EP0040649A1 - Alliage à base de plomb et de cuivre - Google Patents
Alliage à base de plomb et de cuivre Download PDFInfo
- Publication number
- EP0040649A1 EP0040649A1 EP80200481A EP80200481A EP0040649A1 EP 0040649 A1 EP0040649 A1 EP 0040649A1 EP 80200481 A EP80200481 A EP 80200481A EP 80200481 A EP80200481 A EP 80200481A EP 0040649 A1 EP0040649 A1 EP 0040649A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- lead
- copper alloy
- selenium
- der
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C11/00—Alloys based on lead
- C22C11/04—Alloys based on lead with copper as the next major constituent
Definitions
- the invention relates to a lead-copper alloy containing 0.03 to 0.08% by mass of copper for the production of metal sheets and strips for the building industry and for the production of cable sheaths.
- the lead-copper alloy according to DIN 17640 has proven to be very advantageous due to its resistance to thermal cycling. Examples of applications are roof and groove coverings, facade cladding, seals and insulation. In house technology, pressure pipes, drain pipes and drain bends made of lead have proven themselves for a long time due to their durability, easy installation options and the noise reduction of flowing water.
- Lead offers a further advantage due to its good damping properties against sound, especially as sound insulation in building and mechanical engineering.
- This lead material is also used for sheathing telephone and power cables.
- the most important requirement with regard to the high durability of this lead material is a wide range of its plastic deformability.
- a yardstick for this is the elongation at break during the tensile test, on the other hand the number of bends of the material, the thermal alternating stress and the creep rupture strength at room temperature.
- an improved fatigue strength is required compared to soft lead.
- sufficient recrystallization resistance - i.e. Lack of coarse grain as a result of deformation at elevated temperature - desirable.
- the lead-copper alloy with 0.03 to 0.08 mass% copper still contains 0.005 to 0.05 mass%, preferably 0.01 to 0.025 mass%, selenium contains.
- selenium contains 0.005 to 0.05 mass%, preferably 0.01 to 0.025 mass%.
- the addition of selenium achieves a grain-refining effect in that the smallest lead selenide particles act as crystallizers for the lead. These solidify primarily from the melt during solidification.
- the selenium grain refinement goes hand in hand with a finer copper distribution.
- the lead-copper alloy can also contain production-related impurities.
- the finer copper distribution associated with selenium grain refinement therefore has very advantageous consequences for the mechanical-technological properties.
- the hardness HV 1/180 was increased from 3.2 to 3.8, likewise the yield strength and tensile strength, while the elongation at break remains high on average. This is then expressed in the number of back and forth bends that increase with increasing selenium content until breaking, but above all in the strong increase in service life that is important for the construction industry when subjected to changes in temperature.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Continuous Casting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP80200481A EP0040649A1 (fr) | 1980-05-22 | 1980-05-22 | Alliage à base de plomb et de cuivre |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP80200481A EP0040649A1 (fr) | 1980-05-22 | 1980-05-22 | Alliage à base de plomb et de cuivre |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0040649A1 true EP0040649A1 (fr) | 1981-12-02 |
Family
ID=8187002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP80200481A Withdrawn EP0040649A1 (fr) | 1980-05-22 | 1980-05-22 | Alliage à base de plomb et de cuivre |
Country Status (1)
Country | Link |
---|---|
EP (1) | EP0040649A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2169616A (en) * | 1985-01-11 | 1986-07-16 | London Scandinavian Metall | Grain refining metals |
CN110129615A (zh) * | 2019-04-18 | 2019-08-16 | 河南豫光金铅股份有限公司 | 一种电缆护套用Pb-Cu合金及其冶炼方法 |
-
1980
- 1980-05-22 EP EP80200481A patent/EP0040649A1/fr not_active Withdrawn
Non-Patent Citations (1)
Title |
---|
Zeitschrift fur Metallkunde, Band 70 Nr. 12, 1979 Stuttgart U. HEUBNER "Die Kornfeining und Gefugestabilisierung von Blei und Bleilegierungen mit Hilfe von Schwefel, Selen und Tellur" seiten 761 bis 767 * seiten 764, 765 766 * * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2169616A (en) * | 1985-01-11 | 1986-07-16 | London Scandinavian Metall | Grain refining metals |
CN110129615A (zh) * | 2019-04-18 | 2019-08-16 | 河南豫光金铅股份有限公司 | 一种电缆护套用Pb-Cu合金及其冶炼方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Designated state(s): AT BE DE FR NL |
|
17P | Request for examination filed |
Effective date: 19820514 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Withdrawal date: 19830525 |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: REINERT, MAX Inventor name: HEUBNER, ULRICH, DR. DIPL.-ING. |