DK1978049T3 - Epoxyharpikssammensætning, der kan hærdes - Google Patents

Epoxyharpikssammensætning, der kan hærdes

Info

Publication number
DK1978049T3
DK1978049T3 DK07105538.8T DK07105538T DK1978049T3 DK 1978049 T3 DK1978049 T3 DK 1978049T3 DK 07105538 T DK07105538 T DK 07105538T DK 1978049 T3 DK1978049 T3 DK 1978049T3
Authority
DK
Denmark
Prior art keywords
composition
epoxy resin
resin composition
curable
dgebf
Prior art date
Application number
DK07105538.8T
Other languages
English (en)
Inventor
Stephane Schaal
Patricia Gonzalez
Cherif Ghoul
Jens Rocks
Francisco Arauzo
Patrick Meier
Original Assignee
Abb Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38516147&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK1978049(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Abb Research Ltd filed Critical Abb Research Ltd
Application granted granted Critical
Publication of DK1978049T3 publication Critical patent/DK1978049T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
  • Paints Or Removers (AREA)
DK07105538.8T 2007-04-03 2007-04-03 Epoxyharpikssammensætning, der kan hærdes DK1978049T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07105538A EP1978049B1 (en) 2007-04-03 2007-04-03 Curable Epoxy Resin Composition

Publications (1)

Publication Number Publication Date
DK1978049T3 true DK1978049T3 (da) 2010-06-14

Family

ID=38516147

Family Applications (1)

Application Number Title Priority Date Filing Date
DK07105538.8T DK1978049T3 (da) 2007-04-03 2007-04-03 Epoxyharpikssammensætning, der kan hærdes

Country Status (14)

Country Link
US (1) US20100018750A1 (da)
EP (1) EP1978049B1 (da)
JP (1) JP2010523747A (da)
KR (1) KR20100014721A (da)
CN (1) CN101663344A (da)
AT (1) ATE458769T1 (da)
AU (1) AU2008233984A1 (da)
BR (1) BRPI0809920A2 (da)
CA (1) CA2682617A1 (da)
DE (1) DE602007004946D1 (da)
DK (1) DK1978049T3 (da)
ES (1) ES2341375T3 (da)
MX (1) MX2009010648A (da)
WO (1) WO2008119624A1 (da)

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* Cited by examiner, † Cited by third party
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BRPI0823106A2 (pt) * 2008-09-19 2015-06-16 Abb Research Ltd Composição de resina de epóxi
DE102009012195A1 (de) * 2009-03-06 2010-09-09 Siemens Aktiengesellschaft Gießharzsystem für Isolatoren mit erhöhter Wärmeformbeständigkeit
CN102695739B (zh) * 2009-08-27 2014-08-13 Abb研究有限公司 可固化环氧树脂组合物
JP5745248B2 (ja) * 2010-10-08 2015-07-08 株式会社ダイセル エポキシ樹脂用硬化剤組成物、硬化性樹脂組成物及びその硬化物
US8536250B2 (en) 2010-10-14 2013-09-17 Tnemec Company Inc. Geopolymer and epoxy simultaneous interpenetrating polymer network composition, and methods for the same
US9403185B2 (en) * 2011-08-31 2016-08-02 Huntsman International Llc Impregnation of air core reactors
US20150299457A1 (en) * 2011-12-20 2015-10-22 Dow Global Technologies Llc Epoxy resin composites
CN102515626B (zh) * 2012-01-06 2013-05-29 桂林理工大学 一种干式电力变压器用高导热环氧浇注料及其制备方法
EP2629305B1 (en) * 2012-02-20 2014-04-02 ABB Technology AG Composite materials for use in high voltage devices
WO2014035145A1 (ko) * 2012-08-28 2014-03-06 주식회사 케이오씨솔루션 에폭시 아크릴계 광학재료의 제조방법
CN102911544B (zh) * 2012-11-20 2015-01-21 中国海洋石油总公司 一种改性环氧无溶剂涂料
CN103881301B (zh) * 2012-12-24 2015-12-09 江苏绿材谷新材料科技发展有限公司 一种可用于拉挤成型的耐高温环氧树脂组合物及制备方法
JP2017505830A (ja) * 2013-12-18 2017-02-23 ブルー キューブ アイピー エルエルシー 蒸留されたエポキシノボラック樹脂
CN104004320B (zh) * 2014-05-15 2016-02-24 江苏绿材谷新材料科技发展有限公司 一种可用于拉挤成型的阻燃耐高温环氧树脂组合物及制备方法
DE102015213815A1 (de) * 2015-07-17 2017-01-19 Siemens Aktiengesellschaft Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem
DE102015218096A1 (de) * 2015-09-21 2017-03-23 Siemens Aktiengesellschaft Formulierung für ein Imprägnierharz für den VPI Prozess
US20190085227A1 (en) * 2015-12-07 2019-03-21 Hitachi, Ltd. Electrical insulating material for high voltage equipment
JP6714492B2 (ja) * 2015-12-24 2020-06-24 信越化学工業株式会社 有機膜形成用化合物、有機膜形成用組成物、有機膜形成方法、及びパターン形成方法
JP6714493B2 (ja) 2015-12-24 2020-06-24 信越化学工業株式会社 有機膜形成用化合物、有機膜形成用組成物、有機膜形成方法、及びパターン形成方法
CN106566367A (zh) * 2016-10-26 2017-04-19 上海维凯光电新材料有限公司 模压转移涂料组合物
CN106519191A (zh) * 2016-11-02 2017-03-22 武汉工程大学 用于环氧树脂体系的新型固化剂及其应用方法
CN106496523A (zh) * 2016-11-02 2017-03-15 武汉工程大学 一种用于环氧树脂体系的新型固化剂及其应用方法
CN106519192A (zh) * 2016-11-02 2017-03-22 武汉工程大学 一种用于环氧树脂体系的固化剂及其应用方法
CN107880310B (zh) * 2017-10-18 2019-06-04 常州大学 一种用于制备聚酚氧/聚酰胺共混塑料合金的增容剂及其增容方法
KR102279438B1 (ko) * 2017-12-01 2021-07-19 엘에스일렉트릭(주) 에폭시 수지 조성물 및 이를 포함하는 변압기
EP3766085A1 (en) * 2018-03-16 2021-01-20 Huntsman Advanced Materials Licensing (Switzerland) GmbH Curable mixtures for use in impregnation of paper bushings
US11718706B2 (en) * 2018-03-16 2023-08-08 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Compositions for use in impregnation of paper bushings
KR20210043487A (ko) * 2018-09-11 2021-04-21 헨켈 아이피 앤드 홀딩 게엠베하 상 변화 물질-코팅된 열 교환 튜브
US10822517B2 (en) * 2018-11-28 2020-11-03 Industrial Technology Research Institute Resin composition and cured resin composition
KR102008964B1 (ko) * 2019-03-04 2019-10-23 제룡전기 주식회사 몰드 변압기용 친환경 하이브리드수지 조성물 및 그 제조방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3868613A (en) * 1971-10-14 1975-02-25 Westinghouse Electric Corp Solventless epoxy resin composition and an electrical member impregnated therewith
JPS59201684A (ja) * 1983-04-30 1984-11-15 Canon Inc 振動波モ−タ
US4665111A (en) * 1984-10-12 1987-05-12 Siemens Aktiengesellschaft Casting compound for electrical and electronic components and modules
JP3896529B2 (ja) * 1994-07-01 2007-03-22 バンティコ アクチエンゲゼルシャフト エポキシ樹脂注型用組成物
JP2875479B2 (ja) * 1994-09-08 1999-03-31 日本ペルノックス株式会社 半導体の封止方法
US6194490B1 (en) * 1998-02-27 2001-02-27 Vantico, Inc. Curable composition comprising epoxidized natural oils
DE60312143T2 (de) * 2003-06-16 2007-11-29 Abb Technology Ltd. Epoxyharzzusammensetzungen und Verfahren zur Herstellung von geformten Gegenständen daraus
KR100655056B1 (ko) * 2003-12-30 2006-12-06 제일모직주식회사 반도체 소자 밀봉용 액상 에폭시 수지 조성물

Also Published As

Publication number Publication date
BRPI0809920A2 (pt) 2014-10-07
AU2008233984A1 (en) 2008-10-09
JP2010523747A (ja) 2010-07-15
CN101663344A (zh) 2010-03-03
ES2341375T3 (es) 2010-06-18
MX2009010648A (es) 2009-11-26
WO2008119624A1 (en) 2008-10-09
ATE458769T1 (de) 2010-03-15
EP1978049B1 (en) 2010-02-24
US20100018750A1 (en) 2010-01-28
EP1978049A1 (en) 2008-10-08
KR20100014721A (ko) 2010-02-10
DE602007004946D1 (de) 2010-04-08
CA2682617A1 (en) 2008-10-09

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