Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
  • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
  • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
  • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
  • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent

Definitions

• the present invention relates to a grinding tool of the type in which the abrasive is diamond known as the hardest abrasive.
• cermet of titanium nitride which is a new species of ceramics. It is a new material having characteristics combining the properties of ceramics and metals, such as high hardness and heat resistance-characteristic of ceramics and toughness characteristic of metals. It is finding more uses as a material for high-performance cutting tools such as throwaway chips and reamers, in place of the conventional cemented carbides and old ceramics.
• a grinding tool made of diamond superabrasive grains has been in use for truing and sharpening the cutting tools made of cermet.
• it has the disadvantage of being poor in grinding efficiency and life because of the difficulties encountered in grinding the hard cutting material.
• the pressure and temperature at the grinding point are much higher than those which are experienced in the grinding of the conventional cemented carbide. This easily wears the superabrasive grains forming the cutting edge of the grinding tool, and in an extreme case, induces the crushing and releasing of the superabrasive grains.
• a grinding tool usually undergoes, before use, dressing to improve and keep its sharpness(free-cut performance). Dressing makes the cutting edge of the superabrasive grains project several tens of micron from the surface of the bond.
• the grinding tool is made up of diamond grains as the abrasive and an organic polymer such as phenolic resin or a metal such as Cu-Sn alloy, as the base material of the bond, and that the bond contains a solid film-forming lubricant and a filler of fine diamond grains having an average grain size smaller than one-third that of the diamond grains used as the abrasive.
• the di.amond grains used as the abrasive in this invention have a grain size of about 170 to 400 mesh, preferably 200 to 270 mesh, and the content of the abrasive in the bond is about 15 to 50 vol%, preferably 20 to 32 vol%.
• the diamond grains used as the filler of the bond should have a grain size smaller than one-third that of the diamond grains used as the abrasive, and preferably the grain size should be smaller than 20 p m(800 mesh).
• the content of the filler in the bond should be 3 to 30 vol%, preferably 4 to 10 vol%.
• the fine diamond grains incorporated into the bond improve the wear resistance of the bond. In addition, they positively grind and discharge the surface layer and chips of the work which would otherwise come into contact with the bond, whereby preventing loading. This is also effective in preventing the accumulation of friction heat and reducing the breaking down of abrasive grains.
• the filler produces a synergistic effect with the solid-film forming lubricant in greatly improving the ability to grind titanium nitride cermets.
• the grain size of the filler is larger than specified above, leading is more likely to occur. If the amount of the filler is excessively large, the amount of the bond decreases accordingly and the retention of the abrasive grains decreases, which shortens the life of the grinding tool.
• the solid film-forming lubricant is a known substance that forms and deposits a lubricating solid film on the friction surface of the bond.
• the one that can be used in this invention includes inorganic materials such as boron nitride of hexagonal system and tungsten disulfide.
• the amount of the solid film-forming lubricant in the bond is 3 to 20 vol%, preferably 5 to 10 vol%, and in the case of metal bond, it is 5 to 40 vol%, preferably 10 to 30 vol%.
• the total amount of the filler and lubricant is less than the above-mentioned lower limit, their effect is little, and in the opposite case, the amount of the base material of the bond is not enough to firmly retain the abrasive grains and the abrasive grains are easily released.
• the metal bond permits the incorporation of more lubricant than the organic polymer bond because the former has a greater capacity to retain abrasive grains than the latter.
• At least one of the diamond grains as the abrasive and those as the filler is preferable to coat at least one of the diamond grains as the abrasive and those as the filler with Cu or Ni for improving the retaining force and thermal conductivity of the diamond grains.
• Ten straight grinding wheels of the same shape(14A1 type, 150mm in diameter, 8 mm in width of abrasive layer) were prepared, each containing a varied kind and amount of filler in the bond. These wheels were used for wet surface grinding of the periphery of a titanium nitride(TiN) cermet chip (19.1 mm long, 19.1 mm wide, and 4.7 mm thick) under the same conditions (depth of cut : 0.03 mm, table traversing: 6 m/min, peripheral speed of wheel : 28.3 m/sec, coolant : chemical solution type).
• the life of the grinding wheel was evaluated in terms of grinding ratio G R which is the ratio of the volume of the ground TiN cermet to the volume of the worn grinding wheel.
• the sharpness of the grinding wheel was evaluated in terms of the input electric current required to perform grinding.
• the finishing quality was evaluated according to the presence or absence of chipping at the corners of the chip.
• the grinding wheels No. 4 and No. 8 in Table 1 are the typical diamond wheels containing 30 vol% of silicon carbide (SiC).
• the %G R and %A in Table 2 is a relative value compared with that of wheel No. 4 as the reference.
• tungsten disulfide a solid film-forming lubricant
• WS 2 tungsten disulfide
• finely divided diamond a filler
• the life of the wheel is 50 to 60% longer and the sharpness is 30 to 40% better than the reference wheel (No. 4). Improvement more than 100% was almost impossible even if the grain size and anount of the filler were changed.
• the wheel No. 10 containing no fillers in the metal bond caused large chipping to the cermet chip.
• the wheels (No. 1, No. 2 and No. 3) of this invention which contain both tungsten disulfide and finely divided diamond as a filler are greatly improved in life (G R ) and sharpness and provide the best finishing surface among the wheels examined.
• This experimental result shows that the synergistic effect of the above two fillers is obtained.
• the life was extended more than six times and the sharpness was improved nearly 60%.
• the grinding wheels of this invention can be produced with the existing equipment and technology for the conventional standard resin bond diamond wheels or metal bond diamond wheels.
• polyimide resin can be used as the organic polymer for the bond in place of phenolic resin.

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Polishing Bodies And Polishing Tools (AREA)
• Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Applications Claiming Priority (2)

Publications (3)

Family

ID=16766299

Family Applications (1)

Country Status (4)

Cited By (5)

Families Citing this family (22)

Family Cites Families (12)

• 1984
  • 1984-10-22 JP JP59221410A patent/JPS61100352A/ja active Pending
• 1985
  • 1985-10-17 DE DE8585113197T patent/DE3577819D1/de not_active Expired - Lifetime
  • 1985-10-17 EP EP85113197A patent/EP0179404B1/de not_active Expired
  • 1985-10-21 US US06/789,770 patent/US4671021A/en not_active Expired - Fee Related

Also Published As

Similar Documents

Legal Events