EG21462A - Environmentally isolated enclosure for electronic components - Google Patents

Environmentally isolated enclosure for electronic components

Info

Publication number
EG21462A
EG21462A EG38098A EG38098A EG21462A EG 21462 A EG21462 A EG 21462A EG 38098 A EG38098 A EG 38098A EG 38098 A EG38098 A EG 38098A EG 21462 A EG21462 A EG 21462A
Authority
EG
Egypt
Prior art keywords
electronic components
environmentally isolated
isolated enclosure
enclosure
environmentally
Prior art date
Application number
EG38098A
Other languages
English (en)
Inventor
M Arf B Przilas
Robert H Mimlitch
Original Assignee
Raytheon E Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon E Systems Inc filed Critical Raytheon E Systems Inc
Application granted granted Critical
Publication of EG21462A publication Critical patent/EG21462A/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20345Sprayers; Atomizers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Credit Cards Or The Like (AREA)
EG38098A 1997-04-04 1998-04-04 Environmentally isolated enclosure for electronic components EG21462A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/834,502 US5907473A (en) 1997-04-04 1997-04-04 Environmentally isolated enclosure for electronic components

Publications (1)

Publication Number Publication Date
EG21462A true EG21462A (en) 2001-10-31

Family

ID=25267079

Family Applications (1)

Application Number Title Priority Date Filing Date
EG38098A EG21462A (en) 1997-04-04 1998-04-04 Environmentally isolated enclosure for electronic components

Country Status (10)

Country Link
US (2) US5907473A (zh)
EP (1) EP0972433A1 (zh)
CN (1) CN1296995C (zh)
AU (1) AU745437B2 (zh)
CA (1) CA2288099A1 (zh)
EG (1) EG21462A (zh)
SA (1) SA98190211A (zh)
TR (1) TR199903075T2 (zh)
TW (1) TW425833B (zh)
WO (1) WO1998046058A1 (zh)

Families Citing this family (129)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3068209B2 (ja) * 1997-06-23 2000-07-24 三菱電機株式会社 発熱体の水蒸発式冷却装置
FI973881A (fi) * 1997-10-03 1999-04-04 Nokia Telecommunications Oy Elektroniikkakaappi ja elektroniikkakaapin ilmakanavisto
EP0992430A3 (en) * 1998-10-07 2000-09-13 Negesat Di Boer Fabrizio & C. SNC Housing providing cooling for equipment aboard aircraft or spacecraft
US6313992B1 (en) 1998-12-22 2001-11-06 James J. Hildebrandt Method and apparatus for increasing the power density of integrated circuit boards and their components
US6108201A (en) * 1999-02-22 2000-08-22 Tilton; Charles L Fluid control apparatus and method for spray cooling
US6104610A (en) * 1999-07-29 2000-08-15 Tilton; Charles L. EMI shielding fluid control apparatus
US6237353B1 (en) * 1999-07-29 2001-05-29 Carrier Corporation System for removing parasitic losses in a refrigeration unit
JP2001052121A (ja) * 1999-08-13 2001-02-23 Fci Japan Kk カードコネクタ
US6205799B1 (en) 1999-09-13 2001-03-27 Hewlett-Packard Company Spray cooling system
US6354370B1 (en) * 1999-12-16 2002-03-12 The United States Of America As Represented By The Secretary Of The Air Force Liquid spray phase-change cooling of laser devices
US6292364B1 (en) * 2000-04-28 2001-09-18 Raytheon Company Liquid spray cooled module
US6377458B1 (en) * 2000-07-31 2002-04-23 Hewlett-Packard Company Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump
US6459581B1 (en) * 2000-12-19 2002-10-01 Harris Corporation Electronic device using evaporative micro-cooling and associated methods
EP1217708A1 (de) * 2000-12-21 2002-06-26 Abb Research Ltd. Vorrichtung der Supraleitungstechnik
US6550263B2 (en) 2001-02-22 2003-04-22 Hp Development Company L.L.P. Spray cooling system for a device
US6484521B2 (en) 2001-02-22 2002-11-26 Hewlett-Packard Company Spray cooling with local control of nozzles
US6644058B2 (en) 2001-02-22 2003-11-11 Hewlett-Packard Development Company, L.P. Modular sprayjet cooling system
US6708515B2 (en) 2001-02-22 2004-03-23 Hewlett-Packard Development Company, L.P. Passive spray coolant pump
US7082778B2 (en) * 2001-02-22 2006-08-01 Hewlett-Packard Development Company, L.P. Self-contained spray cooling module
US6595014B2 (en) 2001-02-22 2003-07-22 Hewlett-Packard Development Company, L.P. Spray cooling system with cooling regime detection
US6378988B1 (en) * 2001-03-19 2002-04-30 Microfab Technologies, Inc. Cartridge element for micro jet dispensing
US6993926B2 (en) 2001-04-26 2006-02-07 Rini Technologies, Inc. Method and apparatus for high heat flux heat transfer
US7654100B2 (en) * 2001-04-26 2010-02-02 Rini Technologies, Inc. Method and apparatus for high heat flux heat transfer
US6571569B1 (en) 2001-04-26 2003-06-03 Rini Technologies, Inc. Method and apparatus for high heat flux heat transfer
US6498725B2 (en) 2001-05-01 2002-12-24 Mainstream Engineering Corporation Method and two-phase spray cooling apparatus
US6646879B2 (en) * 2001-05-16 2003-11-11 Cray Inc. Spray evaporative cooling system and method
US6904968B2 (en) * 2001-09-14 2005-06-14 Hewlett-Packard Development Company, L.P. Method and apparatus for individually cooling components of electronic systems
DE10158387B4 (de) * 2001-11-28 2017-01-19 Modine Manufacturing Co. Anordnung zur Kühlung von elektrischen Komponenten
US6955062B2 (en) * 2002-03-11 2005-10-18 Isothermal Systems Research, Inc. Spray cooling system for transverse thin-film evaporative spray cooling
US6746212B2 (en) 2002-03-22 2004-06-08 Intel Corporation High efficiency pump for liquid-cooling of electronics
US6604571B1 (en) 2002-04-11 2003-08-12 General Dynamics Land Systems, Inc. Evaporative cooling of electrical components
US6574094B1 (en) 2002-04-11 2003-06-03 General Dynamics Land Systems Inc. Method and apparatus for cooling bus bars
US6625023B1 (en) 2002-04-11 2003-09-23 General Dynamics Land Systems, Inc. Modular spray cooling system for electronic components
US6889509B1 (en) * 2002-09-13 2005-05-10 Isothermal Systems Research Inc. Coolant recovery system
US6857283B2 (en) * 2002-09-13 2005-02-22 Isothermal Systems Research, Inc. Semiconductor burn-in thermal management system
US6880350B2 (en) * 2002-09-13 2005-04-19 Isothermal Systems Research, Inc. Dynamic spray system
US7836706B2 (en) 2002-09-27 2010-11-23 Parker Intangibles Llc Thermal management system for evaporative spray cooling
US7159414B2 (en) * 2002-09-27 2007-01-09 Isothermal Systems Research Inc. Hotspot coldplate spray cooling system
US6697258B1 (en) 2002-10-24 2004-02-24 The Raymond Corporation Moisture-resistant enclosure for electronic circuitry
US6889515B2 (en) 2002-11-12 2005-05-10 Isothermal Systems Research, Inc. Spray cooling system
TW551029B (en) * 2002-12-31 2003-09-01 Mitac Technology Corp Controlling device and method to proceed cooling onto the object requiring heat dissipation by coolant
US6976528B1 (en) 2003-02-18 2005-12-20 Isothermal Systems Research, Inc. Spray cooling system for extreme environments
US6955063B2 (en) * 2003-06-14 2005-10-18 Nanomist Systems, Llc Cooling of electronics and high density power dissipation systems by fine-mist flooding
US7150109B2 (en) * 2003-08-25 2006-12-19 Isothermal Systems Research, Inc. Dry-wet thermal management system
US7043933B1 (en) 2003-08-26 2006-05-16 Isothermal Systems Research, Inc. Spray coolant reservoir system
US7180741B1 (en) * 2003-08-26 2007-02-20 Isothermal Systems Research, Inc. Spray cool system with a dry access chamber
US7240500B2 (en) * 2003-09-17 2007-07-10 Hewlett-Packard Development Company, L.P. Dynamic fluid sprayjet delivery system
JP3778910B2 (ja) * 2003-12-15 2006-05-24 株式会社ソニー・コンピュータエンタテインメント 電子デバイス冷却装置、電子デバイス冷却方法および電子デバイス冷却制御プログラム
US7131825B2 (en) * 2004-01-30 2006-11-07 Isothermal Systems Research, Inc. Spindle-motor driven pump system
US7180751B1 (en) 2004-02-19 2007-02-20 Isothermal Systems Research, Inc. Input/output transition board system
US8430156B2 (en) * 2004-04-29 2013-04-30 Hewlett-Packard Development Company, L.P. Liquid loop with multiple pump assembly
US7165413B2 (en) * 2004-07-09 2007-01-23 Symons Robert S Integrated liquid cooling device with immersed electronic components
US7104078B2 (en) * 2004-08-05 2006-09-12 Isothermal Systems Research, Inc. Spray cooling system for transverse thin-film evaporative spray cooling
US7392660B2 (en) * 2004-08-05 2008-07-01 Isothermal Systems Research, Inc. Spray cooling system for narrow gap transverse evaporative spray cooling
EP1643822B1 (en) * 2004-09-30 2010-06-16 Saab Ab A method for cooling electronic components in an unmanned flying vehicle and a device for carrying out the method
US7079393B2 (en) * 2004-11-16 2006-07-18 International Business Machines Corporation Fluidic cooling systems and methods for electronic components
US7284389B2 (en) * 2005-01-21 2007-10-23 Hewlett-Packard Development Company, L.P. Two-fluid spray cooling system
DE102005005588B4 (de) * 2005-02-07 2008-03-13 Knürr AG Schaltschrank
US8550372B2 (en) * 2005-03-02 2013-10-08 Wisconsin Alumni Research Foundation Full coverage spray and drainage system and method for orientation-independent removal of high heat flux
US7717162B2 (en) * 2005-12-22 2010-05-18 Isothermal Systems Research, Inc. Passive fluid recovery system
US7743619B1 (en) * 2006-01-06 2010-06-29 Isothermal Research Systems, Inc. Heat exchanger system
US8174828B2 (en) * 2006-02-06 2012-05-08 Parker-Hannifin Corporation Narrow gap spray cooling in a globally cooled enclosure
US7602608B2 (en) * 2006-02-06 2009-10-13 Isothermal Systems Research, Inc. Narrow gap spray cooling in a globally cooled enclosure
US7495914B2 (en) * 2006-02-06 2009-02-24 Isothermal Systems Research, Inc. Narrow gap spray cooling in a globally cooled enclosure
US7522417B2 (en) * 2006-03-30 2009-04-21 Wisconsin Alumni Research Foundation Multi-mode fluid cooling system and method
EP2022302A4 (en) * 2006-06-02 2010-07-21 Ericsson Telefon Ab L M TEMPERATURE MANAGEMENT FOR ELECTRONIC COMPONENTS
US7561425B2 (en) * 2006-06-07 2009-07-14 The Boeing Company Encapsulated multi-phase electronics heat-sink
US20080093054A1 (en) * 2006-08-29 2008-04-24 Tilton Charles L Manifold for a Two-Phase Cooling System
US7709296B2 (en) 2006-10-19 2010-05-04 International Business Machines Corporation Coupling metal clad fiber optics for enhanced heat dissipation
TWI304466B (en) * 2006-10-24 2008-12-21 Ind Tech Res Inst Micro spray cooling system
US7450378B2 (en) * 2006-10-25 2008-11-11 Gm Global Technology Operations, Inc. Power module having self-contained cooling system
US7405935B1 (en) * 2006-11-28 2008-07-29 Isothermal Systems Research, Inc. Service tray for a thermal management system
US20080264614A1 (en) * 2007-04-27 2008-10-30 Szolyga Thomas H Cooling components in electronic devices
CN101339449A (zh) * 2007-07-02 2009-01-07 鸿富锦精密工业(深圳)有限公司 散热结构组合
US7854547B2 (en) * 2007-08-07 2010-12-21 International Business Machines Corporation Bidirectional and expandable heat flow measurement tool for units of air cooled electrical equipment
US20090147472A1 (en) * 2007-12-11 2009-06-11 Honeywell International Inc. Means to Utilize Conduction-cooled Electronics Modules in an Air Cooled System
CA2731994C (en) * 2008-08-11 2018-03-06 Green Revolution Cooling, Inc. Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
US7796384B2 (en) * 2008-08-27 2010-09-14 Honeywell International Inc. Hybrid chassis cooling system
CA2737091C (en) * 2008-09-15 2017-01-24 Cooper Technologies Company Integrated condition or actuation monitoring and control component for switches, circuit breakers,panel boards, and other items for electrical control and circuit protection
US7961475B2 (en) * 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7885070B2 (en) * 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US7916483B2 (en) * 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7944694B2 (en) * 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7983040B2 (en) * 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7724524B1 (en) * 2008-11-12 2010-05-25 International Business Machines Corporation Hybrid immersion cooled server with integral spot and bath cooling
US8197124B2 (en) * 2009-02-05 2012-06-12 International Business Machines Corporation Heat flow measurement tool for a rack mounted assembly of electronic equipment
FR2943488B1 (fr) * 2009-03-23 2011-04-22 Converteam Technology Ltd Module electrique destine a etre immerge dans de l'eau
US8373959B2 (en) * 2009-09-08 2013-02-12 International Business Machines Corporation Detecting and preventing overheating in power connectors
US8956130B2 (en) * 2009-12-23 2015-02-17 Pentair Flow Technologies, Llc Redundant sump pump system
AT11837U1 (de) * 2010-06-21 2011-05-15 Avl List Gmbh Mobiles messgerät
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
EP2593765B1 (en) * 2010-07-16 2018-04-04 Kulite Semiconductor Products, Inc. Pressure scanner assemblies having replaceable sensor plates
US8671697B2 (en) 2010-12-07 2014-03-18 Parker-Hannifin Corporation Pumping system resistant to cavitation
US9261308B2 (en) 2012-11-08 2016-02-16 International Business Machines Corporation Pump-enhanced, sub-cooling of immersion-cooling fluid
US9357675B2 (en) 2013-10-21 2016-05-31 International Business Machines Corporation Pump-enhanced, immersion-cooling of electronic component(s)
DE112015002386T5 (de) 2014-05-21 2017-02-02 Cooper Technologies Company Gehäusediagnose- und -steuersysteme
JP5853072B1 (ja) * 2014-08-25 2016-02-09 株式会社ExaScaler 電子機器の冷却システム
US11032939B2 (en) * 2014-09-26 2021-06-08 Liquidcool Solutions, Inc. Liquid submersion cooled electronic systems
WO2016175834A1 (en) * 2015-04-30 2016-11-03 Hewlett Packard Enterprise Development Lp Cooling via a sleeve connector
EP3177125B1 (en) 2015-12-01 2019-12-11 Aselsan Elektronik Sanayi ve Ticaret Anonim Sirketi A hybrid cooling device
CN105658037B (zh) * 2016-03-18 2018-04-20 苏州大景能源科技有限公司 一种整体式液冷散热机箱
CN105934138B (zh) * 2016-06-16 2018-05-22 广东合一新材料研究院有限公司 高功率电磁波发生器的工质接触式冷却系统及其工作方法
CN105934140B (zh) * 2016-06-16 2018-08-31 广东合一新材料研究院有限公司 一种大功率电力器件的工质接触式冷却系统
CN105934139B (zh) * 2016-06-16 2018-05-22 广东合一新材料研究院有限公司 大功率器件的工质接触式冷却系统及其工作方法
CN105960148B (zh) * 2016-06-16 2018-08-31 广东合一新材料研究院有限公司 一种可间断式工质接触式冷却系统
CN106455433B (zh) * 2016-10-17 2019-02-05 广东合一新材料研究院有限公司 一种直接接触式冷却机柜的布液系统
CN106455439B (zh) * 2016-10-31 2018-12-04 广东合一新材料研究院有限公司 一种数据中心机房集中冷却系统
GB201619987D0 (en) * 2016-11-25 2017-01-11 Iceotope Ltd Fluid cooling system
US10028409B1 (en) * 2017-01-06 2018-07-17 Hamilton Sundstrand Corporation Immersion cooling arrangements
JP6944251B2 (ja) * 2017-02-27 2021-10-06 川崎重工業株式会社 制御盤
DE102018211666A1 (de) * 2018-07-12 2020-01-16 Mahle International Gmbh Kühlanordnung
WO2020027725A1 (en) * 2018-07-30 2020-02-06 Nanyang Technological University Server rack cooling arrangement
SG10201809662QA (en) * 2018-10-31 2020-05-28 Kong Chye Gregory Ong Enclosure for providing liquid film cooling
CN109483520A (zh) * 2018-11-30 2019-03-19 华北科技学院 一种可用机器人快速更换的机电模块
US11432426B2 (en) * 2019-04-14 2022-08-30 Aertight Systems, Inc. Computer isolation housing
CN110001548B (zh) * 2019-04-15 2020-10-27 哈尔滨理工大学 一种纯电动汽车整车控制器
US11291143B2 (en) * 2019-12-27 2022-03-29 Baidu Usa Llc Cooling design for electronics enclosure
US11597255B2 (en) * 2020-03-25 2023-03-07 Pony Al Inc. Systems and methods for cooling vehicle components
CN212341825U (zh) * 2020-06-29 2021-01-12 建准电机工业股份有限公司 浸没式冷却系统及具有该浸没式冷却系统的电子装置
US11531383B1 (en) * 2020-09-30 2022-12-20 Amazon Technologies, Inc. Mist cooling for computer systems
US11924998B2 (en) 2021-04-01 2024-03-05 Ovh Hybrid immersion cooling system for rack-mounted electronic assemblies
US11729950B2 (en) * 2021-04-01 2023-08-15 Ovh Immersion cooling system with dual dielectric cooling liquid circulation
US11805624B2 (en) 2021-09-17 2023-10-31 Green Revolution Cooling, Inc. Coolant shroud
US11925946B2 (en) 2022-03-28 2024-03-12 Green Revolution Cooling, Inc. Fluid delivery wand
JP2024009658A (ja) * 2022-07-11 2024-01-23 三菱重工業株式会社 冷却装置

Family Cites Families (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2845472A (en) * 1953-08-28 1958-07-29 Westinghouse Electric Corp Transformer cooling apparatus
US2901893A (en) * 1956-05-24 1959-09-01 Alvin R Saltzman Thermal diffusion desorption cooling system
US2906103A (en) * 1957-06-10 1959-09-29 Alvin R Saltzman Chassis design for inert carrier gasliquid thermal diffusion cooling system
US3004406A (en) * 1958-05-02 1961-10-17 Phillips Petroleum Co Quenching hot liquids
DE1279605B (de) * 1964-12-21 1968-10-10 Roechlingsche Eisen & Stahl Mittel und Vorrichtung zum Kuehlen von zu Ringen gehaspeltem Walzdraht
BE788766A (fr) * 1971-09-23 1973-01-02 Bunker Ramo Assemblages de traversee electriques
US3725566A (en) * 1972-05-01 1973-04-03 Us Navy Evaporative cooling and heat extraction system
US3801241A (en) * 1973-02-08 1974-04-02 Micropump Corp Pump impeller construction
US4056949A (en) * 1973-05-02 1977-11-08 Hermann Heye Apparatus for cooling tools of glass-forming machines by evaporation of a cooling liquid
US3997376A (en) * 1974-06-19 1976-12-14 Midland-Ross Corporation Spray mist cooling method
DE2443122B2 (de) * 1974-09-09 1979-05-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Gerät für die Hochfrequenz- und Nachrichtentechnik
US4111614A (en) * 1977-01-24 1978-09-05 Micropump Corporation Magnetically coupled gear pump construction
US4127365A (en) * 1977-01-28 1978-11-28 Micropump Corporation Gear pump with suction shoe at gear mesh point
US4165206A (en) * 1977-01-28 1979-08-21 Micropump Corporation Three gear pump with module construction
IT1098750B (it) * 1977-08-29 1985-09-07 Carrier Corp Blocco terminale
US4163164A (en) * 1977-10-11 1979-07-31 Micropump Corporation Split magnet drive
US4629269A (en) * 1977-10-25 1986-12-16 Allied Corporation Electrical connector with environmental seal
JPS5848019B2 (ja) * 1979-11-09 1983-10-26 石川島播磨重工業株式会社 鋼板の噴霧冷却方法及びその装置
US4352392A (en) * 1980-12-24 1982-10-05 Thermacore, Inc. Mechanically assisted evaporator surface
US4399484A (en) * 1981-03-10 1983-08-16 The United States Of America As Represented By The Secretary Of The Air Force Integral electric module and assembly jet cooling system
US4407136A (en) * 1982-03-29 1983-10-04 Halliburton Company Downhole tool cooling system
US4493625A (en) * 1982-08-06 1985-01-15 Micropump Corporation Grooved gear pump
US4498118A (en) * 1983-04-05 1985-02-05 Bicc-Vero Electronics Limited Circuit board installation
US4846641A (en) * 1983-08-08 1989-07-11 Micropump Corporation Readily-removable floating bushing pump construction
US4666228A (en) * 1983-09-28 1987-05-19 Pave Technology Co. Hermetic connector and method
CA1227886A (en) * 1984-01-26 1987-10-06 Haruhiko Yamamoto Liquid-cooling module system for electronic circuit components
JPS60229353A (ja) * 1984-04-27 1985-11-14 Hitachi Ltd 熱伝達装置
FR2578553B1 (fr) * 1985-03-06 1989-01-06 Bertin & Cie Installation de refroidissement par pulverisation
US4715189A (en) * 1985-11-12 1987-12-29 Hypres, Inc. Open cycle cooling of electrical circuits
US4750086A (en) * 1985-12-11 1988-06-07 Unisys Corporation Apparatus for cooling integrated circuit chips with forced coolant jet
JPS63120449A (ja) * 1986-11-10 1988-05-24 Fujitsu Ltd 集積回路素子の蒸発冷却装置
US5021001A (en) * 1987-01-29 1991-06-04 Lucas Weinschel Inc. Multiple use electrical connector having planar exposed surface
US4838041A (en) * 1987-02-05 1989-06-13 Gte Laboratories Incorporated Expansion/evaporation cooling system for microelectronic devices
JPH065700B2 (ja) * 1987-07-22 1994-01-19 株式会社日立製作所 電子回路デバイスの冷却装置
CA1303238C (en) * 1988-05-09 1992-06-09 Kazuhiko Umezawa Flat cooling structure of integrated circuit
IT1218075B (it) * 1988-06-15 1990-04-12 Fimac Spa Dispositivo per il raffredamento di zone con superficie di scambio termico limitata,in particolare per componenti elettronici
US4866570A (en) * 1988-08-05 1989-09-12 Ncr Corporation Apparatus and method for cooling an electronic device
US4912600A (en) * 1988-09-07 1990-03-27 Auburn Univ. Of The State Of Alabama Integrated circuit packaging and cooling
JP2708495B2 (ja) * 1988-09-19 1998-02-04 株式会社日立製作所 半導体冷却装置
US5183104A (en) * 1989-06-16 1993-02-02 Digital Equipment Corporation Closed-cycle expansion-valve impingement cooling system
JPH03229493A (ja) * 1990-02-05 1991-10-11 Fujitsu Ltd 浸漬冷却構造
US5097385A (en) * 1990-04-18 1992-03-17 International Business Machines Corporation Super-position cooling
JPH07114250B2 (ja) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 熱伝達システム
US5265670A (en) * 1990-04-27 1993-11-30 International Business Machines Corporation Convection transfer system
US5067047A (en) * 1990-05-11 1991-11-19 At&T Bell Laboratories Circuit pack with inboard jet cooling
GB9013403D0 (en) * 1990-06-15 1990-08-08 Ibm Lock mechanism
USH1145H (en) * 1990-09-25 1993-03-02 Sematech, Inc. Rapid temperature response wafer chuck
CA2053055C (en) * 1990-10-11 1997-02-25 Tsukasa Mizuno Liquid cooling system for lsi packages
US5096390A (en) * 1990-10-16 1992-03-17 Micropump Corporation Pump assembly with integral electronically commutated drive system
JPH04161957A (ja) * 1990-10-24 1992-06-05 Nippon Paint Co Ltd 光重合性組成物および感光性平版印刷版
US5129449A (en) * 1990-12-26 1992-07-14 Sundstrand Corporation High performance heat exchanger
US5131233A (en) * 1991-03-08 1992-07-21 Cray Computer Corporation Gas-liquid forced turbulence cooling
JP2995590B2 (ja) * 1991-06-26 1999-12-27 株式会社日立製作所 半導体冷却装置
US5263536A (en) * 1991-07-19 1993-11-23 Thermo Electron Technologies Corp. Miniature heat exchanger
US5228502A (en) * 1991-09-04 1993-07-20 International Business Machines Corporation Cooling by use of multiple parallel convective surfaces
JPH05136305A (ja) * 1991-11-08 1993-06-01 Hitachi Ltd 発熱体の冷却装置
US5220804A (en) * 1991-12-09 1993-06-22 Isothermal Systems Research, Inc High heat flux evaporative spray cooling
US5311931A (en) * 1991-12-27 1994-05-17 The Research Foundation Of State University Of New York Mist supercooling of a heated surface
JP2792304B2 (ja) * 1992-01-22 1998-09-03 日本電気株式会社 集積回路用冷却装置
CA2088821C (en) * 1992-02-05 1999-09-07 Hironobu Ikeda Cooling structure for integrated circuit
DE69321501T2 (de) * 1992-02-10 1999-03-04 Nec Corp Kühlvorrichtung für Bauteile mit elektronischen Schaltungen
JP2745948B2 (ja) * 1992-04-06 1998-04-28 日本電気株式会社 集積回路の冷却構造
US5239443A (en) * 1992-04-23 1993-08-24 International Business Machines Corporation Blind hole cold plate cooling system
US5406807A (en) * 1992-06-17 1995-04-18 Hitachi, Ltd. Apparatus for cooling semiconductor device and computer having the same
JP2853481B2 (ja) * 1992-09-30 1999-02-03 日本電気株式会社 半導体素子の冷却構造
US5320554A (en) * 1992-10-02 1994-06-14 Compaq Computer Corp. Attachment unit interface connector
US5316075A (en) * 1992-12-22 1994-05-31 Hughes Aircraft Company Liquid jet cold plate for impingement cooling
JP2500757B2 (ja) * 1993-06-21 1996-05-29 日本電気株式会社 集積回路の冷却構造
US5435884A (en) * 1993-09-30 1995-07-25 Parker-Hannifin Corporation Spray nozzle and method of manufacturing same
US5412536A (en) * 1994-03-28 1995-05-02 International Business Machines Corporation Local condensation control for liquid impingement two-phase cooling
US5831824A (en) * 1996-01-31 1998-11-03 Motorola, Inc. Apparatus for spray-cooling multiple electronic modules
US5687577A (en) * 1996-04-10 1997-11-18 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
EP0990378B1 (en) * 1996-05-16 2005-01-12 L-3 Communications Integrated Systems L.P. Heat spreader system and method for cooling heat generating components
KR100212987B1 (ko) * 1996-06-18 1999-08-02 윤종용 하드디스크 드라이브의 헤더 콘넥터 장치

Also Published As

Publication number Publication date
CN1296995C (zh) 2007-01-24
US5907473A (en) 1999-05-25
SA98190211A (ar) 2005-12-03
CA2288099A1 (en) 1998-10-15
CN1260944A (zh) 2000-07-19
AU745437B2 (en) 2002-03-21
US6139361A (en) 2000-10-31
WO1998046058A1 (en) 1998-10-15
EP0972433A1 (en) 2000-01-19
TR199903075T2 (xx) 2000-04-21
TW425833B (en) 2001-03-11
AU6878698A (en) 1998-10-30

Similar Documents

Publication Publication Date Title
EG21462A (en) Environmentally isolated enclosure for electronic components
AU2200700A (en) Simple enclosure for electronic components
GB2317745B (en) Metallic housing for electronic components
GB2335079A8 (en) Switch assembly for an electronic device
EP0971381A4 (en) ELECTRONIC COMPONENT
GB2340667B (en) Housing for an electronic component
SG72793A1 (en) Electronic speed-control circuit
GB9702120D0 (en) Electronic circuit
HUP9801903A3 (en) Electronic circuit
GB9419260D0 (en) Enclosure for electrical components
HUP9801904A3 (en) Electronic interrupter
GB2322973B (en) Shielding case for electronic equipment
TW438212U (en) Electronic machine
GB9725999D0 (en) Enclosure
CA81279S (en) Enclosure for electronic circuitry
CA81600S (en) Enclosure for electronic circuitry
GB9727271D0 (en) Electronic circuit
AU129764S (en) An electronic computer
GB2325313B (en) Electronic circuits
GB9704064D0 (en) Electronic circuits
TW349725U (en) Circuit new structure for electronic stabilizator
AU129956S (en) An electronic computer
ZA988458B (en) An enclosure
TW335156U (en) Box structure for electronic target
GB9827309D0 (en) Novel electronic components