn Gmbh | Verfahren und vorrichtung zum thermischen behandeln von materialien mit anteilen an verdampfbaren stoffen |
US5542596A (en) * | 1994-12-20 | 1996-08-06 | United Technologies Corp. | Vapor phase soldering machine having a tertiary cooling vapor |
US6051421A (en) * | 1996-09-09 | 2000-04-18 | Air Liquide America Corporation | Continuous processing apparatus and method for cleaning articles with liquified compressed gaseous solvents |
DE29704629U1 (de) * | 1997-03-14 | 1998-07-09 | Asscon Systech Elektronik Gmbh | Vorrichtung zur Wärmebehandlung von Werkstücken mit heißem Dampf |
TW539918B (en) | 1997-05-27 | 2003-07-01 | Tokyo Electron Ltd | Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process |
US6500605B1 (en) | 1997-05-27 | 2002-12-31 | Tokyo Electron Limited | Removal of photoresist and residue from substrate using supercritical carbon dioxide process |
US6306564B1 (en) | 1997-05-27 | 2001-10-23 | Tokyo Electron Limited | Removal of resist or residue from semiconductors using supercritical carbon dioxide |
JP3737604B2 (ja) * | 1997-06-03 | 2006-01-18 | 大日本スクリーン製造株式会社 | 基板処理装置 |
FR2774013B1 (fr) * | 1998-01-23 | 2000-04-07 | Jean Paul Garidel | Procede de traitement thermique d'une piece a l'aide d'au moins un liquide de transfert thermique et four a condensation pour sa mise en oeuvre |
US6277753B1 (en) | 1998-09-28 | 2001-08-21 | Supercritical Systems Inc. | Removal of CMP residue from semiconductors using supercritical carbon dioxide process |
US7064070B2 (en) * | 1998-09-28 | 2006-06-20 | Tokyo Electron Limited | Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process |
US6315189B1 (en) * | 1998-10-13 | 2001-11-13 | Texas Instruments Incorporated | Semiconductor package lead plating method and apparatus |
DE19911887C1 (de) * | 1999-03-17 | 2000-12-21 | Asscon Systech Elektronik Gmbh | Verfahren zum Reflow-Löten in einer Dampfphasenvakuumlötanlage |
US6193135B1 (en) * | 1999-09-13 | 2001-02-27 | Lucent Technologies Inc. | System for providing back-lighting of components during fluxless soldering |
CA2387373A1 (fr) | 1999-11-02 | 2001-06-28 | Tokyo Electron Limited | Procede et dispositif servant a effectuer le traitement supercritique d'une piece |
US6748960B1 (en) | 1999-11-02 | 2004-06-15 | Tokyo Electron Limited | Apparatus for supercritical processing of multiple workpieces |
EP1277233A2 (fr) * | 2000-04-25 | 2003-01-22 | Tokyo Electron Corporation | Procede de depot de film metallique et outil combine de depot metallique comprenant un module de sechage/nettoyage supercritique |
DE10025472C2 (de) * | 2000-05-23 | 2003-04-24 | Rehm Anlagenbau Gmbh | Dampfphasenlötanlage mit überhitztem Dampf |
US6921456B2 (en) * | 2000-07-26 | 2005-07-26 | Tokyo Electron Limited | High pressure processing chamber for semiconductor substrate |
KR100777892B1 (ko) * | 2001-04-10 | 2007-11-21 | 동경 엘렉트론 주식회사 | 반도체 기판 처리용 고압 챔버 |
US20040040660A1 (en) * | 2001-10-03 | 2004-03-04 | Biberger Maximilian Albert | High pressure processing chamber for multiple semiconductor substrates |
WO2003064065A1 (fr) * | 2002-01-25 | 2003-08-07 | Supercritical Systems Inc. | Methode pouvant reduire la formation de contaminants au cours de procedes supercritiques au gaz carbonique |
WO2003070846A2 (fr) * | 2002-02-15 | 2003-08-28 | Supercritical Systems Inc. | Sechage d'une photoresine au moyen d'un bain aux solvants et d'un co2 supercritique |
AU2003215238A1 (en) * | 2002-02-15 | 2003-09-09 | Supercritical Systems Inc. | Pressure enchanced diaphragm valve |
US7001468B1 (en) | 2002-02-15 | 2006-02-21 | Tokyo Electron Limited | Pressure energized pressure vessel opening and closing device and method of providing therefor |
US6924086B1 (en) * | 2002-02-15 | 2005-08-02 | Tokyo Electron Limited | Developing photoresist with supercritical fluid and developer |
US20050227187A1 (en) * | 2002-03-04 | 2005-10-13 | Supercritical Systems Inc. | Ionic fluid in supercritical fluid for semiconductor processing |
US7387868B2 (en) * | 2002-03-04 | 2008-06-17 | Tokyo Electron Limited | Treatment of a dielectric layer using supercritical CO2 |
US7270941B2 (en) * | 2002-03-04 | 2007-09-18 | Tokyo Electron Limited | Method of passivating of low dielectric materials in wafer processing |
CN1642665A (zh) * | 2002-03-22 | 2005-07-20 | 东京毅力科创株式会社 | 用超临界工艺清除杂质 |
US7169540B2 (en) * | 2002-04-12 | 2007-01-30 | Tokyo Electron Limited | Method of treatment of porous dielectric films to reduce damage during cleaning |
WO2003106093A2 (fr) * | 2002-06-14 | 2003-12-24 | Vapour Phase Technology Aps | Procede et dispositif de brasage en phase vapeur |
US20040177867A1 (en) * | 2002-12-16 | 2004-09-16 | Supercritical Systems, Inc. | Tetra-organic ammonium fluoride and HF in supercritical fluid for photoresist and residue removal |
US20040112409A1 (en) * | 2002-12-16 | 2004-06-17 | Supercritical Sysems, Inc. | Fluoride in supercritical fluid for photoresist and residue removal |
US7021635B2 (en) * | 2003-02-06 | 2006-04-04 | Tokyo Electron Limited | Vacuum chuck utilizing sintered material and method of providing thereof |
US20040154647A1 (en) * | 2003-02-07 | 2004-08-12 | Supercritical Systems, Inc. | Method and apparatus of utilizing a coating for enhanced holding of a semiconductor substrate during high pressure processing |
US7225820B2 (en) * | 2003-02-10 | 2007-06-05 | Tokyo Electron Limited | High-pressure processing chamber for a semiconductor wafer |
US7077917B2 (en) * | 2003-02-10 | 2006-07-18 | Tokyo Electric Limited | High-pressure processing chamber for a semiconductor wafer |
US7270137B2 (en) | 2003-04-28 | 2007-09-18 | Tokyo Electron Limited | Apparatus and method of securing a workpiece during high-pressure processing |
US20040231707A1 (en) * | 2003-05-20 | 2004-11-25 | Paul Schilling | Decontamination of supercritical wafer processing equipment |
US7163380B2 (en) * | 2003-07-29 | 2007-01-16 | Tokyo Electron Limited | Control of fluid flow in the processing of an object with a fluid |
US20050035514A1 (en) * | 2003-08-11 | 2005-02-17 | Supercritical Systems, Inc. | Vacuum chuck apparatus and method for holding a wafer during high pressure processing |
US20050034660A1 (en) * | 2003-08-11 | 2005-02-17 | Supercritical Systems, Inc. | Alignment means for chamber closure to reduce wear on surfaces |
US20050067002A1 (en) * | 2003-09-25 | 2005-03-31 | Supercritical Systems, Inc. | Processing chamber including a circulation loop integrally formed in a chamber housing |
US7186093B2 (en) * | 2004-10-05 | 2007-03-06 | Tokyo Electron Limited | Method and apparatus for cooling motor bearings of a high pressure pump |
WO2005087422A1 (fr) * | 2004-03-11 | 2005-09-22 | IBl Löttechnik GmbH | Procede et dispositif pour souder avec une depression en phase vapeur |
US7250374B2 (en) | 2004-06-30 | 2007-07-31 | Tokyo Electron Limited | System and method for processing a substrate using supercritical carbon dioxide processing |
US7307019B2 (en) | 2004-09-29 | 2007-12-11 | Tokyo Electron Limited | Method for supercritical carbon dioxide processing of fluoro-carbon films |
US20060065288A1 (en) * | 2004-09-30 | 2006-03-30 | Darko Babic | Supercritical fluid processing system having a coating on internal members and a method of using |
US20060065189A1 (en) * | 2004-09-30 | 2006-03-30 | Darko Babic | Method and system for homogenization of supercritical fluid in a high pressure processing system |
US7491036B2 (en) | 2004-11-12 | 2009-02-17 | Tokyo Electron Limited | Method and system for cooling a pump |
US7140393B2 (en) * | 2004-12-22 | 2006-11-28 | Tokyo Electron Limited | Non-contact shuttle valve for flow diversion in high pressure systems |
US20060135047A1 (en) * | 2004-12-22 | 2006-06-22 | Alexei Sheydayi | Method and apparatus for clamping a substrate in a high pressure processing system |
US20060134332A1 (en) * | 2004-12-22 | 2006-06-22 | Darko Babic | Precompressed coating of internal members in a supercritical fluid processing system |
US7434590B2 (en) * | 2004-12-22 | 2008-10-14 | Tokyo Electron Limited | Method and apparatus for clamping a substrate in a high pressure processing system |
US7291565B2 (en) | 2005-02-15 | 2007-11-06 | Tokyo Electron Limited | Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid |
US7435447B2 (en) * | 2005-02-15 | 2008-10-14 | Tokyo Electron Limited | Method and system for determining flow conditions in a high pressure processing system |
US20060185694A1 (en) * | 2005-02-23 | 2006-08-24 | Richard Brown | Rinsing step in supercritical processing |
US20060186088A1 (en) * | 2005-02-23 | 2006-08-24 | Gunilla Jacobson | Etching and cleaning BPSG material using supercritical processing |
US20060185693A1 (en) * | 2005-02-23 | 2006-08-24 | Richard Brown | Cleaning step in supercritical processing |
US7562853B2 (en) * | 2005-03-11 | 2009-07-21 | Christopher Mazzola | Container support and mounting bracket |
US7550075B2 (en) | 2005-03-23 | 2009-06-23 | Tokyo Electron Ltd. | Removal of contaminants from a fluid |
US7380984B2 (en) * | 2005-03-28 | 2008-06-03 | Tokyo Electron Limited | Process flow thermocouple |
US7767145B2 (en) * | 2005-03-28 | 2010-08-03 | Toyko Electron Limited | High pressure fourier transform infrared cell |
US20060225772A1 (en) * | 2005-03-29 | 2006-10-12 | Jones William D | Controlled pressure differential in a high-pressure processing chamber |
US20060223899A1 (en) * | 2005-03-30 | 2006-10-05 | Hillman Joseph T | Removal of porogens and porogen residues using supercritical CO2 |
US7399708B2 (en) * | 2005-03-30 | 2008-07-15 | Tokyo Electron Limited | Method of treating a composite spin-on glass/anti-reflective material prior to cleaning |
US20060219268A1 (en) * | 2005-03-30 | 2006-10-05 | Gunilla Jacobson | Neutralization of systemic poisoning in wafer processing |
US7494107B2 (en) * | 2005-03-30 | 2009-02-24 | Supercritical Systems, Inc. | Gate valve for plus-atmospheric pressure semiconductor process vessels |
US7442636B2 (en) * | 2005-03-30 | 2008-10-28 | Tokyo Electron Limited | Method of inhibiting copper corrosion during supercritical CO2 cleaning |
US7789971B2 (en) | 2005-05-13 | 2010-09-07 | Tokyo Electron Limited | Treatment of substrate using functionalizing agent in supercritical carbon dioxide |
US7524383B2 (en) * | 2005-05-25 | 2009-04-28 | Tokyo Electron Limited | Method and system for passivating a processing chamber |
US20070000519A1 (en) * | 2005-06-30 | 2007-01-04 | Gunilla Jacobson | Removal of residues for low-k dielectric materials in wafer processing |
DE102006025184B4 (de) * | 2006-05-30 | 2008-02-21 | IBL-Löttechnik GmbH | Vorrichtung zum Löten in der Dampfphase |
US20080145038A1 (en) * | 2006-12-15 | 2008-06-19 | Applied Materials, Inc. | Method and apparatus for heating a substrate |
DE102007005345B4 (de) * | 2007-02-02 | 2014-06-18 | Seho Systemtechnik Gmbh | Verfahren zum Reflow-Löten sowie Vorrichtung zur Durchführung des Verfahrens |
US9166139B2 (en) * | 2009-05-14 | 2015-10-20 | The Neothermal Energy Company | Method for thermally cycling an object including a polarizable material |
US20100308103A1 (en) * | 2009-06-08 | 2010-12-09 | Tyco Electronics Corporation | System and method for vapor phase reflow of a conductive coating |
JP6188671B2 (ja) * | 2014-12-12 | 2017-08-30 | 株式会社Ssテクノ | 水蒸気リフロー装置及び水蒸気リフロー方法 |
JP6909999B2 (ja) | 2018-11-07 | 2021-07-28 | パナソニックIpマネジメント株式会社 | 気相式加熱方法及び気相式加熱装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3025533A (en) * | 1959-06-01 | 1962-03-20 | Kenneth E Hair | Steam bath apparatus |
US4077467A (en) * | 1976-01-28 | 1978-03-07 | Spigarelli Donald J | Method and apparatus for soldering, fusing or brazing |
GB2058335B (en) * | 1979-05-18 | 1983-09-01 | Atomic Energy Authority Uk | Soldering apparatus |
EP0023107B1 (fr) * | 1979-07-09 | 1983-09-07 | Electrovert Ltd. | Procédé et appareil pour le soudage en phase vapeur |
US4264299A (en) * | 1980-03-12 | 1981-04-28 | Bell Telephone Laboratories, Incorporated | Process and apparatus for controlling losses in volatile working fluid systems |
FR2481431A1 (fr) * | 1980-04-23 | 1981-10-30 | Inst Ochistke T | Four de chauffage de produits |
FR2499228B1 (fr) * | 1981-01-30 | 1985-10-25 | Carreras Michelle | Procede de chauffage d'objets a haute temperature par vapeur sous pression et appareil de mise en oeuvre |
JPS60108162A (ja) * | 1983-11-16 | 1985-06-13 | Hitachi Ltd | 蒸気槽 |
FR2579737B1 (fr) * | 1985-04-02 | 1987-11-20 | Inf Milit Spatiale Aeronaut | Limitation de la corrosion en machine de refusion en phase-vapeur |
JPS61238464A (ja) * | 1985-04-13 | 1986-10-23 | Eiichi Miyake | 物品加熱装置 |
US4698915A (en) * | 1986-08-04 | 1987-10-13 | American Telephone And Telegraph Company | Method and apparatus for condensation heating |
-
1987
- 1987-11-12 US US07/119,567 patent/US4838476A/en not_active Expired - Fee Related
-
1988
- 1988-11-11 KR KR1019890701310A patent/KR890701272A/ko not_active Application Discontinuation
- 1988-11-11 WO PCT/EP1988/001023 patent/WO1989004234A1/fr active IP Right Grant
- 1988-11-11 AU AU27862/89A patent/AU2786289A/en not_active Abandoned
- 1988-11-11 DE DE8888909752T patent/DE3873321T2/de not_active Expired - Lifetime
- 1988-11-11 JP JP63509049A patent/JPH02502200A/ja active Pending
- 1988-11-11 EP EP88909752A patent/EP0340275B1/fr not_active Expired - Lifetime
-
1989
- 1989-07-10 RU SU894614624A patent/RU2014975C1/ru active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202009014590U1 (de) | 2009-10-29 | 2010-02-04 | Asscon Systemtechnik-Elektronik Gmbh | Dampfphasen-Lötanlage |
Also Published As
Publication number | Publication date |
---|---|
JPH02502200A (ja) | 1990-07-19 |
WO1989004234A1 (fr) | 1989-05-18 |
DE3873321D1 (de) | 1992-09-03 |
EP0340275A1 (fr) | 1989-11-08 |
DE3873321T2 (de) | 1992-12-03 |
AU2786289A (en) | 1989-06-01 |
RU2014975C1 (ru) | 1994-06-30 |
KR890701272A (ko) | 1989-12-19 |
US4838476A (en) | 1989-06-13 |
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