EP0281154A2 - Procédé de réalisation d'un revêtement protecteur à base de carbure de silicium - Google Patents
Procédé de réalisation d'un revêtement protecteur à base de carbure de silicium Download PDFInfo
- Publication number
- EP0281154A2 EP0281154A2 EP88103394A EP88103394A EP0281154A2 EP 0281154 A2 EP0281154 A2 EP 0281154A2 EP 88103394 A EP88103394 A EP 88103394A EP 88103394 A EP88103394 A EP 88103394A EP 0281154 A2 EP0281154 A2 EP 0281154A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- formula
- range
- compound
- same
- given above
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011253 protective coating Substances 0.000 title claims abstract description 9
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims description 13
- 229910010271 silicon carbide Inorganic materials 0.000 title claims description 12
- 238000000034 method Methods 0.000 title claims description 6
- 150000001875 compounds Chemical class 0.000 claims abstract description 44
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 16
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 13
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 9
- 150000001340 alkali metals Chemical class 0.000 claims abstract description 9
- 229920001577 copolymer Polymers 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 13
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 4
- -1 alkyl radicals Chemical class 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 150000005840 aryl radicals Chemical class 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- GRVDJDISBSALJP-UHFFFAOYSA-N methyloxidanyl Chemical group [O]C GRVDJDISBSALJP-UHFFFAOYSA-N 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 238000000576 coating method Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- BOXVSHDJQLZMFJ-UHFFFAOYSA-N [dimethoxy(methyl)silyl]-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)[Si](C)(OC)OC BOXVSHDJQLZMFJ-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- ZYKMXPLFVHNTTQ-UHFFFAOYSA-N dimethoxy-[methoxy(dimethyl)silyl]-methylsilane Chemical compound CO[Si](C)(C)[Si](C)(OC)OC ZYKMXPLFVHNTTQ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- MDLRQEHNDJOFQN-UHFFFAOYSA-N methoxy(dimethyl)silicon Chemical compound CO[Si](C)C MDLRQEHNDJOFQN-UHFFFAOYSA-N 0.000 description 2
- WCYWZMWISLQXQU-UHFFFAOYSA-N methyl Chemical compound [CH3] WCYWZMWISLQXQU-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- ORGHESHFQPYLAO-UHFFFAOYSA-N vinyl radical Chemical compound C=[CH] ORGHESHFQPYLAO-UHFFFAOYSA-N 0.000 description 2
- IIVWHGMLFGNMOW-UHFFFAOYSA-N 2-methylpropane Chemical compound C[C](C)C IIVWHGMLFGNMOW-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- CIUQDSCDWFSTQR-UHFFFAOYSA-N [C]1=CC=CC=C1 Chemical compound [C]1=CC=CC=C1 CIUQDSCDWFSTQR-UHFFFAOYSA-N 0.000 description 1
- CEHSHXVXKJXWMV-UHFFFAOYSA-N [dimethoxy(methyl)silyl]-ethenyl-methoxy-methylsilane Chemical compound CO[Si](C)(OC)[Si](C)(OC)C=C CEHSHXVXKJXWMV-UHFFFAOYSA-N 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000005466 alkylenyl group Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- LPTGGGHKFLYHMO-UHFFFAOYSA-N dimethoxy-(methoxy-methyl-phenylsilyl)-methylsilane Chemical compound CO[Si](C)(OC)[Si](C)(OC)C1=CC=CC=C1 LPTGGGHKFLYHMO-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- OKHRRIGNGQFVEE-UHFFFAOYSA-N methyl(diphenyl)silicon Chemical compound C=1C=CC=CC=1[Si](C)C1=CC=CC=C1 OKHRRIGNGQFVEE-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920000548 poly(silane) polymer Polymers 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- LPNYRYFBWFDTMA-UHFFFAOYSA-N potassium tert-butoxide Chemical compound [K+].CC(C)(C)[O-] LPNYRYFBWFDTMA-UHFFFAOYSA-N 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1275—Process of deposition of the inorganic material performed under inert atmosphere
Definitions
- the object of the invention is to produce a thermally and chemically resistant coating on metallic and non-metallic surfaces.
- the invention relates to a process for producing a protective coating based on silicon carbide, which is characterized in that a copolymer obtained by reacting at least one disilane of the formula wherein R is the same or different monovalent alkyl, alkenyl or aryl groups and R 1 is the same or different monovalent alkyl groups, optionally in a mixture with a compound of the formula wherein R has the meaning given above, with at least one compound of the formula wherein R has the meaning given above and R 2 represents the methoxy group or has the same meaning as R, in the presence of at least one compound of the formula wherein R has the meaning given above and M represents an alkali metal, and a compound of the formula in which R 1 has the meaning given above, R 3 denotes identical or different alkenyl groups, x lies within the range from 0.5-1.5, y lies within the range from 3-5 and n lies within the range from 500-2000, is applied to the substrate to be protected and is reacted under an inert atmosphere or in a
- the copolymer is obtained by reacting at least one disilane of the formula wherein R is the same or different monovalent alkyl, alkenyl or aryl groups and R 1 is the same or different monovalent alkyl groups, optionally in a mixture with a compound of the formula wherein R has the meaning given above, with at least one compound of the formula wherein R has the meaning given above and R 2 represents the methoxy group or has the same meaning as R, in the presence of at least one compound of the formula wherein R has the meaning given above and M represents an alkali metal, and a compound of the formula in which R I has the meaning given above, R 3 denotes identical or different alkenyl groups, x is within the range from 0.5-1.5, y is within the range from 3-5 and n is within the range from 500-2000, a compound of the formula wherein R 1 and R 3 have the meaning given above, a within the range from 0.3-0.4, b within the range from 0.0
- Alkyl groups R, R 1 and R 2 preferably each contain 1 to 12 carbon atoms per radical, such as the methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl and 2-ethylhexyl radical, and also dodecyl radicals .
- aryl radicals R and R 2 are the phenyl radical and xenyl radicals. Particularly because of the easy accessibility, alkyl groups R, R 1 and R 2 are preferred as methyl groups.
- the most important example of an alkylenyl group R or R 3 is the vinyl group.
- the alkali metal can be lithium, sodium, potassium, rubidium or cesium. Preferred as an alkali metal in the compound of the formula are sodium and potassium.
- Examples of preferred disilanes are 1,1,2-trimethyl-1,2,2-trimethoxydisilane, 1-phenyl-1,2-dimethyl-1,2,2-trimethoxydisilane and 1-vinyl-1,2-dimethyl -1,2,2-trimethoxydisilane.
- the main example of a compound of the formula is 1,2-dimethyl-1,1,2,2-tetramethoxydisilane.
- disilanes of the formula used they are preferably used in amounts of 0.5 mol to 1.5 mol per mol of disilane of the formula used.
- Examples of compounds of the formula which are preferably used are dimethylmethoxysilane and diphenylmethylsilane.
- compound of formula in amounts of 0.5 to 5 percent by weight, in particular 2 to 4 percent by weight, based in each case on the weight of the amount of disilane used in each case.
- Compound of formula serves as a catalyst. It is preferably used in amounts of 0.2 to 0.5 percent by weight, based on the weight of the amount of disilane used in each case.
- R I is a methyl radical
- R 3 is a vinyl radical
- y in the range from 3-5 and n in the range from 500-2000.
- 0.1-10% by weight, in particular 1-5% by weight, of the compound of the formula are preferred in the process according to the invention based on the weight of the disilanes used.
- R 1 is a methyl radical
- R 3 is a vinyl radical
- b in the range 0.01-0.1 c in the range 0.5-0.7
- d in the range from 10-100.
- the preparation of such compounds is known, for example from W. Noll, Chemistry and Technology of Silicones, Academic Press, Inc., London 1968.
- 0.1-10% by weight, in particular 3-5% by weight, of the compound of the formula are preferred based on the weight of the disilanes used.
- a protective coating based on silicon carbide from a copolymer obtained by reacting at least one disilane of the formula wherein R is the same or different monovalent alkyl, alkenyl or aryl groups and? means the same or different monovalent alkyl groups, optionally in a mixture with a compound of the formula wherein R has the meaning given above, with at least one compound of the formula wherein R has the meaning given above and R 2 represents the methoxy group or has the same meaning as R, in the presence of at least one compound of the formula wherein R has the meaning given above and M represents an alkali metal, and a compound of the formula in which R 1 has the meaning given above, R 3 denotes identical or different alkenyl groups, x lies within the range from 0.5-1.5, y lies within the range from 3-5 and n lies within the range from 500-2000, optionally with the addition of a compound of the formula wherein R 1 and R 3- have the meaning given above, a within the range from 0.3-0.4, b
- Preferred examples of such solvents are organic aromatic or aliphatic hydrocarbons.
- toluene petroleum ether of various boiling fractions or butyl acetate are used.
- the coating according to the invention can be applied in any suitable manner for the application of liquid or pasty substances to substrates, e.g. by dipping, spraying, brushing, pouring or rolling. After the application, the coating is preferably air-dried for 15-60 minutes at temperatures of 10-100 ° C. and then at temperatures of 700-1400 ° C., preferably 900-1100 ° C. under an inert atmosphere, for example generated by flushing with inert gases such as argon or nitrogen, or implemented in vacuo.
- inert gases such as argon or nitrogen
- the protective coatings according to the invention preferably have a thickness of 5-2000 ⁇ m, in particular 10-50 ⁇ m.
- the protective coatings according to the invention are used in particular to produce thermally and chemically resistant surface coatings on metals, ceramics, glass ceramics, fiber materials and carbon.
- the protection against oxidation of CFC (carbon fiber reinforced carbon), the surface sealing of porous ceramics or fiber materials and the corrosion protection of metals are particularly important.
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Silicon Polymers (AREA)
- Carbon And Carbon Compounds (AREA)
- Chemically Coating (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT88103394T ATE80673T1 (de) | 1987-03-06 | 1988-03-04 | Verfahren zur herstellung eines schutzueberzuges auf basis von siliciumcarbid. |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3707224 | 1987-03-06 | ||
| DE19873707224 DE3707224A1 (de) | 1987-03-06 | 1987-03-06 | Verfahren zur herstellung eines schutzueberzuges auf basis von siliciumcarbid |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0281154A2 true EP0281154A2 (fr) | 1988-09-07 |
| EP0281154A3 EP0281154A3 (en) | 1989-07-19 |
| EP0281154B1 EP0281154B1 (fr) | 1992-09-16 |
Family
ID=6322422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP88103394A Expired - Lifetime EP0281154B1 (fr) | 1987-03-06 | 1988-03-04 | Procédé de réalisation d'un revêtement protecteur à base de carbure de silicium |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4879142A (fr) |
| EP (1) | EP0281154B1 (fr) |
| JP (1) | JPS63235481A (fr) |
| AT (1) | ATE80673T1 (fr) |
| CA (1) | CA1288645C (fr) |
| DE (2) | DE3707224A1 (fr) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2223231A (en) * | 1988-07-22 | 1990-04-04 | Dow Corning | Composition control of ceramic chars derived from methylpolysilanes |
| EP0392822A2 (fr) * | 1989-04-14 | 1990-10-17 | Ethyl Corporation | Compositions précéramiques et produits céramiques |
| EP0492826A2 (fr) * | 1990-12-24 | 1992-07-01 | Dow Corning Corporation | Procédé de pyrolyse en sens inversé |
| GB2234255B (en) * | 1988-07-22 | 1992-09-30 | Dow Corning | Methylpolysilanes and method for their preparation |
| US8481640B2 (en) | 2007-05-01 | 2013-07-09 | Dow Corning Corporation | Polymer compositions |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1011098C2 (nl) * | 1999-01-21 | 2000-07-24 | Univ Utrecht | Keramische deklaag. |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4446169A (en) * | 1982-09-16 | 1984-05-01 | Westinghouse Electric Corp. | Method for making silicon carbide coatings |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52112700A (en) * | 1976-02-28 | 1977-09-21 | Tohoku Daigaku Kinzoku Zairyo | Amorphous organopolysilicone composite for preparing silicone carbide |
| GB2039787B (en) * | 1978-11-13 | 1982-12-08 | Res Inst For Special Inorganic | Producing corrosion resistant articles |
| JPS5567585A (en) * | 1978-11-13 | 1980-05-21 | Tokushu Muki Zairyo Kenkyusho | Manufacture of corrosionnresistant* heattresistant and acid resistant molded body |
| US4418097A (en) * | 1981-12-11 | 1983-11-29 | Martin Marietta Corporation | Coating for graphite electrodes |
| US4696827A (en) * | 1982-03-12 | 1987-09-29 | Sony Corporation | Silicon carbide-carbon composite molded product and process for manufacturing the same |
| JPS60125375A (ja) * | 1983-12-07 | 1985-07-04 | Usui Internatl Ind Co Ltd | 金属・セラミツクス接合体及びその製造方法 |
-
1987
- 1987-03-06 DE DE19873707224 patent/DE3707224A1/de not_active Withdrawn
-
1988
- 1988-02-22 US US07/158,813 patent/US4879142A/en not_active Expired - Fee Related
- 1988-02-25 CA CA000559864A patent/CA1288645C/fr not_active Expired - Lifetime
- 1988-03-04 DE DE8888103394T patent/DE3874569D1/de not_active Expired - Lifetime
- 1988-03-04 AT AT88103394T patent/ATE80673T1/de active
- 1988-03-04 EP EP88103394A patent/EP0281154B1/fr not_active Expired - Lifetime
- 1988-03-07 JP JP63051798A patent/JPS63235481A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4446169A (en) * | 1982-09-16 | 1984-05-01 | Westinghouse Electric Corp. | Method for making silicon carbide coatings |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2223231A (en) * | 1988-07-22 | 1990-04-04 | Dow Corning | Composition control of ceramic chars derived from methylpolysilanes |
| GB2223231B (en) * | 1988-07-22 | 1992-09-30 | Dow Corning | Composition control of ceramic chars derived from methylpolysilanes |
| GB2234255B (en) * | 1988-07-22 | 1992-09-30 | Dow Corning | Methylpolysilanes and method for their preparation |
| EP0392822A2 (fr) * | 1989-04-14 | 1990-10-17 | Ethyl Corporation | Compositions précéramiques et produits céramiques |
| EP0392822A3 (fr) * | 1989-04-14 | 1991-10-23 | Ethyl Corporation | Compositions précéramiques et produits céramiques |
| EP0492826A2 (fr) * | 1990-12-24 | 1992-07-01 | Dow Corning Corporation | Procédé de pyrolyse en sens inversé |
| EP0492826A3 (en) * | 1990-12-24 | 1993-03-03 | Dow Corning Corporation | Reverse direction pyrolysis processing |
| US8481640B2 (en) | 2007-05-01 | 2013-07-09 | Dow Corning Corporation | Polymer compositions |
| US8592545B2 (en) | 2007-05-01 | 2013-11-26 | Dow Corning Corporation | Polymer and polymer compositions |
Also Published As
| Publication number | Publication date |
|---|---|
| ATE80673T1 (de) | 1992-10-15 |
| US4879142A (en) | 1989-11-07 |
| DE3707224A1 (de) | 1988-09-15 |
| JPS63235481A (ja) | 1988-09-30 |
| CA1288645C (fr) | 1991-09-10 |
| EP0281154A3 (en) | 1989-07-19 |
| DE3874569D1 (de) | 1992-10-22 |
| EP0281154B1 (fr) | 1992-09-16 |
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