DK364586A - Epoxyharpiksmateriale og dets anvendelse - Google Patents

Epoxyharpiksmateriale og dets anvendelse Download PDF

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Publication number
DK364586A
DK364586A DK364586A DK364586A DK364586A DK 364586 A DK364586 A DK 364586A DK 364586 A DK364586 A DK 364586A DK 364586 A DK364586 A DK 364586A DK 364586 A DK364586 A DK 364586A
Authority
DK
Denmark
Prior art keywords
epoxy resin
bisphenol
preparation
acid
resin material
Prior art date
Application number
DK364586A
Other languages
Danish (da)
English (en)
Other versions
DK364586D0 (da
Inventor
Diane Sexton
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of DK364586D0 publication Critical patent/DK364586D0/da
Publication of DK364586A publication Critical patent/DK364586A/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C08G14/08—Ureas; Thioureas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Catalysts (AREA)
  • Measurement Of Force In General (AREA)
  • Materials For Medical Uses (AREA)
  • Organic Insulating Materials (AREA)
  • Insulating Bodies (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Graft Or Block Polymers (AREA)
DK364586A 1985-07-31 1986-07-31 Epoxyharpiksmateriale og dets anvendelse DK364586A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB858519290A GB8519290D0 (en) 1985-07-31 1985-07-31 Resin composition

Publications (2)

Publication Number Publication Date
DK364586D0 DK364586D0 (da) 1986-07-31
DK364586A true DK364586A (da) 1987-02-01

Family

ID=10583118

Family Applications (1)

Application Number Title Priority Date Filing Date
DK364586A DK364586A (da) 1985-07-31 1986-07-31 Epoxyharpiksmateriale og dets anvendelse

Country Status (17)

Country Link
US (2) US4713137A (de)
EP (1) EP0211382B1 (de)
JP (1) JPH0772225B2 (de)
KR (1) KR900001944B1 (de)
CN (1) CN1017248B (de)
AT (1) ATE106435T1 (de)
AU (1) AU593826B2 (de)
BR (1) BR8603615A (de)
CA (1) CA1292824C (de)
DE (1) DE3689869T2 (de)
DK (1) DK364586A (de)
ES (1) ES2001053A6 (de)
FI (1) FI89807C (de)
GB (1) GB8519290D0 (de)
IN (1) IN167874B (de)
MY (1) MY102533A (de)
NO (1) NO171414C (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1257434A (en) * 1985-08-26 1989-07-11 Gary W. Bogan Encapsulating compositions
ATE72450T1 (de) * 1986-12-15 1992-02-15 Siemens Nixdorf Inf Syst Verfahren zur herstellung von prepregs und deren verwendung.
US4732962A (en) * 1987-02-18 1988-03-22 General Motors Corporation High temperature epoxy tooling composition of bisphenol-A epoxy, trifunctional epoxy, anhydride curing agent and an imidazole catalyst
US4868059A (en) * 1987-11-16 1989-09-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
US5179139A (en) * 1988-10-24 1993-01-12 Mitsubishi Rayon Co., Ltd. Dihydroxybiphenyl-advanced epoxy resin blends
JP2829369B2 (ja) * 1988-10-24 1998-11-25 三菱レイヨン株式会社 エポキシ樹脂組成物
US5043184A (en) * 1989-02-06 1991-08-27 Somar Corporation Method of forming electrically conducting layer
ATE107676T1 (de) * 1989-03-03 1994-07-15 Siemens Ag Epoxidharz-formmassen.
US5166289A (en) * 1990-12-19 1992-11-24 Exxon Chemical Patents Inc. Thermoset coating composition having improved hardness
DE4110219A1 (de) * 1991-03-28 1992-10-01 Huels Troisdorf Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz
MY131084A (en) * 1991-04-03 2007-07-31 Dow Chemical Co Epoxy resin compositions for use in electrical laminates.
US5478607A (en) * 1991-05-17 1995-12-26 Hitachi Telecon Technologies Ltd. Method for use of preflux, printed wiring board, and method for production thereof
US5364925A (en) * 1992-01-27 1994-11-15 The Dow Chemical Company Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
WO1996028490A1 (fr) * 1995-03-14 1996-09-19 Nissan Chemical Industries, Ltd. Composition refractaire a base de resine epoxy
US6207595B1 (en) * 1998-03-02 2001-03-27 International Business Machines Corporation Laminate and method of manufacture thereof
JPH11279376A (ja) * 1998-03-27 1999-10-12 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板
ATE277103T1 (de) * 2002-01-28 2004-10-15 Abb Research Ltd Vergussmasse auf der basis duroplastischer epoxidharze
US7094843B2 (en) * 2002-08-19 2006-08-22 3M Innovative Properties Company Epoxy compositions having improved shelf life and articles containing the same
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
US7078816B2 (en) * 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
US7270845B2 (en) * 2004-03-31 2007-09-18 Endicott Interconnect Technologies, Inc. Dielectric composition for forming dielectric layer for use in circuitized substrates
US7145221B2 (en) * 2004-03-31 2006-12-05 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US8530053B2 (en) * 2004-10-27 2013-09-10 Nagase Chemtex Corporation Heat-resistant composite material
EP2162481A1 (de) * 2007-06-15 2010-03-17 Dow Global Technologies Inc. Verfahren zur herstellung von verbundwerkstoffen unter verwendung von epoxidharzzusammensetzungen
US8455573B2 (en) * 2010-12-20 2013-06-04 E I Du Pont De Nemours And Company Curable composition comprising imidazolium monocarboxylate salt
EP3261814B1 (de) 2015-02-27 2023-04-19 Huntsman Advanced Materials Licensing (Switzerland) GmbH Verfahren zur herstellung eines artikels aus faserverstärktem verbundwerkstoff, der hergestellte verbundwerkstoffartikel und seine verwendung

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3314912A (en) * 1963-01-23 1967-04-18 Hooker Chemical Corp Epoxy resin compositions containing triorgano phosphate diluents
CH506581A (de) * 1968-01-25 1971-04-30 Hoechst Ag Verfahren zur Herstellung von Epoxidharzschaumstoffen
DE1770400A1 (de) * 1968-05-13 1972-04-06 Hoechst Ag Verfahren zur Herstellung von Epoxidharzschaumstoffen
US3577370A (en) * 1968-08-05 1971-05-04 Armour Ind Chem Co Modifier for phenolic resins
US3842037A (en) * 1972-06-08 1974-10-15 Shell Oil Co Process for preparing higher molecular weight polyepoxide products by condensing lower molecular weight polyepoxide with polyhydric phenols
US4046733A (en) * 1975-12-30 1977-09-06 Westinghouse Electric Corporation Sulfonic acid composition for forming thermoparticulating coating
GB2038348A (en) * 1978-12-12 1980-07-23 Desai Polymer Dev Phenolic materials
US4331582A (en) * 1980-01-14 1982-05-25 Hitco Epoxy latent catalyst
US4366295A (en) * 1981-06-01 1982-12-28 The Dow Chemical Company Stable precatalyzed epoxy resin compositions
US4433014A (en) * 1982-06-21 1984-02-21 Desoto, Inc. Pigmented, corrosion resistant, thermosetting coating compositions
US4393181A (en) * 1982-06-30 1983-07-12 Shell Oil Company Polyfunctional phenolic-melamine epoxy resin curing agents
US4438254A (en) * 1983-02-28 1984-03-20 The Dow Chemical Company Process for producing epoxy resins
EP0160054A1 (de) * 1983-10-25 1985-11-06 The Commonwealth Of Australia Verstärkungsverfahren und vorrichtung für hörhilfegerät
CA1276358C (en) * 1984-01-31 1990-11-13 Dieter H. Klein Epoxy resin for preparing electric laminates
US4528359A (en) * 1984-05-16 1985-07-09 The Dow Chemical Company Adducts of epoxy resins and amino-substituted aromatic sulfonic acid amides
US4604317A (en) * 1984-10-05 1986-08-05 The Dow Chemical Company Curable compositions containing a polyepoxide and a halogenated bisphenol
US4668718A (en) * 1984-10-05 1987-05-26 Ciba-Geigy Corporation Self-extinguishing, track-resistant epoxy resin moulding composition and use thereof

Also Published As

Publication number Publication date
NO863074D0 (no) 1986-07-30
NO171414C (no) 1993-03-10
JPH0772225B2 (ja) 1995-08-02
NO863074L (no) 1987-02-02
JPS6270415A (ja) 1987-03-31
CA1292824C (en) 1991-12-03
DE3689869T2 (de) 1994-11-17
IN167874B (de) 1991-01-05
GB8519290D0 (en) 1985-09-04
AU593826B2 (en) 1990-02-22
EP0211382B1 (de) 1994-06-01
FI89807B (fi) 1993-08-13
FI863136A0 (fi) 1986-07-31
CN86105670A (zh) 1987-03-25
US4959400A (en) 1990-09-25
US4713137A (en) 1987-12-15
ES2001053A6 (es) 1988-04-16
EP0211382A3 (en) 1988-08-24
ATE106435T1 (de) 1994-06-15
MY102533A (en) 1992-07-31
BR8603615A (pt) 1987-03-10
KR870001245A (ko) 1987-03-12
AU6074886A (en) 1987-02-05
KR900001944B1 (ko) 1990-03-26
EP0211382A2 (de) 1987-02-25
FI89807C (fi) 1993-11-25
DK364586D0 (da) 1986-07-31
FI863136A (fi) 1987-02-01
DE3689869D1 (de) 1994-07-07
CN1017248B (zh) 1992-07-01
NO171414B (no) 1992-11-30

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Legal Events

Date Code Title Description
AHB Application shelved due to non-payment