EP0193848A1 - Galvanisches Bad für das Elektroplattieren von Goldlegierungen - Google Patents

Galvanisches Bad für das Elektroplattieren von Goldlegierungen Download PDF

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Publication number
EP0193848A1
EP0193848A1 EP86102442A EP86102442A EP0193848A1 EP 0193848 A1 EP0193848 A1 EP 0193848A1 EP 86102442 A EP86102442 A EP 86102442A EP 86102442 A EP86102442 A EP 86102442A EP 0193848 A1 EP0193848 A1 EP 0193848A1
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EP
European Patent Office
Prior art keywords
amino
acid
gold
cyanide
copper
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EP86102442A
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English (en)
French (fr)
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EP0193848B1 (de
Inventor
Heinz Emmenegger
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Definitions

  • the present invention relates to new gold alloys, as well as to galvanic baths for the electrolytic deposition of these alloys.
  • the object of this invention aims to remedy the aforementioned drawbacks of known alloys and baths, consists of an alloy containing between 40 and 92% by weight of gold, 4 to 12% by weight of cadmium and 0.1 at 1% by weight of zinc, the remainder consisting of copper.
  • another object of this invention consists of a galvanic bath for the electrolytic deposition of these Au-Cu-Cd-Zn alloys, which is characterized by the fact that it contains a cyanide complex of gold, a cyanide complex of copper, a cyanide complex of cadmium and a cyanide complex of zinc, and at least one complexing agent and a surfactant.
  • the bath operates in the presence or absence of free cyanide.
  • the concentration of free potassium cyanide must be between 22 and 32 g / l, otherwise the deposit becomes hazy and pitted. . If the concentration of free cyanide is increased, the deposition of copper is slowed down and the deposit becomes too white. If this concentration is reduced, the deposit becomes too pink and not very resistant to corrosion.
  • the copper-cyanide ratio is very important, because if the concentration of copper decreases by half, that is 30 g / l, the concentration of free cyanide should also decrease by half; in this case, the working margin is therefore further reduced. This is why, in traditional baths, it is preferred to work with very high copper concentrations, of the order of 60 to 70 g / l. This allows for greater tolerance in the concentration of free cyanide.
  • this fourth metal namely zinc
  • the amount of total cyanide must increase proportionally.
  • the amount of free cyanide can vary within a range of 0 to 30 g / l for 10 g / l of zinc. The higher the zinc content, the larger this range.
  • the copper concentration must be reduced and can be between 5 and 70 g / l, while that of zinc can vary from 0.5 to 50 g / l. With, for example, 35 g / l of copper and 5 g / l of zinc, there is in fact 20 g / l of cyanide linked loosely to the zinc complex. If we add another 5 g / l of free cyanide, we have in total 25 g / l of total cyanide. This provides excellent deposits.
  • Gold and copper are introduced into the bath in the form of cyanide complexes KAu (CN) 2 and K 2 Cu (CN) 3 .
  • Cadmium and zinc can also be introduced in the form of cyanide complexes.
  • amino-carboxylates for example amino-carboxylates; hydroxy-alkyl-amino-carboxylic, poly-amino-carboxylic, hydroxy-alkyl-poly-amino-carboxylic, amino-phosphonic, poly-amino-phosphonic, phosphpnic acids or amino-carboxylic acids- phosphonic acids, which belong to different classes of chemical compounds, but whose molecule always contains one or more nitrogen atoms linked to various groups, such as those of methly-phosphonic acids or also alkyl, carboxy-alkyl and hydroxy-alkyl .
  • R represents an alkyl group whose number of atoms
  • carbon can be used in isolation is between 1 and 4, or acids or in combinations of the commercially available products- nitrilo-tri-acetic (NTA ), oxycarbonyl-ethyl-amino, known by the names of non-diacetic, N-carboxy-methyl-aspartic, N, N-bis- (carboxyionic, anionic, cationic or amphoteric) surfactants.
  • NTA nitrilo-tri-acetic
  • oxycarbonyl-ethyl-amino known by the names of non-diacetic, N-carboxy-methyl-aspartic, N, N-bis- (carboxyionic, anionic, cationic or amphoteric) surfactants.
  • methyl) -asparftic, aspartic, glutamic and imino-specific can advantageously be used amidodiacetics, etc.
  • All of these acids are preferably used propyl-dimethyl-amino-oxides of saturated fatty acids, for- in the form of soluble salts, that is to say in the form of general mule salts: sodium, potassium, ammonium or amines.
  • the fatty acid or alkyl groups can also be ethoxylated.
  • Phosphorus esters of ethylene oxide chains linked to an aliphatic chain can also be used as surfactants: monoester, or diester
  • n a number between 8 and 18
  • x represents a number between 6 and 15 and M a sodium or potassium ion.
  • the concentrations of the various organic adducts can vary within a relatively large range, from 5 to 200 g / l for the complexing agents and from 0.01 to 50 ml / l for the surfactants.
  • inorganic shine means soluble salts, therefore alkali metals, ammonium or amines, or complex salts of certain elements, capable of influencing the crystallization of the galvanic deposit so that it appears shiny.
  • These inorganic brighteners contain selenium, tellurium, vanadium, arsenic, antimony, thallium, bismuth, titanium, germanium, zirconium, tantalum and / or niobium elements. These inorganic brighteners are used at low concentrations, ie from 0.01 to 100 mg / l.
  • alkaline salts such as carbonates, phosphates or sulfites, in amounts of 5 to 30 g / l. They also act as pH regulators.
  • the electrolytic baths which are the subject of the present invention are preferably used at a pH of 8 to 11, with a current density of 0.6 to 2.5 A / dm 2 and at a temperature of 40 to 75 ° C.
  • a steel plate was subjected to electrolysis in this bath at a current density of 0.8 A / dm 2 and at the temperature of 60 ° C.
  • the alloy deposited has the following composition: The deposit is uniform, shiny and pale yellow in color 1 N 14.
  • a steel plate was subjected to electrolysis in this bath at a current density of 1 A / dm 2 and at the temperature of 60 ° C.
  • the deposited alloy has the following composition: The deposit is uniform, shiny and pale yellow in color 1 N 14.
  • the deposition rate is regulated, on the one hand by the current density allowed, on the other hand by the amount of organic complexing agent added to the bath.
  • the current density allowed, on the other hand by the amount of organic complexing agent added to the bath.
  • copper deposits little compared to gold and cadmium and the alloy is yellow.
  • high current density it is an excess of copper which must be avoided by regulating the concentration of free cyanide and maintaining the organic complexing agent at relatively low concentrations.
  • the baths of quaternary alloys which are the subject of the present invention, allow a greater margin of current densities than the usual baths of ternary alloys. They allow, in particular to obtain excellent deposits at high current densities, admitting a deposition rate of 1 micron in one to two minutes, which is much higher than that of generally used baths, which require at least three minutes to deposit 1 micron.
  • the usual baths of ternary alloys allow, for deposits, a gold content of 14 to 18 carats, or 58 to 75% of gold. Outside these limits, the deposits have neither a good appearance, nor good mechanical characteristics and corrosion resistance.
  • baths B1 to B5 were used to obtain deposits of Au-Cu-Cd-Zn alloys, working at a temperature of 60 ° C and with a current density of 0.7 A / dm 2 for the baths B1 and B2, 0.8 A / dm 2 for the B3 bath, and 0.75 A / dm 2 for the B4 bath.
  • Bath B5 was used with a current density of 1.0 A / dm 2 - (B5a), then 1.25 A / dm 2 (B5b).
  • the deposits obtained are all pale yellow in color, ductile, shiny and perfectly resistant to corrosion.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP86102442A 1985-03-01 1986-02-25 Galvanisches Bad für das Elektroplattieren von Goldlegierungen Expired EP0193848B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH944/85 1985-03-01
CH944/85A CH662583A5 (fr) 1985-03-01 1985-03-01 Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc.

Publications (2)

Publication Number Publication Date
EP0193848A1 true EP0193848A1 (de) 1986-09-10
EP0193848B1 EP0193848B1 (de) 1989-08-16

Family

ID=4198804

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86102442A Expired EP0193848B1 (de) 1985-03-01 1986-02-25 Galvanisches Bad für das Elektroplattieren von Goldlegierungen

Country Status (4)

Country Link
US (1) US4687557A (de)
EP (1) EP0193848B1 (de)
CH (1) CH662583A5 (de)
DE (2) DE193848T1 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0304315A1 (de) * 1987-08-21 1989-02-22 Engelhard Limited Bad für das Elektroplattieren einer Gold-Kupfer-Zink-Legierung
EP1983077A1 (de) * 2007-04-19 2008-10-22 Enthone, Inc. Elektrolyt und Verfahren zur elektrolytischen Ablagerung von Gold-Kupfer-Legierungen
EP2312021A1 (de) * 2009-10-15 2011-04-20 The Swatch Group Research and Development Ltd. Verfahren zum Erhalten einer gelben Goldlegierungsablagerung durch Galvanoplastik ohne Verwendung von giftigen Metallen
US9683303B2 (en) 2007-09-21 2017-06-20 The Swatch Group Research And Development Ltd Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
EP3356579B1 (de) 2015-09-30 2020-03-11 Coventya S.p.A. Galvanikbad zur elektrochemischen abscheidung einer cu-sn-zn-pd-legierung, verfahren zur elektrochemischen abscheidung von dieser legierung, substrat mit dieser legierung und verwendung des substrats

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8903818D0 (en) * 1989-02-20 1989-04-05 Engelhard Corp Electrolytic deposition of gold-containing alloys
DE3929569C1 (de) * 1989-09-06 1991-04-18 Degussa Ag, 6000 Frankfurt, De
GB9522591D0 (en) * 1995-11-03 1996-01-03 Enthone Omi Suisse S A Electroplating processes compositions and deposits
ATE220736T1 (de) * 1995-11-03 2002-08-15 Enthone Omi Inc Elektroplattierungsverfahren, zusammensetzungen und überzügen
FR2828889B1 (fr) * 2001-08-24 2004-05-07 Engelhard Clal Sas Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
CH714243B1 (fr) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Procédé d'électroformage et pièce ou couche obtenue par ce procédé.
US7534289B1 (en) 2008-07-02 2009-05-19 Rohm And Haas Electronic Materials Llc Electroless gold plating solution
EP2143820B1 (de) * 2008-07-11 2012-03-07 Rohm and Haas Electronic Materials LLC Stromfreie Goldplattierungslösung
CN101634021B (zh) * 2008-07-24 2012-11-07 罗门哈斯电子材料有限公司 无电镀金液
CH706336B1 (fr) * 2012-04-02 2016-03-31 Haute Ecole Arc Bain galvanique pour le dépôt électrolytique d'un matériau composite.
ITFI20120103A1 (it) 2012-06-01 2013-12-02 Bluclad Srl Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni.
IT201900001769A1 (it) * 2019-02-07 2020-08-07 Italfimet Srl Lega d'oro rosa, procedimento di realizzazione ed uso.
CN116917549A (zh) 2021-02-23 2023-10-20 意大利菲美特有限公司 用于电镀电沉积的方法以及相关的电镀池
CN114836794B (zh) * 2021-06-25 2024-01-30 深圳市铭轩珠宝首饰有限公司 一种金-铜合金电铸工艺及其应用
WO2023126257A1 (en) 2021-12-29 2023-07-06 Basf Se Alkaline composition for copper electroplating comprising a grain refiner

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1572525A (de) * 1967-05-11 1969-06-27
GB2012306A (en) * 1978-01-16 1979-07-25 Oxy Metal Industries Corp Zinc electroplating bath and process
AT353071B (de) * 1977-10-06 1979-10-25 Oxy Metal Industries Corp Cyanidfreies, basisches sulfitbad zur elektrolytischen faellung von gold-zink- legierungen
US4179344A (en) * 1973-07-02 1979-12-18 Lea-Ronal, Inc. Gold alloy plating compositions and method
EP0140832A2 (de) * 1983-09-01 1985-05-08 H. E. Finishing SA Galvanisches Bad für das elekrolytische Absetzen einer Goldlegierung und galvanisches Verfahren für die Verwendung dieses Bads

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL130011C (de) * 1960-04-23
CH418085A (fr) * 1964-08-19 1966-07-31 Pilot Pen Co Ltd Electrolyte pour le dépôt galvanique d'alliages d'or
CH522740A (de) * 1968-06-28 1972-06-30 Degussa Verfahren zur galvanischen Abscheidung von Gold-Kupfer-Cadmium-Legierungsüberzügen
CH529843A (fr) * 1971-07-09 1972-10-31 Oxy Metal Finishing Europ S A Bain pour le dépôt électrolytique d'alliages d'or et son utilisation en galvanoplastie
CH556916A (fr) * 1972-03-23 1974-12-13 Lea Ronal Inc Procede pour le depot electrolytique d'alliages d'or.
DE2251285C3 (de) * 1972-10-14 1981-01-22 Schering Ag, 1000 Berlin Und 4619 Bergkamen Alkalisches Bad für die galvanische Abscheidung von Goldlegierungen
CH621367A5 (en) * 1977-07-08 1981-01-30 Systemes Traitements Surfaces Electrolytic bath for plating gold-copper-cadmium alloys and its use in galvanoplasty
CH632533A5 (fr) * 1979-06-14 1982-10-15 Aliprandini P Procede pour le depot galvanoplastique d'un alliage d'or.
DE3020765A1 (de) * 1980-05-31 1981-12-10 Degussa Ag, 6000 Frankfurt Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten
US4486275A (en) * 1983-02-07 1984-12-04 Heinz Emmenegger Solution for electroplating a gold-copper-cadmium alloy

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1572525A (de) * 1967-05-11 1969-06-27
US4179344A (en) * 1973-07-02 1979-12-18 Lea-Ronal, Inc. Gold alloy plating compositions and method
AT353071B (de) * 1977-10-06 1979-10-25 Oxy Metal Industries Corp Cyanidfreies, basisches sulfitbad zur elektrolytischen faellung von gold-zink- legierungen
GB2012306A (en) * 1978-01-16 1979-07-25 Oxy Metal Industries Corp Zinc electroplating bath and process
EP0140832A2 (de) * 1983-09-01 1985-05-08 H. E. Finishing SA Galvanisches Bad für das elekrolytische Absetzen einer Goldlegierung und galvanisches Verfahren für die Verwendung dieses Bads

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0304315A1 (de) * 1987-08-21 1989-02-22 Engelhard Limited Bad für das Elektroplattieren einer Gold-Kupfer-Zink-Legierung
US4980035A (en) * 1987-08-21 1990-12-25 Engelhard Corporation Bath for electrolytic deposition of a gold-copper-zinc alloy
EP1983077A1 (de) * 2007-04-19 2008-10-22 Enthone, Inc. Elektrolyt und Verfahren zur elektrolytischen Ablagerung von Gold-Kupfer-Legierungen
EP3170924A1 (de) * 2007-04-19 2017-05-24 Enthone, Inc. Elektrolyt und verfahren zur elektrolytischen ablagerung von gold-kupfer-legierungen
US9683303B2 (en) 2007-09-21 2017-06-20 The Swatch Group Research And Development Ltd Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
US10233555B2 (en) 2007-09-21 2019-03-19 The Swatch Group Research And Development Ltd. Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
US10619260B2 (en) 2007-09-21 2020-04-14 The Swatch Group Research And Development Ltd. Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
EP2312021A1 (de) * 2009-10-15 2011-04-20 The Swatch Group Research and Development Ltd. Verfahren zum Erhalten einer gelben Goldlegierungsablagerung durch Galvanoplastik ohne Verwendung von giftigen Metallen
US9567684B2 (en) 2009-10-15 2017-02-14 The Swatch Group Research And Development Ltd Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials
EP3356579B1 (de) 2015-09-30 2020-03-11 Coventya S.p.A. Galvanikbad zur elektrochemischen abscheidung einer cu-sn-zn-pd-legierung, verfahren zur elektrochemischen abscheidung von dieser legierung, substrat mit dieser legierung und verwendung des substrats

Also Published As

Publication number Publication date
DE193848T1 (de) 1986-12-18
DE3665078D1 (en) 1989-09-21
US4687557A (en) 1987-08-18
CH662583A5 (fr) 1987-10-15
EP0193848B1 (de) 1989-08-16

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