DK461589A - Uv-haerdelig materialer til fremstilling af trykte kredsloeb - Google Patents

Uv-haerdelig materialer til fremstilling af trykte kredsloeb Download PDF

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Publication number
DK461589A
DK461589A DK461589A DK461589A DK461589A DK 461589 A DK461589 A DK 461589A DK 461589 A DK461589 A DK 461589A DK 461589 A DK461589 A DK 461589A DK 461589 A DK461589 A DK 461589A
Authority
DK
Denmark
Prior art keywords
preparation
printed circuits
curable materials
curable
materials
Prior art date
Application number
DK461589A
Other languages
Danish (da)
English (en)
Other versions
DK461589D0 (da
Inventor
Paul Ling Kong Hung
Kenneth Kuo-Shu Tseng
Original Assignee
M & T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M & T Chemicals Inc filed Critical M & T Chemicals Inc
Publication of DK461589D0 publication Critical patent/DK461589D0/da
Publication of DK461589A publication Critical patent/DK461589A/da

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/035Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/114Initiator containing
    • Y10S430/117Free radical

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
DK461589A 1988-09-20 1989-09-19 Uv-haerdelig materialer til fremstilling af trykte kredsloeb DK461589A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/247,052 US5006436A (en) 1988-09-20 1988-09-20 UV curable compositions for making tentable solder mask coating

Publications (2)

Publication Number Publication Date
DK461589D0 DK461589D0 (da) 1989-09-19
DK461589A true DK461589A (da) 1990-03-21

Family

ID=22933355

Family Applications (1)

Application Number Title Priority Date Filing Date
DK461589A DK461589A (da) 1988-09-20 1989-09-19 Uv-haerdelig materialer til fremstilling af trykte kredsloeb

Country Status (13)

Country Link
US (1) US5006436A (ko)
EP (1) EP0360579A1 (ko)
JP (1) JPH02210443A (ko)
KR (1) KR900005230A (ko)
CN (1) CN1043397A (ko)
AU (1) AU4145989A (ko)
BR (1) BR8904708A (ko)
DK (1) DK461589A (ko)
FI (1) FI894430A (ko)
IL (1) IL91686A0 (ko)
NO (1) NO893734L (ko)
PT (1) PT91735A (ko)
ZA (1) ZA897138B (ko)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5420171A (en) * 1991-12-31 1995-05-30 Tech Spray, Inc. UV curable temporary solder mask
JPH06295060A (ja) * 1992-10-29 1994-10-21 Ajinomoto Co Inc 感光性樹脂組成物又は感光性熱硬化性樹脂組成物及びそれらを使用したフォトソルダ−レジスト組成物
DE69325391T2 (de) * 1993-01-20 2000-02-24 Agfa Gevaert Nv Fotopolymerisierbare Zusammensetzung mit hoher Empfindlichkeit und dieseZusammensetzung verwendendes Vefahren zum Herstellen von Bildern
EP0750229B1 (en) * 1994-03-04 1999-10-06 Asahi Kasei Kogyo Kabushiki Kaisha Liquid photosensitive resin composition for forming relief structures
EP0868685A1 (en) 1995-12-21 1998-10-07 The Dow Chemical Company Solder mask compositions
US5707782A (en) * 1996-03-01 1998-01-13 The Board Of Trustees Of The University Of Illinois Photoimageable, dielectric, crosslinkable copolyesters
DE69800652T2 (de) * 1997-02-25 2001-08-23 Du Pont Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten
US5874197A (en) * 1997-09-18 1999-02-23 E. I. Du Pont De Nemours And Company Thermal assisted photosensitive composition and method thereof
AU1383699A (en) 1997-11-06 1999-05-31 Edgington Company, The Coating composition
EP0921152B1 (en) 1997-12-02 2006-04-05 Ciba SC Holding AG Polyolefin materials having enhanced surface durability and methods of making the same by exposure to radiation
US6331317B1 (en) * 1999-11-12 2001-12-18 Alkermes Controlled Therapeutics Ii Inc. Apparatus and method for preparing microparticles
AU2001284499A1 (en) 2000-09-11 2002-03-26 Showa Denko K K Photosensitive composition, cured article thereof, and printed circuit board using the same
US6762231B2 (en) * 2000-12-15 2004-07-13 The College Of William And Mary Organic thiol metal-free stabilizers and plasticizers for halogen-containing polymers
US6667357B2 (en) 2000-12-15 2003-12-23 The College Of William And Mary Organic thiol metal-free stabilizers and plasticizers for halogen-containing polymers
US6927247B2 (en) * 2000-12-15 2005-08-09 The College Of William And Mary Organic thiol metal-free stabilizers and plasticizers for halogen-containing polymers
US7312266B2 (en) * 2000-12-15 2007-12-25 The College Of William And Mary Organic thiol metal-free stabilizers and plasticizers for halogen-containing polymers
JP4581706B2 (ja) * 2004-01-29 2010-11-17 住友ベークライト株式会社 ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法
JP4587865B2 (ja) * 2004-04-22 2010-11-24 昭和電工株式会社 感光性樹脂組成物及びその硬化物並びにそれらを使用するプリント配線基板の製造方法
JP2007010785A (ja) * 2005-06-28 2007-01-18 Fujifilm Holdings Corp 永久パターン形成方法
TWI426351B (zh) * 2006-11-15 2014-02-11 Taiyo Holdings Co Ltd Photolithography (Phototool) and the formation of resistance to resistance pattern
JP6361944B1 (ja) * 2017-01-24 2018-07-25 東洋インキScホールディングス株式会社 カラーフィルタ用感光性組成物及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3048502A1 (de) * 1980-12-22 1982-07-22 Hoechst Ag, 6000 Frankfurt Durch strahlung polymerisierbares gemisch und daraus hergestelltes strahlungsempfindliches aufzeichnungsmaterial
US4422914A (en) * 1981-01-16 1983-12-27 W. R. Grace & Co. Polymer composition having terminal alkene and terminal carboxyl groups
JPS5986045A (ja) * 1982-11-05 1984-05-18 Nippon Soda Co Ltd 永久レジスト用光硬化性樹脂組成物
US4572890A (en) * 1983-05-11 1986-02-25 Ciba-Geigy Corporation Process for the production of images
DE3412992A1 (de) * 1984-04-06 1985-10-24 Hoechst Ag, 6230 Frankfurt Durch strahlung polymerisierbares gemisch und verfahren zum aufbringen von markierungen auf eine loetstopresistschicht
US4849320A (en) * 1986-05-10 1989-07-18 Ciba-Geigy Corporation Method of forming images

Also Published As

Publication number Publication date
JPH02210443A (ja) 1990-08-21
US5006436A (en) 1991-04-09
CN1043397A (zh) 1990-06-27
DK461589D0 (da) 1989-09-19
PT91735A (pt) 1990-03-30
FI894430A (fi) 1990-03-21
AU4145989A (en) 1990-03-29
EP0360579A1 (en) 1990-03-28
ZA897138B (en) 1990-06-27
BR8904708A (pt) 1990-05-01
FI894430A0 (fi) 1989-09-19
IL91686A0 (en) 1990-04-29
NO893734D0 (no) 1989-09-19
KR900005230A (ko) 1990-04-13
NO893734L (no) 1990-03-21

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