DE602004027731D1 - Verfahren zur kühlung elektronische Bauteile in einem unbemannten Flugkörper und Vorrichtung zur Durchführung des Verfahrens - Google Patents

Verfahren zur kühlung elektronische Bauteile in einem unbemannten Flugkörper und Vorrichtung zur Durchführung des Verfahrens

Info

Publication number
DE602004027731D1
DE602004027731D1 DE602004027731T DE602004027731T DE602004027731D1 DE 602004027731 D1 DE602004027731 D1 DE 602004027731D1 DE 602004027731 T DE602004027731 T DE 602004027731T DE 602004027731 T DE602004027731 T DE 602004027731T DE 602004027731 D1 DE602004027731 D1 DE 602004027731D1
Authority
DE
Germany
Prior art keywords
electronic components
carrying
cooling electronic
unmanned missile
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004027731T
Other languages
English (en)
Inventor
Karl-Johan Molin
Lars Olsson
Hakan Bjoerk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saab AB
Original Assignee
Saab AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saab AB filed Critical Saab AB
Publication of DE602004027731D1 publication Critical patent/DE602004027731D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20345—Sprayers; Atomizers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1434—Housings for electronics exposed to high gravitational force; Cylindrical housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
  • Aiming, Guidance, Guns With A Light Source, Armor, Camouflage, And Targets (AREA)
DE602004027731T 2004-09-30 2004-09-30 Verfahren zur kühlung elektronische Bauteile in einem unbemannten Flugkörper und Vorrichtung zur Durchführung des Verfahrens Active DE602004027731D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04023324A EP1643822B1 (de) 2004-09-30 2004-09-30 Verfahren zur kühlung elektronische Bauteile in einem unbemannten Flugkörper und Vorrichtung zur Durchführung des Verfahrens

Publications (1)

Publication Number Publication Date
DE602004027731D1 true DE602004027731D1 (de) 2010-07-29

Family

ID=34926797

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004027731T Active DE602004027731D1 (de) 2004-09-30 2004-09-30 Verfahren zur kühlung elektronische Bauteile in einem unbemannten Flugkörper und Vorrichtung zur Durchführung des Verfahrens

Country Status (6)

Country Link
US (1) US7561424B2 (de)
EP (1) EP1643822B1 (de)
AT (1) ATE471653T1 (de)
DE (1) DE602004027731D1 (de)
ES (1) ES2345197T3 (de)
ZA (1) ZA200507888B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8003004B2 (en) * 2008-01-23 2011-08-23 3M Innovative Properties Company Heat transfer apparatus and methods including hydrofluorocarbonates
US8412411B2 (en) * 2009-12-14 2013-04-02 Robert Bosch Gmbh Electronic control module heat limiting systems and methods
US10006720B2 (en) * 2011-08-01 2018-06-26 Teledyne Scientific & Imaging, Llc System for using active and passive cooling for high power thermal management
KR102059611B1 (ko) 2015-08-11 2019-12-26 주식회사 엘지화학 무인 비행체용 전지팩 및 이를 포함하는 무인 비행체
US10274251B2 (en) 2016-03-16 2019-04-30 Walmart Apollo, Llc Systems and methods for cooling products during transportation
US10231360B2 (en) * 2016-11-09 2019-03-12 Lockheed Martin Corporation Dual-mode passive thermal management system and method
JP6771407B2 (ja) * 2017-03-07 2020-10-21 株式会社フェザーグラス 除熱方法及び除熱システム
US20190289745A1 (en) * 2018-03-13 2019-09-19 Rosemount Aerospace Inc. Flexible heat sink for aircraft electronic units

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB837022A (en) * 1957-02-28 1960-06-09 Gen Electric Co Ltd Improvements in or relating to cooling arrangements
US4922381A (en) * 1986-03-25 1990-05-01 Hughes Aircraft Company Stacked circuit cards and guided configurations
JPH05113299A (ja) * 1991-10-22 1993-05-07 Mitsubishi Electric Corp 誘導飛翔体
US5184470A (en) 1991-11-18 1993-02-09 Hughes Aircraft Company Endothermic cooler for electronic components
US5515910A (en) * 1993-05-03 1996-05-14 Micro Control System Apparatus for burn-in of high power semiconductor devices
US5907473A (en) * 1997-04-04 1999-05-25 Raytheon Company Environmentally isolated enclosure for electronic components
US7082778B2 (en) * 2001-02-22 2006-08-01 Hewlett-Packard Development Company, L.P. Self-contained spray cooling module
US6595014B2 (en) * 2001-02-22 2003-07-22 Hewlett-Packard Development Company, L.P. Spray cooling system with cooling regime detection
US6498725B2 (en) * 2001-05-01 2002-12-24 Mainstream Engineering Corporation Method and two-phase spray cooling apparatus
US6578491B2 (en) * 2001-09-10 2003-06-17 Raytheon Company Externally accessible thermal ground plane for tactical missiles
US6625023B1 (en) * 2002-04-11 2003-09-23 General Dynamics Land Systems, Inc. Modular spray cooling system for electronic components
US6889509B1 (en) * 2002-09-13 2005-05-10 Isothermal Systems Research Inc. Coolant recovery system
US6880350B2 (en) * 2002-09-13 2005-04-19 Isothermal Systems Research, Inc. Dynamic spray system
TW551029B (en) * 2002-12-31 2003-09-01 Mitac Technology Corp Controlling device and method to proceed cooling onto the object requiring heat dissipation by coolant
US6976528B1 (en) * 2003-02-18 2005-12-20 Isothermal Systems Research, Inc. Spray cooling system for extreme environments
US6955063B2 (en) * 2003-06-14 2005-10-18 Nanomist Systems, Llc Cooling of electronics and high density power dissipation systems by fine-mist flooding
US6953082B2 (en) * 2003-12-16 2005-10-11 3M Innovative Properties Company Hydrofluoroether as a heat-transfer fluid
US7602608B2 (en) * 2006-02-06 2009-10-13 Isothermal Systems Research, Inc. Narrow gap spray cooling in a globally cooled enclosure

Also Published As

Publication number Publication date
ZA200507888B (en) 2006-08-30
ES2345197T3 (es) 2010-09-17
US20060250775A1 (en) 2006-11-09
ATE471653T1 (de) 2010-07-15
US7561424B2 (en) 2009-07-14
EP1643822B1 (de) 2010-06-16
EP1643822A1 (de) 2006-04-05

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